CN106028643B - The production method of flexible mainboard, flexible display device and flexible mainboard - Google Patents
The production method of flexible mainboard, flexible display device and flexible mainboard Download PDFInfo
- Publication number
- CN106028643B CN106028643B CN201610352839.0A CN201610352839A CN106028643B CN 106028643 B CN106028643 B CN 106028643B CN 201610352839 A CN201610352839 A CN 201610352839A CN 106028643 B CN106028643 B CN 106028643B
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- China
- Prior art keywords
- motherboard
- mainboard
- core board
- flexible
- core
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/058—Direct connection between two or more FPCs or between flexible parts of rigid PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention discloses a kind of flexible mainboards, the flexibility mainboard includes motherboard and core board, the motherboard folds structure using two layers of flexible circuit board, and external interface is installed on the motherboard, the core board folds structure using at least four layers of flexible circuit board, and core chips is installed on the core board, the core board edge is stamp hole structure, and the core board is welded on the motherboard in the stamp hole structure position.A kind of flexible display device and a kind of production method of flexible mainboard is also disclosed in the present invention.Mainboard is integrally resolved into the core board of installation core chips and the motherboard of installation external tapping by the present invention, with stamp hole connection type, not only make core board and motherboard stable connection but also remain the flexibility after core board welding, guarantee flexible mainboard basic function under normal circumstances, effectively reduces the material cost of flexible mainboard.
Description
Technical field
The present invention relates to flexible display technologies fields, more particularly, to a kind of flexible mainboard, flexible display device and flexibility
The production method of mainboard.
Background technique
In the modern life, the intelligent display devices such as mobile phone, plate have increasingly consequence in people's lives,
User to equipment function and intelligence propose high request while, appearance and novelty to the innovation of equipment there has also been
Increasingly higher demands.Based on this, either mobile phone or plate all start to develop to flexibility direction now, have it is flexible,
The mainboard of bent characteristic is also the prerequisite feature of equipment institute.FPC (Flexible Printed Circuit) flexible wire
It is a kind of high reliability and flexible printing electricity made of substrate that road plate, which is with polyimides (PI) or polyester film (PET),
Road, abbreviation soft board, it has the characteristics that Distribution density is high, light-weight, thickness is thin.In Flexible Displays, FPC replaces hard PCB
As trend, the mainboard of the equipment such as mobile phone, plate also starts using FPC as development trend.
In the prior art, to meet equipment performance requirement, mainboard integrally uses multi-layer FPC to fold structure, peripheral interface components
Be mounted on mainboard entirety with core chips, since multi-layer FPC mainboard is expensive, particularly with industry control panel size compared with
Big plate, cost is very high, is unfavorable for the future development of flexible display technologies.
Summary of the invention
The technical problem to be solved in the present invention is to provide the production methods of a kind of flexible mainboard and flexible mainboard, to solve
Flexible mainboard integrally uses multi-layer soft wiring board to fold the problem that structure causes flexible display device material cost high in the prior art.
In order to solve the above technical problems, on the one hand, the present invention provides a kind of flexible mainboard, and the flexibility mainboard includes motherboard
With core board, the motherboard folds structure using two layers of flexible circuit board, and external interface is installed on the motherboard, the core board
Structure is folded using at least four layers of flexible circuit board, and core chips is installed on the core board, the core board edge is
Stamp hole structure, the core board are welded on the motherboard in the stamp hole structure position.
Further, the stamp hole structure includes multiple coupling parts and multiple transition portions, each coupling part with
Each transition portion alternately connects, and the coupling part is welded and fixed with the motherboard, and the transition portion is for realizing institute
State the bending of flexible mainboard.
Further, the external interface is installed on the outer edge of the motherboard.
Further, the core board is installed on the master surface, and the core board and the external interface are in described
The same side of motherboard.
Further, the installation region of the core board size is reserved in the master surface, the installation region includes pair
Answer the pad of the coupling part position of the stamp hole structure.
Further, the core chips includes sound card chip, microprogram processing chip, memory chip and Flash chip, institute
Stating external interface includes switch, key, camera and USB interface.
On the one hand, the present invention provides a kind of flexible display device, and the flexible display device includes display panel and this hair
The bright flexible mainboard, the flexibility mainboard, which drives the display panel to work and controls the display panel, shows image.
On the other hand, the present invention provides a kind of production method of flexible mainboard, comprising:
Folded structure at least four layers of flexible circuit board form core board, and core chips is installed on the core board, will be described
Core board edge is made stamp hole structure, and the stamp hole structure includes multiple coupling parts and multiple transition portions, each described
Coupling part replaces connection with each transition portion；
Flexible circuit board described in folded two layers of structure forms motherboard, and external interface is installed on the motherboard；
The core board is welded on the motherboard in the coupling part position of the stamp hole structure, the mistake
Part is crossed for realizing the bending of the flexible mainboard.
Further, " folded two layers of flexible circuit board of structure forms motherboard, and external interface is installed on the motherboard " step packet
It includes: reserving the installation region of the core board size in the center of the motherboard, the installation region includes described in correspondence
The external interface, is installed on the outer edge of the motherboard by the pad of the stamp hole structure position of core board.
Further, it includes: using weldering that the core board " is welded on the motherboard to " step in the stamp hole site
Tin is by the weldering of the coupling part of the stamp hole structure of the core board and the installation region of the motherboard
Disk welds together.
Beneficial effects of the present invention are as follows: the core board that multi-layer FPC folds structure is welded in two at the stamp hole structure at edge
Layer FPC is folded on the motherboard of structure, and mainboard integrally resolves into the core board of installation core chips and the motherboard of installation external tapping, with postal
Ticket hole connection type had not only made core board and motherboard stable connection but also had remained the flexibility after core board welding, and guaranteed Flexible Main
Plate entirety basic function under normal circumstances, effectively reduces the material cost of flexible mainboard.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
Other obvious modes of texturing are obtained according to these attached drawings.
Fig. 1 is the flexible mainboard schematic diagram that the embodiment of the present invention one provides.
Fig. 2 is the partial schematic diagram of the stamp hole structure for the flexible mainboard that the embodiment of the present invention one provides.
Fig. 3 is the flexible display device schematic diagram that the embodiment of the present invention one provides.
Fig. 4 is flexible mainboard schematic diagram provided by Embodiment 2 of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Fig. 1 is the flexible mainboard schematic diagram that provides of the embodiment of the present invention one, as shown, flexible mainboard include motherboard 10 with
Core board 20.Wherein, motherboard 10 is that two layers of flexible circuit board folds structure composition, and core board 20 is that multi-layer soft wiring board folds structure group
At in a kind of embodiment, core board 20 is folded structure by 4 layers of flexible circuit board and formed, and certainly, according to the function of core chips and goes out
Line factor, the folded structure number of plies of core board 20 can be 6 layers, 8 layers it is even more.For save the cost, the area of core board 20 is most
It measures small.Wherein a kind of flexible circuit board to be with polyimides (PI) or polyester film (PET) be made of substrate high reliability and
Flexible printed circuit.20 edge of core board is stamp hole structure 22, and in conjunction with Fig. 2, stamp hole structure 22 includes multiple alternatings
The coupling part 222 of connection and transition portion 224, coupling part 222 are semicircle, and in a kind of embodiment, core board 20 will
It is installed on the center of motherboard 10, the installation region of 20 size of core board is reserved in the center of motherboard 10, and in corresponding postal
222 position of coupling part of ticket pore structure 22 is provided with pad, and the coupling part 222 of stamp hole structure 22 is connected by scolding tin 30
With the pad of installation region, core board 20 is welded on motherboard 10, Fig. 1 only schematical sections scolding tin 30.Motherboard 10 is outside it
Multiple external interfaces, including switch 102, key 104, camera 106 and usb 1 08 etc. are installed, external interface is used at edge
Control or operation of the user to equipment are connect or realized with external equipment.Core chips, including Flash are installed on core board 20
Chip 202, sound card chip 204, microprogram processing chip 206, memory chip 208 and other core chipss 210, core chips are used
In each function of realizing flexible display device.
Flexible circuit board has many advantages such as that saving space, mitigation weight and flexibility are high, but higher cost is limitation
An important factor for it develops.The flexible mainboard that the embodiment of the present invention one provides is led to by the core board 20 that multi-layer soft wiring board folds structure
Cross stamp hole structure 22 be welded in two layers of flexible circuit board fold structure motherboard 10 pad on, the stamp hole structure of core board 20 with
The reserved installation region of motherboard 10 and pad ensure that the precision of welding, coupling part 222 and the pad of stamp hole structure 22
Solder joint bond strength is high, and transition portion 224 remains the flexibility of the flexible and flexible mainboard entirety of core board 20 simultaneously.It should
Embodiment had not only guaranteed that the function of core chips can be realized normally, but also reduced the material consumption of flexible circuit board, reduced material
Expect cost.
The embodiment of the present invention one provide flexible mainboard the production method is as follows:
Step 1, folded four layers of flexible circuit board of structure form core board 20, and stamp hole structure is made in the edge of core board 20
22, stamp hole structure 22 replaced by semicircular coupling part 222 with transition portion 224 connection forms, by Flash chip 202,
Sound card chip 204, microprogram processing chip 206, memory chip 208 and other core chipss 210 are installed on the core board 20
On；
Step 2, folded two layers of flexible circuit board of structure form motherboard 10, reserve 20 size of core board in the center of motherboard 10
Installation region, and pad is set in 22 position of stamp hole structure of corresponding core board 20, by switch 102, key 104, images
The external interfaces such as first 106 and usb 1 08 are installed on the outer edge of motherboard 10；
The coupling part 222 of stamp hole structure 22 is welded on the pad of motherboard 10 by step 3 using scolding tin 30, makes core
Core 20 is fixed on the reserved area of motherboard 10.
The production method for the flexible mainboard that the embodiment of the present invention one provides is welded on pad by stamp hole structure 22
Method links together the core board 20 of multi-laminate structure and the motherboard 10 of two stacking structures, and stamp hole structure 22 retains core board 20
Flexibility, guaranteeing flexible mainboard basic function under normal circumstances, effectively reducing the material cost of flexible mainboard.
Fig. 3 is the flexible display device schematic diagram that the embodiment of the present invention one provides, and flexible display device includes flexible mainboard 1
With display panel 2, display panel 2 equally have the characteristics that it is bent, display flexible display device integrally there is flexible bendable.
It being connect using the flexible mainboard 1 that the embodiment of the present invention one provides with display panel 2, flexible mainboard 1 drives display panel 2 to work,
Flexible display device shows that image, flexible mainboard 1 control the display panel 2 display images by the display surface of display panel 2
Content, in conjunction with Fig. 1, the external interface completion flexible display device of flexible mainboard 1 and the connection of other equipment or operator are to soft
Property display equipment partial function control, as usb 1 08 and other equipment complete data exchange, switch 102 or key 104
Complete control etc. of the operator to flexible display device.
Flexible display device is different from existing ordinary flat and shows equipment, has the characteristics that flexible bendable, to use
Person brings entirely different usage experience and application range is wider.There is flexible display device ordinary flat to show the complete of equipment
Function cooperates flexible mainboard 1, and the production material cost of flexible display device substantially reduces, and has better application prospect.
Fig. 4 is flexible mainboard schematic diagram provided by Embodiment 2 of the present invention, as shown, the embodiment and embodiment one
Difference is that the flexibility mainboard has multiple cores plate 20.In a kind of embodiment, flexible mainboard has two core boards 20,
Respectively the first core board 24 and the second core board 26, certainly, the quantity of core board 20 can be more.On first core board 24
Flash chip 202, sound card chip 204, microprogram processing chip 206 and memory chip 208 are installed, pacified on the second core board 26
Fill other core chipss 210.First core board 24 and 26 edge of the second core board are equipped with stamp hole 22, and on motherboard 10 in
Heart district domain is reserved with the position of corresponding two core boards 20 and two installation regions of size, and installation region edge is equipped with correspondence
The pad of stamp hole structure 22.First core board 24, the second core board 26 pass sequentially through scolding tin 30 for respective stamp hole structure
22 are welded on pad, the first core board 24, the second core board 26 are fixed on the corresponding installation region of motherboard 10, Fig. 4 only shows
Part scolding tin 30 out.
One core board 20 is split as multiple cores plate 20, each core by flexibility mainboard provided by Embodiment 2 of the present invention
Several different core chipss are installed on plate 20, guarantees that flexible mainboard basic function is normal, effectively reduces the material of flexible mainboard
While expecting cost, there is gap due to being mounted between each core board 20 on motherboard 10, improve the flexibility of flexible mainboard.
Above disclosed is only several preferred embodiments of the present invention, cannot limit the power of the present invention with this certainly
Sharp range, those skilled in the art can understand all or part of the processes for realizing the above embodiment, and weighs according to the present invention
Benefit requires made equivalent variations, still belongs to the scope covered by the invention.
Claims (9)
1. a kind of flexibility mainboard, it is characterised in that: the flexibility mainboard includes motherboard and core board, and the motherboard is soft using two layers
Property wiring board fold structure, and external interface is installed on the motherboard, the core board uses at least four layers of flexible circuit board
Folded structure, and core chips is installed on the core board, the core board edge is stamp hole structure, and the core board is described
Stamp hole structure position is welded on the motherboard, and the stamp hole structure includes multiple coupling parts and multiple transition portions,
Each coupling part replaces connection with each transition portion, and the coupling part is welded and fixed with the motherboard, the mistake
Part is crossed for realizing the bending of the flexible mainboard.
2. flexibility mainboard according to claim 1, which is characterized in that the external interface is installed on the outside of the motherboard
Edge.
3. flexibility mainboard according to claim 2, which is characterized in that the core board is installed on the master surface, institute
It states core board and the external interface is in the same side of the motherboard.
4. flexibility mainboard according to claim 3, which is characterized in that reserve the core board size in the master surface
Installation region, the installation region includes the pad of the coupling part position of the corresponding stamp hole structure.
5. flexibility mainboard according to claim 1, which is characterized in that the core chips includes sound card chip, microprogram
Chip, memory chip and Flash chip are handled, the external interface includes switch, key, camera and USB interface.
6. a kind of flexible display device, which is characterized in that the flexible display device includes that display panel and claim 1-5 appoint
Flexible mainboard described in meaning one, the flexibility mainboard drive the display panel to work and control the display panel display figure
Picture.
7. a kind of production method of flexibility mainboard characterized by comprising
Folded structure at least four layers of flexible circuit board form core board, core chips are installed on the core board, by the core
Stamp hole structure is made in edges of boards edge, and the stamp hole structure includes multiple coupling parts and multiple transition portions, each connection
Part replaces connection with each transition portion；
Flexible circuit board described in folded two layers of structure forms motherboard, and external interface is installed on the motherboard；
The core board is welded on the motherboard in the coupling part position of the stamp hole structure, the transition part
Divide for realizing the bending of the flexible mainboard.
8. the production method of flexibility mainboard according to claim 7, which is characterized in that " folded two layers of flexible circuit board group of structure
At motherboard, external interface is installed on the motherboard " step includes: to reserve the core board in the center of the motherboard
The installation region of size, the installation region includes the pad of the stamp hole structure position of the corresponding core board, by institute
State the outer edge that external interface is installed on the motherboard.
9. the production method of flexibility mainboard according to claim 8, which is characterized in that " in the stamp hole site by institute
Core board is stated to be welded on the motherboard " step includes: described in the stamp hole structure using scolding tin by the core board
Coupling part is together with the pad solder of the installation region of the motherboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610352839.0A CN106028643B (en) | 2016-05-25 | 2016-05-25 | The production method of flexible mainboard, flexible display device and flexible mainboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610352839.0A CN106028643B (en) | 2016-05-25 | 2016-05-25 | The production method of flexible mainboard, flexible display device and flexible mainboard |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106028643A CN106028643A (en) | 2016-10-12 |
| CN106028643B true CN106028643B (en) | 2018-12-07 |
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ID=57093748
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201610352839.0A Active CN106028643B (en) | 2016-05-25 | 2016-05-25 | The production method of flexible mainboard, flexible display device and flexible mainboard |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107278027A (en) * | 2017-07-12 | 2017-10-20 | 武汉华星光电技术有限公司 | Circuit board and mobile terminal |
| CN107322116B (en) * | 2017-07-28 | 2019-10-08 | 信利半导体有限公司 | A kind of production method of lamp bar |
| WO2021128366A1 (en) * | 2019-12-28 | 2021-07-01 | 瑞声声学科技(深圳)有限公司 | Electronic element packaging structure |
| CN113133228A (en) * | 2020-01-15 | 2021-07-16 | 铜陵睿变电路科技有限公司 | Flexible circuit board module made of multiple films and manufacturing method |
| CN111447734B (en) * | 2020-03-27 | 2022-05-10 | 绍兴上虞锴达电子有限公司 | Portable circuit board |
| CN113438800B (en) * | 2021-06-29 | 2023-04-07 | 展讯通信（上海）有限公司 | Terminal device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5864463A (en) * | 1992-11-13 | 1999-01-26 | Seiko Epson Corporation | Electronic device having connector with rows of terminals divided by ribs and ground or power terminal adjacent ribs |
| CN203352944U (en) * | 2013-05-30 | 2013-12-18 | 航天科工深圳（集团）有限公司 | PCB with stamp holes |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05206603A (en) * | 1992-01-28 | 1993-08-13 | Sumitomo Electric Ind Ltd | Flexible printed wiring board |
-
2016
- 2016-05-25 CN CN201610352839.0A patent/CN106028643B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5864463A (en) * | 1992-11-13 | 1999-01-26 | Seiko Epson Corporation | Electronic device having connector with rows of terminals divided by ribs and ground or power terminal adjacent ribs |
| CN203352944U (en) * | 2013-05-30 | 2013-12-18 | 航天科工深圳（集团）有限公司 | PCB with stamp holes |
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| Publication number | Publication date |
|---|---|
| CN106028643A (en) | 2016-10-12 |
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