CN207022277U - Flexible PCB and projecting apparatus - Google Patents
Flexible PCB and projecting apparatus Download PDFInfo
- Publication number
- CN207022277U CN207022277U CN201720719235.5U CN201720719235U CN207022277U CN 207022277 U CN207022277 U CN 207022277U CN 201720719235 U CN201720719235 U CN 201720719235U CN 207022277 U CN207022277 U CN 207022277U
- Authority
- CN
- China
- Prior art keywords
- circuit layer
- strip piece
- flexible pcb
- substrate
- bending segment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
It the utility model is related to a kind of flexible PCB and projecting apparatus.The strip piece of flexible PCB has bending segment, bending segment is located at the middle part of strip piece, strip piece also includes substrate, circuit layer, insulating barrier, two the first adhesive layers and two the second adhesive layers, on the thickness direction of strip piece, substrate, circuit layer and insulating barrier stack gradually, two the first adhesive layers are disposed on the both ends of substrate, and it is respectively positioned between substrate and circuit layer, and the both ends of substrate are fixedly connected with the both ends of circuit layer respectively, two the second adhesive layers are disposed on the both ends of circuit layer, and it is respectively positioned between circuit layer and insulating barrier, and the both ends of circuit layer are fixedly connected with the both ends of insulating barrier, wherein, the position in the gap between the position of bending segment and two the first adhesive layers, the position in the gap between two the second adhesive layers is corresponding.Above-mentioned flexible PCB is not easy to be torn.
Description
Technical field
Porjector technology field is the utility model is related to, more particularly to a kind of flexible PCB and projecting apparatus.
Background technology
The design of Current projection machine is based on DMD (Digital Micro-mirror Device, digital micro-mirror using one kind
Device) chip technology, needed between dmd chip and data processing chip PCB (Printed circuit board, printing electricity
Road plate) connect, and pcb board is divided into hardboard and soft board.Wherein, soft board is that flexible PCB has height reliability, excellent
Pliability, the characteristics of Distribution density is high, in light weight, thickness of thin and bending property are good, and be widely used in the connection of product.So
And because flexible PCB needs constantly to carry out the action such as bending in application process, during bending, flexible PCB holds
Easily it is torn or fractures, has a strong impact on the normal use of product.
Utility model content
Based on this, it is necessary to provide a kind of flexible PCB for being not easy to be torn.
A kind of further it is provided that projecting apparatus.
A kind of flexible PCB, including strip piece, the strip piece have bending segment, and the bending segment is located at the bar shaped
The middle part of part, the strip piece also include substrate, circuit layer, insulating barrier, two the first adhesive layers and two the second adhesive layers,
On the thickness direction of the strip piece, the substrate, the circuit layer and the insulating barrier stack gradually, two first glue
Adhesion coating is disposed on the both ends of the substrate, and is respectively positioned between the substrate and the circuit layer, and by the substrate
Both ends of the both ends respectively with the circuit layer are fixedly connected, and two second adhesive layers are disposed on the two of the circuit layer
End, and is respectively positioned between the circuit layer and the insulating barrier, and by the both ends of the circuit layer and the both ends of the insulating barrier
It is fixedly connected, wherein, the position in the gap between the position of the bending segment and two first adhesive layers, two described
The position in the gap between two adhesive layers is corresponding.
The position in the gap between the position of the bending segment of above-mentioned flexible PCB and two the first adhesive layers, two second
The position in the gap between adhesive layer is corresponding, i.e., does not have the first adhesive layer, and electricity between substrate and circuit layer at bending segment
Without the second adhesive layer at bending segment between road floor and insulating barrier, between substrate, circuit layer and insulating barrier at bending segment layer
Layer separation, so as to reduce the mechanical strength of bending segment so that bending segment becomes soft, is easy to bend, makes flexible PCB
It is not easy to be torn when being bent.
In one of the embodiments, on the width of the strip piece, the bending segment of the strip piece
Opposite sides distinguishes crumple, so that the width of the bending segment is less than the width at the both ends of the strip piece.
In one of the embodiments, the width of the bending segment is less than or equal to the width at the both ends of the bar-shaped body
4/5ths of degree.
In one of the embodiments, the deep equality of the opposite sides crumple of the bending segment.
In one of the embodiments, five points of the length of the bending segment more than or equal to the length of the strip piece
One of.
In one of the embodiments, in addition to two stiffening plates, it is remote that two stiffening plates are laminated in the substrate
On side from the circuit layer, and it is disposed on the both ends of the strip piece.
In one of the embodiments, the strip piece is additionally provided with protection zone, and the protection zone is located at the strip piece
One end, via is further opened with the strip piece, the via is located in the protection zone, and the via runs through the base
Plate, the circuit layer, the insulating barrier, first adhesive layer and second adhesive layer, the flexible circuit
Plate also includes stiffening plate, and the stiffening plate is laminated on side of the substrate away from the circuit layer, and the stiffening plate
Position is corresponding with the position of the protection zone, and the stiffening plate covers an opening of the via.
A kind of projecting apparatus, including：
Data processing chip；
Display chip；
Such as the flexible PCB any one of above-mentioned preferred embodiment, the flexible PCB electrically connects the data
Process chip and the display chip.
In one of the embodiments, in addition to electrical connection module, include can be with the data for the electrical connection module
First connector of process chip electrical connection and the second connector that can be electrically connected with the display chip, first connection
Device and second connector are located at the both ends of the strip piece respectively, and are mounted on the insulating barrier away from the circuit layer
Side, and electrically connected with the circuit layer.
In one of the embodiments, the flexible PCB also includes extending to be formed from the end vertical of the strip piece
Extension, the projecting apparatus also includes component, and the component is arranged on the extension, and with circuit layer electricity
Connection, the component is memory, resistor or inductor.
Brief description of the drawings
Fig. 1 is the structural representation of the projecting apparatus of an embodiment；
Fig. 2 eliminates the structural representation of data processing chip and display chip for the projecting apparatus shown in Fig. 1；
Fig. 3 is that the projecting apparatus shown in Fig. 2 is eliminated after the first connector along the profile of A-A' lines；
Fig. 4 is the structural representation of another angle of the flexible PCB of the projecting apparatus shown in Fig. 2；
Fig. 5 is profiles of the Fig. 2 along B-B' lines.
Embodiment
For the ease of understanding the utility model, the utility model is more fully retouched below with reference to relevant drawings
State.Preferred embodiment of the present utility model is given in accompanying drawing.But the utility model can come in many different forms
Realize, however it is not limited to embodiment described herein.On the contrary, the purpose for providing these embodiments is made to of the present utility model
The understanding of disclosure more thorough and comprehensive.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be element placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement are for illustrative purposes only.
Unless otherwise defined, all of technologies and scientific terms used here by the article is led with belonging to technology of the present utility model
The implication that the technical staff in domain is generally understood that is identical.It is simply in term used in the description of the present utility model herein
The purpose of description specific embodiment, it is not intended that in limitation the utility model.
As shown in figure 1, the projecting apparatus 10 of an embodiment includes data processing chip 100, display chip 200 and flexible electrical
Road plate 300.
The view data of input can be converted into the data of control sequential by data processing chip 100, so as to showing core
Piece 200 carries out SECO.
Display chip 200 is under the control of the data of control sequential caused by data processing chip 100, by the image of input
Image caused by data conversion into projection.In this example it is shown that chip 200 is dmd chip (data micro mirror display chip),
Data micro mirror display chip is a kind of spatial light modulator of numerical control MOEMS.The quantity of dmd chip is a piece of, two panels
Or three.
Also referring to Fig. 2, flexible PCB 300 electrically connects data processing chip 100 and display chip 200.Wherein, it is soft
Property circuit board 300 includes strip piece 310, and strip piece 310 has bending segment 311, and bending segment 311 is located in strip piece 310
Portion.By carrying out bending operation in bending segment 311, to realize the bendable folding endurance of flexible PCB 300.
On the width of strip piece 310, the opposite sides difference crumple of the bending segment 311 of strip piece 310, so that curved
The width of trisection 311 is less than the width at the both ends of strip piece 310.Due to the width of the bending segment 311 of above-mentioned flexible PCB 300
Less than the width at the both ends of strip piece 310, it is necessary to which the folding force for being applied to flexible PCB 300 diminishes when carrying out bending operation,
It is more laborsaving when bending, make flexible PCB 300 more pliable, carried out so as to avoid the occurrence of flexible PCB 300
The problem of bending segment 311 is torn during bending.
Specifically, the width of bending segment 311 is less than or equal to 4/5ths of the width at the both ends of strip piece 310.More
Specifically, the deep equality of the opposite sides crumple of bending segment 311.
Further, the length of bending segment 311 is more than or equal to 1/5th of the length of strip piece 310.
Also referring to Fig. 3, strip piece 310 includes 314, two substrate 312, circuit layer 313, insulating barrier the first adhesive layers
315 and two the second adhesive layers 316.On the thickness direction of strip piece 310, substrate 312, circuit layer 313 and insulating barrier 314 according to
Secondary stacking.
The material of substrate 312 is polyethylene terephthalate, so that substrate 312 has good mechanical property, it is resistance to
Folding endurance is good.It is to be appreciated that the material of substrate 312 is not limited to above-mentioned material, such as：The material of substrate 312 can also be polyamides
Imines.
Circuit layer 313 can pass through the step such as silk-screen printing and etching and be formed on substrate 312.Wherein, the material of circuit layer 313
Matter is copper.
It is to be appreciated that the quantity of substrate 312 and the quantity of circuit layer 313 are unlimited, and can be one layer, can also be equal
For multilayer；When the quantity of substrate 312 and the quantity of circuit layer 313 are multilayer, multilager base plate 312 and multilayer circuit layer 313
It is arranged alternately.
Insulating barrier 314 is the film being mixed to form by polyethylene terephthalate and glue, and glue is preferably 3M's
Glue, the thickness of insulating barrier 314 is 13 μm.
Two the first adhesive layers 315 are arranged at intervals on substrate 312, and are respectively positioned on substrate 312 close to the one of circuit layer 313
Side, two the first adhesive layers 315 are respectively positioned between substrate 312 and circuit layer 313, so that the both ends of substrate 312 and circuit layer 313
Both ends be fixedly connected, i.e., two the first adhesive layers 315 bond together the both ends at the both ends of substrate 312 and circuit layer 313.
Specifically, two the first adhesive layers 315 are formed by the glue solidifies, and glue is preferably 3M glue.
Two the second adhesive layers 316 are arranged at intervals on circuit layer 313, and are respectively positioned on circuit layer 313 close to insulating barrier 314
Side, two the second adhesive layers 316 are respectively positioned between circuit layer 313 and insulating barrier 314 so that the both ends of circuit layer 313 with
The both ends of insulating barrier 314 are fixedly connected, i.e., the both ends at the both ends of circuit layer 314 and insulating barrier 315 bond together.
Specifically, two the second adhesive layers 316 are formed by the glue solidifies, and glue is preferably 3M glue.
Wherein, gap between the position in the gap between two the first adhesive layers 315, two the second adhesive layers 316
Position correspondence of the position with bending segment 311.
Due to the position in the gap between the position of bending segment 311 and two the first adhesive layers 315, two the second adhesive layers
The position in the gap between 316 is corresponding, i.e., without the first adhesive layer at bending segment 311 between substrate 312 and circuit layer 313
315 bondings, and be bonded between circuit layer 313 and insulating barrier 314 at bending segment 311 without the second adhesive layer 316, substrate 312,
It is layers-separated at bending segment 311 between circuit layer 313 and insulating barrier 314, it is strong so as to reduce the machinery of bending segment 311
Degree so that bending segment 311 becomes soft, more pliable, is not easy to be torn when being bent flexible PCB 300.
Referring to Fig. 1, further, projecting apparatus 10 also includes electrical connection module (figure is not marked), electrical connection module bag
Include the first connector 410 that can be electrically connected with data processing chip 100 and can be electrically connected with display chip 200 second connects
Connect device 420.
First connector 410 is located at one end of strip piece 310, and is arranged on one of insulating barrier 314 away from circuit layer 313
Side, the first connector 410 electrically connect with circuit layer 313.Data processing chip 100 by the first connector 410 and with flexible electrical
Road plate 300 electrically connects.
Specifically, data processing chip 100 is provided with the first connector (not shown), and the first connector can be connected with first
The grafting of device 410, and the first connector is electrically connected with the first connector 410, so that data processing chip 100 and flexible electrical
Road plate 300 electrically connects.The connected mode to be cooperated using this connector and connector, is advantageously implemented data processing chip
100 are removed and replaced for.
Second connector 420 is located at the other end of strip piece 310, and is arranged on one of insulating barrier 314 away from circuit layer 313
Side, the second connector 420 electrically connect with circuit layer 313.Display chip 200 by the second connector 420 and with flexible PCB
300 electrical connections.
Specifically, display chip 200 is provided with the second connector (not shown), and the second connector can be with the second connector
420 grafting, and the second connector is electrically connected with the second connector 420, so that display chip 200 and flexible PCB
300 electrical connections.The connected mode to be cooperated using this connector and connector, is advantageously implemented tearing open for display chip 200
Unload and replace.
Also referring to Fig. 4, flexible PCB 300 also includes two stiffening plates 320, and two stiffening plates 320 are laminated in
On side of the substrate 312 away from circuit layer 313, and it is arranged at intervals at the both ends of strip piece 310.Due on flexible PCB 300
Provided with stiffening plate 320, the mechanical strength at the both ends of strip piece 310 is added, so as to improve the tear-proof of flexible PCB 300
Performance.
Specifically, two stiffening plates 320 are bonded on substrate 312 by glue, and glue is preferably 3M glue.Two
Stiffening plate 320 is generally made from a metal, such as：Stainless steel.
Please refer to Fig. 2 in the lump again, strip piece 310 is additionally provided with protection zone 317, and protection zone 317 is located at the one of strip piece 310
On end, and the position of protection zone 317 is corresponding with the position of a stiffening plate 320.
Further, via 318 is further opened with strip piece 310, via 318 is located in protection zone 317.In double-faced flexible
In circuit board and multi-layer flexible circuit board, in order to connect the circuit layer 313 of each layer, in the circuit layer 313 that each layer needs to connect
Intersection sets via 318, i.e. plated through-hole, and the copper dish of circle are formed with the upper and lower surface in the circuit layer 313 of each layer.
Please refer to fig. 5, via 318 is through 314, substrate 312, circuit layer 313, insulating barrier first adhesive layers
315 and second adhesive layer 316.One stiffening plate 320 covers an opening of via 318, so that via 318 is placed in reinforcement
Under the protection of plate 320, so as to add the tear resistance of via 318, to prevent during bending copper dish to peel off
Flexible PCB 300 is set to fail.
It is to be appreciated that the quantity of via 318 is unlimited, can be one, or multiple.
Referring to Fig. 4, flexible PCB 300 also includes component 330, and component 330 is located at substrate 312 away from electricity
On the side of road floor 313, and electrically connected with circuit layer 313.Wherein, component 330 is memory, for storing image or number
According to.It is to be appreciated that component 330 is not limited to memory or resistor, inductor can also be.
Further, flexible PCB 300 also includes extending the extension 319 to be formed from the end vertical of strip piece 310,
Extension 319 is located at one end of strip piece 310.Component 330 is arranged on the substrate 312 of extension 319, and is located at substrate
On 312 sides away from circuit layer 313, and electrically connected with circuit layer 313.
Above-mentioned flexible PCB at least has advantages below：
(1) above-mentioned flexible PCB 300 includes strip piece 310, on the width of strip piece 310, strip piece 310
The opposite sides difference crumple of bending segment 311, so that the width of bending segment 311 is less than the width at the both ends of strip piece 310, curved
It is more laborsaving when bending, it is necessary to the folding force for being applied to bending segment 311 diminishes when trisection 311 carries out bending operation, make
The problem of bending segment 311 is more pliable, and bending segment 311 is torn when being bent so as to avoiding the occurrence of flexible PCB 300.
(2) gap between the position of the bending segment 311 of above-mentioned flexible PCB 300 and two the first adhesive layers 315
The position in the gap between position, two the second adhesive layers 315 is corresponding, i.e., in bending segment between substrate 312 and circuit layer 313
The first adhesive layer 315 is not bonded at 311, and does not have the second glue between circuit layer 313 and insulating barrier 314 at bending segment 311
Adhesion coating 316 is bonded, layers-separated at bending segment 311 between substrate 312, circuit layer 313 and insulating barrier 314, so as to drop
The mechanical strength of low bending segment 311, the compliance of bending segment 311 is added, make bending segment 311 more pliable, make flexible circuit
Plate 300 is not easy to be torn when being bent, and avoids the electrical connection module (figure caused by flexible PCB 300 is not pliable
Do not mark) loose contact the problem of, the display chip 200 for further preventing from being connected with flexible PCB 300 is because of flexible PCB 300
It is not pliable and damage.
(3) both ends of the strip piece 310 of above-mentioned flexible PCB 300 are provided with stiffening plate 320, add strip piece 310
Both ends mechanical strength, so as to improve the tear resistance of flexible PCB 300.
(4) via 318 of above-mentioned flexible PCB 300 is under the protection of stiffening plate 320, so as to add via 318
Tear resistance, with prevent from appearing in bending during copper dish peel off and make flexible PCB 300 fail the problem of, enter one
Step improves the yields of flexible PCB 300.
Further, since above-mentioned flexible PCB 300 has, to be easy to that bending, tear resistance are higher and yields is higher etc. excellent
Point, data processing chip 100 and display chip 200 can be preferably connected, ensure that data processing chip 100 and display chip
200 normal operation, further ensure the normal use of projecting apparatus 10.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope that this specification is recorded all is considered to be.
Embodiment described above only expresses several embodiments of the present utility model, and its description is more specific and detailed,
But therefore it can not be interpreted as the limitation to utility model patent scope.It should be pointed out that the common skill for this area
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (10)
1. a kind of flexible PCB, it is characterised in that including strip piece, the strip piece has bending segment, the bending section
In the middle part of the strip piece, the strip piece also includes substrate, circuit layer, insulating barrier, two the first adhesive layers and two the
Two adhesive layers, on the thickness direction of the strip piece, the substrate, the circuit layer and the insulating barrier stack gradually, and two
Individual first adhesive layer is disposed on the both ends of the substrate, and is respectively positioned between the substrate and the circuit layer, and
Both ends of the both ends of the substrate respectively with the circuit layer are fixedly connected, two second adhesive layers are disposed on institute
The both ends of circuit layer are stated, and are respectively positioned between the circuit layer and the insulating barrier, and by both ends of the circuit layer and described
The both ends of insulating barrier are fixedly connected, wherein, the position in the gap between the position of the bending segment and two first adhesive layers
Put, the position in gap between two second adhesive layers it is corresponding.
2. flexible PCB according to claim 1, it is characterised in that described on the width of the strip piece
The opposite sides difference crumple of the bending segment of strip piece, so that the width of the bending segment is less than the both ends of the strip piece
Width.
3. flexible PCB according to claim 2, it is characterised in that the width of the bending segment is less than or equal to institute
State 4/5ths of the width at the both ends of bar-shaped body.
4. flexible PCB according to claim 2, it is characterised in that the depth of the opposite sides crumple of the bending segment
It is equal.
5. flexible PCB according to claim 2, it is characterised in that the length of the bending segment is more than or equal to institute
State 1/5th of the length of strip piece.
6. flexible PCB according to claim 1, it is characterised in that also including two stiffening plates, two reinforcement
Plate is laminated on side of the substrate away from the circuit layer, and is disposed on the both ends of the strip piece.
7. flexible PCB according to claim 1, it is characterised in that the strip piece is additionally provided with protection zone, the guarantor
Shield area is located at one end of the strip piece, and via is further opened with the strip piece, and the via is located in the protection zone, and
The via runs through the substrate, the circuit layer, the insulating barrier, first adhesive layer and second glue
Adhesion coating, the flexible PCB also include stiffening plate, and the stiffening plate is laminated in side of the substrate away from the circuit layer
On, and the position of the stiffening plate is corresponding with the position of the protection zone, one of the stiffening plate masking via opens
Mouthful.
A kind of 8. projecting apparatus, it is characterised in that including：
Data processing chip；
Display chip；
Such as flexible PCB according to any one of claims 1 to 7, the flexible PCB electrically connects the data processing core
Piece and the display chip.
9. projecting apparatus according to claim 8, it is characterised in that also including electrical connection module, the electrical connection module bag
Include the first connector that can be electrically connected with the data processing chip and can be electrically connected with the display chip second connects
Device is connect, first connector and second connector are located at the both ends of the strip piece respectively, and are mounted on described exhausted
Side of the edge layer away from the circuit layer, and electrically connected with the circuit layer.
10. projecting apparatus according to claim 8, it is characterised in that the flexible PCB is also included from the strip piece
End vertical extend the extension to be formed, the projecting apparatus also includes component, and the component is arranged on the extension
On, and electrically connected with the circuit layer, the component is memory, resistor or inductor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720719235.5U CN207022277U (en) | 2017-06-20 | 2017-06-20 | Flexible PCB and projecting apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720719235.5U CN207022277U (en) | 2017-06-20 | 2017-06-20 | Flexible PCB and projecting apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207022277U true CN207022277U (en) | 2018-02-16 |
Family
ID=61486084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720719235.5U Active CN207022277U (en) | 2017-06-20 | 2017-06-20 | Flexible PCB and projecting apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207022277U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110177427A (en) * | 2019-05-24 | 2019-08-27 | 上海温良昌平电器科技股份有限公司 | Depressed structure and its production technology are escaped in a kind of pressure-sensing glue reinforcement |
| CN110831320A (en) * | 2019-10-23 | 2020-02-21 | 百富计算机技术（深圳）有限公司 | Flexible tear-proof circuit board |
| WO2020107399A1 (en) * | 2018-11-30 | 2020-06-04 | 深圳市柔宇科技有限公司 | Chip-on-film module, display panel and display device |
-
2017
- 2017-06-20 CN CN201720719235.5U patent/CN207022277U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020107399A1 (en) * | 2018-11-30 | 2020-06-04 | 深圳市柔宇科技有限公司 | Chip-on-film module, display panel and display device |
| CN110177427A (en) * | 2019-05-24 | 2019-08-27 | 上海温良昌平电器科技股份有限公司 | Depressed structure and its production technology are escaped in a kind of pressure-sensing glue reinforcement |
| CN110831320A (en) * | 2019-10-23 | 2020-02-21 | 百富计算机技术（深圳）有限公司 | Flexible tear-proof circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN207022277U (en) | Flexible PCB and projecting apparatus | |
| TW488193B (en) | Flexible wiring substrate and its manufacturing method | |
| CN101360386B (en) | Circuit board binding glue layer and circuit board comprising the glue layer | |
| CN107484328B (en) | A kind of display device | |
| CN203020727U (en) | Packaging body and packaging body set and packaging body assembly | |
| TW581800B (en) | Adhesive, liquid crystal device, process for manufacturing liquid crystal device, and electronic equipment | |
| KR20060111854A (en) | Antenna circuit, ic inlet, ic tag and ic card, as well as manufacturing method of ic tag and manufacturing method of ic card | |
| CN106028643B (en) | The production method of flexible mainboard, flexible display device and flexible mainboard | |
| TW201310302A (en) | Plastic film and touch sensor | |
| CN110687729A (en) | Display module and display device | |
| CN112822834A (en) | Circuit board and electronic equipment | |
| CN106255310A (en) | A kind of COF flexible PCB, display device | |
| CN109757034B (en) | Circuit board structure and preparation method thereof, display panel and preparation method thereof | |
| CN202773168U (en) | Flexible circuit board | |
| CN103108502B (en) | Soft board middle level covers the method for epiphragma | |
| CN214851965U (en) | Circuit board and electronic equipment | |
| CN207053876U (en) | A kind of FPC and electronic equipment | |
| CN104051405A (en) | Circuit board structure provided with electronic assemblies in embedded manner and manufacturing method thereof | |
| CN109714883B (en) | Circuit compensation FPC | |
| CN106648196A (en) | Flexible touch panel, manufacturing method thereof and touch display panel | |
| CN208110198U (en) | A kind of FPC backlight | |
| CN202425184U (en) | Multilayer flexible circuit board | |
| CN206835453U (en) | A kind of double-faced flexible wiring board | |
| CN206879184U (en) | A kind of FPC winding displacements for LCDs | |
| CN207911124U (en) | A kind of flexible printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20181008 Address after: 362006 A 3, 2.5 Industrial Park, 69 Yushi Road, Quanzhou economic and Technological Development Zone, Fujian. Patentee after: Quanzhou new sharp Aurora Technology Co., Ltd. Address before: 518000 TCL, Science Park B7-11C, 1001 Zhongshan Garden Road, Xili street, Shenzhen, Guangdong, B7-11C Patentee before: Shenzhen nine top Optoelectronic Technology Co., Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190828 Address after: 100000 Floor 10, No. 11 Zhongcun Street, Haidian District, Beijing, 2002-03 Patentee after: Xinshijia Science and Technology (Beijing) Co., Ltd. Address before: 362006 Quanzhou Economic and Technological Development Zone, Fujian Province, 69 Yushi Road, 2.5 Industrial Park, Building A, 3 floors Patentee before: Quanzhou new sharp Aurora Technology Co., Ltd. |