CN215581905U

CN215581905U - Magnetic head FPC

Info

Publication number: CN215581905U
Application number: CN202121054051.4U
Authority: CN
Inventors: 宁才传
Original assignee: Shenzhen Jizitong Technology Co ltd
Current assignee: Shenzhen Jizitong Technology Co ltd
Priority date: 2021-05-17
Filing date: 2021-05-17
Publication date: 2022-01-18
Anticipated expiration: 2031-05-17

Abstract

The embodiment of the utility model provides a magnetic head FPC (flexible printed circuit), which comprises a circuit layer, a base material drilling layer and a covering film windowing layer which are fixed on two opposite sides of the circuit layer, a bonding pad which is clamped and fixed between the circuit layer and the covering film windowing layer, and a first through hole which is arranged on the covering film windowing layer and is concentric with the bonding pad, wherein the size of the first through hole is smaller than that of the bonding pad, and the distance between the edge of the first through hole and the edge of the bonding pad is 0.1 mm. The magnetic head FPC can effectively prevent the bonding pad from falling off from the circuit layer, and further the service life of the magnetic head FPC is prolonged. On the other hand, the magnetic head FPC has the advantages of simple structure, low manufacturing cost, high practicability and easy popularization.

Description

Magnetic head FPC

Technical Field

The utility model relates to the technical field of Flexible Printed Circuit (FPC), in particular to a magnetic head FPC.

Background

At present, consumer electronic products develop towards the direction of small volume and strong functions, the electronic products have smaller and smaller volumes, but more and more integrated functions and also have the appearance of a five-flower eight-door structure, and the magnetic head FPC can well meet the development requirement of the electronic products due to the characteristics of flexibility, thinness and the like, and is the hot direction of the development of the existing circuit board. Specifically, the magnetic head FPC comprises a circuit layer and a bonding pad fixedly arranged on the circuit layer, and different components are welded on the bonding pad on the circuit layer, so that the product achieves the expected functions.

However, the pad of the conventional magnetic head FPC is frequently separated from the surface of the circuit layer and falls off under long-time and repeated high-temperature welding operation, and the magnetic head FPC after the pad falls off cannot be normally used, so that the service life of the magnetic head FPC is shortened.

Therefore, it is necessary to provide a new magnetic head FPC to solve the above problems.

SUMMERY OF THE UTILITY MODEL

In view of the above problems, embodiments of the present invention are proposed to provide a magnetic head FPC that overcomes or at least partially solves the above problems.

In order to solve the above problems, an embodiment of the present invention discloses a magnetic head FPC, which includes a circuit layer, a substrate drilling layer and a cover film windowing layer fixed to opposite sides of the circuit layer, a pad sandwiched and fixed between the circuit layer and the cover film windowing layer, and a first through hole provided in the cover film windowing layer and concentrically arranged with the pad, wherein the size of the first through hole is smaller than that of the pad, and the distance between the edge of the first through hole and the edge of the pad is 0.1 mm.

Preferably, the pad and the first via hole are both circular in shape.

Preferably, the substrate drilling layer and the cover film windowing layer are fixedly bonded on two opposite sides of the circuit layer through adhesive.

Preferably, the glued object is glue or adhesive tape.

Preferably, the circuit layer is made of a conductive material; the substrate drilling layer is made of an insulating material.

Preferably, the conductive material is copper or a copper alloy.

Preferably, the magnetic head FPC further includes a second through hole provided on the substrate drill hole layer.

Compared with the prior art, in the magnetic head FPC, the first through hole and the bonding pad are concentrically arranged, the size of the first through hole is smaller than that of the bonding pad, and the distance between the edge of the first through hole and the edge of the bonding pad is 0.1 mm. The structure is arranged, so that the bonding pad is not easy to fall off from the circuit layer, and the service life of the magnetic head FPC is prolonged. On the other hand, the magnetic head FPC is simple in structure, low in manufacturing cost, high in practicability and easy to popularize.

Drawings

FIG. 1 is a schematic perspective view of a magnetic head FPC of the present invention;

fig. 2 is an exploded perspective view of the magnetic head FPC of the present invention.

Wherein, 1, a circuit layer; 2. drilling a hole layer on the substrate; 3. covering a film windowing layer; 4. a pad; 5. a first through hole; 6. a second via.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.

Referring to fig. 1-2, the present invention provides a magnetic head FPC, which includes a circuit layer 1, a substrate drilling layer 2 and a cover film windowing layer 3 fixed to two opposite sides of the circuit layer 1, a pad 4 sandwiched and fixed between the circuit layer 1 and the cover film windowing layer 3, and a first through hole 5 provided in the cover film windowing layer 3 and concentrically arranged with the pad 4, wherein the size of the first through hole 5 is smaller than that of the pad 4, and the distance between the edge of the first through hole 5 and the edge of the pad 4 is 0.1 mm.

In the structure of the magnetic head FPC, the first through hole 5 and the bonding pad 4 are concentrically arranged, the size of the first through hole 5 is smaller than that of the bonding pad 4, and the distance between the edge of the first through hole 5 and the edge of the bonding pad 4 is 0.1 mm. Due to the arrangement of the structure, the bonding pad 4 is not easy to fall off from the circuit layer 1, and the service life of the magnetic head FPC is further prolonged. On the other hand, the magnetic head FPC is simple in structure, low in manufacturing cost, high in practicability and easy to popularize.

In the present embodiment, the pad 4 and the first through hole 5 are both circular in shape. Of course, without being limited thereto, the shapes of the pad 4 and the first through hole 5 may be adaptively set according to actual situations.

Specifically, the substrate drilling layer 2 and the cover film windowing layer 3 are fixedly bonded on two opposite sides of the circuit layer 1 through an adhesive. The setting of this structure, very big improvement magnetic head FPC's steadiness. In this embodiment, the gluing object is glue or an adhesive tape.

Preferably, the circuit layer 1 is made of a conductive material; the substrate drilling layer 2 is made of an insulating material. In the present embodiment, to further improve the conductivity of the circuit layer 1, the conductive material is copper or a copper alloy.

It should be noted that, in order to make the heat dissipation effect of the magnetic head FPC better, in this embodiment, the magnetic head FPC further includes a second through hole 6 provided on the substrate drilling layer 2.

The foregoing detailed description of the magnetic head FPC provided by the present invention has been presented, and the principles and embodiments of the present invention have been explained by using specific examples, and the descriptions of the above examples are only used to help understanding the method and the core idea of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.

Claims

1. The utility model provides a magnetic head FPC, its characterized in that, magnetic head FPC includes the circuit layer, is fixed in the substrate drilling layer and the cover membrane windowing layer of the relative both sides of circuit layer, press from both sides to establish and be fixed in the circuit layer with cover membrane windowing layer between the pad and set up in cover membrane windowing layer and with the pad is the first through-hole of concentric setting, the size of first through-hole is less than the size of pad, just first through-hole edge with the distance at pad edge is 0.1 mm.

2. The magnetic head FPC of claim 1, wherein the pads and the first vias are each circular in shape.

3. The magnetic head FPC of claim 1, wherein the substrate drilling layer and the cover film windowing layer are fixed on opposite sides of the circuit layer by adhesive bonding.

4. The magnetic head FPC of claim 3, wherein the adhesive is glue or tape.

5. The magnetic head FPC of claim 1, wherein the wiring layer is made of a conductive material; the substrate drilling layer is made of an insulating material.

6. The magnetic head FPC of claim 5, wherein the conductive material is copper or a copper alloy.

7. The magnetic head FPC of claim 1, further comprising a second via opening on the substrate drilling layer.