CN216775366U - High-efficient thermal diffusivity circuit board for treadmill - Google Patents
High-efficient thermal diffusivity circuit board for treadmill Download PDFInfo
- Publication number
- CN216775366U CN216775366U CN202123398156.4U CN202123398156U CN216775366U CN 216775366 U CN216775366 U CN 216775366U CN 202123398156 U CN202123398156 U CN 202123398156U CN 216775366 U CN216775366 U CN 216775366U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- fixedly connected
- heat dissipation
- heat
- mounting box
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 41
- 239000000428 dust Substances 0.000 claims abstract description 11
- 230000000903 blocking effect Effects 0.000 claims abstract description 5
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 9
- 239000004917 carbon fiber Substances 0.000 claims description 9
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- 229910021389 graphene Inorganic materials 0.000 claims description 8
- 238000009423 ventilation Methods 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims 2
- 238000000034 method Methods 0.000 abstract description 12
- 238000007664 blowing Methods 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 description 8
- 241000446313 Lamella Species 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 239000000741 silica gel Substances 0.000 description 7
- 229910002027 silica gel Inorganic materials 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- -1 graphite alkene Chemical class 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a high-efficiency heat dissipation circuit board for a treadmill. Treadmill is with high-efficient thermal diffusivity circuit board includes: a circuit board body; the mounting box is fixedly connected to the bottom of the circuit board body; the heat dissipation assembly is fixedly connected between the bottoms of the two sides of the inner wall of the mounting box; and the heat conduction assembly is fixedly connected to the bottom of the heat dissipation assembly. The high-efficiency heat dissipation circuit board for the treadmill can enable the surface of the heat conduction column to be cooled in the process of conducting heat through the heat dissipation fan in the heat dissipation assembly, so that the heat conduction efficiency is effectively improved, the heat dissipation performance of the circuit board body is more efficient, in addition, dust can be prevented from entering the interior in the process of blowing through the dust blocking net, and the dissipation of internal heat can be improved by reducing the attachment of the dust to parts.
Description
Technical Field
The utility model relates to the field of circuit boards, in particular to a high-efficiency heat dissipation circuit board for a treadmill.
Background
The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout. The circuit board is a flexible printed circuit board which is made of polyimide or polyester film as a base material and has high reliability and excellent performance, and the flexible printed circuit board has high wiring density, light weight, thin thickness and soft and hard combination boards.
The treadmill among the prior art is with high-efficient thermal diffusivity circuit board in the use, mostly all is single derives the heat through the heat conduction material, and the heat as heat conduction material itself also can heat up along with the heat conduction process, if the heat of heat conduction material itself can not obtain the decline to can influence heat conduction efficiency, and then influence the thermal diffusivity of circuit board.
Therefore, it is necessary to provide a circuit board with high heat dissipation for a treadmill to solve the above technical problems.
SUMMERY OF THE UTILITY MODEL
The utility model provides a high-efficiency heat dissipation circuit board for a treadmill, which solves the problem that the heat of a heat conduction material cannot be reduced in the use process of the high-efficiency heat dissipation circuit board for the treadmill in the prior art, so that the heat conduction efficiency is influenced, and further the heat dissipation of the circuit board is influenced.
In order to solve the above technical problems, the present invention provides a high-efficiency heat dissipation circuit board for a treadmill, comprising: a circuit board body;
the mounting box is fixedly connected to the bottom of the circuit board body;
the heat dissipation assembly is fixedly connected between the bottoms of the two sides of the inner wall of the mounting box;
the heat conduction assembly is fixedly connected to the bottom of the heat dissipation assembly;
the fixing bolt is arranged on the top of the circuit board body;
the air outlet is formed in the top of the front face of the mounting box;
the ventilation plate penetrates through the bottom of the mounting box.
Preferably, the heat dissipation assembly comprises a frame body and a heat dissipation plate, the frame body penetrates through the back face of the inner wall of the mounting box, the heat dissipation plate is fixedly connected between the bottoms of the two sides of the inner wall of the mounting box, the back plates are fixedly connected to the rear sides of the two sides of the top of the inner wall of the frame body, the two back plates are fixedly connected to the front faces of the back plates, the heat dissipation fan is fixedly connected to the front faces of the back plates, the dust blocking net is arranged on the front face of the frame body, and the heat conduction columns are fixedly connected to the two sides of the top of the heat dissipation plate.
Preferably, the bottom of the surface of each of the two heat conduction columns is fixedly connected with a water-absorbing sponge ring, and the bottom of the heat dissipation plate is provided with heat dissipation holes.
Preferably, the heat conduction assembly comprises a graphene layer, and a carbon fiber layer is fixedly connected to the bottom of the graphene layer.
Preferably, the bottom fixedly connected with silica gel lamella of carbon fiber layer, the bottom fixedly connected with copper aluminium sheet layer of silica gel lamella.
Compared with the prior art, the high-efficiency heat dissipation circuit board for the treadmill has the following beneficial effects:
the utility model provides a high-efficiency heat dissipation circuit board for a treadmill, which can reduce the temperature of the surface of a heat conduction column during the heat conduction process through a heat dissipation fan in a heat dissipation assembly, thereby effectively improving the heat conduction efficiency, enabling the heat dissipation of a circuit board body to be more efficient, and in addition, dust can be prevented from entering the interior during the blowing process through a dust blocking net, and the dissipation of the internal heat can be improved by reducing the attachment of the dust to parts.
Drawings
FIG. 1 is a schematic structural diagram of a circuit board with high heat dissipation for a treadmill according to a preferred embodiment of the present invention;
FIG. 2 is a schematic structural view of the mounting box shown in FIG. 1;
fig. 3 is a schematic structural view of the heat conducting assembly shown in fig. 1.
The reference numbers in the figures: 1. the circuit board body, 2, the mounting box, 3, radiator unit, 301, the framework, 302, the heating panel, 303, the backplate, 304, radiator fan, 305, keep off the dirt net, 306, the heat conduction post, 307, the sponge circle that absorbs water, 308, louvre, 4, heat-conducting component, 401, graphite alkene layer, 402, the carbon fiber layer, 403, silica gel lamella, 404, copper aluminum plate layer, 5, gim peg, 6, the exhaust vent, 7, the ventilating board.
Detailed Description
The utility model is further described below with reference to the drawings and the embodiments.
Referring to fig. 1, fig. 2 and fig. 3, wherein fig. 1 is a schematic structural diagram of a high-efficiency heat dissipation circuit board for a treadmill according to a preferred embodiment of the present invention; FIG. 2 is a schematic view of the mounting box of FIG. 1; fig. 3 is a schematic structural view of the heat conducting assembly shown in fig. 1. High-efficient thermal diffusivity circuit board includes for the treadmill: a circuit board body 1;
the mounting box 2 is fixedly connected to the bottom of the circuit board body 1;
the heat dissipation component 3 is fixedly connected between the bottoms of the two sides of the inner wall of the mounting box 2;
the heat conducting component 4 is fixedly connected to the bottom of the heat radiating component 3;
the fixing bolt 5 is arranged at the top of the circuit board body 1;
the air outlet holes 6 are formed in the top of the front face of the mounting box 2, and the number of the air outlet holes 6 is multiple;
the ventilation plate 7, ventilation plate 7 run through in the bottom of mounting box 2.
The bottom on two heat conduction post 306 surfaces all fixedly connected with sponge circle 307 that absorbs water, louvre 308 has been seted up to the bottom of heating panel 302, can absorb the steam that produces in the heat conduction post 306 surface cooling process through setting up sponge circle 307 that absorbs water.
The heat conducting assembly 4 includes a graphene layer 401, a carbon fiber layer 402 fixedly connected to a bottom of the graphene layer 401, and a top of the graphene layer 401 fixedly connected to a bottom of the heat dissipating plate 302.
The bottom fixedly connected with silica gel lamella 403 of carbon fiber layer 402, the bottom fixedly connected with copper aluminium sheet layer 404 of silica gel lamella 403 consumes one by one through graphite alkene layer 401, carbon fiber layer 402, silica gel lamella 403 and copper aluminium sheet layer 404 on the heat-conducting component 4, leads to the aerofoil 7 at last and goes out the heat conduction.
The working principle of the high-efficiency heat dissipation circuit board for the running machine provided by the utility model is as follows:
circuit board body 1 during operation, can be through on heat conduction post 306 with heat direction heating panel 302, the in-process of conducting heat is carried out at heat conduction post 306, through starting radiator fan 304, radiator fan 304 rotates and produces cold wind and consumes the heat on heat conduction post 306 surface, derive through exhaust vent 6 at last, the remaining heat of heat conduction post 306 can pass through on the heating panel 302 reaches heat-conducting component 4, graphene layer 401 through on the heat-conducting component 4, carbon fiber layer 402, silica gel lamella 403 and copper aluminum plate layer 404 consume one by one, it goes out the heat conduction to lead to ventilation board 7 at last.
Compared with the related art, the high-efficiency heat dissipation circuit board for the running machine provided by the utility model has the following beneficial effects:
through radiator fan 304 among the radiator unit 3 can make heat conduction post 306 carry out the in-process of thermal conductance, cool down the processing to its surface to the effectual heat conduction efficiency that has improved for the thermal diffusivity of circuit board body 1 is more high-efficient, can avoid blowing in-process dust through keeping off dirt net 305 in addition and enter into inside, through reducing the dust and adhere to on the spare part, can improve inside thermal dissipation.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (5)
1. The utility model provides a high-efficient thermal diffusivity circuit board for treadmill which characterized in that includes: a circuit board body (1);
the mounting box (2), the mounting box (2) is fixedly connected to the bottom of the circuit board body (1);
the heat dissipation assembly (3) is fixedly connected between the bottoms of the two sides of the inner wall of the mounting box (2);
the heat conduction assembly (4), the heat conduction assembly (4) is fixedly connected to the bottom of the heat dissipation assembly (3);
the fixing bolt (5), the fixing bolt (5) is arranged on the top of the circuit board body (1);
the air outlet (6) is formed in the top of the front face of the mounting box (2);
the ventilation plate (7), ventilation plate (7) run through in the bottom of mounting box (2).
2. The circuit board with high heat dissipation performance for the treadmill according to claim 1, wherein the heat dissipation assembly (3) comprises a frame body (301) and a heat dissipation plate (302), the frame body (301) penetrates through the back surface of the inner wall of the mounting box (2), the heat dissipation plate (302) is fixedly connected between the bottoms of two sides of the inner wall of the mounting box (2), the back plates (303) are fixedly connected to the back sides of two sides of the top of the inner wall of the frame body (301), the heat dissipation fans (304) are fixedly connected to the front surfaces of the two back plates (303), the dust blocking net (305) is arranged on the front surface of the frame body (301), and the heat conduction columns (306) are fixedly connected to two sides of the top of the heat dissipation plate (302).
3. The circuit board for dissipating heat of a treadmill according to claim 2, wherein a water absorbing sponge ring (307) is fixedly connected to the bottom of each of the two heat conducting pillars (306), and heat dissipating holes (308) are formed in the bottom of the heat dissipating plate (302).
4. The circuit board for treadmill of claim 1, wherein the heat conducting component (4) comprises a graphene layer (401), and a carbon fiber layer (402) is fixedly connected to the bottom of the graphene layer (401).
5. The circuit board with high heat dissipation performance for the treadmill according to claim 4, wherein a silicone sheet layer (403) is fixedly connected to the bottom of the carbon fiber layer (402), and a copper-aluminum sheet layer (404) is fixedly connected to the bottom of the silicone sheet layer (403).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123398156.4U CN216775366U (en) | 2021-12-30 | 2021-12-30 | High-efficient thermal diffusivity circuit board for treadmill |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123398156.4U CN216775366U (en) | 2021-12-30 | 2021-12-30 | High-efficient thermal diffusivity circuit board for treadmill |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216775366U true CN216775366U (en) | 2022-06-17 |
Family
ID=81970433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123398156.4U Expired - Fee Related CN216775366U (en) | 2021-12-30 | 2021-12-30 | High-efficient thermal diffusivity circuit board for treadmill |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216775366U (en) |
-
2021
- 2021-12-30 CN CN202123398156.4U patent/CN216775366U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220617 |