CN212436018U - Heat dissipation type circuit board - Google Patents
Heat dissipation type circuit board Download PDFInfo
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- CN212436018U CN212436018U CN202021305424.6U CN202021305424U CN212436018U CN 212436018 U CN212436018 U CN 212436018U CN 202021305424 U CN202021305424 U CN 202021305424U CN 212436018 U CN212436018 U CN 212436018U
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- circuit board
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 149
- 230000000149 penetrating effect Effects 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 10
- 238000010438 heat treatment Methods 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 230000005855 radiation Effects 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000003245 working effect Effects 0.000 description 1
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Abstract
The application relates to a heat dissipation type circuit board, which comprises a circuit board body; the circuit board body is provided with a heat dissipation cavity extending along the width direction of the circuit board body; an insulating heat conduction layer is connected in the heat dissipation cavity; the lower end face of the circuit board body is fixedly provided with a first heat dissipation plate; the first heat dissipation plate is provided with a mounting hole penetrating through the upper surface and the lower surface of the first heat dissipation plate; and a heat dissipation support column is inserted into the mounting hole. This application has the thermal diffusivity that improves the circuit board body, prevents the too high effect of damaging electronic component of temperature.
Description
Technical Field
The application relates to the field of electronic equipment, in particular to a heat dissipation type circuit board.
Background
At present, the circuit board is also called as a printed circuit board or a printed circuit board, and the existence of the printed circuit board can be almost kept away in electronic equipment which can be seen by people, namely electronic components such as electronic watches, calculators, general computers, computer communication electronic equipment and the like.
The prior art may refer to the utility model patent with the publication number CN204721704U, which discloses a circuit board, including: the circuit board body, the waterproof board that bonds on the circuit board body, arrange the water receiving tank that is used for catchmenting in the waterproof board in, paste the drier piece on the water receiving tank. The circuit board can protect the circuit board, water entering the circuit board is gathered and is sucked up in time, the circuit board is prevented from breaking down, and the service life of the circuit board is prolonged.
In view of the above-mentioned related technologies, the inventor believes that although the waterproof performance of the circuit board in the structure is improved, certain heat is generated during operation of the electronic equipment, so that the internal temperature of the equipment rises rapidly, if the heat is not dissipated in time, the equipment is heated continuously, the element is failed due to overheating, and the reliability of the electronic equipment is reduced.
SUMMERY OF THE UTILITY MODEL
In order to improve the heat dissipation problem of circuit board, this application provides a heat dissipation type circuit board.
The application provides a heat dissipation type circuit board adopts following technical scheme:
a heat dissipation type circuit board comprises a circuit board body; the circuit board body is provided with a heat dissipation cavity extending along the width direction of the circuit board body; the heat dissipation cavities are all connected with insulating heat conduction layers; the lower end face of the circuit board body is fixedly provided with a first heat dissipation plate; the first heat dissipation plate is provided with a mounting hole penetrating through the upper surface and the lower surface of the first heat dissipation plate; and a heat dissipation support column is inserted into the mounting hole.
By adopting the technical scheme, when the heat dissipation structure is used, the electronic element is arranged above the insulating heat conduction layer, and heat generated in the working process of the electronic element is transferred to the first heat dissipation plate on the lower end face of the circuit board body through the insulating heat conduction layer, so that the heat can be dissipated timely, and the heat dissipation capacity of the circuit board is enhanced; still partial heat distributes from the junction of second heating panel and heat dissipation support column, through mutually supporting of heat dissipation support column and heating panel, conveniently dispels the heat.
Preferably, a plurality of arc-shaped grooves are uniformly distributed on the surface of one end, far away from the heat dissipation cavity, of the insulating heat conduction layer.
Through adopting above-mentioned technical scheme, the arc recess has increased the area of contact between insulating heat-conducting layer and the electronic component, is convenient for with the heat transfer on the electronic component to insulating heat-conducting layer fast on, has improved the rate of heat dissipation.
Preferably, the distance between two adjacent heat dissipation cavities is greater than twice the thickness of the circuit board body.
By adopting the technical scheme, the heat dissipation cavities are arranged, the heat dissipation effect of the circuit board can be enhanced, the distance between every two adjacent heat dissipation cavities is larger, the situation that the circuit board body is broken due to lower strength can be avoided, and the strength and the use stability of the circuit board body are improved.
Preferably, the side surface of the circuit board body is fixedly provided with a radiating fin; the heat dissipation fins are provided with first heat dissipation holes.
By adopting the technical scheme, in the process that the heat is transmitted downwards by the insulating heat conduction layer, partial heat can be transmitted to the two sides of the circuit board body along the circuit board body and then transmitted to the heat dissipation fins, and the heat dissipation effect of the circuit board body is further improved by discharging the heat through the first heat dissipation holes.
Preferably, the upper end of the circuit board body is fixedly provided with a second heat dissipation plate; a cavity is reserved between the second heat dissipation plate and the circuit board body; and a plurality of second heat dissipation holes penetrating through the upper surface and the lower surface of the second heat dissipation plate are uniformly distributed on the second heat dissipation plate.
Through adopting above-mentioned technical scheme, the heat that electronic component produced upwards gives off and gets into the cavity between second heating panel and the circuit board body, and the effect through the circulation of air is effluvium through the second louvre, also can accelerate thermal giving off, prevents that the too high working property that influences electronic component of temperature from improving the heat dissipation function of circuit board body.
Preferably, a waterproof plate is arranged at one end, far away from the circuit board body, of the second heat dissipation plate; and a connecting column is fixedly arranged between the waterproof plate and the second heat dissipation plate.
By adopting the technical scheme, the waterproof board plays a waterproof role, and water is prevented from entering the circuit board body through the second heat dissipation hole to damage the circuit board; and be connected through the spliced pole between waterproof board and the second heating panel for form a space between waterproof board and the second heating panel, also can accelerate thermal giving off.
Preferably, the heat dissipation cavity is a rectangular cavity.
By adopting the technical scheme, the rectangular cavity is regular in shape, and after heat is transmitted to the insulating heat-conducting layer from the electronic element, the transmission rate of the heat inside the insulating heat-conducting layer is uniform, the heat can be uniformly dispersed, and the heat dissipation effect is improved.
Preferably, arc-shaped mounting grooves are formed in the two inner walls of the heat dissipation cavity; the arc-shaped mounting groove extends along the length direction of the heat dissipation cavity; the both ends of insulating heat-conducting layer set firmly the connecting block of joint in the arc mounting groove respectively.
Through adopting above-mentioned technical scheme, earlier align the connecting block at insulating heat-conducting layer both ends and arc mounting groove during the installation, then insert insulating heat dissipation layer from the one end in heat dissipation chamber, through the cooperation of connecting block and arc mounting groove, can improve insulating heat dissipation layer and the laminating nature between the heat dissipation chamber, still be convenient for simultaneously insulating heat dissipation layer's dismantlement and installation.
In summary, the present application includes at least one of the following beneficial technical effects:
1. when the heat dissipation device is used, the electronic element is arranged above the insulating heat conduction layer, and heat generated in the working process of the electronic element is transferred to the first heat dissipation plate on the lower end face of the circuit board body through the insulating heat conduction layer, so that the heat can be dissipated timely, and the heat dissipation capacity of the circuit board is enhanced; part of heat is radiated from the joint of the second heat radiation plate and the heat radiation support column, and the heat radiation is facilitated through the mutual matching of the heat radiation support column and the heat radiation plate;
2. a second heat dissipation plate is arranged above the circuit board body, a second heat dissipation hole is formed in the second heat dissipation plate, and the heat transfer rate is increased through the mutual matching of the first heat dissipation plate and the second heat dissipation plate;
3. the waterproof plate is arranged at the upper end of the second heat dissipation plate and plays a waterproof role, and water is prevented from entering the circuit board body through the second heat dissipation holes to damage the circuit board; and be connected through the spliced pole between waterproof board and the second heating panel for waterproof board and second heating panel form a space in front, also can accelerate thermal giving off.
Drawings
FIG. 1 is a schematic diagram of an overall structure of a heat dissipation circuit board;
fig. 2 is a schematic cross-sectional structure diagram of the circuit board in the embodiment.
Description of reference numerals: 1. a circuit board body; 2. a heat dissipation cavity; 21. an arc-shaped mounting groove; 3. an insulating heat-conducting layer; 31. an arc-shaped groove; 32. connecting blocks; 4. a first heat dissipation plate; 41. mounting holes; 42. a heat dissipation support column; 5. a heat dissipating fin; 51. a first heat dissipation hole; 6. a second heat dissipation plate; 61. a cavity; 62. a second heat dissipation hole; 7. connecting columns; 8. a waterproof board.
Detailed Description
The present application is described in further detail below with reference to figures 1-2.
The embodiment of the application discloses heat dissipation type circuit board. Referring to fig. 1, the circuit board includes circuit board body 1, and a plurality of heat dissipation chamber 2 have been seted up to circuit board body 1's up end equipartition, and a plurality of heat dissipation chamber 2 parallel arrangement just extend along circuit board body 1's width direction. The circuit board is in the use, is to install electronic component on circuit board body 1, in order to in time distribute away the heat that produces in the electronic component working process, all is connected with insulating heat-conducting layer 3 in every heat dissipation chamber 2 to still set firmly the first heating panel 4 with the adaptation of circuit board body 1 shape size on the lower terminal surface of circuit board body 1. The heat is firstly transferred to the circuit board body 1 through the insulating heat-conducting layer 3 and then transferred to the first heat-radiating plate 4, and the first heat-radiating plate 4 radiates the heat subsequently, so that the temperature of the circuit board body 1 is reduced, and electronic elements are protected. After insulating heat-conducting layer 3 absorbed the heat, for the convenience of inside thermal even transmission, set up heat dissipation chamber 2 into the rectangle chamber to the one end that insulating heat-conducting layer 3 kept away from heat dissipation chamber 2 still has set firmly arc recess 31 on its surface, increased with the area of contact between the electronic component for thermal transmission.
Referring to fig. 2, arc-shaped mounting grooves 21 extending along the length direction of the heat dissipation chamber 2 are respectively formed in two side walls of the heat dissipation chamber 2, and connecting blocks 32 matched with the arc-shaped mounting grooves 21 are respectively fixedly arranged at two ends of the insulating and heat conducting layer 3. After heat dissipation chamber 2 is installed into to insulating heat-conducting layer 3, connecting block 32 just in time the joint has improved the laminating nature between insulating heat-conducting layer 3 and the heat dissipation chamber 2 in arc mounting groove 21, but also the installation and the dismantlement of insulating heat-conducting layer 3 of being convenient for.
Referring to fig. 2, the distance between two adjacent heat dissipation cavities 2 is at least twice the thickness of the circuit board body 1, so that the strength and the use stability of the circuit board body 1 are ensured while the heat dissipation effect is ensured.
Referring to fig. 2, in order to improve the heat dissipation effect of the first heat dissipation plate 4, a plurality of mounting holes 41 penetrating through the upper and lower surfaces of the first heat dissipation plate 4 are uniformly distributed on the first heat dissipation plate 4, and a heat dissipation support column 42 is inserted in each mounting hole 41. After the heat is transferred to the first heat dissipation plate 4, part of the heat is transferred to the heat dissipation support columns 42 from the gaps between the mounting holes 41 and the heat dissipation support columns 42, and the heat dissipation capability is enhanced through the mutual matching of the first heat dissipation plate 4 and the heat dissipation support columns 42.
Referring to fig. 1 and 2, after heat is transferred to the circuit board body 1, the heat may be transferred to both sides along the circuit board body 1, in order to increase the heat transfer rate, a serrated heat dissipation fin 5 is fixedly disposed on the sidewall of the circuit board body 1, and a first heat dissipation hole 51 for facilitating heat dissipation is further disposed on the heat dissipation fin 5.
Referring to fig. 2, in order to further improve the heat dissipation performance, an arc-shaped second heat dissipation plate 6 is fixedly disposed above the circuit board body 1, a cavity 61 facilitating air circulation is formed between the second heat dissipation plate 6 and the circuit board body 1, and a plurality of second heat dissipation holes 62 penetrating through the upper and lower surfaces of the second heat dissipation plate 6 are uniformly distributed along the arc surface of the second heat dissipation plate. The heat generated by the electronic components during operation is transferred upwards to the cavity 61, and finally dissipated out through the second heat dissipation hole 62 along with the circulation of air.
Referring to fig. 2, the vertical spliced pole 7 that has set firmly in intermediate position department of second heating panel 6, spliced pole 7 extends and the tip has set firmly curved waterproof board 8 to the direction of keeping away from second heating panel 6, and spliced pole 7 makes and forms the space of the circulation of air of being convenient for between waterproof board 8 and the second heating panel 6, and waterproof board 8 just in time is located second louvre 62 directly over moreover. In order not to influence the heat dissipation effect of the second heat dissipation plate 6, the arc length of the cross section of the waterproof plate 8 perpendicular to the connecting column 7 is smaller than that of the cross section of the second heat dissipation plate 6 perpendicular to the connecting column 7. When water enters the circuit board, the water firstly flows down to two sides along the surface of the waterproof board 8, then falls onto the second heat dissipation plate 6 and flows to two sides along the surface of the second heat dissipation plate 6, so that the water is prevented from entering the circuit board main body from the second heat dissipation holes 62 to damage electronic elements. The heat radiated from the second heat radiation hole 62 enters the space between the second heat radiation plate 6 and the waterproof plate 8, and is discharged from the space by the air circulation.
The implementation principle of a heat dissipation type circuit board in the embodiment of the application is as follows: during the use, insert insulating heat-conducting layer 3 from the one end in heat dissipation chamber 2 and locate in heat dissipation chamber 2 to make connecting block 32 joint in arc mounting groove 21, improve the laminating nature between insulating heat-conducting layer 3 and the heat dissipation chamber 2. Part of heat generated in the working process of the electronic element is absorbed by the insulating heat-conducting layer 3, is transmitted to the bottom and two sides along the circuit board body 1 and is dissipated through the first heat dissipation plate 4 and the heat dissipation fins 5; and partial heat is transferred upwards, is dissipated through the second heat dissipation hole 62 on the second heat dissipation plate 6, and is accelerated to be transferred in all directions through the mutual matching of the first heat dissipation hole 51, the second heat dissipation hole 62 and the first heat dissipation plate 4, so that the heat dissipation effect is improved.
The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.
Claims (8)
1. A heat dissipation type circuit board comprises a circuit board body (1); the method is characterized in that: the circuit board body (1) is provided with a heat dissipation cavity (2) extending along the width direction of the circuit board body (1); the heat dissipation cavities (2) are internally connected with insulating heat conduction layers (3); a first heat dissipation plate (4) is fixedly arranged on the lower end face of the circuit board body (1); the first heat dissipation plate (4) is provided with a mounting hole (41) penetrating through the upper surface and the lower surface of the first heat dissipation plate; and a heat dissipation supporting column (42) is inserted into the mounting hole (41).
2. The heat dissipation type circuit board according to claim 1, wherein: a plurality of arc grooves (31) are uniformly distributed on the surface of one end, far away from the heat dissipation cavity (2), of the insulating heat conduction layer (3).
3. The heat dissipation type circuit board according to claim 2, wherein: the distance between two adjacent heat dissipation cavities (2) is larger than twice of the thickness of the circuit board body (1).
4. The heat dissipation type circuit board according to claim 1, wherein: a radiating fin (5) is fixedly arranged on the side surface of the circuit board body (1); the radiating fins (5) are provided with first radiating holes (51).
5. The heat dissipation type circuit board according to claim 1, wherein: a second heat dissipation plate (6) is fixedly arranged at the upper end of the circuit board body (1); a cavity (61) is reserved between the second heat dissipation plate (6) and the circuit board body (1); and a plurality of second heat dissipation holes (62) penetrating through the upper surface and the lower surface of the second heat dissipation plate (6) are uniformly distributed on the second heat dissipation plate.
6. The heat dissipation type circuit board according to claim 5, wherein: one end of the second heat dissipation plate (6) far away from the circuit board body (1) is provided with a waterproof plate (8); a connecting column (7) is fixedly arranged between the waterproof plate (8) and the second heat dissipation plate (6).
7. The heat dissipation type circuit board according to claim 1, wherein: the heat dissipation cavity (2) is a rectangular cavity.
8. The heat dissipation type circuit board according to claim 1, wherein: arc-shaped mounting grooves (21) are formed in the two inner walls of the heat dissipation cavity (2); the arc-shaped mounting groove (21) extends along the length direction of the heat dissipation cavity (2); the two ends of the insulating heat-conducting layer (3) are respectively and fixedly provided with connecting blocks (32) clamped in the arc-shaped mounting grooves (21).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021305424.6U CN212436018U (en) | 2020-07-04 | 2020-07-04 | Heat dissipation type circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021305424.6U CN212436018U (en) | 2020-07-04 | 2020-07-04 | Heat dissipation type circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212436018U true CN212436018U (en) | 2021-01-29 |
Family
ID=74278441
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021305424.6U Active CN212436018U (en) | 2020-07-04 | 2020-07-04 | Heat dissipation type circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212436018U (en) |
-
2020
- 2020-07-04 CN CN202021305424.6U patent/CN212436018U/en active Active
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