CN104051405A - Circuit board structure provided with electronic assemblies in embedded manner and manufacturing method thereof - Google Patents
Circuit board structure provided with electronic assemblies in embedded manner and manufacturing method thereof Download PDFInfo
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- CN104051405A CN104051405A CN201310076764.4A CN201310076764A CN104051405A CN 104051405 A CN104051405 A CN 104051405A CN 201310076764 A CN201310076764 A CN 201310076764A CN 104051405 A CN104051405 A CN 104051405A
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- electronic building
- building brick
- dielectric layer
- circuit board
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Disclosed is a circuit board structure provided with electronic assemblies in an embedded manner and a manufacturing method thereof. The circuit board structure includes a substrate, a first dielectric layer, the electronic assemblies, a second dielectric layer, a plurality of conductive blind holes and a second circuit layer. A first circuit layer is formed on at least one surface of the substrate. The first dielectric layer is formed on the surface of the substrate and provided with a plurality of dielectric-layer openings which expose the first circuit layer so as to allow the electronic assemblies to be arranged in the dielectric-layer openings and electrically connected to the first circuit layer via metal jointers. The second dielectric layer is formed on the first dielectric layer and the electronic assemblies and provided with a plurality of dielectric-layer blind holes used for exposing the electronic assemblies so as to allow the conductive blind holes to be formed in the dielectric-layer blind holes. The second circuit layer is formed on the second dielectric layer and electrically connected with the electronic assemblies via the conductive blind holes. The circuit board structure provided with the electronic assemblies in the embedded manner is capable of effectively improving the design flexibility of a circuit board.
Description
Technical field
The present invention relates to a kind of circuit board structure and method for making thereof, espespecially a kind of circuit board structure and method for making thereof that is embedded with electronic building brick.
Background technology
Along with the evolution of semiconductor packaging, except traditional routing type (wire bonding) and cover the semiconductor packaging of crystalline substance (flip chip), semiconductor device (semiconductor device) has been developed different encapsulation kenels at present, for example directly in a base plate for packaging (package substrate), be embedded into and electrically integrate an electronic building brick, this kind of packaging part can reduce the volume of overall circuit board structure and promote electrical functionality, then becomes a kind of trend of encapsulation.
Figure 1A to Fig. 1 G those shown is the existing circuit board structure of electronic building brick and the cutaway view of method for making thereof of being embedded with.
As shown in Figure 1A, provide one there is relative first surface 10a and second surface 10b and run through this first surface 10a and the substrate 10 of the opening 100 of second surface 10b.
The adhesive sheet 11 of these opening 100 one end of capping is set as shown in Figure 1B, on this second surface 10b.
As shown in Figure 1 C, on this first surface 10a, positioning frame body 12 is set, to locate this substrate 10.
As shown in Fig. 1 D, on this adhesive sheet 11 with this opening 100, electronic building brick 13 is set, this electronic building brick 13 has the first relative acting surface 13a and the second acting surface 13b, on this first acting surface 13a and the second acting surface 13b, be respectively equipped with the first electronic pads 131a and the second electronic pads 131b, and make this first acting surface 13a and on the first electronic pads 131a expose to this first surface 10a.
As shown in Fig. 1 E, remove this adhesive sheet 11 and positioning frame body 12, and in this first surface 10a and second surface 10b upper sequentially pressing the first dielectric layer 14a, the first metal layer 15a and the second dielectric layer 14b, the second metal level 15b respectively.
As shown in Fig. 1 F, in this first dielectric layer 14a and the second dielectric layer 14b, form respectively the first conductive blind hole 141a and the second conductive blind hole 141b, and patterning this first metal layer 15a and the second metal level 15b, to form respectively the first line layer 151a and the second line layer 151b.
As shown in Figure 1 G, on this first dielectric layer 14a and the second dielectric layer 14b, form respectively the first layer reinforced structure 16a and the second layer reinforced structure 16b.
But, the existing circuit board structure that is embedded with electronic building brick only can be embedded into the electronic building brick of individual layer, and total number of plies of line layer is even number, the design of the electronic product to pluralistic function produces restriction, and be difficult for reaching light, thin, short, the little demand of electronic product now, therefore conventionally only can be applied on low order (low end) product.
Therefore, how to avoid above-mentioned variety of problems of the prior art, the real problem of desiring most ardently at present solution that become.
Summary of the invention
Because the shortcoming of above-mentioned prior art, main purpose of the present invention is to provide a kind of circuit board structure and method for making thereof that is embedded with electronic building brick, can effectively promote the flexible design degree of wiring board.
The circuit board structure that is embedded with electronic building brick of the present invention comprises: substrate, is formed with the first line layer on its at least one surface; The first dielectric layer, it is formed on this surface of this substrate, and has multiple dielectric layer openings that expose this first line layer; Multiple electronic building bricks, it is located in these dielectric layer openings, and is electrically connected this first line layer by metal bonded article, and these electronic building bricks of part are erectly located in this dielectric layer opening, and all the other these electronic building bricks are located in this dielectric layer opening flatwise; The second dielectric layer, it is formed on this first dielectric layer and electronic building brick, and have multiple dielectric layer blind holes that expose this electronic building brick, the degree of depth that correspondence exposes the dielectric layer blind hole of this upright electronic building brick is less than correspondence and exposes the degree of depth of the dielectric layer blind hole of this electronic building brick keeping flat; Multiple conductive blind holes, it is formed in this dielectric layer blind hole, and the degree of depth of the conductive blind hole to electronic building brick that should be upright is less than the degree of depth of the conductive blind hole of the electronic building brick to keeping flat; And second line layer, it is formed on this second dielectric layer, makes this second line layer be electrically connected this electronic building brick by this conductive blind hole.
The present invention also provides a kind of method for making of the circuit board structure that is embedded with electronic building brick, it comprises: at least one surface of substrate, form the first dielectric layer, this substrate surface has the first line layer, and this first dielectric layer has multiple dielectric layer openings that expose this first line layer; Multiple electronic building bricks are arranged in these dielectric layer openings, and make these electronic building bricks be electrically connected this first line layer by metal bonded article, these electronic building bricks of part are erectly arranged in this dielectric layer opening, and all the other these electronic building bricks are arranged in this dielectric layer opening flatwise; And on this first dielectric layer and electronic building brick, sequentially form the second dielectric layer, the second line layer and be formed at the multiple conductive blind holes in this second dielectric layer, this second line layer is electrically connected this electronic building brick by this conductive blind hole, and the degree of depth of the conductive blind hole to electronic building brick that should be upright is less than the degree of depth of the conductive blind hole of the electronic building brick to keeping flat.
As from the foregoing, because the present invention can by the indivedual vertical and horizontal directions of multiple electronic building bricks miscellaneous be embedded in wiring board, and these electronic building bricks storehouse each other, so the present invention can reach the effect of these electronic building bricks of parallel connection and serial connection, and then promote the flexible design degree of wiring board, meet the design requirement of the product of high complexity, powerful and customized profile.
Brief description of the drawings
Figure 1A to Fig. 1 G those shown is the existing circuit board structure of electronic building brick and the cutaway view of method for making thereof of being embedded with.
Fig. 2 A to Fig. 2 G those shown is the cutaway view that is embedded with the circuit board structure of electronic building brick and the first embodiment of method for making thereof of the present invention, and wherein, Fig. 2 G ' is another embodiment of Fig. 2 G.
Fig. 3 A to Fig. 3 G those shown is the cutaway view that is embedded with the circuit board structure of electronic building brick and the second embodiment of method for making thereof of the present invention, and wherein, Fig. 3 G ' is another embodiment of Fig. 3 G.
Symbol description
10,2,3 substrates
10a first surface
10b second surface
100 openings
11 adhesive sheets
12 positioning frame body
13,24,36 electronic building bricks
13a the first acting surface
13b the second acting surface
131a the first electronic pads
131b the second electronic pads
14a, 22,34 first dielectric layers
14b, 25,37 second dielectric layers
141a the first conductive blind hole
141b the second conductive blind hole
15a the first metal layer
15b the second metal level
151a, 21,33 first line layers
151b, 261,381 second line layers
16a the first layer reinforced structure
16b the second layer reinforced structure
20,30 core loading plates
201 conductive through holes
220,340 dielectric layer openings
23,35 metal bonded articles
26,38 metal levels
251,371 conductive blind holes
300 openings
In 31, bury electronic building brick
32 core dielectric layers.
Embodiment
By particular specific embodiment explanation embodiments of the present invention, those skilled in the art can understand other advantage of the present invention and effect easily by content disclosed in the present specification below.
Notice, appended graphic the illustrated structure of this specification, ratio, size etc., all contents for coordinating specification to disclose only, for those skilled in the art's understanding and reading, be not intended to limit the enforceable qualifications of the present invention, therefore the not technical essential meaning of tool, the adjustment of the modification of any structure, the change of proportionate relationship or size, not affecting under effect that the present invention can produce and the object that can reach, all should still drop on disclosed technology contents and obtain in the scope that can contain.Simultaneously, in this specification, quote as " on ", " inside burying ", " in " and the term of " " etc., also only for ease of understanding of narrating, but not for limiting the enforceable scope of the present invention, the change of its relativeness or adjustment, changing under technology contents, when being also considered as the enforceable category of the present invention without essence.
The first embodiment
Fig. 2 A to Fig. 2 G those shown, is the cutaway view that is embedded with the circuit board structure of electronic building brick and the first embodiment of method for making thereof of the present invention, and wherein, Fig. 2 G ' is another embodiment of Fig. 2 G.
As shown in Figure 2 A, provide a substrate 2, it comprises: core loading plate 20; Multiple conductive through holes 201, it runs through two surfaces of this core loading plate 20; And first line layer 21, its relative two surfaces that are formed at this core loading plate 20 are upper, and are electrically connected this conductive through hole 201.
As shown in Figure 2 B, in upper first dielectric layer 22 that forms in relative two surfaces of this substrate 2, the material of this first dielectric layer 22 can be prepreg (prepreg).
As shown in Figure 2 C, remove this first dielectric layer 22 of part by laser burn mode, to form multiple dielectric layer openings 220 that expose this first line layer 21.
As shown in Figure 2 D, form metal bonded article 23 by wire mark mode on this first line layer 21 exposing, the material of this metal bonded article 23 can be copper cream, silver paste or conducting metal goo.
As shown in Figure 2 E, multiple electronic building bricks 24 are set in these dielectric layer openings 220, and make these electronic building bricks 24 be electrically connected this first line layer 21 by this metal bonded article 23, and be electrically connected this first line layer 21 with parallel connection or series system, these electronic building bricks 24 of part are erectly arranged in this dielectric layer opening 220, all the other these electronic building bricks 24 are arranged in this dielectric layer opening 220 flatwise, and each length its accommodating electronic building brick 24 corresponding to width of this dielectric layer opening 220.In the present embodiment, the quantity of this electronic building brick 24 is multiple, but not as limit.In the present embodiment, this electronic building brick 24 can be electric capacity, and this electric capacity can be monolithic ceramic capacitor (Multi-layer Ceramic Capacitor, be called for short MLCC), but not as limit.
As shown in Figure 2 F, on this first dielectric layer 22 and electronic building brick 24, sequentially form the second dielectric layer 25 and metal level 26.
As shown in Figure 2 G, in this second dielectric layer 25, form multiple conductive blind holes 251, and this metal level 26 of patterning, to form the second line layer 261, this second line layer 261 is electrically connected this electronic building brick 24 by the conductive blind hole 251 in this second dielectric layer 25, the degree of depth of the conductive blind hole 251 to electronic building brick 24 that should be upright is less than the degree of depth of the conductive blind hole 251 of the electronic building brick 24 to keeping flat, and so far completes the circuit board structure that is embedded with electronic building brick of the present invention.
Or, as shown in Fig. 2 G ', only form this metal bonded article 23 and this electronic building brick 24 be set in a side of this substrate 2, so this in affiliated technical field, have conventionally know that the knowledgeable complies with this specification can the person of understanding, therefore do not repeat at this.
The second embodiment
Fig. 3 A to Fig. 3 G those shown, is the cutaway view that is embedded with the circuit board structure of electronic building brick and the second embodiment of method for making thereof of the present invention, and wherein, Fig. 3 G ' is another embodiment of Fig. 3 G.
As shown in Figure 3A, provide a substrate 3, it comprises: core loading plate 30, and it has the opening 300 that runs through its relative two surfaces; Inside bury electronic building brick 31, it is located in this opening 300; Core dielectric layer 32, its be formed at this core loading plate 30 this two surface with in bury on electronic building brick 31; And first line layer 33, it is formed on this core dielectric layer 32, and is electrically connected this interior electronic building brick 31 that buries.In the present embodiment, this interior electronic building brick 31 that buries can be electric capacity, and this electric capacity can be monolithic ceramic capacitor (Multi-layer Ceramic Capacitor, be called for short MLCC), but not as limit.
As shown in Figure 3 B, in upper first dielectric layer 34 that forms in relative two surfaces of this substrate 3, the material of this first dielectric layer 34 can be prepreg (prepreg).
As shown in Figure 3 C, remove this first dielectric layer 34 of part by laser burn mode, to form multiple dielectric layer openings 340 that expose this first line layer 33.
As shown in Figure 3 D, form metal bonded article 35 by wire mark mode on this first line layer 33 exposing, the material of this metal bonded article 35 can be copper cream, silver paste or conducting metal goo.
As shown in Fig. 3 E, multiple electronic building bricks 36 are set in these dielectric layer openings 340, and make these electronic building bricks 36 be electrically connected this first line layer 33 by this metal bonded article 35, and be electrically connected this first line layer 33 with parallel connection or series system, these electronic building bricks 36 of part are erectly arranged in this dielectric layer opening 340, all the other these electronic building bricks 36 are arranged in this dielectric layer opening 340 flatwise, and each length its accommodating electronic building brick 36 corresponding to width of this dielectric layer opening 340.In the present embodiment, the quantity of this electronic building brick 36 is multiple, but not as limit.In the present embodiment, this electronic building brick 36 can be electric capacity, and this electric capacity can be monolithic ceramic capacitor (Multi-layer Ceramic Capacitor, be called for short MLCC), but not as limit.
As shown in Fig. 3 F, on this first dielectric layer 34 and electronic building brick 36, sequentially form the second dielectric layer 37 and metal level 38.
As shown in Fig. 3 G, in this second dielectric layer 37, form multiple conductive blind holes 371, and this metal level 38 of patterning, to form the second line layer 381, this second line layer 381 is electrically connected this electronic building brick 36 by the conductive blind hole 371 in this second dielectric layer 37, so far completes the circuit board structure that is embedded with electronic building brick of the present invention.
Or, as shown in Fig. 3 G ', only form this metal bonded article 35 and this electronic building brick 36 be set in a side of this substrate 3, so this in affiliated technical field, have conventionally know that the knowledgeable complies with this specification can the person of understanding, therefore do not repeat at this.
The present invention also provides a kind of circuit board structure that is embedded with electronic building brick, comprising: substrate 2,3, is formed with the first line layer 21,33 on its at least one surface; The first dielectric layer 22,34, it is formed on this surface of this substrate 2,3, and has multiple dielectric layer openings 220,340 that expose this first line layer 21,33; Multiple electronic building bricks 24,36, it is located at these dielectric layer openings 220, in 340, and be electrically connected this first line layer 21,33 by metal bonded article 23,35, these electronic building bricks 24 of part, 36 are erectly located in this dielectric layer opening 220,340, all the other these electronic building bricks 24,36 are located in this dielectric layer opening 220,340 flatwise; The second dielectric layer 25,37, it is formed at this first dielectric layer 22,34 with electronic building brick 24,36 on, and there are multiple this electronic building bricks 24 that expose, 36 dielectric layer blind hole, the degree of depth that correspondence exposes the dielectric layer blind hole of this upright electronic building brick 24,36 is less than correspondence and exposes the degree of depth of the dielectric layer blind hole of this electronic building brick 24,36 keeping flat; Multiple conductive blind holes 251,371, it is formed in this dielectric layer blind hole, and the degree of depth of the conductive blind hole 251,371 to electronic building brick 24,36 that should be upright is less than the degree of depth of the conductive blind hole 251,371 of the electronic building brick 24,36 to keeping flat; And second line layer 261,381, it is formed on this second dielectric layer 25,37, makes this second line layer 261,381 be electrically connected these electronic building bricks 24,36 by this conductive blind hole 251,371.
In the circuit board structure that is embedded with electronic building brick of the present invention, this substrate 2 can comprise: core loading plate 20; Multiple conductive through holes 201, it runs through relative two surfaces of this core loading plate 20; And this first line layer 21, it is formed at least one surface of this core loading plate 20, and is electrically connected this conductive through hole 201.Or this substrate 3 can comprise: core loading plate 30, it has the opening 300 that runs through its relative two surfaces; Inside bury electronic building brick 31, it is located in this opening 300; Core dielectric layer 32, its be formed at this core loading plate 30 this two surface with in bury on electronic building brick 31; And this first line layer 33, it is formed on this core dielectric layer 32, and is electrically connected this interior electronic building brick 31 that buries.
According to the front described circuit board structure that is embedded with electronic building brick, this electronic building brick 24,36 are electrically connected this first line layer 21,33 with parallel connection or series system, this electronic building brick 24,36 is resistance, electric capacity, inductance or chip, and this metal bonded article 23,35 is copper cream, silver paste or conducting metal goo, respectively this dielectric layer opening 220,340 length its accommodating electronic building brick 24,36 corresponding to width.
In sum, than prior art, due to the present invention can by the indivedual vertical and horizontal directions of multiple electronic building bricks miscellaneous be embedded in wiring board, and these electronic building bricks storehouse each other, therefore the present invention can reach the effect of these electronic building bricks of parallel connection and serial connection, and then promote the flexible design degree of wiring board, meet the design requirement of the product of high complexity, powerful and customized profile.
Above-described embodiment is only for illustrative principle of the present invention and effect thereof, but not for limiting the present invention.Any those skilled in the art all can, under spirit of the present invention and category, modify to above-described embodiment.Therefore the scope of the present invention, should be as listed in claims.
Claims (14)
1. a circuit board structure that is embedded with electronic building brick, it comprises:
Substrate, is formed with the first line layer on its at least one surface;
The first dielectric layer, it is formed on this surface of this substrate, and has multiple dielectric layer openings that expose this first line layer;
Multiple electronic building bricks, it is located in these dielectric layer openings, and is electrically connected this first line layer by metal bonded article, and these electronic building bricks of part are erectly located in this dielectric layer opening, and all the other these electronic building bricks are located in this dielectric layer opening flatwise;
The second dielectric layer, it is formed on this first dielectric layer and electronic building brick, and have multiple dielectric layer blind holes that expose this electronic building brick, the degree of depth that correspondence exposes the dielectric layer blind hole of this upright electronic building brick is less than correspondence and exposes the degree of depth of the dielectric layer blind hole of this electronic building brick keeping flat;
Multiple conductive blind holes, it is formed in this dielectric layer blind hole, and the degree of depth of the conductive blind hole to electronic building brick that should be upright is less than the degree of depth of the conductive blind hole of the electronic building brick to keeping flat; And
The second line layer, it is formed on this second dielectric layer, makes this second line layer be electrically connected this electronic building brick by this conductive blind hole.
2. the circuit board structure that is embedded with electronic building brick according to claim 1, is characterized in that, this substrate comprises:
Core loading plate;
Multiple conductive through holes, it runs through relative two surfaces of this core loading plate; And
This first line layer, it is formed at least one surface of this core loading plate, and is electrically connected this conductive through hole.
3. the circuit board structure that is embedded with electronic building brick according to claim 1, is characterized in that, this substrate comprises:
Core loading plate, it has the opening that runs through its relative two surfaces;
Inside bury electronic building brick, it is located in this opening;
Core dielectric layer, its be formed at this core loading plate this two surface with in bury on electronic building brick; And
This first line layer, it is formed on this core dielectric layer, and is electrically connected this interior electronic building brick that buries.
4. the circuit board structure that is embedded with electronic building brick according to claim 1, is characterized in that, this electronic building brick is electrically connected this first line layer with parallel connection or series system.
5. the circuit board structure that is embedded with electronic building brick according to claim 1, is characterized in that, this electronic building brick is resistance, electric capacity, inductance or chip.
6. the circuit board structure that is embedded with electronic building brick according to claim 1, is characterized in that, this metal bonded article is copper cream, silver paste or conducting metal goo.
7. the circuit board structure that is embedded with electronic building brick according to claim 1, is characterized in that, respectively the length of this dielectric layer opening its accommodating electronic building brick corresponding to width.
8. a method for making that is embedded with the circuit board structure of electronic building brick, it comprises:
On at least one surface of substrate, form the first dielectric layer, this substrate surface has the first line layer, and this first dielectric layer has multiple dielectric layer openings that expose this first line layer;
Multiple electronic building bricks are arranged in these dielectric layer openings, and make these electronic building bricks be electrically connected this first line layer by metal bonded article, these electronic building bricks of part are erectly arranged in this dielectric layer opening, and all the other these electronic building bricks are arranged in this dielectric layer opening flatwise; And
On this first dielectric layer and electronic building brick, sequentially form the second dielectric layer, the second line layer and be formed at the multiple conductive blind holes in this second dielectric layer, this second line layer is electrically connected this electronic building brick by this conductive blind hole, and the degree of depth of the conductive blind hole to electronic building brick that should be upright is less than the degree of depth of the conductive blind hole of the electronic building brick to keeping flat.
9. the method for making of the circuit board structure that is embedded with electronic building brick according to claim 8, is characterized in that, this substrate comprises:
Core loading plate;
Multiple conductive through holes, it runs through relative two surfaces of this core loading plate; And
This first line layer, it is formed at least one surface of this core loading plate, and is electrically connected this conductive through hole.
10. the method for making of the circuit board structure that is embedded with electronic building brick according to claim 8, is characterized in that, this substrate comprises:
Core loading plate, it has the opening that runs through its relative two surfaces;
Inside bury electronic building brick, it is located in this opening;
Core dielectric layer, its be formed at this core loading plate this two surface with in bury on electronic building brick; And
This first line layer, it is formed on this core dielectric layer, and is electrically connected this interior electronic building brick that buries.
The method for making of 11. circuit board structures that are embedded with electronic building brick according to claim 8, is characterized in that, this electronic building brick is electrically connected this first line layer with parallel connection or series system.
The method for making of 12. circuit board structures that are embedded with electronic building brick according to claim 8, is characterized in that, this electronic building brick is resistance, electric capacity, inductance or chip.
The method for making of 13. circuit board structures that are embedded with electronic building brick according to claim 8, is characterized in that, this metal bonded article is copper cream, silver paste or conducting metal goo.
The method for making of 14. circuit board structures that are embedded with electronic building brick according to claim 8, is characterized in that, respectively the length of this dielectric layer opening its accommodating electronic building brick corresponding to width.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310076764.4A CN104051405A (en) | 2013-03-11 | 2013-03-11 | Circuit board structure provided with electronic assemblies in embedded manner and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310076764.4A CN104051405A (en) | 2013-03-11 | 2013-03-11 | Circuit board structure provided with electronic assemblies in embedded manner and manufacturing method thereof |
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| CN104051405A true CN104051405A (en) | 2014-09-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201310076764.4A Pending CN104051405A (en) | 2013-03-11 | 2013-03-11 | Circuit board structure provided with electronic assemblies in embedded manner and manufacturing method thereof |
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| CN (1) | CN104051405A (en) |
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| CN104576563A (en) * | 2014-12-30 | 2015-04-29 | 华天科技（西安）有限公司 | Embedded sensor chip system packaging structure |
| CN107611114A (en) * | 2017-07-31 | 2018-01-19 | 华为技术有限公司 | A kind of embedded substrate |
| CN109473416A (en) * | 2017-09-08 | 2019-03-15 | 日月光半导体制造股份有限公司 | For encapsulating the substrate and its manufacturing method of semiconductor device packages |
| WO2022007271A1 (en) * | 2019-07-07 | 2022-01-13 | 深南电路股份有限公司 | Circuit board and manufacturing method therefor |
| US11602054B2 (en) | 2020-07-07 | 2023-03-07 | Shennan Circuits Co., Ltd. | Circuit board and method for manufacturing the same |
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| CN102256435A (en) * | 2010-05-21 | 2011-11-23 | 富士通株式会社 | Multilayer printed circuit board using flexible interconnect structure, and method of making same |
| US20120181073A1 (en) * | 2011-01-14 | 2012-07-19 | Harris Corporation | Electronic device having liquid crystal polymer solder mask and outer sealing layers, and associated methods |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104576563A (en) * | 2014-12-30 | 2015-04-29 | 华天科技（西安）有限公司 | Embedded sensor chip system packaging structure |
| CN107611114A (en) * | 2017-07-31 | 2018-01-19 | 华为技术有限公司 | A kind of embedded substrate |
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| CN109473416A (en) * | 2017-09-08 | 2019-03-15 | 日月光半导体制造股份有限公司 | For encapsulating the substrate and its manufacturing method of semiconductor device packages |
| WO2022007271A1 (en) * | 2019-07-07 | 2022-01-13 | 深南电路股份有限公司 | Circuit board and manufacturing method therefor |
| US11602054B2 (en) | 2020-07-07 | 2023-03-07 | Shennan Circuits Co., Ltd. | Circuit board and method for manufacturing the same |
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Application publication date: 20140917 |