CN207118064U - Double-layer flexible circuit board - Google Patents
Double-layer flexible circuit board Download PDFInfo
- Publication number
- CN207118064U CN207118064U CN201720793821.4U CN201720793821U CN207118064U CN 207118064 U CN207118064 U CN 207118064U CN 201720793821 U CN201720793821 U CN 201720793821U CN 207118064 U CN207118064 U CN 207118064U
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- conductor layer
- layer
- bottom membrane
- lamella
- conductor
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Abstract
It the utility model is related to the Double-layer flexible circuit board of electrical lighting applied technical field,Including bottom membrane,Flat conductor layer and cover layer,Flat conductor layer includes two layers altogether,Respectively the first conductor layer and the second conductor layer,The bottom surface of bottom membrane also has additional reinforcement lamella,And it is pasted with silica gel cushion in the bottom surface for strengthening lamella,First conductor layer is between middle film layer and bottom membrane,Second conductor layer is positioned between film layer and middle film layer,The surface punching of middle film layer has via hole,And there is convex platform in the surface punching of first conductor layer corresponding with conducting hole site,Strengthen lamella and play good supporting role,The stability of FPC can be strengthened,Avoid FPC from appointing to wave,Silica gel cushion plays good cushioning effect,And the stability of installation can be strengthened,Increase the service life of product,It is hardly damaged,The convex platform set up can ensure that the first conductor layer contacts well with the second conductor layer,So as to strengthen the performance of FPC.
Description
Technical field
It the utility model is related to electrical lighting applied technical field, and in particular to a kind of wiring board, it is more particularly to double-deck soft
Property wiring board.
Background technology
It is well known that with the progress of society, increasing electronic product is more and more common now is made by people
With flexible PCB has become a kind of essential part of circuit arrangement, flexible PCB in each electronic product
(FPC) also known as " soft board ", it is the printed circuit made of flexible insulating substrate, there are many rigid printed circuit boards not possess
The advantages of.Such as it can require any arrangement, and appoint in three dimensions with free bend, winding, folding according to space layout
Meaning is mobile and flexible, so as to reach the integration that components and parts assembling connects with wire.Electronic product can be substantially reduced using FPC
Volume, it is applicable the needs that electronic product develops to high density, miniaturization, highly reliable direction.Therefore, FPC is in space flight, military affairs, shifting
It is widely used on the fields such as dynamic communication, laptop computer, computer peripheral equipment, PDA, digital camera or product.
At present, also there is following defect in existing flexible PCB：1）Flexible PCB is overall too soft, during use
Easily produce and wave, stability is poor；2）Flexible PCB using when be directly by two ends be connected to corresponding on interface, electronics
Vibrations often occur during product use, the service life of flexible PCB will be influenceed when shaking serious；3）Double-decker
Flexible PCB connection stability it is poor, when press it is not tight when will influence flexible PCB performance.
Utility model content
The purpose of this utility model is that solve disadvantages described above, there is provided Double-layer flexible circuit board, it is contacted well, not rapid wear
It is bad, and install stable.
The purpose of this utility model is achieved in the following ways：
Double-layer flexible circuit board, including bottom membrane, flat conductor layer and cover layer, flat conductor layer are located at counterdie
Between layer and cover layer, bottom membrane, flat conductor layer and cover layer are bonded by hot pressing technique, and flat is led
Body layer includes two layers altogether, and respectively the first conductor layer and the second conductor layer, the bottom surface of bottom membrane also have additional reinforcement lamella, strengthens
Lamella is bonded by hot pressing technique, and is pasted with silica gel cushion in the bottom surface for strengthening lamella, and the first conductor layer is located at
The lower section of second conductor layer, is provided with middle film layer between the first conductor layer and the second conductor layer, the first conductor layer is neat by two panels
The arrangement and strip copper foil mutually broken off is formed, if the second conductor layer is by dry plate transverse fold and the special-shaped copper foil mutually broken off
Form, the section for installing electronic component is left between adjacent two panels abnormity copper foil, cover layer is located at the second conductor layer
Top, cover layer surface punching have the emptiness avoiding hole corresponding with the position of section, make in the center and emptiness avoiding hole of section
The heart is corresponding, the first conductor layer positioned at middle film layer and bottom membrane between, the second conductor layer be positioned over film layer and middle film layer it
Between, the punching of the surface of middle film layer has a via hole, and first conductor layer corresponding with conducting hole site surface punching have it is convex
Platform, after the first conductor layer and the second conductor layer progress hot pressing, the first conductor layer is set to pass through upper convex flat with the second conductor layer
Platform is turned on.
In described above, as preferable scheme, the area of the emptiness avoiding hole is more than the area of section.
In described above, as preferable scheme, the bottom membrane, cover layer and middle film layer are by PI material structures
Into.
Beneficial effect is caused by the utility model：Reinforcement lamella is had additional in the bottom surface of bottom membrane, strengthens lamella and rises
Good supporting role, the stability of FPC can be strengthened, avoid FPC from appointing and wave, meanwhile, also in reinforced sheet
The bottom surface of layer is pasted with silica gel cushion, and silica gel cushion plays good cushioning effect, and can strengthen the stability of installation, increases
Add the service life of product, be hardly damaged, in addition, the first conductor layer surface punching have convex platform, when the first conductor layer with
After second conductor layer carries out hot pressing, the first conductor layer is set to be turned on the second conductor layer by convex platform, that sets up is upper
Convex flat platform can ensure that the first conductor layer contacts well with the second conductor layer, so as to strengthen the performance of FPC.
Brief description of the drawings
Fig. 1 is the schematic cross-section of the utility model embodiment；
Fig. 2 is the structural representation of the first conductor layer in the utility model embodiment；
Fig. 3 is the structural representation of the second conductor layer in the utility model embodiment；
In figure, 1 is bottom membrane, and 2 be cover layer, and 3 be the first conductor layer, and 4 be the second conductor layer, and 5 be to strengthen lamella, 6
It is middle film layer for silica gel cushion, 7,8 be convex platform, and 9 be strip copper foil, and 10 be special-shaped copper foil.
Embodiment
The utility model is described in further detail with embodiment below in conjunction with the accompanying drawings.
The present embodiment, reference picture 1- Fig. 3, its Double-layer flexible circuit board being embodied include bottom membrane 1, flat conductor
Layer and cover layer 2, flat conductor layer bottom membrane 1, flat conductor layer and are covered between bottom membrane 1 and cover layer 2
Epiphragma layer 2 is bonded by hot pressing technique.
Flat conductor layer includes two layers altogether, and respectively the first conductor layer 3 and the second conductor layer 4, the bottom surface of bottom membrane 1 is also
Have additional and strengthen lamella 5, strengthen lamella 5 and bonded by hot pressing technique, and silica gel is pasted with the bottom surface for strengthening lamella 5
Cushion 6, had additional in the bottom surface of bottom membrane 1 and strengthen lamella 5, strengthened lamella 5 and play good supporting role, flexible wires can be strengthened
The stability of road plate, avoid FPC from appointing and wave, meanwhile, silica gel cushion 6 also is pasted with the bottom surface for strengthening lamella 5,
Silica gel cushion 6 plays good cushioning effect, and can strengthen the stability of installation, increases the service life of product, not rapid wear
It is bad.
First conductor layer 3 is located at the lower section of the second conductor layer 4, and centre is provided between the first conductor layer 3 and the second conductor layer 4
Film layer 7, in the present embodiment, bottom membrane 1, cover layer 2 and middle film layer 7 are formed by PI materials, as shown in Fig. 2 first leads
Body layer 3 is made up of two panels proper alignment and the strip copper foil 9 mutually broken off, if as shown in figure 3, the second conductor layer 4 is by dry plate
The transverse fold and special-shaped copper foil 10 mutually broken off is formed, left between adjacent two panels abnormity copper foil 10 for installing electronics member device
The section of part, cover layer 2 are located at the top of the second conductor layer 4, and the surface punching of cover layer 2 has corresponding with the position of section
Emptiness avoiding hole, make the center of section corresponding with the center of emptiness avoiding hole, the first conductor layer 3 be located at middle film layer 7 and bottom membrane 1 it
Between, the second conductor layer 4 is positioned between film layer 2 and middle film layer 7, and the surface punching of middle film layer 7 has via hole, and with leading
The surface punching of the first corresponding conductor layer 3 of lead to the hole site has convex platform 8, when the first conductor layer 3 and the second conductor layer 4 are carried out
After hot pressing, the first conductor layer 3 is set to be turned on the second conductor layer 4 by convex platform 8, on the surface of the first conductor layer 3
Punching has convex platform 8, after the first conductor layer 3 and the second conductor layer 4 progress hot pressing, makes the first conductor layer 3 and the second conductor
Layer 4 is turned on by convex platform 8, and it is good that the convex platform 8 set up can ensure that the first conductor layer 3 contacts with the second conductor layer 4
It is good, so as to strengthen the performance of FPC.
Above content is to combine specific preferred embodiment further detailed description of the utility model, it is impossible to is recognized
Fixed specific implementation of the present utility model is confined to these explanations.For the ordinary skill people of the utility model art
For member, without departing from the concept of the premise utility, some simple deduction or replace can also be made, be regarded as this
The protection domain of utility model.
Claims (3)
1. Double-layer flexible circuit board, including bottom membrane, flat conductor layer and cover layer, flat conductor layer are located at bottom membrane
Between cover layer, bottom membrane, flat conductor layer and cover layer are bonded by hot pressing technique, flat conductor
Layer includes two layers altogether, respectively the first conductor layer and the second conductor layer, it is characterised in that：The bottom surface of bottom membrane also has additional reinforcement
Lamella, strengthen lamella and bonded by hot pressing technique, and silica gel cushion is pasted with the bottom surface for strengthening lamella, first leads
Body layer is located at the lower section of the second conductor layer, is provided with middle film layer between the first conductor layer and the second conductor layer, the first conductor layer by
The two panels proper alignment and strip copper foil mutually broken off is formed, if the second conductor layer is by dry plate transverse fold and mutually breaks off
Special-shaped copper foil is formed, and leaves the section for installing electronic component between adjacent two panels abnormity copper foil, and cover layer is positioned at the
The top of two conductor layers, the surface punching of cover layer have the emptiness avoiding hole corresponding with the position of section, make the center of section with keeping away
The center of emptying aperture is corresponding, and for the first conductor layer between middle film layer and bottom membrane, the second conductor layer is positioned over film layer with
Between between film layer, the surface punching of middle film layer has via hole, and on the surface of first conductor layer corresponding with conducting hole site
Punching has convex platform, after the first conductor layer and the second conductor layer progress hot pressing, the first conductor layer is led to the second conductor layer
Convex platform is crossed to be turned on.
2. Double-layer flexible circuit board according to claim 1, it is characterised in that：The area of the emptiness avoiding hole is more than the face of section
Product.
3. Double-layer flexible circuit board according to claim 1, it is characterised in that：The bottom membrane, cover layer and intermediate coat
Layer is formed by PI materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720793821.4U CN207118064U (en) | 2018-01-05 | 2018-01-05 | Double-layer flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720793821.4U CN207118064U (en) | 2018-01-05 | 2018-01-05 | Double-layer flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207118064U true CN207118064U (en) | 2018-03-16 |
Family
ID=61586175
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720793821.4U Active CN207118064U (en) | 2018-01-05 | 2018-01-05 | Double-layer flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207118064U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111312687A (en) * | 2020-02-20 | 2020-06-19 | 京东方科技集团股份有限公司 | Flexible circuit board, manufacturing method thereof and display module |
| CN114286538A (en) * | 2020-09-28 | 2022-04-05 | 鹏鼎控股(深圳)股份有限公司 | Multilayer circuit board with plugging fingers and manufacturing method thereof |
-
2018
- 2018-01-05 CN CN201720793821.4U patent/CN207118064U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111312687A (en) * | 2020-02-20 | 2020-06-19 | 京东方科技集团股份有限公司 | Flexible circuit board, manufacturing method thereof and display module |
| CN114286538A (en) * | 2020-09-28 | 2022-04-05 | 鹏鼎控股(深圳)股份有限公司 | Multilayer circuit board with plugging fingers and manufacturing method thereof |
| CN114286538B (en) * | 2020-09-28 | 2024-03-15 | 鹏鼎控股(深圳)股份有限公司 | Multilayer circuit board with inserted fingers and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information |
Inventor after: Wu Weibin Inventor before: Mei Xiaohong Inventor before: Wu Weibin |
|
| CB03 | Change of inventor or designer information | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230809 Address after: 517000 the first floor (workshop) on the east side of Xinggong Avenue and the south side of Kesi Road, high tech Development Zone, Heyuan City, Guangdong Province Patentee after: GUANGDONG LIZI MICRO ELECTRIC TECHNOLOGY Co.,Ltd. Address before: 523000 No. 1-3, Xusheng Road, Xiangxi village, Liaobu Town, Dongguan City, Guangdong Province Patentee before: DONGGUAN YINGTE ELECTRONIC TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right |