CN220440984U - Flexible multiply wood with anti-drop structure - Google Patents
Flexible multiply wood with anti-drop structure Download PDFInfo
- Publication number
- CN220440984U CN220440984U CN202321507942.XU CN202321507942U CN220440984U CN 220440984 U CN220440984 U CN 220440984U CN 202321507942 U CN202321507942 U CN 202321507942U CN 220440984 U CN220440984 U CN 220440984U
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- CN
- China
- Prior art keywords
- layer
- copper foil
- foil circuit
- flexible multilayer
- adhesive layer
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- 239000002023 wood Substances 0.000 title description 9
- 239000010410 layer Substances 0.000 claims abstract description 133
- 239000012790 adhesive layer Substances 0.000 claims abstract description 69
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 47
- 239000011889 copper foil Substances 0.000 claims abstract description 47
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 31
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 31
- 239000010703 silicon Substances 0.000 claims abstract description 31
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 229920001721 polyimide Polymers 0.000 claims description 28
- 239000003822 epoxy resin Substances 0.000 claims description 16
- 229920000647 polyepoxide Polymers 0.000 claims description 16
- 239000003292 glue Substances 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims 2
- 238000004382 potting Methods 0.000 abstract description 25
- 238000000034 method Methods 0.000 abstract description 5
- 230000003628 erosive effect Effects 0.000 abstract description 4
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 4
- 230000002035 prolonged effect Effects 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model discloses a flexible multilayer board with an anti-falling structure, which comprises a substrate layer, wherein a first copper foil circuit layer is arranged at the top end of the substrate layer, a second adhesive layer is arranged at one end of the first copper foil circuit layer, which is far away from the substrate layer, an upper organic silicon potting adhesive layer is adhered to one end of the second adhesive layer, which is far away from the first copper foil circuit layer, and a second copper foil circuit layer is arranged at the bottom end of the substrate layer. The utility model not only reduces the phenomenon that layering and falling off occur between the plate layers of the flexible multilayer plate, but also can reduce the phenomenon that the flexible multilayer plate is stuck on a fixed plane and falls off, and can uniformly spread out the heat energy generated in the use process of the flexible multilayer plate, thereby increasing the heat dissipation area of the flexible multilayer plate, further improving the stability of the flexible multilayer plate in use, prolonging the service life of the flexible multilayer plate, reducing the phenomenon that the flexible multilayer plate is damaged due to external water stain erosion, and further prolonging the service life of the flexible multilayer plate.
Description
Technical Field
The utility model relates to the technical field of flexible multi-layer boards, in particular to a flexible multi-layer board with an anti-falling structure.
Background
Flexible multilayer boards are a type of printed circuit made from flexible insulating substrates, and such flexible multilayer boards can provide excellent electrical properties and meet the design requirements of smaller and higher density installations, also contributing to reduced assembly processes and enhanced reliability.
The current flexible multiply wood can be better provide the electric property to satisfy people's established demand, be the state that directly sets up between each sheet layer of this kind of flexible multiply wood generally, make the holistic structural property of this flexible multiply wood general, and then easily produce the phenomenon that drops, puzzles people often.
Disclosure of Invention
The utility model aims to provide a flexible multi-layer board with an anti-falling structure, which solves the problems that in the background technology, all board layers of part of flexible multi-layer boards are in a direct arrangement state, so that the whole structure performance of the flexible multi-layer board is general, and the falling phenomenon is easy to occur.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a flexible multiply wood with anti-drop structure, includes the base plate layer, the top of base plate layer is equipped with first copper foil circuit layer, the one end that the base plate layer was kept away from to first copper foil circuit layer is equipped with the second bonding glue film, the one end that first copper foil circuit layer was kept away from to the second bonding glue film is pasted and is had the organic silicon potting adhesive layer, the bottom of base plate layer is equipped with the second copper foil circuit layer, the one end that the base plate layer was kept away from to the second copper foil circuit layer is equipped with the third bonding glue film, the one end that the second copper foil circuit layer was kept away from to the third bonding glue film is pasted and is had the organic silicon potting adhesive layer down, the bottom of organic silicon potting adhesive layer is equipped with the fourth bonding glue film down, the one end that the organic silicon potting adhesive layer was kept away from down is pasted and is had the second polyimide film layer down, the bottom of second polyimide film layer is equipped with the second epoxy waterproof layer.
Preferably, a first adhesive layer is arranged at the top end of the upper organic silicon potting adhesive layer, and a first polyimide film layer is adhered to one end, far away from the upper organic silicon potting adhesive layer, of the first adhesive layer so as to protect the upper organic silicon potting adhesive layer.
Preferably, one end of the first polyimide film layer, which is far away from the first adhesive layer, is provided with a first epoxy resin waterproof layer so as to improve the waterproof performance of the flexible multilayer board.
Preferably, the thickness of the first copper foil circuit layer is equal to the thickness of the second copper foil circuit layer, and the first copper foil circuit layer and the second copper foil circuit layer are symmetrical about the center line of the substrate layer to form the main body part of the flexible multilayer board.
Preferably, an adhesive board is arranged at one end of the second epoxy resin waterproof layer far away from the second polyimide film layer, so that the instant adhesive layer is arranged.
Preferably, one end of the adhesive plate, which is far away from the second epoxy resin waterproof layer, is provided with an instant adhesive layer so as to reduce the falling phenomenon generated when the flexible multilayer plate is adhered to a fixed plane.
Compared with the prior art, the utility model has the beneficial effects that: the flexible multilayer board with the anti-falling structure not only reduces the phenomenon of layered falling between all board layers of the flexible multilayer board, but also can reduce the phenomenon that the flexible multilayer board is stuck on a fixed plane to fall off, and can uniformly spread out heat energy generated in the use process of the flexible multilayer board, so that the heat dissipation area of the flexible multilayer board is increased, the stability of the flexible multilayer board in use is further improved, the service life of the flexible multilayer board is prolonged, the phenomenon that the flexible multilayer board is damaged due to external water stain erosion is reduced, and the service life of the flexible multilayer board is further prolonged;
(1) The first polyimide film layer and the first copper foil circuit layer are adhered to the two ends of the upper organic silicon potting adhesive layer through the first adhesive layer and the second adhesive layer, the second copper foil circuit layer and the second polyimide film layer are adhered to the two ends of the lower organic silicon potting adhesive layer through the third adhesive layer and the fourth adhesive layer, so that the integral structure of the flexible multilayer board is improved, and meanwhile, the instant adhesive layer is arranged at the bottom end of the adhesive board, so that the adhesive performance of the flexible multilayer board is stronger, the layering and falling phenomenon generated between all the layers of the flexible multilayer board is reduced, and the falling phenomenon generated when the flexible multilayer board is adhered to a fixed plane can be reduced;
(2) The upper organic silicon potting adhesive layer and the lower organic silicon potting adhesive layer are respectively arranged at one ends of the first copper foil circuit layer and the second copper foil circuit layer, so that heat energy generated in the use process of the flexible multilayer board can be uniformly spread, the heat dissipation area of the flexible multilayer board is increased, the burning loss phenomenon caused by overhigh temperature at a certain place can be reduced, the stability of the flexible multilayer board in use is improved, and the service life of the flexible multilayer board is prolonged;
(3) Through setting up first epoxy waterproof layer and second epoxy waterproof layer in the one end on first polyimide film layer and second polyimide film layer respectively for the waterproof performance of this flexible multiply wood obtains promoting, in order to reduce this flexible multiply wood because of the phenomenon that external water stain erosion produced the damage, thereby further prolonged the life of this flexible multiply wood.
Drawings
FIG. 1 is a schematic elevational view of the present utility model;
FIG. 2 is a schematic view of a three-dimensional structure of the present utility model;
FIG. 3 is a schematic view of a partial enlarged structure of a first adhesive layer according to the present utility model;
FIG. 4 is a schematic view of a partial enlarged structure of an instant adhesive layer according to the present utility model;
fig. 5 is a schematic diagram of a partially enlarged structure of an organic silicon potting adhesive layer in the present utility model.
In the figure: 1. a substrate layer; 2. applying an organic silicon potting adhesive layer; 3. a first epoxy resin waterproof layer; 4. a first polyimide film layer; 5. a first adhesive layer; 6. a second adhesive layer; 7. a first copper foil circuit layer; 8. a second copper foil circuit layer; 9. a third adhesive layer; 10. a second epoxy resin waterproof layer; 11. a sticking board; 12. an instant adhesive layer; 13. a second polyimide film layer; 14. a fourth adhesive layer; 15. and a lower organic silicon potting adhesive layer.
Detailed Description
The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-5, an embodiment of the present utility model is provided: the flexible multilayer board with the anti-falling structure comprises a substrate layer 1, wherein a first copper foil circuit layer 7 is arranged at the top end of the substrate layer 1, the thickness of the first copper foil circuit layer 7 is equal to that of a second copper foil circuit layer 8, and the first copper foil circuit layer 7 and the second copper foil circuit layer 8 are symmetrical with each other about the central line of the substrate layer 1;
when in use, the first copper foil circuit layer 7 and the second copper foil circuit layer 8 are symmetrically arranged at two ends of the substrate layer 1 to form a main body part of the flexible multilayer board;
the end, far away from the substrate layer 1, of the first copper foil circuit layer 7 is provided with a second adhesive layer 6, an upper organic silicon potting adhesive layer 2 is adhered to the end, far away from the first copper foil circuit layer 7, of the second adhesive layer 6, a first adhesive layer 5 is arranged at the top end of the upper organic silicon potting adhesive layer 2, and a first polyimide film layer 4 is adhered to the end, far away from the upper organic silicon potting adhesive layer 2, of the first adhesive layer 5;
when in use, the first polyimide film layer 4 is arranged at the upper end of the upper organic silicon potting adhesive layer 2 so as to carry out protection treatment on the upper organic silicon potting adhesive layer 2;
a first epoxy resin waterproof layer 3 is arranged at one end of the first polyimide film layer 4 far away from the first adhesive layer 5;
when the flexible multilayer board is used, the waterproof performance of the flexible multilayer board is improved by arranging the first epoxy resin waterproof layer 3 at the top end of the first polyimide film layer 4;
the bottom end of the substrate layer 1 is provided with a second copper foil circuit layer 8, one end of the second copper foil circuit layer 8, which is far away from the substrate layer 1, is provided with a third adhesive layer 9, one end of the third adhesive layer 9, which is far away from the second copper foil circuit layer 8, is stuck with a lower organic silicon potting adhesive layer 15, the bottom end of the lower organic silicon potting adhesive layer 15 is provided with a fourth adhesive layer 14, one end of the fourth adhesive layer 14, which is far away from the lower organic silicon potting adhesive layer 15, is stuck with a second polyimide film layer 13, the bottom end of the second polyimide film layer 13 is provided with a second epoxy resin waterproof layer 10, and one end of the second epoxy resin waterproof layer 10, which is far away from the second polyimide film layer 13, is provided with a sticking board 11;
when in use, the adhesive plate 11 is arranged at the bottom end of the second epoxy resin waterproof layer 10 so as to carry out arrangement treatment on the instant adhesive layer 12;
an instant adhesive layer 12 is arranged at one end of the sticking board 11 far away from the second epoxy resin waterproof layer 10;
when in use, the instant adhesive layer 12 is arranged at the bottom end of the sticking board 11, so that the phenomenon that the flexible multilayer board falls off when being stuck on a fixed plane is reduced.
When the embodiment of the application is used, the upper organic silicon potting adhesive layer 2 and the lower organic silicon potting adhesive layer 15 are respectively arranged at one ends of the first copper foil circuit layer 7 and the second copper foil circuit layer 8, so that the heat energy generated in the use process of the flexible multilayer board can be uniformly spread, the heat dissipation area of the flexible multilayer board is increased, the burning loss phenomenon of the flexible multilayer board due to overhigh temperature at a certain place can be reduced, the stability of the flexible multilayer board in use is improved, the service life of the flexible multilayer board can be effectively prolonged, the waterproof performance of the flexible multilayer board is improved by respectively arranging the first epoxy resin waterproof layer 3 and the second epoxy resin waterproof layer 10 at one ends of the first polyimide film layer 4 and the second polyimide film layer 13, the damage phenomenon of the flexible multilayer board due to external water erosion is reduced, the service life of the flexible multilayer board can be further prolonged, the first polyimide film layer 4 and the first copper foil circuit layer 7 are adhered and arranged at the two ends of the upper organic silicon encapsulating adhesive layer 2 through the first adhesive layer 5 and the second adhesive layer 6, the second copper foil circuit layer 8 and the second polyimide film layer 13 are adhered and arranged at the two ends of the lower organic silicon encapsulating adhesive layer 15 through the third adhesive layer 9 and the fourth adhesive layer 14, the integral structure of the flexible multilayer board is improved, the layering shedding phenomenon between all the board layers of the flexible multilayer board can be reduced, meanwhile, the instant adhesive layer 12 is arranged at the bottom end of the adhesive board 11, the pasting performance of the flexible multilayer board is improved, the shedding phenomenon generated when the flexible multilayer board is adhered on a fixed plane can be reduced, and the use of the flexible multilayer board is completed.
Claims (4)
1. The flexible multilayer board with the anti-falling structure is characterized by comprising a substrate layer (1), a first copper foil circuit layer (7) is arranged at the top end of the substrate layer (1), a second adhesive layer (6) is arranged at one end, far away from the substrate layer (1), of the first copper foil circuit layer (7), an upper organic silicon encapsulating layer (2) is adhered to one end, far away from the first copper foil circuit layer (7), of the second copper foil circuit layer (1), a second copper foil circuit layer (8) is arranged at the bottom end, far away from the substrate layer (1), of the second copper foil circuit layer (8), a third adhesive layer (9) is arranged at one end, far away from the second copper foil circuit layer (8), of the third adhesive layer (9), a lower organic silicon encapsulating layer (15) is adhered to one end, far away from the lower organic silicon encapsulating layer (15), of the fourth adhesive layer (14) is adhered to a second polyimide film layer (13), and a second polyimide film (10) is arranged at one end, far away from the lower organic silicon encapsulating layer (15), of the second polyimide film layer (13). One end of the second epoxy resin waterproof layer (10) far away from the second polyimide film layer (13) is provided with a sticking board (11); one end of the adhesive plate (11) far away from the second epoxy resin waterproof layer (10) is provided with an instant adhesive layer (12).
2. The flexible multiwall sheet with anti-drop structures of claim 1, wherein: the top of last organosilicon filling and sealing glue layer (2) is equipped with first bonding glue film (5), the one end that goes up organosilicon filling and sealing glue layer (2) is kept away from to first bonding glue film (5) is pasted and is had first polyimide film layer (4).
3. The flexible multiwall sheet with anti-drop structures of claim 2, wherein: one end of the first polyimide film layer (4) far away from the first adhesive layer (5) is provided with a first epoxy resin waterproof layer (3).
4. The flexible multiwall sheet with anti-drop structures of claim 1, wherein: the thickness of the first copper foil circuit layer (7) is equal to that of the second copper foil circuit layer (8), and the first copper foil circuit layer (7) and the second copper foil circuit layer (8) are symmetrical with respect to the central line of the substrate layer (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321507942.XU CN220440984U (en) | 2023-06-14 | 2023-06-14 | Flexible multiply wood with anti-drop structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321507942.XU CN220440984U (en) | 2023-06-14 | 2023-06-14 | Flexible multiply wood with anti-drop structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220440984U true CN220440984U (en) | 2024-02-02 |
Family
ID=89685483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321507942.XU Active CN220440984U (en) | 2023-06-14 | 2023-06-14 | Flexible multiply wood with anti-drop structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220440984U (en) |
-
2023
- 2023-06-14 CN CN202321507942.XU patent/CN220440984U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |