CN220798618U - Smooth LED flexible tin conducting sheet - Google Patents
Smooth LED flexible tin conducting sheet Download PDFInfo
- Publication number
- CN220798618U CN220798618U CN202322301588.1U CN202322301588U CN220798618U CN 220798618 U CN220798618 U CN 220798618U CN 202322301588 U CN202322301588 U CN 202322301588U CN 220798618 U CN220798618 U CN 220798618U
- Authority
- CN
- China
- Prior art keywords
- tin
- layer
- foil layer
- copper foil
- flat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 54
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 51
- 239000011889 copper foil Substances 0.000 claims abstract description 50
- YVIMHTIMVIIXBQ-UHFFFAOYSA-N [SnH3][Al] Chemical compound [SnH3][Al] YVIMHTIMVIIXBQ-UHFFFAOYSA-N 0.000 claims abstract description 31
- 239000011888 foil Substances 0.000 claims abstract description 29
- 239000010410 layer Substances 0.000 claims description 123
- 229910000679 solder Inorganic materials 0.000 claims description 13
- 239000012790 adhesive layer Substances 0.000 claims description 11
- 239000003292 glue Substances 0.000 claims description 9
- 238000003475 lamination Methods 0.000 abstract description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000003825 pressing Methods 0.000 description 3
- 239000005030 aluminium foil Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001690 polydopamine Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The utility model discloses a smooth LED flexible tin-conducting sheet, which comprises a top insulating layer, a double-sided circuit board and a smooth tin-aluminum foil layer, wherein a tin-conducting opening hole is formed in the top insulating layer; the double-sided circuit board is attached to the top insulating layer; the flat tin-aluminum foil layer is filled in the tin conduction opening hole, and after being pressed at high temperature, the flat tin-aluminum foil layer is enabled to be level to the upper surface of the top insulating layer in height. According to the utility model, the flat tin-aluminum foil layer is arranged, so that the flat tin-aluminum foil layer is covered in the tin conduction opening hole during high-temperature lamination, the whole circuit board is flat, the situation that a groove collapses does not occur, and the problem that the conducting hole is not full does not occur during tin feeding, thereby ensuring that the tin on the top layer can be completely communicated with the copper foil on the bottom layer, and ensuring the conductivity of the flexible circuit board.
Description
Technical Field
The utility model relates to the field of flexible circuit boards, in particular to a smooth LED flexible tin conducting thin plate.
Background
The flexible circuit board is called FPC in industry, is made of flexible insulating base material (mainly polyimide or polyester film), and has many advantages not possessed by hard printed circuit board. For example it can be freely bent, rolled, folded. The FPC is utilized to greatly reduce the volume of the electronic product, and is suitable for the requirements of the electronic product on development in the high-density, miniaturized and high-reliability directions. Therefore, FPCs have been widely used in the fields or products of aerospace, military, mobile communication, portable computers, computer peripherals, PDAs, digital cameras, and the like.
However, in the current bowl-shaped plate or tin conducting products with thin copper standards of 18/18, 25/25, 35/35 and the like, after the base materials are combined, the bottom bonding pad is uneven after being pressed due to windowing of the top bonding pad in the pressing process, and is concave, when a user applies tin, the situation that the tin on the top layer cannot be completely communicated with the copper foil on the bottom layer easily occurs, and the poor conductivity rate of the flexible circuit board is high.
Disclosure of Invention
The utility model aims to overcome the defects in the prior art and provides a smooth LED flexible tin conducting sheet.
The aim of the utility model is realized by the following technical scheme:
a flexible tin-plated sheet for a flat LED, comprising:
a top insulating layer, on which tin conduction opening holes are formed;
the double-sided circuit board is attached to the top insulating layer; and
And the flat tin-aluminum foil layer is used for conducting the double-sided circuit board, the flat tin-aluminum foil layer is filled in the tin conduction opening hole, and after the flat tin-aluminum foil layer is pressed at a high temperature, the height of the outer surface of the flat tin-aluminum foil layer is flush with the upper surface of the top insulating layer.
In one embodiment, the double-sided circuit board comprises a top copper foil layer, an insulating adhesive layer and a bottom connecting copper foil layer,
the top insulating layer is attached to the top copper foil layer through an insulating adhesive layer, the top copper foil layer is attached to the top insulating layer, and a first tin via hole is formed in the top copper foil layer; and a second tin conducting hole is formed in the insulating adhesive layer, and the tin conducting window hole, the first tin conducting hole and the second tin conducting hole are communicated.
In one embodiment, the top insulating layer is a white film or a yellow film or a black film.
In one embodiment, the insulating glue layer is a PI insulating layer or a glue layer.
In one embodiment, the bottom connection copper foil layer includes a bottom copper foil layer and a bottom solder mask layer, the bottom copper foil layer is attached to the insulating glue layer, and the bottom solder mask layer covers the bottom copper foil layer.
In one embodiment, the top insulating layer is the same thickness as the bottom copper foil layer.
In one embodiment, the flat tin-aluminum foil layer penetrates through the tin conducting opening hole, the first tin conducting hole and the second tin conducting hole so that the top copper foil layer and the bottom copper foil layer are connected.
In one embodiment, the bottom solder mask layer is a solder mask white layer.
Compared with the prior art, the utility model has the following advantages:
the utility model relates to a smooth LED flexible tin conducting sheet, which is characterized in that a smooth tin aluminum foil layer is arranged, so that the smooth tin aluminum foil layer is covered in a tin conducting opening hole during high-temperature lamination, the whole circuit board is smooth, the situation that a groove collapses does not occur, the problem that a conducting hole is not full does not occur during tin plating, the tin on the top layer can be completely communicated with a copper foil on the bottom layer, and the conductivity of the flexible circuit board is ensured.
Drawings
FIG. 1 is a schematic view of a flat LED flexible tin-conductive sheet according to an embodiment of the present utility model;
fig. 2 is a schematic structural view of the flat LED flexible tin-conductive sheet shown in fig. 1.
Detailed Description
In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. The drawings illustrate preferred embodiments of the utility model. This utility model may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Referring to fig. 1, a flat LED flexible tin-conductive sheet includes: the top insulating layer 100, the double-sided circuit board 200 and the flat tin-aluminum foil layer 300 should be noted, wherein the top insulating layer 100 is used for realizing the insulation of the top surface; the double-sided circuit board 200 is used for realizing the electrical connection of the double-sided board, and the flat tin-aluminum foil layer 300 is used for filling the first via hole 110, so that the flatness can be realized.
A tin through opening 110 is formed on the top insulating layer 100; the double-sided wiring board 200 is attached to the top insulating layer 100; the flat tin-aluminum foil layer 300 is used for conducting the double-sided circuit board, after the flat tin-aluminum foil layer 300 is pressed at a high temperature, the flat tin-aluminum foil layer 300 is filled in the tin conducting opening hole 110, and the outer surface of the flat tin-aluminum foil layer 300 is level with the upper surface of the top insulating layer. The tin conduction opening hole formed in the top insulating layer is larger than the first tin conduction Kong Shanbian by more than 0.5 mm. That is, the tin via hole is larger than the first tin via hole by 1mm or more.
So, through setting up smooth tin aluminium foil layer to can be so when the high temperature pressfitting, will level smooth tin aluminium foil layer and cover in tin switches on the fenestration, and make whole circuit board level, the circumstances that the recess collapsed can not appear, and can not appear the problem that the via hole is not full yet when going on tin, thereby can guarantee that the tin of top layer can communicate completely with the copper foil of bottom, guaranteed the conductivity of flexible line way board.
Referring to fig. 2, the double-sided circuit board 200 includes a top copper foil layer 210, an insulating adhesive layer 220 and a bottom connection copper foil layer 230, wherein the top copper foil layer 210 is used for realizing circuit connection of the top surface; the insulating glue layer 220 is used for insulating the top copper foil layer 210 and the bottom copper foil layer at the bottom; the bottom connection copper foil layer 230 is used to realize the circuit connection of the bottom surface.
The top copper foil layer is attached to the top insulating layer, and a first tin via hole 211 is formed in the top copper foil layer 210; the insulating adhesive layer is adhered to the top copper foil layer,
a second tin via 221 is formed on the insulating glue layer 220, and the tin via hole, the first tin via hole and the second tin via hole are communicated; the bottom connecting copper foil layer is arranged on the insulating adhesive layer.
It should be noted that the bottom connection copper foil layer 230 includes a bottom copper foil layer 231 and a bottom solder mask layer 232, the bottom copper foil layer is attached to the insulating adhesive layer, and the bottom solder mask layer covers the bottom copper foil layer. The bottom copper foil layer 231 is used for realizing the circuit connection of the bottom surface, and the bottom solder mask layer 232 is used for realizing the insulation function of the bottom surface.
Further, the thickness of the top insulating layer is equal to the thickness of the bottom copper foil layer. In this way, structural stability can be improved.
Further, the flat tin-aluminum foil layer penetrates through the tin conducting opening hole, the first tin conducting hole and the second tin conducting hole, so that the top copper foil layer is connected with the bottom copper foil layer. Therefore, the function of connecting the top copper foil layer with the bottom copper foil layer by utilizing the tin-aluminum layer and realizing the double-panel can be achieved. The flat tin-aluminum foil layer in the application is tin-aluminum alloy, namely, the flat tin-aluminum foil layer is filled with the conducting holes at high temperature in a pressing mode, so that conducting effect is achieved.
In this embodiment, the top insulating layer is a white film or a yellow film or a black film. The insulating glue layer is a PI insulating layer or a glue layer. The bottom solder mask layer is a solder mask white layer.
Specifically, when the flexible circuit board is produced, the bottom copper foil layer faces the iron plate and the wave fiber cloth, and the top copper foil layer faces the tin-aluminum foil. The tin-aluminum foil is filled in the windowed bonding pad of the top layer during high-temperature lamination, namely, the tin is conducted in the windowed hole, the bonding pad is not extruded after lamination, and the bonding pad is relatively flat because the bonding pad is propped by the iron plate and the glass fiber cloth at the bottom. Compared with the existing tin-aluminum foil and lower opening buffer pad, the production process is smoother, and the pressing effect is better.
The above embodiments represent only a few embodiments of the present utility model, which are described in more detail and are not to be construed as limiting the scope of the present utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.
Claims (8)
1. A flexible tin-conductive sheet for a flat LED, comprising:
a top insulating layer, on which tin conduction opening holes are formed;
the double-sided circuit board is attached to the top insulating layer; and
And the flat tin-aluminum foil layer is used for conducting the double-sided circuit board, the flat tin-aluminum foil layer is filled in the tin conduction opening hole, and after the flat tin-aluminum foil layer is pressed at a high temperature, the height of the outer surface of the flat tin-aluminum foil layer is flush with the upper surface of the top insulating layer.
2. The flexible tin-conductive sheet of claim 1, wherein the double-sided circuit board comprises a top copper foil layer, an insulating adhesive layer, and a bottom copper foil layer,
the top insulating layer is attached to the top copper foil layer through an insulating adhesive layer, the top copper foil layer is attached to the top insulating layer, and a first tin via hole is formed in the top copper foil layer; and a second tin conducting hole is formed in the insulating adhesive layer, and the tin conducting window hole, the first tin conducting hole and the second tin conducting hole are communicated.
3. The flat LED flexible tin conductive sheet of claim 1 or 2, wherein the top insulating layer is a white film or a yellow film or a black film.
4. The flexible tin-conductive sheet of claim 2, wherein the insulating adhesive layer is a PI insulating layer or a glue layer.
5. The flexible tin-conductive sheet of claim 2, wherein the bottom connecting copper foil layer comprises a bottom copper foil layer and a bottom solder mask layer, the bottom copper foil layer is attached to the insulating glue layer, and the bottom solder mask layer is covered on the bottom copper foil layer.
6. The flat LED flexible tin conductive sheet of claim 5, wherein said top insulating layer and said bottom copper foil layer are of equal thickness.
7. The flat LED flexible tin-conductive sheet of claim 5, wherein said flat tin-aluminum foil layer extends through said tin-conductive opening, said first tin-via and said second tin-via to connect said top copper foil layer to said bottom copper foil layer.
8. The flat LED flexible tin-conductive sheet of claim 5, wherein said bottom solder mask is a solder mask white layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322301588.1U CN220798618U (en) | 2023-08-26 | 2023-08-26 | Smooth LED flexible tin conducting sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322301588.1U CN220798618U (en) | 2023-08-26 | 2023-08-26 | Smooth LED flexible tin conducting sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220798618U true CN220798618U (en) | 2024-04-16 |
Family
ID=90663260
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322301588.1U Active CN220798618U (en) | 2023-08-26 | 2023-08-26 | Smooth LED flexible tin conducting sheet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220798618U (en) |
-
2023
- 2023-08-26 CN CN202322301588.1U patent/CN220798618U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |