CN109640522B - Electronic device and electronic apparatus - Google Patents
Electronic device and electronic apparatus Download PDFInfo
- Publication number
- CN109640522B CN109640522B CN201811533883.7A CN201811533883A CN109640522B CN 109640522 B CN109640522 B CN 109640522B CN 201811533883 A CN201811533883 A CN 201811533883A CN 109640522 B CN109640522 B CN 109640522B
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- conductive
- circuit board
- electronic device
- main body
- insulating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Telephone Set Structure (AREA)
Abstract
The invention relates to an electronic device and electronic equipment, the electronic device includes: a main body; the circuit board is electrically connected with the main body; one of the back surface of the main body and the circuit board is provided with a conductive area, and the other one is provided with an insulating area; the conductive area is provided with at least two insulating counterpoint portions, the insulating area is provided with at least two conductive counterpoint portions opposite to the two insulating counterpoint portions, and the conductive counterpoint portions are mutually insulated; the two insulation counterpoint portions are respectively matched with the two conductive counterpoint portions in a counterpoint mode, so that the circuit board can be positioned towards the bending of the back face of the main body. The electronic device provided by the invention not only can realize the bending alignment of the circuit board by utilizing the alignment matching between the conductive alignment part and the insulating alignment part, but also can judge whether the bending alignment of the circuit board is accurate or not by detecting the two conductive alignment parts, thereby improving the yield of the electronic device.
Description
Technical Field
The present invention relates to the field of electronic products, and in particular, to an electronic device and an electronic apparatus.
Background
The electronic device is closely related to the life of people, and the electronic device is provided with the circuit board, and when the electronic device is assembled with other parts, the circuit board is required to be bent to the back of the electronic device for convenient assembly, and if the bent position deviation of the circuit board is large, the use of a customer can be influenced. For example in the display screen field, the display screen mainly includes display module assembly and FPC (flexible circuit board), and in the production process, FPC will buckle the back of display module assembly usually, for the convenient to use of low reaches firm, will guarantee the position precision after FPC buckles usually to avoid influencing customer's use. For example, the FPC is usually connected with a connector, and if the FPC is bent and assembled, the position of the connector is inclined, which further causes the problems of difficult insertion and poor assembly reliability during the assembly of a client. Meanwhile, the FPC can only judge whether the bending meets the requirements or not in a visual inspection mode after being bent, the accuracy is poor, the problems when a customer uses the FPC are further aggravated, and the reputation of a manufacturer is seriously influenced.
Disclosure of Invention
Therefore, it is necessary to provide an electronic device and an electronic apparatus for solving the problems that the circuit board has poor bending alignment accuracy and cannot effectively detect whether the bending meets the requirement.
An electronic device, comprising: a main body; the circuit board is electrically connected with the main body; one of the back surface of the main body and the circuit board is provided with a conductive area, and the other one is provided with an insulating area; the conductive area is provided with at least two insulating counterpoint portions, the insulating area is provided with at least two conductive counterpoint portions corresponding to the two insulating counterpoint portions respectively, and the conductive counterpoint portions are insulated from each other; the bending of the circuit board to the back of the main body can be positioned by the alignment matching of the at least two insulation alignment parts and the at least two conductive alignment parts respectively.
Furthermore, a metal frame is arranged on the back of the main body, and the insulating counterpoint portion is arranged on the metal frame.
Further, the insulation counterpoint part is an insulation hole; the conductive counterpoint part is a conductive column matched with the insulating hole.
Further, the radius of the insulation hole is larger than that of the cross section of the conductive column, and the dimensional tolerance between the insulation hole and the conductive column is 0.4mm-0.6 mm.
Further, the insulation counterpoint portion is an insulation layer disposed on the conductive region.
Further, the conductive counterpoint portion is arranged on the first surface of the circuit board and extends from the first surface of the circuit board to the second surface of the circuit board; the first surface of the circuit board is a surface which is close to the back surface of the main body after being bent; the second surface of the circuit board is arranged opposite to the first surface of the circuit board.
Further, the electronic device further comprises an adhesive tape, and the adhesive tape is used for adhering the circuit board to the back surface of the main body.
Further, the electronic device is a display device, the main body comprises a display module, and the display module is electrically connected with the circuit board.
Further, the electronic device is a touch display device; the main body comprises a display panel and a touch conductive film which are arranged in a stacked mode; the touch conductive film is electrically connected with the circuit board, and the part of the touch conductive film extending out of the display panel is bent to the back of the main body.
The invention also provides electronic equipment which comprises the electronic device.
The electronic device provided by the invention can realize bending alignment of the circuit board by using alignment matching between the conductive alignment part and the insulating alignment part. And after the circuit board is bent to the back of the main body, whether the bending alignment of the circuit board is accurate or not is judged by detecting whether the conductive alignment parts are conductive or not, so that the yield of the electronic device can be improved.
Drawings
Fig. 1 is a schematic back structure diagram of an electronic device according to the present invention;
FIG. 2 is a schematic sectional view taken along line A-A of an electronic device according to the present invention;
FIG. 3 is a schematic partial enlarged view of an insulating hole of an electronic device according to the present invention;
fig. 4 is a schematic sectional view taken along the direction a-a of another electronic device provided by the present invention.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to," mounted on, "or provided with" another element, or the like, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" or "contiguous" to another element, it can be directly connected or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
As shown in fig. 1, in an embodiment provided by the present invention, the electronic device mainly includes: a main body 1 and a circuit board 2 electrically connected to each other. The back of the main body 1 is provided with a conductive region 11, the circuit board 2 is provided with an insulating region 21 (a part of the non-conductive region on the circuit board 2 may be the insulating region in this embodiment), and when the circuit board 2 is bent to the back of the main body, the corresponding region of the insulating region 21 and the corresponding region of the conductive region 11 may be overlapped.
Meanwhile, in the present embodiment, the conductive region 11 is provided with two insulation alignment portions 12, and the insulating region 21 is provided with two conductive alignment portions 22 corresponding to the two insulation alignment portions 12, respectively; the two conductive counterpoint portions 22 are insulated from each other; through the alignment coordination between the two insulation alignment parts 12 and the two conductive alignment parts 22, the circuit board 2 can be bent to the position of the back surface of the main body 1 for positioning.
In addition, in the embodiment, when the bending position of the circuit board 2 is accurate, the two conductive alignment portions 22 are respectively in contact with the two insulation alignment portions 12, so that the two conductive alignment portions 22 are not electrically conducted, and conversely, if the bending position of the circuit board 2 is inaccurate, the two conductive alignment portions 22 are respectively in contact with the conductive areas 11, and at this time, the two conductive alignment portions 22 are electrically conducted. Therefore, after the circuit board 2 is bent to the back of the main body 1, whether the bending position of the circuit board 2 is accurate can be determined by detecting whether the two conductive positioning parts 22 are electrically conductive, so that defective products can be screened out in time for correction, the yield of products is improved, and the satisfaction degree of customers can be improved.
It will be appreciated that in other embodiments of the invention, it is also possible that the conductive areas 11 are provided on the circuit board 2 and the insulating areas 21 are provided on the back of the body 1. In addition, in other embodiments provided by the present invention, the number of the corresponding insulation positioning portions 12 and the number of the corresponding conductive positioning portions 22 may also be multiple (the conductive positioning portions 22 are insulated from each other), and when the bending position of the circuit board 2 is accurate, each conductive positioning portion 22 is in contact with the corresponding insulation positioning portion 12, so that no conduction exists between any two conductive positioning portions 22.
It is understood that the number of the insulating alignment portions 12 may be greater than or equal to the number of the conductive alignment portions 22, and when the numbers of the insulating alignment portions 12 are equal to each other, the positional relationship between the conductive alignment portions 22 and the positional relationship between the insulating alignment portions 12 are the same and correspond to each other; when the number of the insulating alignment portions 12 is greater than the number of the conductive alignment portions 22, the positional relationship of the arrangement between the conductive alignment portions 22 may be the same as the positional relationship of the arrangement between the partially insulating alignment portions 12. The number of the insulating alignment portions 12 may be smaller than the number of the conductive alignment portions 22, but the number of the insulating alignment portions 12 is only one less than the number of the conductive alignment portions 22 so as not to affect the detection of the position accuracy of the circuit board 2 after bending.
In the embodiment of the present invention, the circuit board 2 may be an FPC board (the FPC board is an abbreviation of Flexible printed circuit), and the FPC board has a good bending performance and is more convenient to bend toward the back of the main body 1. Of course, in other embodiments provided by the present invention, the circuit Board 2 may also adopt a PCB (PCB is an abbreviation of printedcuiit Board, and the name of the chinese character is a printed circuit Board) or the like. At this time, the PCB is connected to the main body 1 through a flexible conductive wire, so that the PCB is bent to the back of the main body 1.
As shown in fig. 2 and 4, in the embodiment of the present invention, a metal frame 3 is disposed on the back surface of the main body 1, and the metal frame 3 mainly serves to electromagnetically shield the main body 1 and prevent the main body 1 from being collided. Among them, in order to reduce the cost, the metal frame 3 is generally an iron frame. The corresponding conductive area on the metal frame 3 is the conductive area 11, and the insulation positioning portion 12 is directly disposed on the metal frame 3. Of course, in other embodiments provided by the present invention, the conductive area 11 may be disposed in other manners, for example, the conductive area 11 may be a conductive coating disposed on the back surface of the main body 1.
The conductive material of the conductive alignment portion 22 may be a metal such as copper or silver, a metal oxide, or a metal composite thereof, the material of the insulating alignment portion 12 may be a resin or an insulating paste, and in this embodiment, the shape and size of each insulating alignment portion 12 are the same, and the shape and size of each conductive alignment portion 22 are the same.
As shown in fig. 2 and 3, in the present embodiment, the insulating positioning portion 12 is an insulating hole, and mainly includes a hole 121 disposed in the conductive region 11, and an insulating layer 122 disposed in the hole 121. When the sidewall and the bottom of the hole 121 are both conductive, the insulating layer 122 covers the sidewall and the bottom of the hole 121; when the bottom of the hole site 121 is not conductive, the insulating layer 122 only needs to cover the sidewall of the hole site 121.
The conductive positioning portion 22 is a conductive column matched with the insulating hole, the radius of the cross section of the conductive column is smaller than that of the insulating hole, and when the circuit board 2 is bent to the back of the main body 1, the conductive column can enter the insulating hole, so that the conductive positioning portion 22 and the insulating positioning portion 12 can be more conveniently aligned and matched. In addition, in order to ensure the alignment precision of the bent circuit board 2, the dimensional tolerance between the radius of the insulating hole and the radius of the cross section of the conductive column is 0.4mm-0.6 mm.
It is understood that in other embodiments provided by the present invention, the insulation positioning portion 12 may be disposed in other manners, for example, as shown in fig. 4, the insulation positioning portion 12 is an insulation block disposed on the conductive area, and the insulation block may be disposed on the conductive area 11 by spraying, printing, pasting, or the like. In this case, the conductive positioning portion 22 may be a conductive block corresponding to the insulating block, the conductive block may be formed by printing, mask etching, or the like, or the conductive layer may be a thin metal plate or the like attached to the insulating region 21. The insulating block and the conductive block may be provided in various shapes such as a circle, a cross, a ring, etc., and the present invention is not particularly limited thereto. In order to ensure the alignment precision of the bent circuit board, the width of a certain position of the insulating block is larger than that of the corresponding position of the conducting block, and the unilateral tolerance is 0.4mm-0.6 mm.
As shown in fig. 2, in the embodiment of the invention, the conductive positioning portion 22 is disposed on the first surface 23 of the circuit board 2 and extends from the first surface 23 of the circuit board 2 to the second surface 24 of the circuit board 2, wherein the first surface 23 of the circuit board 2 is a surface that is bent and close to the back surface of the main body 1, and the second surface 24 of the circuit board 2 is disposed opposite to the first surface 23 of the circuit board 2. When the circuit board 2 is bent to the back of the main body 1, the conductive positioning portions 22 are exposed from the second surface 24 of the circuit board 2, so that the electrical conduction between the conductive positioning portions 22 can be directly detected by a detection device (such as a multimeter) on the second surface of the circuit board, thereby improving the detection efficiency.
As shown in fig. 2 and 4, in the embodiment provided by the invention, the electronic device further includes an adhesive tape 4 for adhering the circuit board to the back surface of the main body, so that the circuit board can be more closely attached to the back surface of the main body, and the whole electronic device is more neat and beautiful. In the present embodiment, the adhesive tape 4 is a double-sided tape.
In the embodiment of the present invention, the electronic device is a display device, such as an LCM display screen (LCM is an abbreviation of Liquid Crystal Module), and at this time, the main body 1 includes components such as a display Module, wherein the display Module mainly includes a display panel and a backlight Module disposed on a back surface of the display panel. The display panel is used for displaying images, the backlight module is used for projecting light rays to the display panel to lighten the display panel, and the circuit board 2 is electrically connected with the display panel and can transmit corresponding driving signals to the display panel. In addition, in the present embodiment, the back surface of the main body 1 refers to the back surface of the backlight module.
In another embodiment of the present invention, the electronic device is a touch display device, and the main body 1 further includes a touch conductive film 5 in addition to the display panel and the backlight module. The touch conductive film 5 is disposed on the front surface of the display panel and electrically connected to the circuit board 2. In the embodiment, the touch conductive film 5 is exposed out of the main body 1 (i.e., the display panel cannot completely cover the touch conductive film 5), wherein a portion of the touch conductive film 5 extending out of the display panel is bent to the back surface of the main body 1 (i.e., bent to the back surface of the backlight module), so that it is not necessary to shield the electrode leads of the touch conductive film 5 by applying ink or the like, thereby reducing the frame of the touch electronic device and increasing the screen occupation ratio. In the present embodiment, the main body 1 is exposed at a side where the touch conductive film 5 is connected to the circuit board 2, and it is understood that in other embodiments, the touch conductive film 5 may be exposed at other positions of the main body 1.
In addition, in the present embodiment, the display panel is also electrically connected to the circuit board 2, that is, the display panel and the touch conductive film 5 are connected to the same circuit board. It can be understood that, in other embodiments provided by the present invention, the display panel may also be electrically connected to another circuit board (the circuit board is defined as a second circuit board), and the second circuit board may also be bent to the back side of the backlight module by the above-mentioned manner, for the sake of bending convenience and reducing the thickness of the whole touch electronic device, the second circuit board and the circuit board 2 are respectively located at different sides of the display panel, so that the two are not overlapped after being bent.
It is understood that in other embodiments provided by the present invention, the electronic device may be other devices that require bending of the circuit board to facilitate installation.
The invention also provides electronic equipment, which uses the electronic device of any embodiment, and the electronic equipment is more convenient to assemble because the bending position of the circuit board in the electronic device is accurate. In addition, in the present embodiment, the electronic device may be a smart phone, a tablet computer, or the like.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (9)
1. An electronic device, comprising:
a main body;
the circuit board is electrically connected with the main body;
one of the back surface of the main body and the circuit board is provided with a conductive area, and the other one is provided with an insulating area;
the conductive area is provided with at least two insulating counterpoint portions, the insulating area is provided with at least two conductive counterpoint portions corresponding to the two insulating counterpoint portions respectively, and the conductive counterpoint portions are insulated from each other; the bending of the circuit board to the back of the main body can be positioned by the alignment matching of the at least two insulation alignment parts and the at least two conductive alignment parts respectively;
the insulating counterpoint part is an insulating hole, and the conductive counterpoint part is a conductive column matched with the insulating hole; the conductive counterpoint part is arranged on the first surface of the circuit board and extends from the first surface of the circuit board to the second surface exposed out of the circuit board; the first surface of the circuit board is a surface which is close to the back surface of the main body after being bent; the second surface of the circuit board is arranged opposite to the first surface of the circuit board.
2. The electronic device according to claim 1, wherein a metal frame is provided on the back surface of the main body, and the insulation positioning portion is provided on the metal frame.
3. The electronic device of claim 1, wherein the radius of the insulating hole is larger than the radius of the cross section of the conductive pillar, and the dimensional tolerance between the insulating hole and the conductive pillar is 0.4mm-0.6 mm.
4. The electronic device of claim 2, wherein the metal frame is an iron frame.
5. The electronic device of claim 1, wherein the insulating hole comprises a hole site disposed in the conductive region and an insulating layer disposed within the hole site.
6. The electronic device of claim 1, further comprising an adhesive tape for adhering the circuit board to the back surface of the main body.
7. The electronic device according to any one of claims 1-6, wherein the electronic device is a display device, the main body comprises a display module, and the display module is electrically connected to the circuit board.
8. The electronic device according to any one of claims 1-6, wherein the electronic device is a touch display device;
the main body comprises a display panel and a touch conductive film which are arranged in a stacked mode;
the touch conductive film is electrically connected with the circuit board, and the part of the touch conductive film extending out of the display panel is bent to the back of the main body.
9. An electronic device, characterized in that the electronic device comprises an electronic apparatus according to any of claims 1-8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811533883.7A CN109640522B (en) | 2018-12-14 | 2018-12-14 | Electronic device and electronic apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811533883.7A CN109640522B (en) | 2018-12-14 | 2018-12-14 | Electronic device and electronic apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109640522A CN109640522A (en) | 2019-04-16 |
| CN109640522B true CN109640522B (en) | 2020-09-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811533883.7A Active CN109640522B (en) | 2018-12-14 | 2018-12-14 | Electronic device and electronic apparatus |
Country Status (1)
| Country | Link |
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| CN (1) | CN109640522B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113237414B (en) * | 2021-05-07 | 2023-02-28 | 厦门天马微电子有限公司 | Display module, electronic equipment and alignment precision detection method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6614499B1 (en) * | 2000-08-16 | 2003-09-02 | Eastman Kodak Company | Electrically addressable display system with alignment reference features and process for forming same |
| CN205229618U (en) * | 2015-12-20 | 2016-05-11 | 江西合力泰科技有限公司 | Display module assembly that FPC accurate positioning is being shaded |
| CN206946142U (en) * | 2017-08-04 | 2018-01-30 | 信利半导体有限公司 | A kind of easy positioning liquid crystal display die set |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102539996A (en) * | 2011-12-08 | 2012-07-04 | 东莞市五株电子科技有限公司 | Detection method and system for layers of multilayer circuit board |
-
2018
- 2018-12-14 CN CN201811533883.7A patent/CN109640522B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6614499B1 (en) * | 2000-08-16 | 2003-09-02 | Eastman Kodak Company | Electrically addressable display system with alignment reference features and process for forming same |
| CN205229618U (en) * | 2015-12-20 | 2016-05-11 | 江西合力泰科技有限公司 | Display module assembly that FPC accurate positioning is being shaded |
| CN206946142U (en) * | 2017-08-04 | 2018-01-30 | 信利半导体有限公司 | A kind of easy positioning liquid crystal display die set |
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|---|---|
| CN109640522A (en) | 2019-04-16 |
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