CN215934901U - Touch module and mobile terminal - Google Patents
Touch module and mobile terminal Download PDFInfo
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- CN215934901U CN215934901U CN202122229424.3U CN202122229424U CN215934901U CN 215934901 U CN215934901 U CN 215934901U CN 202122229424 U CN202122229424 U CN 202122229424U CN 215934901 U CN215934901 U CN 215934901U
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Abstract
The utility model relates to a touch module and a mobile terminal, wherein the FOG module comprises a flexible circuit board; a backlight assembly including an iron frame; the metal foil comprises a first area and a second area, the first area covers the surface of the IC end part of the flexible circuit board, and the second area is electrically connected with the iron frame. The utility model realizes the enhancement of the shielding effect by enlarging the shape of the copper foil on the flexible circuit board, thereby improving the radio frequency problem.
Description
Technical Field
The utility model relates to the technical field of touch control, in particular to a touch control module and a mobile terminal.
Background
With the advent of the 5G era, the increase of frequency has brought great challenges to radio frequency design. Especially in the field of smart phones, this challenge is particularly acute: the thinner the handset, the less space is left for the radio frequency module.
The FOG is a production process of the capacitive touch screen, namely FPC On Glass, the assembly of the flexible circuit board and the Glass panel has the characteristics of thin thickness, light weight and the like, and is widely applied to mobile phone screens, vehicle-mounted screens, medical screens, television screens, industrial control screens and the like. For the radio frequency problem of the mobile phone, the current scheme is that copper foil is attached to an IC end on an FOG and grounded with FPC copper leakage, and the FPC is bent and attached to a backlight iron frame after backlight is assembled.
The prior art has at least the following problems: as the mobile phone is thinner, the thickness of the FPC is also reduced, resulting in a reduced shielding effect.
Disclosure of Invention
In view of the above, the present invention is directed to a touch module, which can improve the rf problem by increasing the copper foil profile on the FPC to enhance the shielding effect.
Therefore, the utility model provides the following technical scheme:
a touch module, comprising:
the FOG module comprises a flexible circuit board;
a backlight assembly including an iron frame;
the metal foil comprises a first area and a second area, the first area covers the surface of the IC end part of the flexible circuit board, and the second area is electrically connected with the iron frame.
As a preferred technical solution, the FOG further includes a glass circuit board, and the glass panel has an IC chip.
As a preferred technical scheme, the first area covers the surface of the IC chip.
As a preferred technical scheme, the flexible circuit board can be bent, and the non-IC end of the flexible circuit board is attached to the iron frame.
As a preferred technical scheme, the metal foil is arranged on one side of the flexible circuit board, and a partial area of the other side of the flexible circuit board is attached to the surface of the iron frame.
Preferably, the second region is a region where the metal foil extends to the outside of the IC terminal of the flexible circuit board.
Preferably, the metal foil is a copper foil.
Preferably, the backlight assembly is disposed on a surface of the glass panel.
As a preferred technical scheme, the iron frame is a rectangular iron frame.
As a preferred technical solution, the flexible circuit board is connected to the metal foil through an iron frame to perform ground shielding.
The application also comprises a mobile terminal which comprises the touch module.
The technical scheme adopted by the utility model has the beneficial effects that the shielding effect is enhanced by enlarging the appearance of the copper foil on the FPC, and the radio frequency problem is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below to form a part of the present invention, and the exemplary embodiments and the description thereof illustrate the present invention and do not constitute a limitation of the present invention. In the drawings:
fig. 1 is a schematic structural diagram of a touch module disclosed in embodiment 1-2 of the present invention;
fig. 2 is a schematic structural diagram of a touch module disclosed in embodiment 1-2 of the present invention;
fig. 3 is a schematic structural diagram of a touch module disclosed in embodiments 1-2 of the present disclosure.
Description of reference numerals:
a glass panel 10; an IC chip 100; a flexible circuit board 11; a first region 12; (ii) a FPC copper leakage 11O; an iron frame 13; a second region 111.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the accompanying drawings. In the description of the present invention, it is noted that the term "or" is generally employed in its sense including "and/or" unless the content clearly dictates otherwise.
In the description of the present invention, it should be noted that, unless otherwise specifically stated or limited, the terms "mounted," "connected," and "spliced" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
It is to be understood that the described embodiments are merely exemplary of the utility model, and not restrictive of the full scope of the utility model. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
This embodiment 1 provides a touch module, including:
the FOG module comprises a flexible circuit board;
a backlight assembly including an iron frame;
the metal foil comprises a first area and a second area, the first area covers the surface of the IC end part of the flexible circuit board, and the second area is electrically connected with the iron frame.
The Flexible Circuit board 11 is a Flexible Printed Circuit, which is called FPC for short. The surface of flexible base material is made into conductor circuit pattern by means of optical imaging pattern transfer and etching process, the surface layer and internal layer of double-face and multi-layer circuit board are electrically communicated with internal layer and external layer by means of metallized hole, and the surface of circuit pattern is protected and insulated by means of PI and adhesive layer. Classifying according to different modes, distinguishing according to softness, and dividing into a flexible circuit board and a rigid-flexible combined circuit board; the flexible printed circuit board is divided into a single-layer flexible printed circuit board, a double-layer flexible printed circuit board and a multi-layer flexible printed circuit board according to the number of layers. It is classified as a flexible board with glue or a flexible board without glue. The connecting structure is applied to connecting parts of electronic products, such as mobile phone flat cables, liquid crystal modules and the like, and compared with a hard board, the connecting structure is smaller in size, lighter in weight, and capable of achieving the advantages of bending, flexing, three-dimensional assembling and the like.
The FOG is a production process of the capacitive touch screen, namely, the FPC On Glass, the Glass panel 10 and the flexible circuit board 11 are assembled, and the IC chip 100 is directly bonded On the Glass panel 10. The flexible circuit board 11 is mainly used for a connection portion of an electronic product, and has an IC terminal and a non-IC terminal.
In this embodiment 1, the metal foil includes a first region 12 and a second region 111, the metal foil covers the surface of the IC terminal portion of the flexible circuit board 11 and the surface of the IC chip 100 and is referred to as the first region 12, and the region where the metal foil extends out of the IC terminal of the flexible circuit board is referred to as the second region 111. After the backlight assembly is assembled on the surface of the glass panel 10, the flexible circuit board 11 is bent to attach one surface of the flexible circuit board, which is not provided with the metal foil, to the surface of the bezel 13, and the area outside the IC end of the flexible circuit board 11 is electrically connected to the bezel 13. At the same time, the second region 111 of the metal foil is also electrically connected to the bezel.
Among them, an IC chip, i.e., an integrated circuit, is a generic name of a semiconductor device product, and includes: an integrated circuit board; secondly, a triode; special electronic components, etc.; the touch IC means a touch chip.
Preferably, the metal foil 12 is a copper foil. Copper foil is an anionic electrolytic material that is deposited as a thin, continuous metal foil on the substrate layer of a circuit board that serves as the electrical conductor for the PCB. It is easy to adhere to the insulating layer, receive the printing protective layer, form the circuit pattern after corroding. In addition, the copper foil has low surface oxygen characteristic, can be attached to various substrates such as metal, insulating materials and the like, and has a wide temperature use range. The conductive copper foil is mainly applied to electromagnetic shielding and antistatic, the conductive copper foil is arranged on the bottom surface of the substrate and combined with a metal base material, so that the conductive copper foil has excellent conductivity and provides an electromagnetic shielding effect. Can be divided into self-adhesive copper foil, double-conductive copper foil, single-conductive copper foil and the like.
Copper foil materials are mainly divided into two types of rolled copper and electrolytic copper, and the copper material of which type is selected to be used as a conductor of a flexible circuit board needs to be considered from the aspects of product application range, circuit precision and the like.
The rolling of copper is to paste high-purity (more than 99.98%) copper on the FPC by a rolling method. The FPC and the copper foil have excellent adhesion, the adhesion strength and the working temperature of the copper foil are high, and the FPC can be dip-soldered in molten tin at 260 ℃ without foaming. The copper foil obtained by the rolling method has the advantages of good bending resistance, but weaker conductivity than electrolytic copper.
Electrolytic copper, as its name implies, is formed by forming a copper foil by adsorbing copper ions onto a substrate by an electrolytic method. For example, the CuSO4 electrolyte can be used to continuously produce "copper foil" in layers, and the thicker the copper foil is, the easier it is to control the thickness. Its advantages are high electric conductivity and low bending strength.
The backlight assembly is one of the key components of the lcd panel. The function is to provide sufficient brightness and light source with uniform distribution, so that the image can be displayed normally. The backlight component mainly comprises a light source, an iron frame 13, a rubber frame, a light guide plate, an optical film and a reflector plate, and the principle is as follows:
the light source, the light guide plate, the reflector plate and the optical film form a backlight source of the liquid crystal display. The light guide plate functions to guide a scattering direction of light, to improve the brightness of the panel, and to ensure uniformity of the brightness of the panel.
The side light source emits light with required brightness, white light or other colors, the side light source is converted into a front-view surface light source under the action of the light guide plate, most light is refracted to the front, a small part of light is recycled after being reflected under the action of the reflecting film, and the light is completely scattered under the diffusion action of the lower diffusion film, so that the light is relatively balanced on the whole plane.
Make light strengthen at horizontal or vertical at the prism gathering effect of membrane of adding lustre to down again, make light strengthen at vertical or horizontal, make light strengthen for the homogeneity of letting the picture better sometimes, or cover slight bad phenomenon, also can use the diffusion barrier in the prism gathering effect of membrane of adding lustre to, light is disturbed by the diffusion once more, and the uniformity of picture demonstration is better.
In addition, the rubber frame is buckled in the iron frame 13 to form an integral frame of the backlight source, and the iron frame 13 is only an outer iron frame on the backlight and is used for enhancing the hardness of the backlight to protect the display screen from being broken easily.
Example 2
According to fig. 1-3, in the conventional scheme, a metal foil 12 is attached to an IC terminal 100 on a FOG and grounded to a FPC copper drain 110, and after assembling a backlight source, a flexible circuit board 11 is bent and attached to a backlight bezel 13, and the metal foil 12 is not in contact with the backlight bezel.
In this embodiment 2, the metal foil 12, i.e. the second region 111, is enlarged. After the backlight source is assembled on the surface of the glass panel 10, the flexible circuit board 11 is bent as shown in fig. 2, and one surface of the flexible circuit board, which is not provided with the metal foil, is attached to the backlight bezel 13. Wherein the second region 111 is electrically connected to the backlight bezel 13. It is apparent that the metal foil 12 is grounded to the flexible circuit board FPC through the bezel 13.
The thinness of the copper foil needs to be controlled in the utility model mainly for two reasons, the first reason is that the uniform copper foil can have very uniform resistance temperature coefficient, so that the signal transmission loss is smaller; and secondly, the temperature rise of the thin copper foil is small when a large current passes through the thin copper foil, so that the thin copper foil is beneficial to heat dissipation and the service life of elements.
The specific thickness and size of the copper foil can be set by those skilled in the art according to practical requirements, and the embodiment of the present invention is not particularly limited.
The utility model further provides a mobile terminal which comprises the touch module provided by the embodiment 1-2.
The foregoing detailed description of the touch module according to the embodiment of the present application has been provided, and specific examples are applied herein to explain the principle and the implementation manner of the present application, and the description of the foregoing embodiments is only used to help understanding the method and the core idea of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation of the present application.
Claims (10)
1. A touch module, comprising:
the FOG module comprises a flexible circuit board;
a backlight assembly including an iron frame;
the metal foil comprises a first area and a second area, the first area covers the surface of the IC end part of the flexible circuit board, and the second area is electrically connected with the iron frame.
2. The touch module of claim 1, wherein the FOG module further comprises a glass panel having an IC chip.
3. The touch module of claim 2, wherein the first area covers the surface of the IC chip.
4. The touch module of claim 1, wherein the flexible circuit board is bendable, and the non-IC end of the flexible circuit board is attached to the bezel.
5. The touch module of claim 1, wherein the metal foil is disposed on one side of the flexible circuit board, and a portion of the other side of the flexible circuit board is attached to the surface of the bezel.
6. The touch module of claim 1, wherein the second area is an area where the metal foil extends to an outside of an IC terminal of a flexible circuit board.
7. The touch module of claim 1, wherein the metal foil is a copper foil.
8. The touch module of claim 1, wherein the bezel is a rectangular bezel.
9. The touch module of claim 1, wherein the flexible circuit board is connected to ground via the bezel and the metal foil for ground shielding.
10. A mobile terminal, characterized in that it comprises a touch module according to any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122229424.3U CN215934901U (en) | 2021-09-14 | 2021-09-14 | Touch module and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122229424.3U CN215934901U (en) | 2021-09-14 | 2021-09-14 | Touch module and mobile terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215934901U true CN215934901U (en) | 2022-03-01 |
Family
ID=80416788
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122229424.3U Active CN215934901U (en) | 2021-09-14 | 2021-09-14 | Touch module and mobile terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215934901U (en) |
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2021
- 2021-09-14 CN CN202122229424.3U patent/CN215934901U/en active Active
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