CN103260342A - Flexible printed circuit (FPC) double-layer board - Google Patents
Flexible printed circuit (FPC) double-layer board Download PDFInfo
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- CN103260342A CN103260342A CN2013101603764A CN201310160376A CN103260342A CN 103260342 A CN103260342 A CN 103260342A CN 2013101603764 A CN2013101603764 A CN 2013101603764A CN 201310160376 A CN201310160376 A CN 201310160376A CN 103260342 A CN103260342 A CN 103260342A
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- adhesive tape
- transparent adhesive
- upper strata
- lower floor
- road transparent
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Abstract
The invention discloses a flexible printed circuit (FPC) double-layer board which comprises a protecting film, a first transparent adhesive tape, a conducting layer, a second transparent adhesive tape, a base material and a pad plating layer. The FPC double-layer board is characterized in that the first transparent adhesive tape is arranged on the protecting layer, the first transparent adhesive tape and the conducting layer are mutually fixed and bonded, the lower end of the conducting layer is further provided with the second transparent adhesive tape, the second transparent adhesive tape and the base material are mutually fixed and bonded, and the pad plating layer is arranged on the first transparent adhesive tape. The FPC double-layer board is high in flexibility and pad flatness, and low in manufacturing cost.
Description
Technical field
The present invention relates to the flexible PCB field, relate in particular to a kind of FPC flexible circuit doubling plate.
Background technology
Along with increasing mobile phone adopts flip structure, flexible PCB also more and more is used thereupon.Combination according to base material and conductive layer is divided, and flexible PCB can be divided into two kinds: glue flexible board and no glue flexible board are arranged.
The price of wherein not having the glue flexible board is more much higher than the flexible board that glue is arranged, because the price of no glue flexible board is too high, most flexible boards of using in market at present still have the flexible board of glue, and doubling plate flexible PCB utilization more especially.
Summary of the invention
Technical problem to be solved by this invention provides a kind of higher pliability that not only has, and the flatness of pad is also higher, and also low FPC flexible circuit doubling plate of manufacturing cost.
For solving the problems of the technologies described above; the invention provides a kind of FPC flexible circuit doubling plate; comprise the upper strata diaphragm; the upper strata first road transparent adhesive tape; the upper strata conductive layer; the upper strata second road transparent adhesive tape; base material; pad coating; via hole; lower floor's diaphragm; lower floor's first road transparent adhesive tape; lower floor's conductive layer; lower floor's second road transparent adhesive tape; it is characterized in that: described upper strata diaphragm is provided with the upper strata first road transparent adhesive tape; the described upper strata first road transparent adhesive tape and upper strata conductive layer interfix bonding; conductive layer lower end, described upper strata also is provided with the upper strata second road transparent adhesive tape; the described upper strata second road transparent adhesive tape and base material interfix bonding, and described pad coating is arranged on the first road transparent adhesive tape of upper strata.
Further; described lower floor diaphragm is provided with lower floor's first road transparent adhesive tape; the described lower floor first road transparent adhesive tape and lower floor's conductive layer interfix bonding, also are provided with lower floor's second road transparent adhesive tape above the described lower floor conductive layer, and the described lower floor second road transparent adhesive tape and base material interfix bonding.
Further, the described upper strata first road transparent adhesive tape, upper strata conductive layer, the upper strata second road transparent adhesive tape, base material, lower floor's first road transparent adhesive tape, lower floor's conductive layer, lower floor's second road transparent adhesive tape are provided with via hole.
Further, described upper strata diaphragm, lower floor's diaphragm, substrate material are polyimides.
Further, the described upper strata first road transparent adhesive tape, the upper strata second road transparent adhesive tape, lower floor's first road transparent adhesive tape, lower floor's second road transparent adhesive tape material are epoxy resin or polyethylene.
Further, described upper strata conductive layer, lower floor's conductive are Copper Foil
A nearlyer step, described pad coating material is gold, tin or scolding tin.
Compared with prior art, beneficial effect of the present invention is: the present invention not only has higher pliability, and the flatness of pad is also higher, and manufacturing cost is also low.
Description of drawings
Fig. 1 is structural representation of the present invention.
Number in the figure:
Conductive layer 4-upper strata, transparent adhesive tape 3-upper strata, first road, diaphragm 2-upper strata, the 1-upper strata second road transparent adhesive tape 5-base material 6-pad coating
The first conductive layer 4-4-lower floor of road transparent adhesive tape 3-3 lower floor of diaphragm 2-2-lower floor of 7-via hole 1-1-lower floor, the second road transparent adhesive tape.
Embodiment
Below in conjunction with the drawings and specific embodiments the present invention is described in further details
Referring to shown in Figure 1; a kind of FPC flexible circuit doubling plate; comprise upper strata diaphragm 1; the upper strata first road transparent adhesive tape 2; upper strata conductive layer 3; the upper strata second road transparent adhesive tape 4; base material 5; pad coating 6; via hole 7; the diaphragm 1-1 of lower floor; the first road transparent adhesive tape 2-2 of lower floor; the conductive layer 3-3 of lower floor; the second road transparent adhesive tape 4-4 of lower floor; described upper strata diaphragm 1 is provided with the upper strata first road transparent adhesive tape 2; the described upper strata first road transparent adhesive tape 2 interfixes bonding with upper strata conductive layer 3; conductive layer 3 lower ends, described upper strata also are provided with the upper strata second road transparent adhesive tape 4; the described upper strata second road transparent adhesive tape 4 interfixes bonding with base material 5; described pad coating 6 is arranged on the first road transparent adhesive tape 2 of upper strata; the described diaphragm 1-1 of lower floor is provided with the first road transparent adhesive tape 2-2 of lower floor; the described first road transparent adhesive tape 2-2 of lower floor and the conductive layer 3-3 of lower floor interfix bonding; also be provided with the second road transparent adhesive tape 4-4 of lower floor above the described conductive layer 3-3 of lower floor; the described second road transparent adhesive tape 4-4 of lower floor also interfixes bonding with base material 5; the described upper strata first road transparent adhesive tape 2; upper strata conductive layer 3; the upper strata second road transparent adhesive tape 4; base material 5; the first road transparent adhesive tape 2-2 of lower floor; the conductive layer 3-3 of lower floor; the second road transparent adhesive tape 4-4 of lower floor is provided with via hole 7; described upper strata diaphragm 1; the diaphragm 1-1 of lower floor; base material 5 materials are polyimides; the described upper strata first road transparent adhesive tape 2; the upper strata second road transparent adhesive tape 4; the first road transparent adhesive tape 2-2 of lower floor; lower floor's second road transparent adhesive tape 4-4 material is epoxy resin or polyethylene; described upper strata conductive layer 3; lower floor's conductive layer 3-3 material is Copper Foil, and described pad coating 6 materials are gold; tin or scolding tin.
To sum up, the present invention not only has higher pliability, and the flatness of pad is also higher, and manufacturing cost is also low.
The above only is preferred embodiments of the present invention; protection scope of the present invention is not limited with above-mentioned execution mode; as long as the equivalence that those of ordinary skills do according to disclosed content is modified or changed, all should include in the protection range of putting down in writing in claims.
Claims (7)
1. FPC flexible circuit doubling plate; comprise the upper strata diaphragm; the upper strata first road transparent adhesive tape; the upper strata conductive layer; the upper strata second road transparent adhesive tape; base material; pad coating; via hole; lower floor's diaphragm; lower floor's first road transparent adhesive tape; lower floor's conductive layer; lower floor's second road transparent adhesive tape; it is characterized in that: described upper strata diaphragm is provided with the upper strata first road transparent adhesive tape; the described upper strata first road transparent adhesive tape and upper strata conductive layer interfix bonding; conductive layer lower end, described upper strata also is provided with the upper strata second road transparent adhesive tape; the described upper strata second road transparent adhesive tape and base material interfix bonding, and described pad coating is arranged on the first road transparent adhesive tape of upper strata.
2. a kind of FPC flexible circuit doubling plate according to claim 1; it is characterized in that: described lower floor diaphragm is provided with lower floor's first road transparent adhesive tape; the described lower floor first road transparent adhesive tape and lower floor's conductive layer interfix bonding; also be provided with lower floor's second road transparent adhesive tape above the described lower floor conductive layer, the described lower floor second road transparent adhesive tape and base material interfix bonding.
3. a kind of FPC flexible circuit doubling plate according to claim 1, it is characterized in that: the described upper strata first road transparent adhesive tape, upper strata conductive layer, the upper strata second road transparent adhesive tape, base material, lower floor's first road transparent adhesive tape, lower floor's conductive layer, lower floor's second road transparent adhesive tape are provided with via hole.
4. a kind of FPC flexible circuit doubling plate according to claim 1, it is characterized in that: described upper strata diaphragm, lower floor's diaphragm, substrate material are polyimides.
5. a kind of FPC flexible circuit doubling plate according to claim 1, it is characterized in that: the described upper strata first road transparent adhesive tape, the upper strata second road transparent adhesive tape, lower floor's first road transparent adhesive tape, lower floor's second road transparent adhesive tape material are epoxy resin or polyethylene.
6. a kind of FPC flexible circuit doubling plate according to claim 1, it is characterized in that: described upper strata conductive layer, lower floor's conductive are Copper Foil.
7. a kind of FPC flexible circuit doubling plate according to claim 1 is characterized in that: described pad coating material is gold, tin or scolding tin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101603764A CN103260342A (en) | 2013-05-04 | 2013-05-04 | Flexible printed circuit (FPC) double-layer board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101603764A CN103260342A (en) | 2013-05-04 | 2013-05-04 | Flexible printed circuit (FPC) double-layer board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103260342A true CN103260342A (en) | 2013-08-21 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013101603764A Pending CN103260342A (en) | 2013-05-04 | 2013-05-04 | Flexible printed circuit (FPC) double-layer board |
Country Status (1)
| Country | Link |
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| CN (1) | CN103260342A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109475039A (en) * | 2017-09-08 | 2019-03-15 | 东莞骅国电子有限公司 | Meagre binary channels flexible circuit bridging line |
| CN110519941A (en) * | 2019-07-09 | 2019-11-29 | 安徽捷鑫光电科技有限公司 | A kind of processing method in flexibility led circuit board function hole |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201015912Y (en) * | 2007-01-15 | 2008-02-06 | 夏超华 | Rubber-resisted film for FPC soft board conventional pressing |
| US20100326704A1 (en) * | 2009-06-30 | 2010-12-30 | Wintek Corporation | Soldering pad layout for flexible printed circuit board |
| CN202095174U (en) * | 2011-05-23 | 2011-12-28 | 上海中航光电子有限公司 | Flexible printed circuit for LCM (liquid crystal module) |
| CN203233593U (en) * | 2013-05-04 | 2013-10-09 | 鑫茂电子（昆山）有限公司 | FPC flexible circuit double-layer board |
-
2013
- 2013-05-04 CN CN2013101603764A patent/CN103260342A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201015912Y (en) * | 2007-01-15 | 2008-02-06 | 夏超华 | Rubber-resisted film for FPC soft board conventional pressing |
| US20100326704A1 (en) * | 2009-06-30 | 2010-12-30 | Wintek Corporation | Soldering pad layout for flexible printed circuit board |
| CN202095174U (en) * | 2011-05-23 | 2011-12-28 | 上海中航光电子有限公司 | Flexible printed circuit for LCM (liquid crystal module) |
| CN203233593U (en) * | 2013-05-04 | 2013-10-09 | 鑫茂电子（昆山）有限公司 | FPC flexible circuit double-layer board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109475039A (en) * | 2017-09-08 | 2019-03-15 | 东莞骅国电子有限公司 | Meagre binary channels flexible circuit bridging line |
| CN110519941A (en) * | 2019-07-09 | 2019-11-29 | 安徽捷鑫光电科技有限公司 | A kind of processing method in flexibility led circuit board function hole |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130821 |