CN203233593U - FPC flexible circuit double-layer board - Google Patents
FPC flexible circuit double-layer board Download PDFInfo
- Publication number
- CN203233593U CN203233593U CN 201320235458 CN201320235458U CN203233593U CN 203233593 U CN203233593 U CN 203233593U CN 201320235458 CN201320235458 CN 201320235458 CN 201320235458 U CN201320235458 U CN 201320235458U CN 203233593 U CN203233593 U CN 203233593U
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- adhesive tape
- transparent adhesive
- upper strata
- lower floor
- road transparent
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Abstract
The utility model discloses an FPC flexible circuit double-layer board which comprises a protective film, a first transparent glue, a conductive layer, a second transparent glue, a substrate and a bonding pad coating. The FPC flexible circuit double-layer board is characterized in that the first transparent glue is disposed on the protective film and fixedly glued with the conductive layer, the second transparent glue is disposed under the conductive layer and fixedly glued with the substrate, and the bonding pad coating is disposed on the first transparent glue. The FPC flexible circuit double-layer board is advantaged by high flexibility, high flatness of the bonding pad and low manufacture cost.
Description
Technical field
The utility model relates to the flexible PCB field, relates in particular to a kind of FPC flexible circuit doubling plate.
Background technology
Along with increasing mobile phone adopts flip structure, flexible PCB also more and more is used thereupon.Combination according to base material and conductive layer is divided, and flexible PCB can be divided into two kinds: glue flexible board and no glue flexible board are arranged.
The price of wherein not having the glue flexible board is more much higher than the flexible board that glue is arranged, because the price of no glue flexible board is too high, most flexible boards of using in market at present still have the flexible board of glue, and doubling plate flexible PCB utilization more especially.
Summary of the invention
Technical problem to be solved in the utility model provides a kind of higher pliability that not only has, and the flatness of pad is also higher, and also low FPC flexible circuit doubling plate of manufacturing cost.
For solving the problems of the technologies described above; the utility model provides a kind of FPC flexible circuit doubling plate; comprise the upper strata diaphragm; the upper strata first road transparent adhesive tape; the upper strata conductive layer; the upper strata second road transparent adhesive tape; base material; pad coating; via hole; lower floor's diaphragm; lower floor's first road transparent adhesive tape; lower floor's conductive layer; lower floor's second road transparent adhesive tape; it is characterized in that: described upper strata diaphragm is provided with the upper strata first road transparent adhesive tape; the described upper strata first road transparent adhesive tape and upper strata conductive layer interfix bonding; conductive layer lower end, described upper strata also is provided with the upper strata second road transparent adhesive tape; the described upper strata second road transparent adhesive tape and base material interfix bonding, and described pad coating is arranged on the first road transparent adhesive tape of upper strata.
Further; described lower floor diaphragm is provided with lower floor's first road transparent adhesive tape; the described lower floor first road transparent adhesive tape and lower floor's conductive layer interfix bonding, also are provided with lower floor's second road transparent adhesive tape above the described lower floor conductive layer, and the described lower floor second road transparent adhesive tape and base material interfix bonding.
Further, the described upper strata first road transparent adhesive tape, upper strata conductive layer, the upper strata second road transparent adhesive tape, base material, lower floor's first road transparent adhesive tape, lower floor's conductive layer, lower floor's second road transparent adhesive tape are provided with via hole.
Further, described upper strata diaphragm, lower floor's diaphragm, substrate material are polyimides.
Further, the described upper strata first road transparent adhesive tape, the upper strata second road transparent adhesive tape, lower floor's first road transparent adhesive tape, lower floor's second road transparent adhesive tape material are epoxy resin or polyethylene.
Further, described upper strata conductive layer, lower floor's conductive are Copper Foil
A nearlyer step, described pad coating material is gold, tin or scolding tin.
Compared with prior art, the beneficial effects of the utility model are: the utility model not only has higher pliability, and the flatness of pad is also higher, and manufacturing cost is also low.
Description of drawings
Fig. 1 is the utility model structural representation.
Number in the figure:
Conductive layer 4-upper strata, transparent adhesive tape 3-upper strata, first road, diaphragm 2-upper strata, the 1-upper strata second road transparent adhesive tape 5-base material 6-pad coating
The first conductive layer 4-4-lower floor of road transparent adhesive tape 3-3 lower floor of diaphragm 2-2-lower floor of 7-via hole 1-1-lower floor, the second road transparent adhesive tape.
Embodiment
Below in conjunction with the drawings and specific embodiments the utility model is described in further details
Referring to shown in Figure 1; a kind of FPC flexible circuit doubling plate; comprise upper strata diaphragm 1; the upper strata first road transparent adhesive tape 2; upper strata conductive layer 3; the upper strata second road transparent adhesive tape 4; base material 5; pad coating 6; via hole 7; the diaphragm 1-1 of lower floor; the first road transparent adhesive tape 2-2 of lower floor; the conductive layer 3-3 of lower floor; the second road transparent adhesive tape 4-4 of lower floor; described upper strata diaphragm 1 is provided with the upper strata first road transparent adhesive tape 2; the described upper strata first road transparent adhesive tape 2 interfixes bonding with upper strata conductive layer 3; conductive layer 3 lower ends, described upper strata also are provided with the upper strata second road transparent adhesive tape 4; the described upper strata second road transparent adhesive tape 4 interfixes bonding with base material 5; described pad coating 6 is arranged on the first road transparent adhesive tape 2 of upper strata; the described diaphragm 1-1 of lower floor is provided with the first road transparent adhesive tape 2-2 of lower floor; the described first road transparent adhesive tape 2-2 of lower floor and the conductive layer 3-3 of lower floor interfix bonding; also be provided with the second road transparent adhesive tape 4-4 of lower floor above the described conductive layer 3-3 of lower floor; the described second road transparent adhesive tape 4-4 of lower floor also interfixes bonding with base material 5; the described upper strata first road transparent adhesive tape 2; upper strata conductive layer 3; the upper strata second road transparent adhesive tape 4; base material 5; the first road transparent adhesive tape 2-2 of lower floor; the conductive layer 3-3 of lower floor; the second road transparent adhesive tape 4-4 of lower floor is provided with via hole 7; described upper strata diaphragm 1; the diaphragm 1-1 of lower floor; base material 5 materials are polyimides; the described upper strata first road transparent adhesive tape 2; the upper strata second road transparent adhesive tape 4; the first road transparent adhesive tape 2-2 of lower floor; lower floor's second road transparent adhesive tape 4-4 material is epoxy resin or polyethylene; described upper strata conductive layer 3; lower floor's conductive layer 3-3 material is Copper Foil, and described pad coating 6 materials are gold; tin or scolding tin.
To sum up, the utility model not only has higher pliability, and the flatness of pad is also higher, and manufacturing cost is also low.
The above only is preferred embodiments of the present utility model; protection range of the present utility model is not limited with above-mentioned execution mode; as long as the equivalence that those of ordinary skills do according to the utility model institute disclosure is modified or changed, all should include in the protection range of putting down in writing in claims.
Claims (7)
1. FPC flexible circuit doubling plate; comprise the upper strata diaphragm; the upper strata first road transparent adhesive tape; the upper strata conductive layer; the upper strata second road transparent adhesive tape; base material; pad coating; via hole; lower floor's diaphragm; lower floor's first road transparent adhesive tape; lower floor's conductive layer; lower floor's second road transparent adhesive tape; it is characterized in that: described upper strata diaphragm is provided with the upper strata first road transparent adhesive tape; the described upper strata first road transparent adhesive tape and upper strata conductive layer interfix bonding; conductive layer lower end, described upper strata also is provided with the upper strata second road transparent adhesive tape; the described upper strata second road transparent adhesive tape and base material interfix bonding, and described pad coating is arranged on the first road transparent adhesive tape of upper strata.
2. a kind of FPC flexible circuit doubling plate according to claim 1; it is characterized in that: described lower floor diaphragm is provided with lower floor's first road transparent adhesive tape; the described lower floor first road transparent adhesive tape and lower floor's conductive layer interfix bonding; also be provided with lower floor's second road transparent adhesive tape above the described lower floor conductive layer, the described lower floor second road transparent adhesive tape and base material interfix bonding.
3. a kind of FPC flexible circuit doubling plate according to claim 1, it is characterized in that: the described upper strata first road transparent adhesive tape, upper strata conductive layer, the upper strata second road transparent adhesive tape, base material, lower floor's first road transparent adhesive tape, lower floor's conductive layer, lower floor's second road transparent adhesive tape are provided with via hole.
4. a kind of FPC flexible circuit doubling plate according to claim 1, it is characterized in that: described upper strata diaphragm, lower floor's diaphragm, substrate material are polyimides.
5. a kind of FPC flexible circuit doubling plate according to claim 1, it is characterized in that: the described upper strata first road transparent adhesive tape, the upper strata second road transparent adhesive tape, lower floor's first road transparent adhesive tape, lower floor's second road transparent adhesive tape material are epoxy resin or polyethylene.
6. a kind of FPC flexible circuit doubling plate according to claim 1, it is characterized in that: described upper strata conductive layer, lower floor's conductive are Copper Foil.
7. a kind of FPC flexible circuit doubling plate according to claim 1 is characterized in that: described pad coating material is gold, tin or scolding tin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320235458 CN203233593U (en) | 2013-05-04 | 2013-05-04 | FPC flexible circuit double-layer board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320235458 CN203233593U (en) | 2013-05-04 | 2013-05-04 | FPC flexible circuit double-layer board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203233593U true CN203233593U (en) | 2013-10-09 |
Family
ID=49289692
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320235458 Expired - Fee Related CN203233593U (en) | 2013-05-04 | 2013-05-04 | FPC flexible circuit double-layer board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203233593U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103260342A (en) * | 2013-05-04 | 2013-08-21 | 鑫茂电子（昆山）有限公司 | Flexible printed circuit (FPC) double-layer board |
| CN111867228A (en) * | 2019-04-25 | 2020-10-30 | 深圳正峰印刷有限公司 | Flexible circuit board and preparation process thereof |
-
2013
- 2013-05-04 CN CN 201320235458 patent/CN203233593U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103260342A (en) * | 2013-05-04 | 2013-08-21 | 鑫茂电子（昆山）有限公司 | Flexible printed circuit (FPC) double-layer board |
| CN111867228A (en) * | 2019-04-25 | 2020-10-30 | 深圳正峰印刷有限公司 | Flexible circuit board and preparation process thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131009 Termination date: 20180504 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |