CN215991351U - Flexible glass-based printed board structure - Google Patents
Flexible glass-based printed board structure Download PDFInfo
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- CN215991351U CN215991351U CN202122066095.5U CN202122066095U CN215991351U CN 215991351 U CN215991351 U CN 215991351U CN 202122066095 U CN202122066095 U CN 202122066095U CN 215991351 U CN215991351 U CN 215991351U
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Abstract
The utility model provides a flexible glass-based printed board structure, which relates to the technical field of printed circuit boards and comprises a mother board, wherein the mother board comprises a flexible substrate and a glass substrate, the flexible substrate comprises an outer layer copper foil a, the bottom surface of the outer layer copper foil a is coated with an adhesive a, the bottom surface of the adhesive a is bonded with a polyimide film, the bottom surface of the polyimide film is coated with an adhesive b, the bottom surface of the adhesive b is bonded with an inner layer copper foil a, the two sides of the top surface of the flexible substrate are provided with outer layer blind holes a, the bottom surface of the flexible substrate is provided with the glass substrate, the glass substrate comprises an inner layer copper foil b, the bottom surface of the inner layer copper foil b is coated with hot melt pure glue b, the bottom surface of the hot melt pure glue b is bonded with the glass substrate, the top surface of the glass substrate is provided with a glass through hole, the bottom surface of the glass substrate is provided with c hot melt pure glue, the bottom surface of the outer layer copper foil b is bonded with the bottom surface of the flexible substrate, and the glass substrate combined structure is adopted to replace the traditional epoxy resin substrate, the problems of poor product heat dissipation, poor stability and high-density LED three-dimensional assembly are solved.
Description
Technical Field
The utility model relates to the technical field of printed circuit boards, in particular to a flexible glass substrate printed board structure.
Background
The patent number is CN201120530430.6, a flexible circuit board, flexible circuit board have a switching board, including the substrate, the substrate includes first face and second face, the first face of substrate is equipped with the crimping finger, the second face both ends of substrate are equipped with first cover film and second cover film respectively, are equipped with the third on the crimping finger and cover the film. The first cover film and the second cover film are used as the reinforcing pieces of the adapter plate, so that the problem that the crimping area is bent and tilted due to different stresses generated by the base material, the crimping fingers and the cover films is effectively solved, and the yield and the quality of the flexible circuit board are improved.
The above patent describes a flexible circuit board, but the epoxy resin substrate of the circuit board itself has a limit in self heat dissipation, and has an influence on product stability, thermal expansion rate, processing precision, etc. since a glass-based printed board is selected, although the glass-based printed board structure has advantages of excellent heat dissipation, low thermal expansion rate, high flatness, good stability, etc., since the glass substrate is a rigid material, it cannot satisfy the three-dimensional high-density LED assembly.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the defects in the prior art and provides a flexible glass-based printed board structure.
In order to achieve the purpose, the utility model adopts the following technical scheme: a flexible glass-based printed board structure includes a mother board including a flexible substrate and a glass substrate;
the flexible substrate comprises an outer-layer copper foil a, the bottom surface of the outer-layer copper foil a is coated with an adhesive a, the bottom surface of the adhesive a is bonded with a polyimide film, the bottom surface of the polyimide film is coated with an adhesive b, the bottom surface of the adhesive b is bonded with an inner-layer copper foil a, and outer-layer blind holes a are formed in two sides of the top surface of the flexible substrate;
the flexible base plate bottom surface is equipped with the glass substrate, the coating has a hot melt adhesive between flexible base plate and the glass substrate, the glass substrate includes b inlayer copper foil, b inlayer copper foil bottom surface coating has b hot melt adhesive, b hot melt adhesive bottom surface glues there is the glass substrate, the glass through-hole has been seted up to glass substrate top surface, glass substrate bottom surface is equipped with c hot melt adhesive, c hot melt adhesive bottom surface bonds has the outer copper foil of b, the glass substrate has seted up two sets of b outer blind holes.
Preferably, the outer layer blind hole a penetrates through the outer layer copper foil a, the adhesive machine a, the polyimide film and the adhesive b.
Preferably, one group of the outer blind holes of the b outer layer penetrates through the inner copper foil of the b inner layer and the hot-melt pure glue of the b outer layer, and the other group of the outer blind holes of the b outer layer penetrates through the outer copper foil of the b outer layer and the hot-melt pure glue of the c outer layer.
Preferably, the pore diameter of the blind holes on the outer layer a and the blind holes on the outer layer b is 50-75 μm.
Preferably, the thickness of the polyimide film is 12.5 μm to 50 μm.
Preferably, the thickness of the adhesive a and the adhesive b is 5-20 μm, and the thickness of the outer copper foil a and the inner copper foil a is 18-70 μm.
Preferably, the a hot-melt pure glue is respectively bonded with the a inner layer copper foil and the b inner layer copper foil.
Preferably, the flexible substrate and the glass substrate are formed by high-temperature and high-pressure press molding.
Preferably, the glass substrate is a mother glass, and the thickness of the glass substrate is 0.10 mm to 0.5 mm.
Preferably, the glass through hole is formed by laser drilling, and the aperture of the glass through hole is 100 μm to 150 μm.
Advantageous effects
According to the utility model, the motherboard is molded by pressing the flexible substrate and the glass substrate at high temperature and high pressure, the flexible substrate is composed of an outer copper foil a, an adhesive a, a polyimide film, an adhesive b and an inner copper foil a, the glass substrate is composed of an inner copper foil b, a hot-melt pure glue b, a glass substrate, a hot-melt pure glue c and an outer copper foil b, the hot-melt pure glue b and the hot-melt pure glue c play a role in adhesion and insulation, the glass through hole is formed by laser drilling, and the conductive paste is stuffed in the glass through hole for metallization, and the traditional epoxy resin substrate is replaced by adopting a combined structure of the flexible substrate and the glass substrate, so that the problems of poor heat dissipation and stability of a product and three-dimensional assembly of a high-density LED are solved.
Drawings
FIG. 1 is an isometric view of the present invention;
FIG. 2 is a perspective view of the present invention;
fig. 3 is a cross-sectional view of the present invention.
Illustration of the drawings:
1. a motherboard; 2. a flexible substrate; 201. a outer copper foil; 202. a, gluing agent; 203. a polyimide film; 204. b, gluing agent; 205. a inner layer copper foil; 206. a, outer layer blind holes; 3. a glass substrate; 301. b inner copper foil; 302. b, hot melting pure glue; 303. a glass substrate; 304. c, hot melting pure glue; 305. b, outer copper foil; 306. a glass through hole; 307. b, outer layer blind holes; 4. a, hot melting pure glue.
Detailed Description
In order to make the technical means, the original characteristics, the achieved purposes and the effects of the utility model easily understood, the utility model is further described below with reference to the specific embodiments and the attached drawings, but the following embodiments are only the preferred embodiments of the utility model, and not all embodiments. Based on the embodiments in the implementation, other embodiments obtained by those skilled in the art without any creative efforts belong to the protection scope of the present invention.
Specific embodiments of the present invention are described below with reference to the accompanying drawings.
The specific embodiment is as follows:
referring to fig. 1 to 3, a flexible glass-based printed board structure includes a mother board 1, the mother board 1 including a flexible substrate 2 and a glass substrate 3;
the flexible substrate 2 comprises an a outer layer copper foil 201, the bottom surface of the a outer layer copper foil 201 is coated with an a adhesive 202, the bottom surface of the a adhesive 202 is bonded with a polyimide film 203, the thickness of the polyimide film 203 is 12.5-50 μm, the bottom surface of the polyimide film 203 is coated with a b adhesive 204, the bottom surface of the b adhesive 204 is bonded with an a inner layer copper foil 205, the thickness of the a adhesive 202 and the thickness of the b adhesive 204 are 5-20 μm, the thickness of the a outer layer copper foil 201 and the thickness of the a inner layer copper foil 205 are 18-70 μm, two sides of the top surface of the flexible substrate 2 are provided with a outer layer blind holes 206, and the a outer layer blind holes 206 penetrate through the a outer layer copper foil 201, the a adhesive 202, the polyimide film 203 and the b adhesive 204;
the bottom surface of the flexible substrate 2 is provided with a glass substrate 3, a hot melt pure glue 4 is coated between the flexible substrate 2 and the glass substrate 3, the flexible substrate 2 and the glass substrate 3 are in high-temperature high-pressure press-molding, the a hot melt pure glue 4 is respectively bonded with an a inner copper foil 205 and a b inner copper foil 301, the glass substrate 3 comprises a b inner copper foil 301, the thickness of the b inner copper foil 301 is 18 mu m-70 mu m, the bottom surface of the b inner copper foil 301 is coated with a b hot melt pure glue 302, the bottom surface of the b hot melt pure glue 302 is bonded with a glass substrate 303, the glass substrate 303 is made of pure glass, the thickness of the glass substrate 303 is 0.10 mm-0.5 mm, the top surface of the glass substrate 303 is provided with a glass through hole 306, the glass through hole 306 is formed by laser drilling, the aperture of the glass through hole 306 is 100 mu m-150 mu m, the bottom surface of the glass substrate 303 is provided with a c hot melt pure glue 304, the bottom surface of the c hot melt pure glue 304 is bonded with a b outer copper foil 305, the thickness of the outer layer copper plated is 18-20 microns, the glass substrate 3 is provided with two groups of outer layer blind holes 307 b, one group of outer layer blind holes 307 b penetrate through the inner layer copper foil 301 b and the hot-melt pure glue 302 b, the other group of outer layer blind holes 307 b penetrate through the outer layer copper foil 305 b and the hot-melt pure glue 304 c, the aperture of the outer layer blind holes 206 a and the outer layer blind holes 307 b is 50-75 microns, the outer layer blind holes 307 b are drilled with laser, plated with secondary outer layer filling holes, the secondary outer layer dry film, etched with secondary outer layer, AOI (argon oxygen decarburization) on the secondary outer layer, the high-density interconnection function of the blind holes of the glass substrate 3 is realized, the hot-melt pure glue 302 b, the hot-melt pure glue 304 c and the hot-melt pure glue 4 a are low-flow heat curing glue with the thickness of 20-30 microns, the surface brown oxide of the copper 1, the outer layer laser drilled with laser, the outer layer copper deposited, plated with outer layer filling holes, the resin grinded board, the outer layer dry film, the etched outer layer etched, the etched outer layer dry film, And the outer layer AOI realizes the hole metallization of the outer layer blind hole layer, thereby realizing the high-density interconnection of the inner/outer layer lines of the motherboard 1.
The working principle of the utility model is as follows: the plate is pressed and molded at high temperature and high pressure through a flexible substrate 2 and a glass substrate 3, the flexible substrate 2 is composed of an outer layer copper foil 201 a, an adhesive 202 a, a polyimide film 203, a b adhesive 204 and an inner layer copper foil 205 a, the outer layer copper foil 201 a, the polyimide film 203 and the inner layer copper foil 205 a are respectively adhered by the adhesive 202 a and the adhesive 204 b, the inner layer copper foil 301 b, the glass substrate 3 is composed of an inner layer copper foil 301 b, a hot melt pure adhesive 302 b, a glass substrate 303, a hot melt pure adhesive 304 c and an outer layer copper foil 305 b, the inner layer 301 b, the glass substrate 303 and the outer layer copper foil 305 b are respectively adhered by the hot melt pure adhesive 302 b and the hot melt pure adhesive 304 c, the flexible substrate 2 and the glass substrate 3 are adhered by the hot melt pure adhesive 4 a and pressed and molded at high temperature and high pressure, the hot melt pure adhesive 302 b and the hot melt pure adhesive 304 c play a role of adhesion and insulation, a glass through hole 306 is formed by laser drilling, and filling and printing the conductive paste to form a glass through hole 306 for metallization.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The foregoing shows and describes the general principles, essential features, and advantages of the utility model. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and the preferred embodiments of the present invention are described in the above embodiments and the description, and are not intended to limit the present invention. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (10)
1. A flexible glass-based printed board structure comprising a mother board (1), characterized in that: the mother board (1) comprises a flexible substrate (2) and a glass substrate (3);
the flexible substrate (2) comprises an a outer layer copper foil (201), an a adhesive (202) is coated on the bottom surface of the a outer layer copper foil (201), a polyimide film (203) is bonded on the bottom surface of the a adhesive (202), a b adhesive (204) is coated on the bottom surface of the polyimide film (203), an a inner layer copper foil (205) is bonded on the bottom surface of the b adhesive (204), and a outer layer blind hole (206) is formed in two sides of the top surface of the flexible substrate (2);
the utility model discloses a glass substrate, including flexible base plate (2), glass substrate (3), the coating has a hot melt adhesive (4) between flexible base plate (2) and glass substrate (3), glass substrate (3) include b inlayer copper foil (301), b inlayer copper foil (301) bottom surface coating has b hot melt adhesive (302), b hot melt adhesive (302) bottom surface bonding has glass substrate (303), glass through-hole (306) have been seted up to glass substrate (303) top surface, glass substrate (303) bottom surface is equipped with c hot melt adhesive (304), c hot melt adhesive (304) bottom surface bonding has b outer copper foil (305), two sets of b outer blind holes (307) have been seted up in glass substrate (3).
2. A flexible glass-based printed board structure according to claim 1, wherein: the outer layer a blind hole (206) penetrates through the outer layer a copper foil (201), the adhesive a (202), the polyimide film (203) and the adhesive b (204).
3. A flexible glass-based printed board structure according to claim 1, wherein: one group of the b outer layer blind holes (307) penetrate through the b inner layer copper foil (301) and the b hot melt pure glue (302), and the other group of the b outer layer blind holes (307) penetrate through the b outer layer copper foil (305) and the c hot melt pure glue (304).
4. A flexible glass-based printed board structure according to claim 1, wherein: the aperture of the outer layer blind hole (206) of the layer a and the aperture of the outer layer blind hole (307) of the layer b are 50-75 μm.
5. A flexible glass-based printed board structure according to claim 1, wherein: the thickness of the polyimide film (203) is 12.5-50 μm.
6. A flexible glass-based printed board structure according to claim 1, wherein: the thickness of the adhesive (202) a and the adhesive (204) b is 5-20 μm, and the thickness of the copper foil (201) on the outer layer a and the copper foil (205) on the inner layer a is 18-70 μm.
7. A flexible glass-based printed board structure according to claim 1, wherein: the a hot-melt pure glue (4) is respectively bonded with the a inner layer copper foil (205) and the b inner layer copper foil (301).
8. A flexible glass-based printed board structure according to claim 1, wherein: the flexible substrate (2) and the glass substrate (3) are formed by high-temperature and high-pressure pressing.
9. A flexible glass-based printed board structure according to claim 1, wherein: the glass substrate (303) is made of the plain glass, and the thickness of the glass substrate (303) is 0.10 mm-0.5 mm.
10. A flexible glass-based printed board structure according to claim 1, wherein: the glass through hole (306) is formed by laser drilling, and the aperture of the glass through hole (306) is 100-150 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122066095.5U CN215991351U (en) | 2021-08-30 | 2021-08-30 | Flexible glass-based printed board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122066095.5U CN215991351U (en) | 2021-08-30 | 2021-08-30 | Flexible glass-based printed board structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215991351U true CN215991351U (en) | 2022-03-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122066095.5U Active CN215991351U (en) | 2021-08-30 | 2021-08-30 | Flexible glass-based printed board structure |
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| Country | Link |
|---|---|
| CN (1) | CN215991351U (en) |
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2021
- 2021-08-30 CN CN202122066095.5U patent/CN215991351U/en active Active
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