CN210093659U

CN210093659U - Heat radiator for PCB board

Info

Publication number: CN210093659U
Application number: CN201920534586.8U
Authority: CN
Inventors: 谷志军; 李波; 其他发明人请求不公开姓名
Original assignee: Hunan Boyuan Electronics Technology Co Ltd
Current assignee: Hunan Boyuan Electronics Technology Co Ltd
Priority date: 2019-04-18
Filing date: 2019-04-18
Publication date: 2020-02-18
Anticipated expiration: 2029-04-18

Abstract

The utility model discloses a heat abstractor of PCB board relates to PCB board design technical field, including heat-conducting plate, heating panel, back shroud, locking Assembly and help and pull out the subassembly, install preceding heat conduction glue film between the heating element part of heat-conducting plate and PCB board leading flank, the outside of heat-conducting plate sets up the heating panel, is connected through heat conduction silicone grease layer between heat-conducting plate and the heating panel, the back shroud is located the trailing flank of PCB board, sets up back heat conduction glue film between back shroud and the PCB board, the utility model provides a heat abstractor sets up the heat-conducting plate in one side of PCB board to give the heat-conducting plate heat dissipation through the heating panel with heat conduction silicone grease layer connection, strengthen the radiating effect; meanwhile, the other side of the PCB is provided with a rear cover plate for heat dissipation, and meanwhile, the rear cover plate has a protection effect, and the pulling-assisting assembly facilitates the pulling and inserting of a product.

Description

Heat radiator for PCB board

Technical Field

The utility model relates to a PCB board design technical field especially relates to a heat abstractor of PCB board.

Background

The PCB is named as a printed circuit board, is an electronic component applied to various electronic components, along with the rapid development of electronic devices and integrated circuit technology and the progress of microelectronic technology, the power density of the electronic components is greatly increased, and the physical size of the PCB is designed to be smaller and smaller, so that the heat flow density is increased, a large amount of heat is inevitably generated under an efficient operating environment to directly influence the working performance of the electronic components, and an efficient heat dissipation mode is required to be added to the electronic components, so that the effective heat dissipation problem of the electronic components becomes a key technology for manufacturing the current electronic components and electronic equipment.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the defects existing in the prior art and providing a heat dissipation device of a PCB.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a heat dissipation device of a PCB comprises a heat conduction plate, a heat dissipation plate, a rear cover plate, a locking assembly and a pulling-assisted assembly, wherein a front heat conduction glue layer is arranged between the heat conduction plate and a heating element on the front side surface of the PCB, the heat dissipation plate is arranged on the outer side of the heat conduction plate, and the heat conduction plate is connected with the heat dissipation plate through a heat conduction silicone grease layer;

the rear cover plate is positioned on the rear side surface of the PCB, and a rear heat-conducting adhesive layer is arranged between the rear cover plate and the PCB;

a locking assembly for installing and locking the heat dissipation structure is arranged between the heat dissipation plate and the rear cover plate;

and a pulling-assistant assembly is arranged at one corner of the heat dissipation plate.

Preferably, the lower surface of the front heat-conducting adhesive layer is in contact with the upper surface of the heating element on the PCB, and the upper surface of the heat-conducting adhesive layer is in contact with the lower surface of the heat-conducting plate.

Preferably, the upper surface of the rear heat-conducting adhesive layer is in contact with the rear side face of the PCB, and the lower surface of the heat-conducting adhesive layer is in contact with the upper surface of the rear cover plate.

Preferably, the locking assembly is composed of a clamping seat, a clamping block and a clamping pin, a groove for accommodating the clamping block is formed in the middle of the clamping seat, clamping holes for inserting the clamping pin are formed in the clamping seat and the clamping block, and limiting blocks are arranged at two ends of the clamping pin.

Preferably, clamping blocks are arranged on two sides of the heat dissipation plate, and clamping seats are arranged at corresponding positions on two sides of the rear cover plate.

Preferably, clamping seats are arranged on two sides of the heat dissipation plate, and clamping blocks are arranged at corresponding positions on two sides of the rear cover plate.

Preferably, the pulling-assisted assembly comprises a protruding plate which is arranged at one corner of the heat dissipation plate and extends outwards, and a process hole convenient for pulling is formed in the protruding plate.

The utility model has the advantages that: the heat dissipation device of the utility model is provided with the heat conduction plate on one side of the PCB, and the heat dissipation plate connected by the heat conduction silicone grease layer dissipates heat to the heat conduction plate, thereby enhancing the heat dissipation effect; meanwhile, the other side of the PCB is provided with a rear cover plate for heat dissipation, and the PCB has a protection function; the pulling-assistant component is convenient for pulling and inserting the product.

Drawings

Fig. 1 is a schematic structural view of a heat dissipation device for a PCB board according to the present invention.

In the figure: 1 heat-conducting plate, 2 heating panels, 3 PCB boards, 4 back shroud, 5 heating elements, 6 locking components, 7 help and pull out the subassembly.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1, a heat abstractor of PCB board, include heat-conducting plate 1, heating panel 2, back shroud 4, locking Assembly 6 and help and pull out subassembly 7, heat-conducting plate 1 sets up at 3 leading flanks of PCB board, and heat-conducting glue layer before installing between the heating element 5 of heat-conducting plate 1 and 3 leading flanks of PCB board, the lower surface of preceding heat-conducting glue layer and the 5 upper surface contact of the heating element on the PCB board 3, the upper surface of heat-conducting glue layer and the lower surface contact of heat-conducting plate 1, preceding heat-conducting glue layer can be with the heat direction heat-conducting plate 1 of the heating element 5.

Further, the outer side surface of the heat conduction plate 1 is provided with a heat dissipation plate 2 which extends outwards, the heat conduction plate 1 is connected with the heat dissipation plate 2 through a heat conduction silicone layer, and the heat conduction plate 1 dissipates heat for the heat conduction plate through the heat dissipation plate 2 connected with the heat conduction silicone layer, so that the heat dissipation effect is improved.

Further, the rear cover plate 4 is located the trailing flank of PCB board, sets up back heat-conducting glue layer between rear cover plate 4 and the PCB board, and the upper surface and the PCB board trailing flank contact of back heat-conducting glue layer, the lower surface of heat-conducting glue layer and the upper surface contact of rear cover plate 4, back heat-conducting glue layer with the heat of PCB board direction rear cover plate 4, rear cover plate 4 has heat dissipation and guard action.

Further, set up the locking Assembly 6 that is used for installation and locking heat radiation structure between heating panel 2 and the back shroud 4, locking Assembly 6 is used for connecting and locking heating panel 2 and back shroud 4, and locking Assembly 6 has cassette, fixture block and bayonet lock to constitute, and the recess that is used for holding the fixture block is seted up at the middle part of cassette, sets up the card hole that is used for inserting the bayonet lock on cassette and the fixture block, and the both ends of bayonet lock set up the stopper.

The heat dissipation plate 2 is provided with the pulling-assisting assembly 7, the pulling-assisting assembly 7 comprises a protruding plate which is arranged at one corner of the heat dissipation plate 2 and extends outwards, a process hole which facilitates pulling and inserting of a product is formed in the protruding plate, and the product can be conveniently taken out of the equipment.

Example 1

Referring to fig. 1, a heat dissipating device for a PCB comprises a heat conducting plate 1, a heat dissipating plate 2, a rear cover plate 4, a locking assembly 6 and a pulling-assisted assembly 7, wherein the heat conducting plate 1 is arranged on the front side surface of the PCB 3, a front heat conducting glue layer is arranged between the heat conducting plate 1 and a heating element 5 on the front side surface of the PCB 3, the heat dissipating plate 2 extending outwards is arranged on the outer side surface of the heat conducting plate 1, the heat conducting plate 1 is connected with the heat dissipating plate 2 through a heat conducting silicone layer, the rear cover plate 4 is arranged on the rear side surface of the PCB, a rear heat conducting glue layer is arranged between the rear cover plate 4 and the PCB, the locking assembly 6 for installing and locking a heat dissipating structure is arranged between the heat dissipating plate 2 and the rear cover plate 4, the locking assembly 6 is provided with a clamping seat, a clamping block and a clamping pin for assembling, a clamping pin are arranged in the middle of the clamping seat, a, the both ends of bayonet lock set up the stopper, and the both sides of heating panel 2 set up the fixture block, and the corresponding position of 4 both sides of back shroud sets up the cassette, set up on the heating panel 2 and help and pull out subassembly 7.

Example 2

A heat dissipating double-fuselage of a PCB board, including heat-conducting plate 1, heat-dissipating plate 2, back cover plate 4, locking assembly 6 and helping and pull out the assembly 7, the said heat-conducting plate 1 is set up in the front side of PCB board 3, install the front heat-conducting glue layer between heat-conducting plate 1 and heating element 5 of the front side of PCB board 3, the lateral surface of the heat-conducting plate 1 sets up the heat-dissipating plate 2 that is stretched out outwardly, connect through the heat-conducting silicone grease layer between heat-conducting plate 1 and heat-dissipating plate 2, the said back cover plate 4 locates at the back side of PCB board, set up the back heat-conducting glue layer between back cover plate 4 and PCB board, set up the locking assembly 6 used for installing and locking the heat-dissipating structure between said heat-dissipating plate 2 and back cover plate 4, the locking assembly 6 has card bed, fixture block and bayonet lock block to make up, the middle part of the card bed offers the recess used for, clamping seats are arranged on two sides of the heat dissipation plate 2, clamping blocks are arranged at corresponding positions on two sides of the rear cover plate 4, and the heat dissipation plate 2 is provided with a pulling-assisting assembly 7.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. The heat dissipation device of the PCB is characterized by comprising a heat conduction plate (1), a heat dissipation plate (2), a rear cover plate (4), a locking assembly (6) and a pulling-assisting assembly (7), wherein a front heat conduction glue layer is arranged between the heat conduction plate (1) and a heating element (5) on the front side surface of the PCB (3), the heat dissipation plate (2) is arranged on the outer side of the heat conduction plate (1), and the heat conduction plate (1) is connected with the heat dissipation plate (2) through a heat conduction silicone grease layer;

the rear cover plate (4) is positioned on the rear side surface of the PCB, and a rear heat-conducting adhesive layer is arranged between the rear cover plate (4) and the PCB;

a locking assembly (6) for installing and locking a heat dissipation structure is arranged between the heat dissipation plate (2) and the rear cover plate (4);

and one corner of the heat dissipation plate (2) is provided with an assistant pulling assembly (7).

2. The PCB heat dissipation device of claim 1, wherein the lower surface of the front thermal conductive adhesive layer is in contact with the upper surface of the heating component on the PCB, and the upper surface of the thermal conductive adhesive layer is in contact with the lower surface of the thermal conductive plate (1).

3. The PCB heat dissipation device of claim 1, wherein the upper surface of the rear heat conductive adhesive layer is in contact with the rear side surface of the PCB, and the lower surface of the heat conductive adhesive layer is in contact with the upper surface of the rear cover plate (4).

4. The PCB heat dissipation device as claimed in claim 1, wherein the locking assembly (6) comprises a clamping seat, a clamping block and a clamping pin, a groove for accommodating the clamping block is formed in the middle of the clamping seat, clamping holes for inserting the clamping pin are formed in the clamping seat and the clamping block, and limiting blocks are arranged at two ends of the clamping pin.

5. The PCB heat dissipation device as claimed in claim 4, wherein the heat dissipation plate (2) has clamping blocks at two sides thereof, and the back cover plate (4) has clamping blocks at corresponding positions at two sides thereof.

6. The PCB heat dissipation device as claimed in claim 4, wherein clamping seats are provided on two sides of the heat dissipation plate (2), and clamping blocks are provided on corresponding positions on two sides of the back cover plate (4).

7. The PCB heat dissipation device of claim 1, wherein the pulling-assisted assembly (7) comprises a protruding plate which is arranged at one corner of the heat dissipation plate (2) and extends outwards, and the protruding plate is provided with a process hole for facilitating pulling.