CN208336164U - Device for integrated antenna package welding - Google Patents
Device for integrated antenna package welding Download PDFInfo
- Publication number
- CN208336164U CN208336164U CN201821033316.0U CN201821033316U CN208336164U CN 208336164 U CN208336164 U CN 208336164U CN 201821033316 U CN201821033316 U CN 201821033316U CN 208336164 U CN208336164 U CN 208336164U
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- Prior art keywords
- metal pins
- integrated antenna
- antenna package
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- area
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Abstract
The device that the utility model relates to weld for integrated antenna package, characterized by comprising: operation area is used to accommodate the integrated antenna package；Heat block is set in operation area and has groove and side, and groove is for accommodating substrate and bare die；Integrated antenna package further includes metal pins, and metal pins are set on side；Briquetting, it is used to high-temperature plastic being pressed into metal pins, the region of metal pins bonded with high-temperature plastic is the first area of metal pins, metal pins are not the second area of metal pins with the region of high-temperature plastic bonding, and the second area of metal pins is for welding lead to be electrically connected with bare die；The region that the first area of metal pins is projected in the upper surface of side is the first surface region of side, and the region that the second area of metal pins is projected in the upper surface of side is the second surface region of side；The plane where plane and second surface region where first surface region has an angle.
Description
Technical field
This application involves integrated antenna package welding technology fields, more particularly to the dress welded for integrated antenna package
It sets.
Background technique
In the technical process of integrated antenna package welding, since the pin of integrated antenna package is generally drawn using metal
Foot, due to the ductility of metal itself, after being pressed another part of metal pins can generate a part of metal pins
Upwarp and float, in this way, generate this part metals pin for upwarping and floating be easy to produce when being used for welding lead rosin joint or
Other defects for reducing the reliability of integrated antenna package subsequent technique process of person, can reduce product yield in this way.
Utility model content
Device provided by the embodiment of this exposure for integrated antenna package welding can effectively solve existing integrated electricity
Because of rosin joint caused by the upwarping of metal pins and the low technical problem of product reliability when the welded encapsulation of road.
The embodiment of this exposure provides a kind of device for integrated antenna package welding, and described device is characterized in that
Include: operation area, the operation area for accommodating the integrated antenna package, wherein the integrated antenna package include substrate and
Bare die, the bare die are set on the substrate；Heat block is set in the operation area and has groove and side, institute
Groove is stated for accommodating the substrate and the bare die；Wherein, the integrated antenna package further includes metal pins, the metal
Pin is set on the side；Briquetting is used to for high-temperature plastic to be pressed into the metal pins, wherein the metal pins
With the high-temperature plastic bonding region be the metal pins first area, the metal pins not with the resistance to height
The region of warm glue bond is the second area of the metal pins, the second areas of the metal pins for welding lead with
The bare die electrical connection；It is the side that wherein the first area of the metal pins, which is projected in the region of the upper surface of the side,
The first surface region in portion, the region that the second area of the metal pins is projected in the upper surface of the side is the side
Second surface region；Wherein, the plane where the first surface region and the plane where the second surface region have
There is an angle.
Detailed description of the invention
It is the partial cross section structural representation of the device for integrated antenna package welding of one embodiment of this exposure shown in Fig. 1
Figure.
It is the cross section structure of the heat block of the device for integrated antenna package welding of one embodiment of this exposure shown in Fig. 2
Schematic diagram.
It is the structural schematic diagram of the device for integrated antenna package welding of one embodiment of this exposure shown in Fig. 3.
It is one of workspace of the device for integrated antenna package welding of one embodiment of this exposure shown in Fig. 4
Structural schematic diagram.
Specific embodiment
This exposure embodiment provides many different embodiments or example of the different characteristic for implementing this exposure embodiment.
The particular instance of component and arrangement is described below to simplify this exposure embodiment.
For ease of description, " first ", " second ", " third " etc. can be used to distinguish herein a figure or a series of figures
Different components." first ", " second ", " third " etc. are not intended to describe corresponding component.
As shown in Fig. 1,3 and 4, the device 4 for integrated antenna package welding includes operation area 1, heat block 10 and briquetting
11, wherein operation area 1 is for accommodating integrated antenna package, which includes substrate 22 and bare die 23, and bare die 23 is set
It is placed on substrate 22.Heat block 10 is set in operation area 1 and has groove 102 and side 101, and groove 102 is for accommodating lining
Bottom 22 and bare die 23, wherein integrated antenna package further includes metal pins 21, and metal pins 21 are set on side 101.Briquetting
11 for being pressed into metal pins 21 for high-temperature plastic 25, and the region that wherein metal pins 21 and high-temperature plastic 25 bond is metal
The first area 211 of pin, the region of metal pins 21 not bonded with high-temperature plastic 25 are the second area of metal pins 21
212, the second area 212 of metal pins 21 is welded with the conducting wire 24 being electrically connected with bare die 23.
As shown in Fig. 2, the region that the first area 211 of the metal pins 21 is projected in the upper surface of side 101 is side
The first surface region 111 in portion 101, the region that the second area 212 of metal pins 21 is projected in the upper surface of side 101 is side
The second surface region 112 in portion 101, the plane where plane and second surface region 112 where first surface region 111
(see the dotted line in Fig. 2) has an angle 3.
Due to being produced between the 112 place plane of 111 place plane of first surface region and second surface region of side 101
A raw angle, makes second surface region 112 relative to 111 1 inclined-plane of first surface region, to work as the of metal pins 21
One region 211 is pressed when upwarping the second area 212 of metal pins 21, the second surface area of the side 101 of heat block 10
Domain 112 can provide support force to the second area 212 upwarped, thus the floating for avoiding second area 212 from generating because upwarping.
In this way in subsequent welding process, rosin joint will not be generated or rear because of floating because of the second area 212 of metal pins 21
The low defect of reliability is generated in continuous technical process, improves the yields of integrated antenna package in this way.
In one embodiment of this exposure, which can be a flat surface, or a cambered surface, here
It's not limited to that, can be selected according to the actual situation.
In one embodiment of this exposure, the groove 102 of heat block 10 is by side 101 around forming or groove 102 is located at
Between side 101.Wherein, when the groove 102 of heat block 10 is surrounded by side 101 to be formed, 4 sides of the integrated antenna package are equal
With metal pins.When groove 102 is between side 101, integrated antenna package can have gold for only its opposite sides
Belong to pin.It should be noted that the integrated antenna package is not limited to only quadrangle, or other shapes, here not
Make specific limit.
In one embodiment of this exposure, the angle 3 is 1.0 degree~10.0 degree.Angle 3 is in one embodiment of this exposure
3.0 degree.
The material of metal pins, heat block and the high-temperature plastic has no specifically limited, common material in various this fields
It may be used in the utility model.In one embodiment of this exposure, the material of the metal pins 21 is copper.It is real in this exposure one
It applies in example, the material of the heat block 10 is steel.In one embodiment of this exposure, the material of the high-temperature plastic is polytetrafluoroethylene (PTFE),
The tolerable temperature of high-temperature plastic may range from 500 DEG C~2300 DEG C.
In one embodiment of this exposure, as shown in figure 3, the device 4 for integrated antenna package welding includes multiple operations
Area 1 is provided with a heat block 10, corresponding 1 briquetting 11 in each operation area 1 in each operation area 1.It is illustrated in figure 41
The structural schematic diagram of corresponding 1 briquetting 11 in operation area 1.
It should be noted that meaning to connect to " one embodiment of this exposure " or the reference of similar terms throughout this manual
It is contained at least one embodiment and can may not be presented on a particular feature, structure, or characteristic that other embodiments are described together
In all embodiments.Therefore, phrase " one embodiment of this exposure " or similar terms throughout this manual everywhere in it is corresponding
Appearance is not necessarily referring to the same embodiment.Furthermore, it is possible to any suitable mode come combine any specific embodiment the special characteristic,
Structure or characteristic and one or more other embodiments.It should be understood that other changes of described herein and diagram illustrating embodiment
Change and modify in view of teachings herein be spirit and scope possible and that this exposure will be considered as part.
The technology contents and technical characterstic of the utility model have revealed that as above, however those skilled in the art still may be used
Can teaching based on the utility model and announcement and make various replacements and modification without departing substantially from the spirit of the present invention.Therefore, originally
The protection scope of utility model should be not limited to the revealed content of embodiment, and should include various replacing without departing substantially from the utility model
It changes and modifies, and covered by present patent application claims.
Claims (7)
1. it is a kind of for integrated antenna package welding device, described device be characterized in that include:
Operation area, the operation area for accommodating the integrated antenna package, wherein the integrated antenna package include substrate and
Bare die, the bare die are set on the substrate；
Heat block is set in the operation area and has groove and side, and the groove is for accommodating the substrate and institute
State bare die；Wherein, the integrated antenna package further includes metal pins, and the metal pins are set on the side；
Briquetting is used to for high-temperature plastic to be pressed into the metal pins, wherein the metal pins with the high-temperature plastic
The region of bonding is the first area of the metal pins, and the region not with high-temperature plastic bonding of the metal pins is
The second area of the metal pins, the second area of the metal pins is for welding lead to be electrically connected with the bare die；
Wherein the first area of the metal pins is projected in the first table that the region of the upper surface of the side is the side
Face region, the region that the second area of the metal pins is projected in the upper surface of the side is the second surface of the side
Region；
Wherein, the plane where the first surface region and the plane where the second surface region have an angle.
2. as described in claim 1 for integrated antenna package welding device, it is characterised in that the heat block it is described
Groove is by the side around being formed or the groove is between the side.
3. the device for integrated antenna package welding as described in claim 1, it is characterised in that the angle is 1.0 degree~
10.0 degree.
4. the device for integrated antenna package welding as described in claim 1, it is characterised in that the angle is 3.0 degree.
5. the device for integrated antenna package welding as described in claim 1, it is characterised in that the material of the metal pins
Matter is copper.
6. the device for integrated antenna package welding as described in claim 1, it is characterised in that the material of the heat block
For steel.
7. the device for integrated antenna package welding as described in claim 1, it is characterised in that the material of the high-temperature plastic
Matter is polytetrafluoroethylene (PTFE).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821033316.0U CN208336164U (en) | 2018-07-02 | 2018-07-02 | Device for integrated antenna package welding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821033316.0U CN208336164U (en) | 2018-07-02 | 2018-07-02 | Device for integrated antenna package welding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208336164U true CN208336164U (en) | 2019-01-04 |
Family
ID=64785922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821033316.0U Active CN208336164U (en) | 2018-07-02 | 2018-07-02 | Device for integrated antenna package welding |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208336164U (en) |
-
2018
- 2018-07-02 CN CN201821033316.0U patent/CN208336164U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 215341 No. 497, Huangpujiang South Road, Qiandeng Town, Kunshan City, Suzhou City, Jiangsu Province Patentee after: Riyuexin semiconductor (Kunshan) Co.,Ltd. Address before: No.373, Songnan Road, Qiandeng Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: ADVANCED SEMICONDUCTOR ENGINEERING (KUNSHAN) Ltd. |
|
| CP03 | Change of name, title or address |