CN219499810U - Multilayer high-conductivity circuit board - Google Patents
Multilayer high-conductivity circuit board Download PDFInfo
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- CN219499810U CN219499810U CN202320490373.6U CN202320490373U CN219499810U CN 219499810 U CN219499810 U CN 219499810U CN 202320490373 U CN202320490373 U CN 202320490373U CN 219499810 U CN219499810 U CN 219499810U
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- circuit board
- heat
- multilayer
- fixedly arranged
- conductivity
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The utility model discloses a multilayer high-conductivity circuit board, relates to the technical field of multilayer high-conductivity circuit boards, and aims to solve the problem that the heat of the lower surface of the circuit board is difficult to disperse and the heat conductivity of the circuit board is affected because the lower surface of the circuit board is directly attached to the component due to the fact that the existing multilayer circuit board is generally fixed with the component directly through a screw mounting mode. Second through holes are formed in four corners of the outer wall of the multilayer circuit board body; further comprises: the support frame is fixedly arranged below the multilayer circuit board body, a heat-conducting silica gel pad is adhered between the support frame and the multilayer circuit board body, an inserting sheet radiator is fixedly arranged below the heat-conducting silica gel pad, and a heat-conducting copper plate is fixedly arranged below the inserting sheet radiator; and the heat dissipation shell is fixedly arranged below the supporting frame and fixedly arranged with the heat conduction copper plate through screws.
Description
Technical Field
The utility model relates to the technical field of multilayer high-conductivity circuit boards, in particular to a multilayer high-conductivity circuit board.
Background
The wiring board is divided into a single-sided wiring board, a double-sided wiring board and a multi-layered wiring board, and the multi-layered board is a printed board having three or more conductive pattern layers laminated with insulating materials therebetween at a spacing, and conductive patterns therebetween being interconnected as required. The multilayer circuit board is a product of electronic information technology which is developed in the directions of high speed, multifunction, large capacity, small volume, thin and light weight. The manufacturing process of the multilayer circuit board adds the manufacturing procedure of inner layer lamination on the basis of a single panel and a double panel, and the interconnection lines are highly concentrated due to the increase of the packaging density of the integrated circuit, so that the multilayer circuit board is needed, and the high-conductivity circuit board is a high-thermal-conductivity circuit board.
However, the existing multilayer circuit board is usually fixed with the component directly by a screw mounting manner, so that the lower surface of the circuit board is directly abutted against the component, and the heat of the lower surface is difficult to dissipate, thereby influencing the heat conductivity of the circuit board; therefore, the existing requirements are not met, and a multilayer high-conductivity circuit board is proposed.
Disclosure of Invention
The utility model aims to provide a multilayer high-conductivity circuit board, which solves the problems that the prior multilayer circuit board is usually fixed with a component directly through a screw mounting mode, so that the lower surface of the circuit board is directly abutted against the component, the heat of the lower surface is difficult to dissipate, and the heat conductivity of the circuit board is affected.
In order to achieve the above purpose, the present utility model provides the following technical solutions: a multilayer high-conductivity circuit board comprising: the multi-layer circuit board comprises a multi-layer circuit board body, wherein second through holes are formed in four corners of the outer wall of the multi-layer circuit board body;
further comprises:
the support frame is fixedly arranged below the multilayer circuit board body, a heat-conducting silica gel pad is adhered between the support frame and the multilayer circuit board body, an inserting sheet radiator is fixedly arranged below the heat-conducting silica gel pad, and a heat-conducting copper plate is fixedly arranged below the inserting sheet radiator;
and the heat dissipation shell is fixedly arranged below the supporting frame and fixedly arranged with the heat conduction copper plate through screws.
Preferably, the U-shaped seat is integrally arranged on two sides of the lower surface of the support frame, the U-shaped seat is fixedly arranged with the heat dissipation outer shell through screws, and a plurality of air duct through holes are formed in the outer wall of the U-shaped seat.
Preferably, the outer walls of the two sides of the heat dissipation outer shell are fixedly provided with the heat dissipation net cover through screws, and a plurality of heat dissipation fans are arranged in the heat dissipation net cover.
Preferably, a plurality of heat dissipation inserting sheets are integrally arranged on the outer wall of the inserting sheet radiator, and an inserting sheet air channel is arranged between the heat dissipation inserting sheets.
Preferably, plastic expansion pipes are arranged at four corners inside the heat dissipation outer shell.
Preferably, a screw is arranged above the plastic expansion pipe, the screw extends into the plastic expansion pipe, and a nut is arranged at the upper end of the screw.
Preferably, a plurality of first through holes are formed in the outer wall of the supporting frame, and the positions of the first through holes are aligned with the second through holes.
Compared with the prior art, the utility model has the beneficial effects that:
1. according to the utility model, the effect of improving the heat conductivity of the multilayer circuit board is achieved by arranging the support frame, the heat-radiating outer shell, the heat-conducting silica gel pad, the inserting sheet radiator and the heat-conducting copper plate, and particularly, the multilayer circuit board body is arranged on the support frame, heat is downwards conducted through the heat-conducting silica gel pad, the support frame is made of aluminum, the heat conductivity is high, auxiliary heat transfer can be carried out, the heat is conducted to the inserting sheet radiator to be dispersed into the air, part of the heat is conducted to the heat-conducting copper plate along the heat-radiating inserting sheet, and then is conducted out by the heat-conducting copper plate.
2. The heat dissipation screen panel can isolate the impurity particle in the air that hangs, play the effect of the inside radiator fan of protection, radiator fan is used for driving outside wind and dispels the heat to multilayer circuit board body and inserted sheet radiator department, make circuit board department heat dispersion improve, fan traction's wind can enter into intermediate position department along the wind channel through-hole, make inserted sheet radiator can be cooled down, the heat dissipation inserted sheet is used for the conduction heat, inserted sheet wind channel can supply the heat dissipation wind to pass, take the heat of heat dissipation inserted sheet department away in the in-process that wind passed, make circuit board department heat dispersion obtain improving.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a schematic view of a partial structure of a multilayer circuit board body according to the present utility model;
FIG. 3 is a schematic view of a part of a heat dissipation mesh enclosure according to the present utility model;
FIG. 4 is a schematic view of a part of a fin-inserted heat sink according to the present utility model;
in the figure: 1. a multi-layer circuit board body; 2. a support frame; 3. a heat dissipation outer case; 4. a thermally conductive silicone pad; 5. an insert radiator; 6. a thermally conductive copper plate; 7. a plastic expansion tube; 8. a screw; 9. a nut; 10. a heat dissipation mesh enclosure; 11. a heat radiation fan; 12. an air duct through hole; 13. a first through hole; 14. a U-shaped seat; 15. a heat dissipation insert; 16. inserting an air duct; 17. and a second through hole.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
Referring to fig. 1-4, an embodiment of the present utility model is provided: a multilayer high-conductivity circuit board comprising: the multi-layer circuit board comprises a multi-layer circuit board body 1, wherein second through holes 17 are formed in four corners of the outer wall of the multi-layer circuit board body 1;
further comprises:
the support frame 2 is fixedly arranged below the multilayer circuit board body 1, a heat-conducting silica gel pad 4 is adhered between the support frame 2 and the multilayer circuit board body 1, an inserting sheet radiator 5 is fixedly arranged below the heat-conducting silica gel pad 4, and a heat-conducting copper plate 6 is fixedly arranged below the inserting sheet radiator 5;
the heat dissipation shell body 3 is fixedly arranged below the support frame 2 and fixedly arranged with the heat conduction copper plate 6 through screws;
through setting up support frame 2, heat dissipation shell body 3, heat conduction silica gel pad 4, insert radiator 5, heat conduction copper 6 play the effect that improves multilayer circuit board heat conductivity, specifically, install multilayer circuit board body 1 on support frame 2, heat conduction downwards through heat conduction silica gel pad 4 between, support frame 2 is the aluminum product, the heat conductivity is high, can carry out auxiliary heat transfer, heat conduction is to the 5 department of insert radiator diverges in to the air, part heat is conducted to heat conduction copper 6 departments along heat dissipation insert 15, heat conduction copper 6 is derived it again, through the above-mentioned structure, can make multilayer circuit board body 1 below possess high heat conduction structure, can be with the heat downwards conduction of multilayer circuit board body 1 department, compared with traditional bottom laminating installation fixed mode, above-mentioned structure can make circuit board department heat be difficult to gather, thereby can improve multilayer circuit board's heat conductivity, avoid multilayer circuit board to damage because of the high temperature is heated.
Referring to fig. 2, both sides of the lower surface of the support frame 2 are integrally provided with a U-shaped seat 14, the U-shaped seat 14 is fixedly mounted with the heat dissipation shell 3 through screws, the outer wall of the U-shaped seat 14 is provided with a plurality of air passage through holes 12, and air drawn by the fan enters the middle position along the air passage through holes 12, so that the insert radiator 5 can be cooled.
Referring to fig. 1-3, the outer walls on two sides of the heat dissipation outer shell 3 are fixedly provided with the heat dissipation mesh enclosure 10 through screws, a plurality of heat dissipation fans 11 are installed in the heat dissipation mesh enclosure 10, the heat dissipation mesh enclosure 10 can isolate impurity particles in hanging air, an effect of protecting the internal heat dissipation fans 11 is achieved, and the heat dissipation fans 11 are used for driving external air to dissipate heat at the positions of the multilayer circuit board body 1 and the inserting sheet radiator 5, so that heat dissipation performance at the circuit board is improved.
Referring to fig. 2 and 4, a plurality of heat dissipation insert pieces 15 are integrally arranged on the outer wall of the insert piece radiator 5, an insert piece air channel 16 is arranged between the heat dissipation insert pieces 15, the heat dissipation insert pieces 15 are used for conducting heat, the insert piece air channel 16 can be used for allowing heat dissipation air to pass through, and heat at the heat dissipation insert pieces 15 is taken away in the process of passing through air, so that the heat dissipation performance at the circuit board is improved.
Referring to fig. 1 and 2, plastic expansion pipes 7 are installed at four corners inside the heat dissipation outer shell 3, and the plastic expansion pipes 7 are used for being assembled with other through holes, so that a user can conveniently assemble and fix the heat dissipation outer shell 3 with other components.
Referring to fig. 2, a screw rod 8 is installed above the plastic expansion tube 7, the screw rod 8 extends into the plastic expansion tube 7, a nut 9 is installed at the upper end of the screw rod 8, after the screw rod 8 is inserted into the plastic expansion tube 7, the plastic expansion tube 7 can expand outwards, so that the plastic expansion tube can prop against through holes of other components, the effect of clamping and fixing is achieved, the nut 9 is used for limiting the screw rod 8, and convenience is brought to a user to install and detach.
Referring to fig. 1 and 2, a plurality of first through holes 13 are disposed on an outer wall of the support frame 2, and the positions of the first through holes 13 are aligned with the second through holes 17, so that the support frame 2 and the multi-layer circuit board can be assembled and mounted by screws after the first through holes 13 and the second through holes 17 are aligned by a user.
Working principle: when in use, the effect of improving the heat conductivity of the multilayer circuit board is achieved by arranging the support frame 2, the heat dissipation outer shell 3, the heat conduction silica gel pad 4, the inserting sheet radiator 5 and the heat conduction copper plate 6, specifically, the multilayer circuit board body 1 is arranged on the support frame 2, heat is downwards conducted through the heat conduction silica gel pad 4, the support frame 2 is made of aluminum materials, the heat conductivity is high, auxiliary heat transfer can be carried out, the heat is conducted to the inserting sheet radiator 5 to be dispersed into the air, part of the heat is conducted to the heat conduction copper plate 6 along the heat dissipation inserting sheet 15, the heat conduction copper plate 6 is led out, through the structure, the lower part of the multilayer circuit board body 1 is provided with a high heat conduction structure, the heat at the multilayer circuit board body 1 is downwards conducted, compared with the traditional bottom attaching and mounting and fixing mode, the structure can enable the heat at the circuit board to be difficult to gather, and the heat conductivity of the multilayer circuit board can be improved, the multi-layer circuit board is prevented from being damaged due to high temperature heating, the heat radiation net cover 10 can isolate impurity particles in hanging air, the effect of protecting the internal heat radiation fan 11 is achieved, the heat radiation fan 11 is used for driving external air to radiate heat at the multi-layer circuit board body 1 and the inserting sheet radiator 5, the heat radiation performance at the circuit board is improved, air drawn by the fan enters the middle position along the air passage through hole 12, the inserting sheet radiator 5 can be cooled, the heat radiation inserting sheet 15 is used for conducting heat, the inserting sheet air passage 16 can be used for allowing the heat radiation air to pass through, the heat at the heat radiation inserting sheet 15 is taken away in the process of passing air, the heat radiation performance at the circuit board is improved, the plastic expansion pipe 7 is used for being assembled with other through holes, a user can conveniently assemble and fix the heat radiation outer shell 3 with other components, and the screw 8 is inserted into the plastic expansion pipe 7, the plastic expansion pipe 7 can be expanded outwards, the plastic expansion pipe can prop against through holes of other components, the effect of clamping and fixing is achieved, the nut 9 is used for limiting the screw rod 8, the installation and the disassembly of a user are facilitated, and after the first through hole 13 and the second through hole 17 are aligned with each other, the support frame 2 and the multilayer circuit board are assembled and installed by means of screws.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (7)
1. The multilayer high-conductivity circuit board comprises a multilayer circuit board body (1), wherein second through holes (17) are formed in four corners of the outer wall of the multilayer circuit board body (1);
the method is characterized in that: further comprises:
the support frame (2) is fixedly arranged below the multilayer circuit board body (1), a heat conduction silica gel pad (4) is adhered between the support frame (2) and the multilayer circuit board body (1), an inserting sheet radiator (5) is fixedly arranged below the heat conduction silica gel pad (4), and a heat conduction copper plate (6) is fixedly arranged below the inserting sheet radiator (5);
and the heat dissipation shell body (3) is fixedly arranged below the supporting frame (2) and fixedly arranged with the heat conduction copper plate (6) through screws.
2. The multilayer high-conductivity circuit board according to claim 1, wherein: u-shaped seats (14) are integrally arranged on two sides of the lower surface of the support frame (2), the U-shaped seats (14) are fixedly arranged with the heat dissipation outer shell (3) through screws, and a plurality of air duct through holes (12) are formed in the outer wall of the U-shaped seats (14).
3. The multilayer high-conductivity circuit board according to claim 1, wherein: the heat radiation outer shell comprises a heat radiation outer shell body (3), wherein the outer walls of the two sides of the heat radiation outer shell body are fixedly provided with a heat radiation net cover (10) through screws, and a plurality of heat radiation fans (11) are arranged in the heat radiation net cover (10).
4. The multilayer high-conductivity circuit board according to claim 1, wherein: a plurality of radiating inserts (15) are integrally arranged on the outer wall of the insert radiator (5), and an insert air channel (16) is arranged between the radiating inserts (15).
5. The multilayer high-conductivity circuit board according to claim 1, wherein: plastic expansion pipes (7) are arranged at four corners inside the heat dissipation outer shell (3).
6. The multilayer high-conductivity circuit board according to claim 5, wherein: the screw rod (8) is arranged above the plastic expansion pipe (7), the screw rod (8) extends into the plastic expansion pipe (7), and the nut (9) is arranged at the upper end of the screw rod (8).
7. The multilayer high-conductivity circuit board according to claim 1, wherein: a plurality of first through holes (13) are formed in the outer wall of the supporting frame (2), and the positions of the first through holes (13) are aligned with the second through holes (17).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320490373.6U CN219499810U (en) | 2023-03-02 | 2023-03-02 | Multilayer high-conductivity circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320490373.6U CN219499810U (en) | 2023-03-02 | 2023-03-02 | Multilayer high-conductivity circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219499810U true CN219499810U (en) | 2023-08-08 |
Family
ID=87476458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320490373.6U Active CN219499810U (en) | 2023-03-02 | 2023-03-02 | Multilayer high-conductivity circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219499810U (en) |
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2023
- 2023-03-02 CN CN202320490373.6U patent/CN219499810U/en active Active
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| GR01 | Patent grant |