CN218514588U - Circuit board assembly with embedded elastic connecting piece - Google Patents

Abstract

The application provides a circuit board assembly with an embedded elastic connecting piece, which comprises a circuit board and the elastic connecting piece, wherein the circuit board is provided with a thickness direction, the circuit board comprises a first rigid substrate, a first bonding layer, a circuit substrate, a second bonding layer and a second rigid substrate which are sequentially stacked, the circuit substrate is provided with a first through hole in a penetrating manner along the thickness direction, the first bonding layer is provided with a second through hole in a penetrating manner, the second bonding layer is provided with a third through hole in a penetrating manner, the first rigid substrate is provided with a fourth through hole in a penetrating manner, the second rigid substrate is provided with a fifth through hole in a penetrating manner, and the fourth through hole, the second through hole, the first through hole, the third through hole and the fifth through hole are sequentially communicated to form an accommodating hole; the elastic connecting piece comprises a base and a needle cylinder arranged on one side of the base, the base is arranged in a fifth through hole, part of the second bonding layer is filled in a gap between the base and the second rigid substrate, and the needle cylinder is arranged in a fourth through hole, a second through hole, a first through hole and a third through hole.

Description

Circuit board assembly with embedded elastic connecting piece

Technical Field

The application relates to a circuit board assembly with an embedded elastic connecting piece.

Background

An elastic connector (Pogo pin) is a precision connector applied to electronic products such as mobile phones, portable electronic devices, communications, automobiles, medical treatment, aerospace and the like, and is often used for signal transmission or positive and negative charging of circuit boards. In the conventional technology, when the elastic connector is connected to the circuit board, the elastic connector is usually directly soldered to the surface of the circuit board, which undoubtedly increases the overall thickness of the circuit board assembly, and is not conducive to miniaturization and thinning of the electronic product. Although the prior art attempts to embed the elastic connector partially inside the circuit board, the elastic connector is usually disposed in the opening by soldering after the opening is formed on one side of the circuit board. In this structure, the contact surface of the elastic connecting member with the hole wall of the opening is single, with the risk of insufficient welding strength.

SUMMERY OF THE UTILITY MODEL

To solve the problems in the background art, the present application provides a circuit board assembly having an embedded elastic connection member.

The application provides a circuit board assembly with an embedded elastic connecting piece, which comprises a circuit board and an elastic connecting piece, wherein the circuit board is provided with a thickness direction, the circuit board comprises a first rigid substrate, a first bonding layer, a circuit substrate, a second bonding layer and a second rigid substrate which are sequentially stacked, the thickness direction is followed, the circuit substrate is provided with a first through hole in a penetrating manner, the first bonding layer is provided with a second through hole in a penetrating manner, the second bonding layer is provided with a third through hole in a penetrating manner, the first rigid substrate is provided with a fourth through hole in a penetrating manner, the second rigid substrate is provided with a fifth through hole in a penetrating manner, and the fourth through hole, the second through hole, the first through hole, the third through hole and the fifth through hole are sequentially communicated to form an accommodating hole;

the elastic connecting piece comprises a base and a needle cylinder arranged on one side of the base, the base is arranged in the fifth through hole, part of the second bonding layer is filled in a gap between the base and the second rigid substrate, and the needle cylinder is arranged in the fourth through hole, the second through hole, the first through hole and the third through hole.

The circuit board further comprises a first outer electroplating layer and a second outer electroplating layer, wherein the first outer electroplating layer is arranged on one side of the first rigid substrate, which is far away from the first bonding layer, and the second outer electroplating layer is arranged on one side of the second rigid substrate, which is far away from the second bonding layer; the first outer electroplating layer is provided with a hole in a penetrating mode, and the hole is communicated with the fourth through hole;

the elastic connecting piece also comprises a spring and a plunger, the spring is accommodated in the needle cylinder, one end of the spring is connected to the base, and the other end of the spring is connected to the plunger;

one end of the plunger, which faces away from the spring, protrudes out of the surface of the circuit board through the open hole and the fourth through hole; one side of the base, which is deviated from the needle cylinder, is connected with the second outer side electroplated layer.

The circuit board further comprises a conductive through hole, a first solder mask layer and a second solder mask layer, the conductive through hole penetrates through the circuit board along the thickness direction, the conductive through hole and the accommodating hole are arranged at intervals, and the conductive through hole is electrically connected with the first outer electroplating layer and the second outer electroplating layer;

the first welding-proof layer is arranged on one side, deviating from the first rigid substrate, of the first outer electroplating layer, the second welding-proof layer is arranged on one side, deviating from the second rigid substrate, of the second outer electroplating layer, and part of the first welding-proof layer and the second welding-proof layer are filled into the hollow conductive through hole.

Further, the cross-sectional width of the fifth through hole is greater than the cross-sectional widths of the second through hole, the first through hole and the third through hole.

Further, the circuit substrate comprises a hard board area and a soft board area connected to the hard board area;

the circuit substrate comprises a flexible substrate, wherein a third bonding layer, a first inner side circuit layer and an inner side electroplated layer are sequentially stacked on two opposite sides of part of the flexible substrate to form the hard board area, the first through hole is formed in the hard board area, and the third bonding layer is partially filled in the first through hole;

and the other part of the flexible substrate is provided with a first covering film and a second covering film on two opposite sides respectively so as to form the flexible board area.

Furthermore, an adhesive layer and a reinforcing sheet are sequentially stacked on one side, away from the flexible substrate, of the second cover film.

Further, the flexible substrate comprises a first substrate layer, and a second inner side circuit layer and a third inner side circuit layer which are arranged on two opposite sides of the first substrate layer; the first rigid substrate comprises a second substrate layer, a first outer side circuit layer and a fourth inner side circuit layer, wherein the first outer side circuit layer and the fourth inner side circuit layer are arranged on two opposite sides of the second substrate layer;

the first base material layer is made of polyimide resin, and the second base material layer and the third base material layer are made of glass fiber epoxy resin.

Further, the fourth inner side circuit layer is connected to the syringe, and the fourth inner side circuit layer is exposed from the fourth through hole.

Furthermore, the circuit board comprises two accommodating holes which are arranged at intervals, and each accommodating hole is provided with an elastic connecting piece;

the second inner side circuit layer is provided with a first opening, the third inner side circuit layer is provided with a second opening, a third opening is arranged to penetrate through the first inner side circuit layer and the inner side electroplated layer, the fourth inner side circuit layer is provided with a fourth opening in a penetrating manner, a fifth opening is arranged to penetrate through the second outer side electroplated layer and the second outer side circuit layer, and part of the third base material layer is exposed out of the fifth opening;

the first opening, the second opening, the third opening, the fourth opening and the fifth opening are correspondingly arranged and are all arranged between the two accommodating holes, so that the two elastic connecting pieces are in insulation connection.

Furthermore, the circuit substrate further comprises a conductive hole and a conductive body, the conductive hole penetrates through the second inner side circuit layer and the first substrate layer, and the conductive hole is electrically connected with the second inner side circuit layer and the third inner side circuit layer;

the conduction body penetrates through the third bonding layer and the first inner side circuit layer, and is electrically connected with the inner side electroplated layer and the second inner side circuit layer, and the inner side electroplated layer and the third inner side circuit layer.

Compared with the prior art, the embedded elastic connecting piece's that this application provided circuit board assembly passes through set up the accepting hole in the circuit board, the accepting hole corresponds elastic connecting piece's appearance correspondence includes fifth through-hole, third through-hole, first through-hole, second through-hole and fourth through-hole, will elastic connecting piece set up in the accepting hole makes the second adhesive linkage fill through the pressfitting in the base with clearance between the first rigid substrate, thereby realize elastic connecting piece's base and cylinder part all with the pore wall of accepting hole firmly bonds, can with elastic connecting piece firmly imbeds in the circuit board, thereby both can effectively reduce circuit board assembly's thickness still and solve the not enough problem of elastic connecting piece welding strength.

Drawings

Fig. 1 is a schematic cross-sectional view of a circuit board assembly according to an embodiment of the present disclosure.

Fig. 2 is a schematic cross-sectional view of the circuit substrate shown in fig. 1.

Description of the main elements

Circuit board assembly 100

Circuit board 200

Circuit board 20

Hard plate region 201

Soft board area 202

First via 203

Flexible substrate 10

First substrate layer 101

Second inner circuit layer 102

First opening 1021

Third inner wiring layer 103

Second opening 1031

Conductive via 104

Third adhesive layer 11

First inner wiring layer 12

Inner plating layer 13

Third opening 131

First cover film 14

The first adhesive layer 141

First protective layer 142

Second cover film 15

Second adhesive layer 151

Second protective layer 152

Third adhesive layer 16

Reinforcing sheet 17

Conducting body 18

First adhesive layer 21

Second through hole 211

Second adhesive layer 22

Third via 221

First rigid substrate 23

Second base material layer 231

First outer circuit layer 232

Fourth inner wiring layer 233

Fourth opening 2331

Fourth via 234

Second rigid substrate 24

Third base material layer 241

Second outer circuit layer 242

Fifth through hole 243

Receiving hole R

The first outer plating layer 25

Opening 251

Second outer plating layer 26

Fifth opening 261

Conductive via 27

First solder mask layer 28

Second solder mask layer 29

Elastic connector 300

Base 301

Syringe 302

Spring 303

Plunger 304

The following detailed description will further illustrate the present application in conjunction with the above-described figures.

Detailed Description

The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, and not all embodiments.

In the description of the present application, it is to be understood that the terms "upper", "lower", "inside", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing the present application and simplifying the description, and do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features.

Referring to fig. 1, an embodiment of the present invention provides a circuit board assembly 100 with an embedded elastic connector, including a circuit board 200 and at least one elastic connector 300 embedded in the circuit board 200, wherein the circuit board 200 has a thickness direction a, at least one receiving hole R is formed through the circuit board 200 along a portion of the thickness direction a, and the elastic connector 300 is disposed in the receiving hole R.

The circuit board 200 includes a circuit board 20, set up in the first adhesive linkage 21 and the second adhesive linkage 22 of circuit board 20 part both sides, and set up in first adhesive linkage 21 deviates from the first rigid base plate 23 of circuit board 20 one side, set up in the second adhesive linkage 22 deviates from the second rigid base plate 24 of circuit board 20 one side still includes to superpose in proper order and locates first rigid base plate 23 deviates from first outside plating layer 25 and the first solder mask layer 28 of first adhesive linkage 21 one side, and superpose in proper order and locate second rigid base plate 24 deviates from the second outside plating layer 26 and the second solder mask layer 29 of second adhesive linkage 22 one side.

Referring to fig. 1 and fig. 2, the circuit substrate 20 includes a hard board area 201 and a soft board area 202 connected to the hard board area 201. The circuit board 20 includes a flexible substrate 10, the flexible substrate 10 includes a first substrate layer 101, a second inner side circuit layer 102 and a third inner side circuit layer 103 respectively disposed on two opposite sides of the first substrate layer 101, and a plurality of conductive holes 104, the conductive holes 104 penetrate through the second inner side circuit layer 102 and the first substrate layer 101, and the conductive holes 104 are electrically connected to the second inner side circuit layer 102 and the third inner side circuit layer 103. A portion of the flexible substrate 10 is sequentially stacked with a third adhesive layer 11, a first inner circuit layer 12, and an inner plating layer 13 on opposite sides thereof to form the hard board region 201, and another portion of the flexible substrate 10 is sequentially stacked with a first cover film 14 and a second cover film 15 on opposite sides thereof to form the soft board region 202. The first cover film 14 includes a first adhesive layer 141 and a first protective layer 142, which are stacked, and the first adhesive layer 141 is disposed between the second inner circuit layer 102 and the first protective layer 142. The second cover film 15 includes a second adhesive layer 151 and a second protective layer 152, which are stacked, and the second adhesive layer 151 is disposed between the third inner circuit layer 103 and the second protective layer 152.

The flexible printed circuit board region 202 further includes a third adhesive layer 16 and a reinforcing patch 17, and the reinforcing patch 17 is attached to one side of the second cover film 15 away from the flexible substrate 10 through the third adhesive layer 16. The hard board region 201 further includes a plurality of vias 18, the vias 18 penetrate through the third adhesive layer 11 and the first inner circuit layer 12, and the vias 18 electrically connect the first inner circuit layer 12 and the second inner circuit layer 102, and electrically connect the first inner circuit layer 12 and the third inner circuit layer 103.

The material of the first substrate layer 101 may be one or more of Polyimide (PI), thermoplastic Polyimide (TPI), polyethylene Terephthalate (PET), polyethylene Naphthalate (PEN), polyethylene (PE), polyvinyl chloride (PVC), and other high polymer materials. In this embodiment, the material of the first substrate layer 101 is PI.

The third adhesive layer 11, the first adhesive layer 21 and the second adhesive layer 22 are made of prepregs (PP), the first protective layer 142 and the second protective layer 152 are made of PI, and the first adhesive layer 141, the second adhesive layer 151 and the third adhesive layer 16 are made of acrylic hot melt adhesives (AD adhesives). The material of the reinforcing sheet 17 is stainless steel (SUS) or copper. The first outer plating layer 25 and the second outer plating layer 26 are made of copper, and the first solder resist layer 28 and the second solder resist layer 29 are made of solder resist ink such as green oil.

The first rigid substrate 23 includes a second substrate layer 231, and a first outer circuit layer 232 and a fourth inner circuit layer 233 which are disposed on two opposite sides of the second substrate layer 231, and the fourth inner circuit layer 233 faces the first adhesive layer 21 and the first adhesive layer 21 includes the fourth inner circuit layer 233. The second rigid board 24 includes a third base material layer 241 and a second outer circuit layer 242 stacked on each other, and the third base material layer 241 faces the second adhesive layer 22.

The material of the second substrate layer 231 and the third substrate layer 241 is usually selected from one of Polyimide (PI), glass fiber epoxy (FR-4), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and Polyethylene (PE). In this embodiment, the second substrate layer 231 and the third substrate layer 241 are both made of FR-4.

The circuit board 200 further includes at least one conductive via 27, the conductive via 27 penetrates the circuit board 200, the conductive via 27 and the receiving hole R are disposed at an interval, and the conductive via 27 is electrically connected to the first outer circuit layer 232, the two first inner circuit layers 12, the second inner circuit layer 102, the third inner circuit layer 103, and the second outer circuit layer 242. A portion of the first solder mask layer 28 and the second solder mask layer 29 fill into the hollow conductive vias 27.

Along the thickness direction a, at least one first through hole 203 is formed through the hard board region 201 of the circuit substrate 20, at least one second through hole 211 is formed through the first adhesive layer 21, at least one third through hole 221 is formed through the second adhesive layer 22, a first opening 251 is formed through the first solder mask layer 28 and the first outer plating layer 25, a fourth through hole 234 is formed through the first rigid substrate 23, the fourth inner circuit layer 233 is exposed from the fourth through hole 234, and a fifth through hole 243 is formed through the second rigid substrate 24. The first opening 251, the fourth through hole 234, the second through hole 211, the first through hole 203, the third through hole 221, and the fifth through hole 243 are coaxially disposed and sequentially communicated to form the receiving hole R. The cross-sectional widths of the first opening 251, the fourth through-hole 234 and the fifth through-hole 243 are greater than the cross-sectional widths of the second through-hole 211, the first through-hole 203 and the third through-hole 221.

The elastic connecting piece 300 comprises a base 301, a needle cylinder 302 arranged on one side of the base 301, a spring 303 contained in the needle cylinder 302 and connected with the base 301 at one end, and a plunger 304 partially contained in the needle cylinder 302 and connected with the other end of the spring 303. The base 301 is disposed in the fifth through hole 243, one end of the base 301 facing away from the syringe 302 is connected to the second outer plating layer 26, and a part of the second adhesive layer 22 fills a gap between the base 301 and the second rigid board 24. Most of the syringe 302 is received in the second through hole 211, the first through hole 203 and the third through hole 221, a small portion of the syringe 302 is exposed from the fourth through hole 234, and the plunger 304 protrudes from the surface of the circuit board 200 through the fourth through hole 234 and the first opening 251.

In this embodiment, the tolerance between the cross-sectional width of the first through hole 203 and the cross-sectional width of the needle cylinder 302 is ± 20 μm, the cross-sectional widths of the second through hole 211 and the third through hole 221 are 3-5 mm greater than the single side of the cross-sectional width of the needle cylinder 302, and the tolerance between the cross-sectional width of the fifth through hole 243 and the cross-sectional width of the base 301 is ± 20 μm. In addition, during actual manufacturing, the prepregs with low glue flow may be used for the first adhesive layer 21 and the second adhesive layer 22, so that the prepregs may be melt-filled into the receiving holes R during the pressing process, thereby fixing the elastic connection member 300.

It is understood that an insulating glue layer (not shown) may be further disposed on the fourth inner circuit layer 233 facing the fourth through hole 234, and the insulating glue layer is used for protecting the fourth inner circuit layer 233.

In this embodiment, the circuit board 200 is provided with two receiving holes R arranged at intervals, each receiving hole R is provided with an elastic connector 300, and the two elastic connectors 300 are connected in an insulating manner.

In this embodiment, the second inner circuit layer 102 has a first opening 1021, the third inner circuit layer 103 has a second opening 1031, and the circuit board 20 further includes a third opening 131, wherein the third opening 131 penetrates through the first inner circuit layer 12 and the inner plating layer 13. The fourth inner wiring layer 233 further has a fourth opening 2331 formed therethrough. The circuit board 200 is further provided with a fifth opening 261, the fifth opening 261 penetrates through the second outer plating layer 26 and the second outer circuit layer 242, and a part of the third substrate layer 241 is exposed through the fifth opening 261. The first opening 1021, the second opening 1031, the third opening 131, the fourth opening 2331 and the fifth opening 261 are all disposed between the two receiving holes R, so that the two elastic connecting members 300 are connected in an insulating manner at intervals.

It is understood that, through the pressing process, a portion of the third adhesive layer 11, the first adhesive layer 21 and the second adhesive layer 22 is filled into the first opening 1021, the second opening 1031, the third opening 131, the fourth opening 2331 and the fifth opening 261.

In an actual manufacturing process of the circuit board assembly 100, the base 301 and the syringe 302 are firmly bonded by first providing the first through hole 203 on the circuit substrate 20, providing the second through hole 211 on the first adhesive layer 21, providing the third through hole 221 on the second adhesive layer 22, providing the fourth through hole 234 on the first rigid substrate 23, and providing the fifth through hole 243 on the second rigid substrate 24, pre-pressing the first rigid substrate 23, the first adhesive layer 21, the circuit substrate 20, the second adhesive layer 22, and the second rigid substrate 24 in this order, and then providing the elastic connector 300 in the first through hole 203, the second through hole 211, the third through hole 221, the fourth through hole 234, and the fifth through hole 243 through a PET transfer film (not shown), and pressing. And finally, forming a closed embedded structure by copper plating and circuit manufacturing processes, and finally, forming the opening 251 by laser cutting and deep opening to enable the plunger 304 to pop out of the surface of the circuit board 200, thereby manufacturing the circuit board assembly 100.

Compared with the prior art, the circuit board assembly 100 provided by the application is through set up the accepting hole R in the circuit board 200, the accepting hole R corresponds the appearance correspondence of elastic connecting piece 300 includes fifth through-hole 243, third through-hole 221, first through-hole 203, second through-hole 211 and fourth through-hole 234 and first trompil 251, will elastic connecting piece 300 set up in accepting hole R, through the pressfitting, elastic connecting piece 300's base 301 and cylinder 302 part all with the pore wall of accepting hole R firmly bonds, can with elastic connecting piece 300 firmly buries in circuit board 200 to can effectively reduce circuit board assembly 100's thickness, and solve the problem that elastic connecting piece 300 welding strength is not enough.

The above description is only an embodiment optimized for the present application, but in practical application, the present invention is not limited to this embodiment. Other modifications and variations to the technical concept of the present application should fall within the scope of the present application for those skilled in the art.

Claims (10)

1. A circuit board assembly with an embedded elastic connecting piece is characterized by comprising a circuit board and the elastic connecting piece, wherein the circuit board is provided with a thickness direction, the circuit board comprises a first rigid substrate, a first bonding layer, a circuit substrate, a second bonding layer and a second rigid substrate which are sequentially stacked, a first through hole penetrates through the circuit substrate along the thickness direction, a second through hole penetrates through the first bonding layer, a third through hole penetrates through the second bonding layer, a fourth through hole penetrates through the first rigid substrate, a fifth through hole penetrates through the second rigid substrate, and the fourth through hole, the second through hole, the first through hole, the third through hole and the fifth through hole are sequentially communicated to form an accommodating hole;

the elastic connecting piece comprises a base and a needle cylinder arranged on one side of the base, the base is arranged in the fifth through hole, part of the second bonding layer is filled in a gap between the base and the second rigid substrate, and the needle cylinder is arranged in the fourth through hole, the second through hole, the first through hole and the third through hole.

2. The circuit board assembly of claim 1, wherein the circuit board further comprises a first outer plating layer disposed on a side of the first rigid substrate facing away from the first adhesive layer and a second outer plating layer disposed on a side of the second rigid substrate facing away from the second adhesive layer; the first outer electroplating layer is provided with a hole in a penetrating mode, and the hole is communicated with the fourth through hole;

the elastic connecting piece also comprises a spring and a plunger, the spring is accommodated in the needle cylinder, one end of the spring is connected to the base, and the other end of the spring is connected to the plunger;

one end of the plunger, which faces away from the spring, protrudes out of the surface of the circuit board through the open hole and the fourth through hole; one side of the base, which is far away from the needle cylinder, is connected with the second outer side electroplated layer.

3. The circuit board assembly of claim 2, wherein the circuit board further comprises a conductive via, a first solder mask and a second solder mask, the conductive via penetrating the circuit board in the thickness direction, the conductive via being spaced apart from the receiving hole, the conductive via electrically connecting the first outer plating layer and the second outer plating layer;

the first anti-welding layer is arranged on one side, away from the first rigid substrate, of the first outer electroplating layer, the second anti-welding layer is arranged on one side, away from the second rigid substrate, of the second outer electroplating layer, and the hollow conductive through hole is filled in the first anti-welding layer and the second anti-welding layer.

4. The circuit board assembly of claim 1, wherein a cross-sectional width of the fifth via is greater than cross-sectional widths of the second, first, and third vias along the thickness direction.

5. The circuit board assembly of claim 2, wherein the circuit substrate includes a hard board region and a soft board region connected to the hard board region;

the circuit substrate comprises a flexible substrate, wherein a third bonding layer, a first inner side circuit layer and an inner side electroplated layer are sequentially stacked on two opposite sides of part of the flexible substrate to form the hard board area, the first through hole is formed in the hard board area, and the third bonding layer is partially filled in the first through hole;

and the other part of the flexible substrate is provided with a first covering film and a second covering film on two opposite sides respectively so as to form the flexible board area.

6. The circuit board assembly according to claim 5, wherein the second cover film is laminated with an adhesive layer and a reinforcing sheet on a side facing away from the flexible substrate.

7. The circuit board assembly of claim 5, wherein the flexible substrate includes a first substrate layer and second and third inner wiring layers disposed on opposite sides of the first substrate layer;

the first rigid substrate comprises a second substrate layer, a first outer side circuit layer and a fourth inner side circuit layer, wherein the first outer side circuit layer and the fourth inner side circuit layer are arranged on two opposite sides of the second substrate layer;

the first base material layer is made of polyimide resin, and the second base material layer and the third base material layer are made of glass fiber epoxy resin.

8. The circuit board assembly of claim 7, wherein the fourth inner wiring layer is connected to the syringe, the fourth inner wiring layer being exposed by the fourth through-hole.

9. The circuit board assembly of claim 7, wherein the circuit board includes two spaced-apart receiving holes, each receiving hole having a resilient connector;

the second inner side circuit layer is provided with a first opening, the third inner side circuit layer is provided with a second opening, a third opening is arranged to penetrate through the first inner side circuit layer and the inner side electroplated layer, a fourth inner side circuit layer is provided with a fourth opening in a penetrating mode, a fifth opening is arranged to penetrate through the second outer side electroplated layer and the second outer side circuit layer, and part of the third base material layer is exposed out of the fifth opening;

the first opening, the second opening, the third opening, the fourth opening and the fifth opening are correspondingly arranged and are all arranged between the two accommodating holes, so that the two elastic connecting pieces are in insulation connection.

10. The circuit board assembly of claim 7, wherein the circuit substrate further comprises a conductive via and a via, the conductive via penetrating the second inner wiring layer and the first substrate layer, the conductive via electrically connecting the second inner wiring layer and the third inner wiring layer;

the conduction body penetrates through the third bonding layer and the first inner side circuit layer, and is electrically connected with the inner side electroplated layer and the second inner side circuit layer, and the inner side electroplated layer and the third inner side circuit layer.

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