CN107322116A - A kind of preparation method of lamp bar - Google Patents
A kind of preparation method of lamp bar Download PDFInfo
- Publication number
- CN107322116A CN107322116A CN201710632586.7A CN201710632586A CN107322116A CN 107322116 A CN107322116 A CN 107322116A CN 201710632586 A CN201710632586 A CN 201710632586A CN 107322116 A CN107322116 A CN 107322116A
- Authority
- CN
- China
- Prior art keywords
- fpc
- justifying
- single plate
- mother matrix
- preparation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Abstract
The invention discloses a kind of preparation method of lamp bar, including：Step 1：Justifying FPC is provided；Step 2：Tin cream is painted on all pads of the justifying FPC；Step 3：Soldered elements are set on all tin creams；Step 4：All tin creams are melted, all pads and soldered elements is all welded together；Wherein, before the either step in step 2,3 and 4, in addition to step A：The relative position between mother matrix FPC and all single plate FPC in the fixed justifying FPC.The preparation method can be prevented when carrying out SMT Reflow Solderings, cause the generation for a problem that soldered elements inclination, rosin joint occur, are uneven because of extruding between the mother matrix FPC and single plate FPC in the justifying FPC.
Description
Technical field
The present invention relates to field of backlights, more particularly to a kind of preparation method of lamp bar.
Background technology
The lamp bar used in backlight mainly includes FPC and some LED and the resistance that are welded on the FPC, the LED
Welding with resistance is all completed on justifying FPC, as Figure 1-3, and the justifying FPC 1 includes mother matrix FPC 11 and many
Individual single plate FPC 12, some tiny tie points 13 formed between mother matrix FPC 11 and single plate FPC 12 by outline die enter
Row layout connect, because FPC is very soft and very thin, the justifying FPC 1 carry out SMT Reflow Solderings when, single plate FPC 12 easily by
The problems such as there is warpage or high-temperature expansion to the influence such as temperature, air-flow, and then occur extruding with mother matrix FPC 11 and cause tin cream 2
Injustice, finally makes a problem that soldered elements 3 on pad inclination, rosin joint occur, are uneven, for LED, these
Unfavorable condition can be impacted to backlight effect and brightness.
The content of the invention
In order to solve above-mentioned the deficiencies in the prior art, the present invention provides a kind of preparation method of lamp bar, can prevent from entering
During row SMT Reflow Solderings, soldered elements are caused to incline because of extruding between the mother matrix FPC and single plate FPC in the justifying FPC
Tiltedly, rosin joint, generation a problem that be uneven.
The technical problems to be solved by the invention are achieved by the following technical programs：
A kind of preparation method of lamp bar, comprises the following steps：
Step 1：There is provided justifying FPC, the justifying FPC includes mother matrix FPC and multiple single plate FPC, and all single plate FPC are arranged at
It is connected by some tie points in the mother matrix FPC and with the mother matrix FPC, complete circuit is respectively provided with each single plate FPC
And with some pads；
Step 2：Tin cream is painted on all pads of the justifying FPC；
Step 3：Soldered elements are set on all tin creams；
Step 4：All tin creams are melted, all pads and soldered elements is all welded together；
Wherein, before the either step in step 2,3 and 4, in addition to step A：Mother matrix FPC in the fixed justifying FPC and
Relative position between all single plate FPC.
Further, the step A includes：
Step A1：Fixing device is provided, the fixing device has the placement region of the justifying FPC, and the placement region is opened
There are multiple suction holes and be connected with air extractor；
Step A2：Before step 2, the justifying FPC is placed in the placement region of the fixing device, it is the multiple to inhale
Stomata covers the mother matrix FPC and all single plate FPC；
Step A3：Between step 2 ~ step 4, the air extractor is opened, by the justifying FPC's by way of vacuumizing
Each position is each attached in the placement region, with the relative position between the fixed mother matrix FPC and all single plate FPC.
Further, the step A includes：
Step A1：Fixing device is provided, the fixing device has the placement region of the justifying FPC, and be pressed together on described
Laminating mechanism in placement region；
Step A2：Before step 2, the justifying FPC is placed in the placement region of the fixing device；
Step A3：After step 3, the laminating mechanism is pressed together on the justifying FPC of the placement region, with fixed described
Relative position between mother matrix FPC and all single plate FPC.
Further, the stitching surface of the laminating mechanism is offered on the position corresponding to all pads avoids described
Some avoiding hollow grooves of soldered elements.
Further, between the stitching surface of the placement region of the fixing device and the laminating mechanism by gravity and/
Or magnetic attraction is pressed.
Further, the step 1 includes：
Step 1.1：There is provided master FPC, the master FPC includes multiple first areas that profile corresponds to multiple single plate FPC, often
Complete circuit is respectively provided with individual first area and with some pads；
Step 1.2：Profile to multiple first areas on the master FPC is punched out, and being formed has mother matrix FPC and multiple
Single plate FPC justifying FPC.
Further, the soldered elements include luminescent device and/or resistance.
Further, the step 4 is completed by SMT reflow soldering processes.
The present invention has the advantages that：The preparation method to the justifying FPC before SMT Reflow Solderings are carried out, first
The relative position fixed by modes such as gravity, vacuum adsorption force or magnetic attractions between the mother matrix FPC and all single plate FPC,
Prevent from, when carrying out SMT Reflow Solderings, causing soldered elements inclination, void occur between the mother matrix FPC and single plate FPC because of extruding
The generation for a problem that welding, be uneven.
Brief description of the drawings
Fig. 1 is existing justifying FPC schematic diagram；
Fig. 2 is enlarged drawing at the A of the whole plate FPC shown in Fig. 1；
Fig. 3 is soldered elements rugged schematic diagram after SMT Reflow Solderings；
The step block diagram of the preparation method for the lamp bar that Fig. 4 provides for the present invention；
A kind of schematic diagram of the fixing means for the justifying FPC that Fig. 5 provides for the present invention；
The schematic diagram of another fixing means for the whole plate FPC that Fig. 6 provides for the present invention.
Embodiment
The present invention will be described in detail with reference to the accompanying drawings and examples.
As shown in figure 4, a kind of preparation method of lamp bar, comprises the following steps：
Step 1：Justifying FPC 1 is provided, as illustrated in fig. 1 and 2, the justifying FPC 1 includes mother matrix FPC 11 and multiple single plate FPC
12, all single plate FPC 12 are arranged in the mother matrix FPC 11 and connected by some tie points 13 with the mother matrix FPC 11
Connect, complete circuit is respectively provided with each single plate FPC 12 and with some pads；
Step 2：Tin cream is painted on all pads of the justifying FPC 1；
Step 3：Soldered elements are set on all tin creams；
Step 4：All tin creams are melted, all pads and soldered elements is all welded together；
Wherein, before the either step in step 2,3 and 4, in addition to step A：Mother matrix FPC in the fixed justifying FPC 1
Relative position between 11 and all single plate FPC 12.
The preparation method to the justifying FPC 1 carry out SMT Reflow Solderings before, first pass through gravity, vacuum adsorption force or
The relative position that the modes such as magnetic attraction are fixed between the mother matrix FPC 11 and all single plate FPC 12, prevents from carrying out SMT times
During fluid welding, soldered elements are caused inclination, rosin joint, height occur not between the mother matrix FPC 11 and single plate FPC 12 because of extruding
The generation of equality unfavorable condition.
The technical program provide a kind of fixed form be：The step A includes：
Step A1：Fixing device is provided, the fixing device has the placement region of the justifying FPC 1, the placement region
It is provided with multiple suction holes 42 and is connected with air extractor；
Step A2：Before step 2, the justifying FPC 1 is placed in the placement region of the fixing device, it is the multiple
Suction hole 42 covers the mother matrix FPC 11 and all single plate FPC 12；
Step A3：Between step 2 ~ step 4, the air extractor is opened, by the justifying FPC 1 by way of vacuumizing
Each position be each attached in the placement region, with the phase between the fixed mother matrix FPC 11 and all single plate FPC 12
To position.
Specifically, as shown in figure 5, the fixing device specifically includes making on a supporting plate 41, the surface of the supporting plate 41
There are multiple suction holes 42 and be connected with air extractor, the justifying FPC 1 is placed to progress brush tin on the surface of the supporting plate 41
Cream and the setting grade of soldered elements 3 operation, and taken out on the either step before being melted to the tin cream described in opening
Device of air is evacuated to the multiple suction hole 42, the mother matrix FPC 11 is fixed using the mode of vacuum suction and all
Relative position between single plate FPC 12.
The technical program provide another fixed form be：The step A includes：
Step A1：Fixing device is provided, the fixing device has the placement region of the justifying FPC 1, and is pressed together on institute
State the laminating mechanism in placement region；
Step A2：Before step 2, the justifying FPC 1 is placed in the placement region of the fixing device；
Step A3：After step 3, the laminating mechanism is pressed together on the justifying FPC 1 of the placement region, to fix
State the relative position between mother matrix FPC 11 and all single plate FPC 12.
Specifically, as shown in fig. 6, the fixing device specifically includes a supporting plate 41 and a pressing plate 43, by the justifying FPC
1 places progress brush tin cream and the setting grade of soldered elements 3 operation on the surface of the supporting plate 41, and is carried out to the tin cream
The pressing plate 43 is pressed together on the justifying FPC 1 before fusing, the mother matrix is fixed using the gravity of the pressing plate 43
Relative position between FPC 11 and all single plate FPC 12.
Wherein, the laminating mechanism（I.e. described pressing plate 43）Stitching surface opened up on the position corresponding to all pads
There are some avoiding hollow grooves 44 for avoiding the soldered elements 3；The pressing plate 43 can be plastics or metal etc., and preferred density is larger
Metal material, such as stainless steel plate or iron plate etc., in theory the weight of the pressing plate 43 be the bigger the better.
Entered between the stitching surface of the placement region of the fixing device and the laminating mechanism by gravity and/or magnetic attraction
Row pressing.
, can be between i.e. described supporting plate 41 and pressing plate 43 on the basis of being pressed using the gravity of the pressing plate 43
The supporting plate 41 and pressing plate 43 are designed as to have magnetic attraction each other, to be pressed using gravity and magnetic attraction simultaneously
Close, such as, the supporting plate 41 uses in magnetic material making or the supporting plate 41 and is provided with magnetic force generation mechanism, the pressing plate
43 are made using the metal material with magnetic conductivity.
The step 1 includes：
Step 1.1：There is provided master FPC, the master FPC includes multiple firstth areas that profile corresponds to multiple single plate FPC 12
Complete circuit is respectively provided with domain, each first area and with some pads；
Step 1.2：Profile to multiple first areas on the master FPC is punched out, and being formed has the Hes of mother matrix FPC 11
Multiple single plate FPC 12 justifying FPC 1.
The soldered elements include luminescent device and/or resistance；The step 4 is preferably but not limited to by SMT Reflow Solderings
Technique is completed.
Embodiment described above only expresses embodiments of the present invention, and it describes more specific and detailed, but can not
Therefore the limitation to the scope of the claims of the present invention is interpreted as, as long as the skill obtained using the form of equivalent substitution or equivalent transformation
Art scheme, all should fall within the scope and spirit of the invention.
Claims (8)
1. a kind of preparation method of lamp bar, it is characterised in that comprise the following steps：
Step 1：There is provided justifying FPC, the justifying FPC includes mother matrix FPC and multiple single plate FPC, and all single plate FPC are arranged at
It is connected by some tie points in the mother matrix FPC and with the mother matrix FPC, complete circuit is respectively provided with each single plate FPC
And with some pads；
Step 2：Tin cream is painted on all pads of the justifying FPC；
Step 3：Soldered elements are set on all tin creams；
Step 4：All tin creams are melted, all pads and soldered elements is all welded together；
Wherein, before the either step in step 2,3 and 4, in addition to step A：Mother matrix FPC in the fixed justifying FPC and
Relative position between all single plate FPC.
2. the preparation method of lamp bar according to claim 1, it is characterised in that the step A includes：
Step A1：Fixing device is provided, the fixing device has the placement region of the justifying FPC, and the placement region is opened
There are multiple suction holes and be connected with air extractor；
Step A2：Before step 2, the justifying FPC is placed in the placement region of the fixing device, it is the multiple to inhale
Stomata covers the mother matrix FPC and all single plate FPC；
Step A3：Between step 2 ~ step 4, the air extractor is opened, by the justifying FPC's by way of vacuumizing
Each position is each attached in the placement region, with the relative position between the fixed mother matrix FPC and all single plate FPC.
3. the preparation method of lamp bar according to claim 1, it is characterised in that the step A includes：
Step A1：Fixing device is provided, the fixing device has the placement region of the justifying FPC, and be pressed together on described
Laminating mechanism in placement region；
Step A2：Before step 2, the justifying FPC is placed in the placement region of the fixing device；
Step A3：After step 3, the laminating mechanism is pressed together on the justifying FPC of the placement region, with fixed described
Relative position between mother matrix FPC and all single plate FPC.
4. the preparation method of lamp bar according to claim 3, it is characterised in that the stitching surface of the laminating mechanism is in correspondence
In offering some avoiding hollow grooves for avoiding the soldered elements on the position of all pads.
5. the preparation method of lamp bar according to claim 3, it is characterised in that：The placement region of the fixing device and institute
State and pressed by gravity and/or magnetic attraction between the stitching surface of laminating mechanism.
6. according to the preparation method of any described lamp bar in claim 1-5, it is characterised in that：The step 1 includes：
Step 1.1：There is provided master FPC, the master FPC includes multiple first areas that profile corresponds to multiple single plate FPC, often
Complete circuit is respectively provided with individual first area and with some pads；
Step 1.2：Profile to multiple first areas on the master FPC is punched out, and being formed has mother matrix FPC and multiple
Single plate FPC justifying FPC.
7. according to the preparation method of any described lamp bar in claim 1-5, it is characterised in that：The soldered elements include hair
Optical device and/or resistance.
8. according to the preparation method of any described lamp bar in claim 1-5, it is characterised in that the step 4 is returned by SMT
Fluid welding technique is completed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710632586.7A CN107322116B (en) | 2017-07-28 | 2017-07-28 | A kind of production method of lamp bar |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710632586.7A CN107322116B (en) | 2017-07-28 | 2017-07-28 | A kind of production method of lamp bar |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107322116A true CN107322116A (en) | 2017-11-07 |
| CN107322116B CN107322116B (en) | 2019-10-08 |
Family
ID=60226512
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710632586.7A Active CN107322116B (en) | 2017-07-28 | 2017-07-28 | A kind of production method of lamp bar |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107322116B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108012457A (en) * | 2018-01-19 | 2018-05-08 | 南京利景盛电子有限公司 | A kind of soft or hard compoboard double-sided bottom welds a reflux technique method |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101384136A (en) * | 2008-10-17 | 2009-03-11 | 林克治 | Surface mounting process for flexible circuit board and used magnetic tool and steel mesh |
| CN102858095A (en) * | 2012-08-27 | 2013-01-02 | 歌尔声学股份有限公司 | Supporting jig of flexible circuit board |
| CN103068159A (en) * | 2012-12-14 | 2013-04-24 | 意力(广州)电子科技有限公司 | Large flexible printed circuit (FPC) and typesetting method of manufacturing FPC |
| CN104244573A (en) * | 2014-08-21 | 2014-12-24 | 世一电子科技（惠州）有限公司 | Flexible printed circuit board and flexible printed circuit board reflow soldering method |
| CN104295973A (en) * | 2014-10-11 | 2015-01-21 | 京东方光科技有限公司 | Light bar manufacturing method |
| CN105898988A (en) * | 2016-06-01 | 2016-08-24 | 深圳市汇晨电子股份有限公司 | Backlight FPC (Flexible Printed Circuit board) full page adhesive film and overall rubberizing process thereof |
| CN106028643A (en) * | 2016-05-25 | 2016-10-12 | 武汉华星光电技术有限公司 | Flexible main board, flexible display equipment and manufacturing method for flexible main board |
| CN106180956A (en) * | 2016-08-25 | 2016-12-07 | 南京中电熊猫照明有限公司 | FPC lamp bar Multifunctional reflux tool |
| CN106304688A (en) * | 2016-08-24 | 2017-01-04 | 广州梁氏通讯电器有限公司 | The Welding Structure of PCB and FPCB and welding method thereof |
| CN206024415U (en) * | 2016-08-19 | 2017-03-15 | 江苏力德尔电子信息技术有限公司 | Justifying FPC clip sucker |
-
2017
- 2017-07-28 CN CN201710632586.7A patent/CN107322116B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101384136A (en) * | 2008-10-17 | 2009-03-11 | 林克治 | Surface mounting process for flexible circuit board and used magnetic tool and steel mesh |
| CN102858095A (en) * | 2012-08-27 | 2013-01-02 | 歌尔声学股份有限公司 | Supporting jig of flexible circuit board |
| CN103068159A (en) * | 2012-12-14 | 2013-04-24 | 意力(广州)电子科技有限公司 | Large flexible printed circuit (FPC) and typesetting method of manufacturing FPC |
| CN104244573A (en) * | 2014-08-21 | 2014-12-24 | 世一电子科技（惠州）有限公司 | Flexible printed circuit board and flexible printed circuit board reflow soldering method |
| CN104295973A (en) * | 2014-10-11 | 2015-01-21 | 京东方光科技有限公司 | Light bar manufacturing method |
| CN106028643A (en) * | 2016-05-25 | 2016-10-12 | 武汉华星光电技术有限公司 | Flexible main board, flexible display equipment and manufacturing method for flexible main board |
| CN105898988A (en) * | 2016-06-01 | 2016-08-24 | 深圳市汇晨电子股份有限公司 | Backlight FPC (Flexible Printed Circuit board) full page adhesive film and overall rubberizing process thereof |
| CN206024415U (en) * | 2016-08-19 | 2017-03-15 | 江苏力德尔电子信息技术有限公司 | Justifying FPC clip sucker |
| CN106304688A (en) * | 2016-08-24 | 2017-01-04 | 广州梁氏通讯电器有限公司 | The Welding Structure of PCB and FPCB and welding method thereof |
| CN106180956A (en) * | 2016-08-25 | 2016-12-07 | 南京中电熊猫照明有限公司 | FPC lamp bar Multifunctional reflux tool |
Non-Patent Citations (1)
| Title |
|---|
| 林科智: "FPC SMT 解决方案", 《2008中国高端SMT学术会议论文集》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108012457A (en) * | 2018-01-19 | 2018-05-08 | 南京利景盛电子有限公司 | A kind of soft or hard compoboard double-sided bottom welds a reflux technique method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107322116B (en) | 2019-10-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204669723U (en) | A kind of circuit board, printed circuit board and steel mesh | |
| CN105655264B (en) | A kind of the plant column device and plant column method of CCGA devices | |
| CN105960107A (en) | Steel net kit and method for applying steel net kit to weld interface component | |
| JP2002064265A (en) | Bga-mounting method | |
| KR20040066023A (en) | Apparatus and method for aligning and attaching solder columns to a substrate | |
| CN103313527A (en) | Furnace-through fixture for reflow soldering | |
| CN107322116A (en) | A kind of preparation method of lamp bar | |
| CN110197796A (en) | A kind of CGA device welding column manufacturing process based on capillary joint filling effect | |
| CN104779232B (en) | Pass through the encapsulation of pre-formed metal pins | |
| CN103108498A (en) | Method of placing parts on printed circuit board (PCB) circuit board surfaces | |
| CN109273375A (en) | A kind of MCM integrated circuit packaging method merging SMT | |
| CN206402548U (en) | A kind of sheet component paster structure | |
| US20060163330A1 (en) | Site flattening tool and method for circuit board repair | |
| CN107498132A (en) | Welder and welding method | |
| JP2002057453A (en) | Repairing method of semiconductor device | |
| CN107524941B (en) | A kind of production method of lamp bar | |
| CN109119393A (en) | A kind of MCM integrated circuit package structure merging SMT | |
| WO2019024351A1 (en) | Pcb board design method for avoiding surface element tombstoning, and packaging method and pcb board | |
| CN109526155B (en) | Manufacturing method of solder joint cold solder joint | |
| JP2003121466A5 (en) | ||
| JPH01278967A (en) | Presoldering method for lead of electronic parts | |
| JP2001094244A (en) | Mounting method for package | |
| CN107371336A (en) | A kind of method of printed circuit board positive and negative while soldering device | |
| JP5397120B2 (en) | Soldering method and soldering apparatus | |
| JP2008071997A (en) | Manufacturing method of substrate for mounting electronic part |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |