CN107322116B - A kind of production method of lamp bar - Google Patents
A kind of production method of lamp bar Download PDFInfo
- Publication number
- CN107322116B CN107322116B CN201710632586.7A CN201710632586A CN107322116B CN 107322116 B CN107322116 B CN 107322116B CN 201710632586 A CN201710632586 A CN 201710632586A CN 107322116 B CN107322116 B CN 107322116B
- Authority
- CN
- China
- Prior art keywords
- fpc
- full page
- single plate
- mother matrix
- production method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The invention discloses a kind of production methods of lamp bar, comprising: step 1: providing full page FPC；Step 2: painting tin cream on all pads of the full page FPC；Step 3: soldered elements are set on all tin creams；Step 4: melting all tin creams, weld together all pads and soldered elements all；It wherein, further include step A before the either step in step 2,3 and 4: the relative position between mother matrix FPC and all single plate FPC in the fixed full page FPC.The production method can prevent the generation for a problem that leading to soldered elements appearance inclination, rosin joint between mother matrix FPC and single plate FPC when carrying out SMT Reflow Soldering, in the full page FPC because of extruding, being uneven.
Description
Technical field
The present invention relates to field of backlights more particularly to a kind of production methods of lamp bar.
Background technique
Lamp bar used in backlight mainly includes FPC and several LED and the resistance that are welded on the FPC, the LED
Welding with resistance is completed on full page FPC, as shown in Figure 1-3, the full page FPC 1 includes mother matrix FPC 11 and more
A single plate FPC 12, between mother matrix FPC 11 and single plate FPC 12 by outline die formed several tiny tie points 13 into
Row layout connection, since FPC is very soft and very thin, the full page FPC 1 carry out SMT Reflow Soldering when, single plate FPC 12 be easy by
The problems such as there is warpage or high-temperature expansion to influences such as temperature, air-flows, and then lead to tin cream 2 with the generation extruding of mother matrix FPC 11
Injustice finally makes the soldered elements 3 on pad a problem that inclination, rosin joint, be uneven occur, for LED, these
Unfavorable condition can impact backlight effect and brightness.
Summary of the invention
In order to solve above-mentioned the deficiencies in the prior art, the present invention provides a kind of production method of lamp bar, can prevent into
When row SMT Reflow Soldering, soldered elements are caused to incline because of extruding between the mother matrix FPC and single plate FPC in the full page FPC
Tiltedly, rosin joint, the generation for a problem that being uneven.
The technical problems to be solved by the invention are achieved by the following technical programs:
A kind of production method of lamp bar, includes the following steps:
Step 1: providing full page FPC, the full page FPC includes mother matrix FPC and multiple single plate FPC, and all single plate FPC are all provided with
It sets in the mother matrix FPC and is connect by several tie points with the mother matrix FPC, all had on each single plate FPC complete
Route and have several pads；
Step 2: painting tin cream on all pads of the full page FPC；
Step 3: soldered elements are set on all tin creams；
Step 4: melting all tin creams, weld together all pads and soldered elements all；
It wherein, further include step A before the either step in step 2,3 and 4: the mother matrix in the fixed full page FPC
Relative position between FPC and all single plate FPC.
Further, the step A includes:
Step A1: providing fixed device, and the fixed device has the placement region of the full page FPC, the rest area
Domain is provided with multiple suction holes and is connected with air extractor；
Step A2: before step 2, the full page FPC being placed in the placement region of the fixed device, described more
A suction hole covers the mother matrix FPC and all single plate FPC；
Step A3: between step 2 ~ step 4, opening the air extractor, by the full page by way of vacuumizing
Each position of FPC is each attached in the placement region, with opposite between fixation the mother matrix FPC and all single plate FPC
Position.
Further, the step A includes:
Step A1: providing fixed device, and the fixed device has the placement region of the full page FPC, and is pressed together on
Laminating mechanism in the placement region；
Step A2: before step 2, the full page FPC is placed in the placement region of the fixed device；
Step A3: after step 3, the laminating mechanism is pressed together on the full page FPC of the placement region, with fixation
Relative position between the mother matrix FPC and all single plate FPC.
Further, the stitching surface of the laminating mechanism offered on the position for corresponding to all pads avoid it is described
Several avoiding hollow grooves of soldered elements.
Further, between the placement region of the fixed device and the stitching surface of the laminating mechanism by gravity and/
Or magnetic attraction is pressed.
Further, the step 1 includes:
Step 1.1: providing master FPC, the master FPC includes multiple firstth areas that shape corresponds to multiple single plate FPC
Domain all has complete route on each first area and has several pads；
Step 1.2: the shape of multiple first areas on the master FPC is punched out, formed have mother matrix FPC and
The full page FPC of multiple single plate FPC.
Further, the soldered elements include luminescent device and/or resistance.
Further, the step 4 is completed by SMT reflow soldering process.
The invention has the following beneficial effects: the production methods before carrying out SMT Reflow Soldering to the full page FPC, first
The relative position between the mother matrix FPC and all single plate FPC is fixed by modes such as gravity, vacuum adsorption force or magnetic attractions,
It prevents when carrying out SMT Reflow Soldering, soldered elements is caused inclination, void occur between the mother matrix FPC and single plate FPC because of extruding
The generation for a problem that welding, being uneven.
Detailed description of the invention
Fig. 1 is the schematic diagram of existing full page FPC；
Fig. 2 is enlarged drawing at the A of full page FPC shown in FIG. 1；
Fig. 3 is soldered elements rugged schematic diagram after SMT Reflow Soldering；
Fig. 4 is the step block diagram of the production method of lamp bar provided by the invention；
Fig. 5 is a kind of schematic diagram of fixing means of full page FPC provided by the invention；
Fig. 6 is the schematic diagram of another fixing means of full page FPC provided by the invention.
Specific embodiment
The present invention will be described in detail with reference to the accompanying drawings and examples.
As shown in figure 4, a kind of production method of lamp bar, includes the following steps:
Step 1: providing full page FPC 1, as illustrated in fig. 1 and 2, the full page FPC 1 includes mother matrix FPC 11 and multiple lists
Version FPC 12, all single plate FPC 12 are arranged in the mother matrix FPC 11 and by several tie points 13 and the mother matrix
The connection of FPC 11 all has complete route on each single plate FPC 12 and has several pads；
Step 2: painting tin cream on all pads of the full page FPC 1；
Step 3: soldered elements are set on all tin creams；
Step 4: melting all tin creams, weld together all pads and soldered elements all；
It wherein, further include step A before the either step in step 2,3 and 4: the mother matrix in the fixed full page FPC 1
Relative position between FPC 11 and all single plate FPC 12.
The production method to the full page FPC 1 carry out SMT Reflow Soldering before, first pass through gravity, vacuum adsorption force or
Relative position between the fixed mother matrix FPC 11 and all single plate FPC 12 of the modes such as magnetic attraction prevents from carrying out SMT times
When fluid welding, soldered elements is caused inclination, rosin joint, height occur not between the mother matrix FPC 11 and single plate FPC 12 because of extruding
The generation of equality unfavorable condition.
A kind of fixed form that the technical program provides are as follows: the step A includes:
Step A1: providing fixed device, and the fixed device has the placement region of the full page FPC 1, the placement
Region is provided with multiple suction holes 42 and is connected with air extractor；
Step A2: before step 2, the full page FPC 1 being placed in the placement region of the fixed device, described
Multiple suction holes 42 cover the mother matrix FPC 11 and all single plate FPC 12；
Step A3: between step 2 ~ step 4, opening the air extractor, by the full page by way of vacuumizing
Each position of FPC 1 is each attached in the placement region, with fixation the mother matrix FPC 11 and all single plate FPC 12 it
Between relative position.
Specifically, being made on the surface of the supporting plate 41 as shown in figure 5, the fixed device specifically includes a supporting plate 41
There are multiple suction holes 42 and be connected with air extractor, the full page FPC 1 is placed and carries out brush tin on the surface of the supporting plate 41
Cream and the equal operation of the setting soldered elements 3, and the pumping is opened on the either step before melting to the tin cream
Device of air is evacuated the multiple suction hole 42, and the mother matrix FPC 11 is fixed in the way of vacuum suction and is owned
Relative position between single plate FPC 12.
Another fixed form that the technical program provides are as follows: the step A includes:
Step A1: providing fixed device, and the fixed device has the placement region of the full page FPC 1, and pressing
Laminating mechanism in the placement region；
Step A2: before step 2, the full page FPC 1 is placed in the placement region of the fixed device；
Step A3: after step 3, the laminating mechanism being pressed together on the full page FPC 1 of the placement region, with solid
Relative position between the fixed mother matrix FPC 11 and all single plate FPC 12.
Specifically, as shown in fig. 6, the fixed device specifically includes a supporting plate 41 and a pressing plate 43, by the full page FPC
Brush tin cream is carried out on the surface of the 1 placement supporting plate 41 and the equal operation of the soldered elements 3 is set, and to tin cream progress
The pressing plate 43 is pressed together on the full page FPC 1 before fusing, fixes the mother matrix using the gravity of the pressing plate 43
Relative position between FPC 11 and all single plate FPC 12.
Wherein, the stitching surface of the laminating mechanism (the i.e. described pressing plate 43) opens up on the position for corresponding to all pads
There are several avoiding hollow grooves 44 for avoiding the soldered elements 3；The pressing plate 43 can be plastics or metal etc., and preferred density is biggish
Metal material, such as stainless steel plate or iron plate etc., theoretically the weight of the pressing plate 43 is the bigger the better.
Between the placement region of the fixed device and the stitching surface of the laminating mechanism by gravity and/or magnetic attraction into
Row pressing.
It, can be between the i.e. described supporting plate 41 and pressing plate 43 on the basis of the gravity using the pressing plate 43 is pressed
The supporting plate 41 and pressing plate 43 are designed as to have magnetic attraction between each other, to be pressed simultaneously using gravity and magnetic attraction
It closes, for example, the supporting plate 41, which uses in magnetic material production or the supporting plate 41, is provided with magnetic force generation mechanism, the pressing plate
43 are made of the metal material with magnetic conductivity.
The step 1 includes:
Step 1.1: providing master FPC, the master FPC includes multiple first that shape corresponds to multiple single plate FPC 12
Region all has complete route on each first area and has several pads；
Step 1.2: the shape of multiple first areas on the master FPC being punched out, being formed has mother matrix FPC
The full page FPC 1 of 11 and multiple single plate FPC 12.
The soldered elements include luminescent device and/or resistance；The step 4 is preferably but not limited to through SMT Reflow Soldering
Technique is completed.
Embodiments of the present invention above described embodiment only expresses, the description thereof is more specific and detailed, but can not
Therefore limitations on the scope of the patent of the present invention are interpreted as, as long as skill obtained in the form of equivalent substitutions or equivalent transformations
Art scheme should all be fallen within the scope and spirit of the invention.
Claims (8)
1. a kind of production method of lamp bar, which comprises the steps of:
Step 1: providing full page FPC, the full page FPC includes mother matrix FPC and multiple single plate FPC, and all single plate FPC are arranged at
In the mother matrix FPC and by several tie points and the mother matrix FPC coplanar connection, all had completely on each single plate FPC
Route and have several pads；
Step 2: painting tin cream on all pads of the full page FPC；
Step 3: soldered elements are set on all tin creams；
Step 4: melting all tin creams, weld together all pads and soldered elements all；
Wherein, further include step A before the either step in step 2,3 and 4: the mother matrix FPC and all single plate FPC are consolidated
It is scheduled on a fixed device, with the relative position between the mother matrix FPC and all single plate FPC in the fixation full page FPC.
2. the production method of lamp bar according to claim 1, which is characterized in that the step A includes:
Step A1: providing fixed device, and the fixed device has the placement region of the full page FPC, and the placement region is opened
There are multiple suction holes and is connected with air extractor；
Step A2: before step 2, the full page FPC is placed in the placement region of the fixed device, the multiple suction
Stomata covers the mother matrix FPC and all single plate FPC；
Step A3: between step 2 ~ step 4, opening the air extractor, by the full page FPC's by way of vacuumizing
Each position is each attached in the placement region, with the relative position between fixation the mother matrix FPC and all single plate FPC.
3. the production method of lamp bar according to claim 1, which is characterized in that the step A includes:
Step A1: providing fixed device, and the fixed device has the placement region of the full page FPC, and is pressed together on described
Laminating mechanism in placement region；
Step A2: before step 2, the full page FPC is placed in the placement region of the fixed device；
Step A3: after step 3, the laminating mechanism is pressed together on the full page FPC of the placement region, described in fixation
Relative position between mother matrix FPC and all single plate FPC.
4. the production method of lamp bar according to claim 3, which is characterized in that the stitching surface of the laminating mechanism is in correspondence
In offering several avoiding hollow grooves for avoiding the soldered elements on the position of all pads.
5. the production method of lamp bar according to claim 3, it is characterised in that: the placement region of the fixed device and institute
It states and is pressed between the stitching surface of laminating mechanism by gravity and/or magnetic attraction.
6. according to claim 1 in -5 any lamp bar production method, it is characterised in that: the step 1 includes:
Step 1.1: providing master FPC, the master FPC includes multiple first areas that shape corresponds to multiple single plate FPC, often
Complete route is all had on a first area and there are several pads；
Step 1.2: the shape of multiple first areas on the master FPC being punched out, being formed has mother matrix FPC and multiple
The full page FPC of single plate FPC.
7. according to claim 1 in -5 any lamp bar production method, it is characterised in that: the soldered elements include hair
Optical device and/or resistance.
8. according to claim 1 in -5 any lamp bar production method, which is characterized in that the step 4 passes through SMT and returns
Fluid welding technique is completed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710632586.7A CN107322116B (en) | 2017-07-28 | 2017-07-28 | A kind of production method of lamp bar |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710632586.7A CN107322116B (en) | 2017-07-28 | 2017-07-28 | A kind of production method of lamp bar |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107322116A CN107322116A (en) | 2017-11-07 |
| CN107322116B true CN107322116B (en) | 2019-10-08 |
Family
ID=60226512
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710632586.7A Active CN107322116B (en) | 2017-07-28 | 2017-07-28 | A kind of production method of lamp bar |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107322116B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108012457A (en) * | 2018-01-19 | 2018-05-08 | 南京利景盛电子有限公司 | A kind of soft or hard compoboard double-sided bottom welds a reflux technique method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102858095A (en) * | 2012-08-27 | 2013-01-02 | 歌尔声学股份有限公司 | Supporting jig of flexible circuit board |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101384136B (en) * | 2008-10-17 | 2014-04-02 | 林克治 | Surface mounting process for flexible circuit board and used magnetic tool and steel mesh |
| CN103068159B (en) * | 2012-12-14 | 2015-12-09 | 意力(广州)电子科技有限公司 | A large FPC and composition method when making FPC |
| CN104244573A (en) * | 2014-08-21 | 2014-12-24 | 世一电子科技（惠州）有限公司 | Flexible printed circuit board and flexible printed circuit board reflow soldering method |
| CN104295973A (en) * | 2014-10-11 | 2015-01-21 | 京东方光科技有限公司 | Light bar manufacturing method |
| CN106028643B (en) * | 2016-05-25 | 2018-12-07 | 武汉华星光电技术有限公司 | The production method of flexible mainboard, flexible display device and flexible mainboard |
| CN105898988B (en) * | 2016-06-01 | 2018-10-02 | 深圳市汇晨电子股份有限公司 | Backlight FPC full pages glued membrane and its whole rubberizing technique |
| CN206024415U (en) * | 2016-08-19 | 2017-03-15 | 江苏力德尔电子信息技术有限公司 | Justifying FPC clip sucker |
| CN106304688B (en) * | 2016-08-24 | 2019-03-08 | 广州明美新能源有限公司 | The welding structure and its welding method of PCB and FPCB |
| CN106180956B (en) * | 2016-08-25 | 2019-08-23 | 南京中电熊猫照明有限公司 | FPC lamp bar Multifunctional reflux jig |
-
2017
- 2017-07-28 CN CN201710632586.7A patent/CN107322116B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102858095A (en) * | 2012-08-27 | 2013-01-02 | 歌尔声学股份有限公司 | Supporting jig of flexible circuit board |
Non-Patent Citations (1)
| Title |
|---|
| FPC SMT 解决方案;林科智;《2008中国高端SMT学术会议论文集》;20081021;全文 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107322116A (en) | 2017-11-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107322116B (en) | A kind of production method of lamp bar | |
| CN105960107A (en) | Steel net kit and method for applying steel net kit to weld interface component | |
| CN108269792A (en) | Waterfall wire bonding | |
| CN103313527A (en) | Furnace-through fixture for reflow soldering | |
| CN103108498A (en) | Method of placing parts on printed circuit board (PCB) circuit board surfaces | |
| CN209133467U (en) | A kind of multi-chip package production line merging SMT process | |
| CN103985686B (en) | A kind of IGBT module welded encapsulation structure | |
| CN106612592B (en) | Pre-plating tin formation system and its method | |
| CN109192683A (en) | A kind of MCM integrated antenna package production line merging SMT process | |
| CN103327751B (en) | Fixing heater, wirebonding device and the wire bonding method thereof of PCB | |
| CN109119393A (en) | A kind of MCM integrated circuit package structure merging SMT | |
| CN206759828U (en) | A kind of molten riveting integrated module of PCB pressings | |
| CN206366749U (en) | Micro metal connector welding tool in a kind of mobile device antenna | |
| CN208336164U (en) | Device for integrated antenna package welding | |
| CN107524941B (en) | A kind of production method of lamp bar | |
| TWI278878B (en) | Coil with pads and manufacturing method thereof | |
| CN207104054U (en) | Solder fixture on a kind of ammeter terminal | |
| JP5397120B2 (en) | Soldering method and soldering apparatus | |
| CN108799281A (en) | Glass panel component adhesive tool and adhering method | |
| CN108962857A (en) | A kind of SIP integrated circuit package structure merging SMT | |
| CN109273376A (en) | A kind of SIP integrated circuit packaging method merging SMT | |
| CN109087876A (en) | A kind of SIP integrated antenna package production line merging SMT process | |
| CN211828687U (en) | Chip ball planting device | |
| CN204810690U (en) | Circuit plate voltage stay knot that inlayer has mosaic constructs | |
| JP2008071997A (en) | Manufacturing method of substrate for mounting electronic part |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |