CN214757086U - Heat dissipation type printed wiring board - Google Patents
Heat dissipation type printed wiring board Download PDFInfo
- Publication number
- CN214757086U CN214757086U CN202121233707.9U CN202121233707U CN214757086U CN 214757086 U CN214757086 U CN 214757086U CN 202121233707 U CN202121233707 U CN 202121233707U CN 214757086 U CN214757086 U CN 214757086U
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- CN
- China
- Prior art keywords
- heat
- printed circuit
- circuit board
- heat dissipation
- heat absorption
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to the technical field of printed circuit boards, and discloses a heat dissipation type printed circuit board, the both ends of printed circuit board are all provided with splint from top to bottom, a shock-proof device is clamped between the two splints, the bottom of the shock-proof device is provided with an aluminum alloy spring, the shock-proof device is provided with a heat conduction groove, the body of the printed circuit board is provided with a heat dissipation hole, the lower part of the printed circuit board is fixedly provided with a heat absorption base, the central position of the heat absorption base is provided with a heat radiator, the two side surfaces of the upper part of the heat radiator are respectively provided with a heat absorption pipeline, the circumferential direction of the surface of the heat absorption pipeline is provided with a heat absorption hole, the two sides of the central position of the top end of the heat absorption base are respectively provided with an aluminum alloy gasket, the aluminum alloy gasket is M-shaped, the top end of the aluminum alloy gasket is tightly connected with the bottom of the printed circuit board, the left end and the right end of the top end of the heat absorption base are respectively fixedly provided with a heat absorption column, and the upper parts of the outer sides of the heat absorption columns are respectively provided with a heat dissipation ball.
Description
Technical Field
The utility model relates to a printed wiring board technical field specifically is a heat dissipation type printed wiring board.
Background
Printed circuit boards (Printed circuit boards) are also known as Printed circuit boards, and are providers of electrical connection of electronic components, and Printed circuit boards are elements of electronic products, and along with the continuous development of electronic products, people pay more and more attention to the heat dissipation performance of Printed circuit boards. A conventional printed wiring board generally includes a substrate, and screw holes provided at four corners of the substrate and used for mounting the printed wiring board on an electronic product. When the substrate is electrified to work, the circuit on the substrate generates heat to generate a large amount of heat, and the heat must be timely dissipated to the surrounding environment so as not to influence the working performance of the printed circuit board. The screw hole on the base plate of the existing printed circuit board can be used for installing the printed circuit board on an electronic product only by connecting screws, when the base plate is electrified to work, a large amount of heat is easy to accumulate near the screw hole and cannot be dissipated in time, the working performance of the printed circuit board is finally greatly influenced, and the printed circuit board can be divided into a single-sided board, a double-sided board, a four-layer board, a six-layer board and other multi-layer circuit boards according to the number of layers of the circuit board.
The common printed circuit board generally does not have a heat dissipation structure, so that the temperature is too high, the service life is short, and the working requirement of the printed circuit board cannot be met.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
The utility model provides a not enough to prior art, the utility model provides a heat dissipation type printed wiring board possesses advantages such as high-efficient heat dissipation, has solved current printed wiring board and has generally not had radiating structure, leads to the high temperature, and life is low, can not satisfy the problem of the operational requirement of printed wiring board.
(II) technical scheme
In order to realize the purpose of the heat dissipation, the utility model provides a following technical scheme: the utility model provides a heat dissipation type printed wiring board, includes the printed wiring version, splint have all been installed from top to bottom at the both ends of printed wiring version, all press from both sides between two splint and adorn the shock mounting, the below fixed mounting of printed wiring version has the heat absorption base, the central point of heat absorption base puts and installs the radiator, the upper portion both sides face of radiator all adds and is equipped with the heat absorption pipeline, heat absorption hole has all been seted up to heat absorption pipeline surface circumference, the top central point of heat absorption base puts both sides and all installs the aluminum alloy gasket, the equal fixed mounting in both ends has the heat absorption post about the top of heat absorption base, the outside upper portion of heat absorption post all adds and is equipped with the heat dissipation ball.
Preferably, the plate body of the decorative printed circuit board is provided with heat dissipation holes.
Preferably, the bottom of each shock-proof device is provided with an aluminum alloy spring, and each shock-proof device is provided with a heat conduction groove.
Preferably, a heat dissipation fan is installed inside the heat sink.
Preferably, the aluminum alloy gasket is M-shaped, and the top end of the aluminum alloy gasket is tightly connected with the bottom of the printed circuit board.
(III) advantageous effects
Compared with the prior art, the utility model provides a heat dissipation type printed wiring board possesses following beneficial effect:
1. according to the heat dissipation type printed circuit board, the heat dissipation holes formed in the printed circuit board can effectively dissipate heat on the mainboard for the first time;
2. the shockproof device arranged on the heat dissipation type printed circuit board can effectively avoid collision and damage of the printed circuit board caused by vibration;
3. this heat dissipation type printed wiring board, the aluminum alloy gasket of installation, aluminum alloy heat absorption base etc. can effectually absorb printed wiring board's heat furthest, make printed wiring board can last work, increase of service life always.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic diagram of the structure printed circuit board of the present invention.
In the figure: 1. printing a circuit board; 2. a shock-proof device; 3. a heat sink base; 4. a heat sink; 5. a heat absorption pipeline; 6. a heat absorbing hole; 7. an aluminum alloy gasket; 8. a heat absorption column; 9. a heat dissipation ball; 10. heat dissipation holes; 11. a splint; 12. an aluminum alloy spring; 13. a heat conduction groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-2, the present invention provides a heat dissipation type printed circuit board, which comprises a printed circuit board 1, a shock-absorbing device 2, a heat-absorbing base 3, a heat sink 4, a heat-absorbing pipe 5, a heat-absorbing hole 6, an aluminum alloy gasket 7, a heat-absorbing column 8, a heat-dissipating ball 9, a heat-dissipating hole 10, a clamping plate 11, an aluminum alloy spring 12 and a shock-absorbing device 13, wherein the heat-dissipating hole 10 is formed in a board body of the printed circuit board 1, the clamping plate 11 is respectively installed at the upper and lower ends of the printed circuit board 1, the shock-absorbing device 2 is respectively clamped between the two clamping plates 11, the aluminum alloy spring 12 is respectively installed at the bottom of the shock-absorbing device 2, the heat-absorbing device 2 is provided with a heat-conducting groove 13, the heat-absorbing base 3 is fixedly installed below the printed circuit board 1, the heat sink 4 is installed at the central position of the heat-absorbing base 3, a heat-dissipating fan is installed inside the heat sink 4, the heat-absorbing pipe 5 is additionally installed at the upper portion of the heat sink 4, the heat absorption hole 6 has all been seted up to heat absorption 5 surperficial circumferences of pipe, and aluminum alloy gasket 7 is all installed to the top central point of heat absorption base 3 put both sides, and aluminum alloy gasket 7 is the M type, and the top of aluminum alloy gasket 7 and the bottom zonulae occludens of printed wiring version 1, and the equal fixed mounting in both ends has heat absorption post 8 about the top of heat absorption base 3, and the outside upper portion of heat absorption post 8 all adds and is equipped with heat dissipation ball 9.
The working principle of the device is as follows: the heat production when the printed circuit board 1 starts working when electrified, the louvre 10 of seting up on the printed circuit board 1 can be with a part of people weight dissipation earlier, the heat conduction groove 13 that the shock mounting 2 was seted up leads the heat to on the heat absorption post 8, the heat absorption post 8 is with heat absorption rethread heat dissipation ball 9 with the heat and arrange the heat to the external world, heat absorption base 3, discharge the heat through radiator 4 behind most heat absorption with aluminum alloy gasket 7 and aluminum alloy spring 12, radiator 4 will distribute the heat of each department and unify the absorption and discharge through the heat absorption hole 6 of seting up on the heat absorption pipeline 5, radiator 4 is connected with outdoor power supply through the wire.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. A heat dissipation type printed wiring board includes a printed wiring board (1), characterized in that: the heat-absorbing device is characterized in that clamping plates (11) are arranged at the two ends of the printed circuit board (1) from top to bottom, a shock-proof device (2) is clamped between the two clamping plates (11), a heat-absorbing base (3) is fixedly arranged below the printed circuit board (1), a heat radiator (4) is arranged at the center of the heat-absorbing base (3), heat-absorbing pipelines (5) are arranged on the two side faces of the upper portion of the heat radiator (4) in an added mode, heat-absorbing holes (6) are formed in the surface circumference of the heat-absorbing pipelines (5), aluminum alloy gaskets (7) are arranged on the two sides of the center of the top of the heat-absorbing base (3) in an added mode, heat-absorbing columns (8) are fixedly arranged at the left end and the right end of the top of the heat-absorbing base (3) in an added mode, and heat-radiating balls (9) are arranged on the upper portion of the outer side of the heat-absorbing columns (8).
2. The heat dissipation printed wiring board of claim 1, wherein: the body of the printed circuit board (1) is provided with heat dissipation holes (10).
3. The heat dissipation printed wiring board of claim 1, wherein: the bottom of the anti-vibration device (2) is provided with an aluminum alloy spring (12), and the anti-vibration device (3) is provided with a heat conduction groove (13).
4. The heat dissipation printed wiring board of claim 1, wherein: and a heat radiation fan is arranged in the heat radiator (4).
5. The heat dissipation printed wiring board of claim 1, wherein: the aluminum alloy gasket (7) is M-shaped, and the top end of the aluminum alloy gasket (7) is tightly connected with the bottom of the printed circuit board (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121233707.9U CN214757086U (en) | 2021-06-03 | 2021-06-03 | Heat dissipation type printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121233707.9U CN214757086U (en) | 2021-06-03 | 2021-06-03 | Heat dissipation type printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214757086U true CN214757086U (en) | 2021-11-16 |
Family
ID=78627758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121233707.9U Expired - Fee Related CN214757086U (en) | 2021-06-03 | 2021-06-03 | Heat dissipation type printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214757086U (en) |
-
2021
- 2021-06-03 CN CN202121233707.9U patent/CN214757086U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20211116 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |