CN221842804U - Heat dissipation type circuit board - Google Patents

Abstract

The utility model discloses a heat dissipation type circuit board, comprising a protection frame, a heat-conducting frame is embedded and installed inside an opening of the top surface of the protection frame, a circuit board body is arranged above the heat-conducting frame, and a heat-conducting adhesive layer is arranged between the circuit board body and the heat-conducting frame; in the utility model, the heat-conducting frame is arranged on the inner side of the protection frame corresponding to the installation area of the circuit board body, and the top surface of the heat-conducting frame is kept in contact with the metal pins at the bottom edge of the circuit board body through the heat-conducting adhesive layer, so that the heat generated by the circuit board body during operation is transferred to the heat-conducting frame and a plurality of heat dissipation fins arranged at the bottom thereof in the form of heat conduction; when heat is dissipated, a heat dissipation fan fixed by an inclined support plate in the protection frame is turned on, so that the heat dissipation fan is driven to work and blow air to the area where the heat dissipation fins are located, and the ventilation effect between the protection frame and the outside is increased in combination with the arrangement of a plurality of ventilation holes opened on the side of the protection frame, so as to achieve the purpose of rapid heat dissipation of the circuit board body.

Description

Heat dissipation circuit board

Technical Field

The utility model relates to the technical field of circuit boards, in particular to a heat dissipation type circuit board.

Background Art

Circuit boards can be divided into printed circuit boards or printed circuit boards, the English name is FPC circuit boards (FPC circuit boards are also called flexible circuit boards. Flexible circuit boards are made of polyimide or polyester film as a substrate. They are highly reliable and extremely flexible printed circuit boards with high wiring density, light weight, thin thickness, and good bending properties. Among them, the existing circuit boards have poor structural protection during installation and use, and generally need to be protected by circuit boxes, resulting in poor heat dissipation during the use of the circuit boards. Heat is easily accumulated inside, resulting in device aging failures, and it is very troublesome during installation and removal.

After searching, publication number CN217509099U discloses a heat dissipation circuit board. In this solution, the circuit board is installed inside the limit groove, and the bottom is adsorbed and fixed by an electromagnetic suction cup to prevent the circuit board from loosening and falling out, thereby increasing the overall stability and self-protection of the circuit board. At the same time, the flow rate of the internal air can be increased by the guide fan, and the internal and external air circulation exchange can be increased through the guide port, which effectively plays a role in cooling the interior and avoiding the accumulation of high temperature inside and causing device aging failure.

However, since the guide fan in this solution only acts on the bottom surface of the circuit board body, due to the provision of a corresponding heat dissipation auxiliary structure, there are problems such as low heat dissipation pertinence and unsatisfactory ventilation effect.

To this end, a heat dissipation type circuit board is proposed, which has the advantage of sufficient heat dissipation and thus solves the problems in the above-mentioned background technology.

Utility Model Content

The utility model aims to solve the shortcomings in the prior art and proposes a heat dissipation type circuit board.

In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a heat-dissipating circuit board, comprising a protective frame, a heat-conducting frame is embedded and installed on the inner side of the opening of the top surface of the protective frame, and a circuit board body is arranged above the heat-conducting frame, a heat-conducting adhesive layer is arranged between the circuit board body and the heat-conducting frame, and the heat-conducting adhesive layer is in contact with the metal pins at the edge of the bottom surface of the circuit board body, a plurality of heat-dissipating fins are integrally cast at the bottom of the heat-conducting frame, a diagonal support plate is welded to the bottom of the inner side of the protective frame, a heat-dissipating fan is fixedly installed on the surface of the diagonal support plate by screws, and the air outlet of the heat-dissipating fan faces the heat-dissipating fins, and a plurality of ventilation holes are opened on the side of the protective frame.

As a further description of the above technical solution: the diagonal support plate is composed of a horizontal portion and an inclined portion, and a vent is provided on the surface of the inclined portion of the diagonal support plate, and the cooling fan is fixed on the inclined portion of the diagonal support plate.

As a further description of the above technical solution: the heat-conducting frame is a rectangular structure as a whole, and a plurality of rectangular openings are opened on the surface of the heat-conducting frame.

As a further description of the above technical solution: the heat dissipation fins are of a square sheet structure as a whole, and the heat dissipation fins are in contact with the inner wall of the protective frame.

As a further description of the above technical solution: a circular metal wire mesh is embedded in the ventilation hole.

As a further description of the above technical solution: two mounting ears are welded on the left and right sides of the protective frame, and circular mounting holes are opened on the surfaces of the two mounting ears.

The utility model has the following beneficial effects:

In the utility model, a heat-conducting frame is arranged on the inner side of the protective frame corresponding to the installation area of the circuit board body, and the top surface of the heat-conducting frame is kept in contact with the metal pins at the bottom edge of the circuit board body through the heat-conducting adhesive layer, so that the heat generated by the operation of the circuit board body is transferred to the heat-conducting frame and a plurality of heat dissipation fins arranged at the bottom thereof in the form of heat conduction. When dissipating heat, a heat dissipation fan fixed by a diagonal support plate in the protective frame is turned on, so that the heat dissipation fan is driven to work and blow air to the area where the heat dissipation fins are located. Combined with the arrangement of a plurality of ventilation holes opened on the side of the protective frame, the ventilation effect between the protective frame and the outside world is increased, so as to achieve the purpose of rapid heat dissipation of the circuit board body. The above-mentioned heat dissipation structure integrates heat conduction and air blowing heat dissipation, and has the advantages of strong pertinence and sufficient heat dissipation.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG1 is a schematic diagram of the structure of a heat dissipation circuit board of the utility model;

FIG2 is a schematic diagram of the internal structure of the protection frame of the heat dissipation type circuit board of the utility model;

FIG3 is a schematic diagram of the heat-conducting frame structure of the heat-dissipating circuit board of the utility model.

Legend:

1. Protective frame; 2. Circuit board body; 3. Mounting ears; 4. Ventilation holes; 5. Diagonal support plate; 6. Cooling fan; 7. Heat conduction frame; 8. Heat dissipation fins; 9. Thermal conductive adhesive layer; 10. Rectangular opening.

DETAILED DESCRIPTION

The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

According to an embodiment of the utility model, a heat dissipation circuit board is provided.

The utility model is further described in conjunction with the accompanying drawings and specific embodiments. As shown in FIGS. 1-3, a heat dissipation type circuit board according to an embodiment of the utility model includes a protective frame 1, a heat-conducting frame 7 is embedded and installed inside the opening of the top surface of the protective frame 1, and a circuit board body 2 is arranged above the heat-conducting frame 7, a heat-conducting adhesive layer 9 is arranged between the circuit board body 2 and the heat-conducting frame 7, and the heat-conducting adhesive layer 9 is in contact with the metal pins at the edge of the bottom surface of the circuit board body 2, a plurality of heat dissipation fins 8 are integrally cast at the bottom of the heat-conducting frame 7, a diagonal support plate 5 is welded to the bottom of the inner side of the protective frame 1, a heat dissipation fan 6 is fixedly installed on the surface of the diagonal support plate 5 by screws, and the air outlet of the heat dissipation fan 6 faces the heat dissipation fins 8, and the protective frame 1 A plurality of ventilation holes 4 are provided on the side of the protective frame 1, and the heat generated by the circuit board body 2 is transferred to the heat-conducting frame 7 and the plurality of heat-dissipating fins 8 arranged at the bottom thereof in the form of heat conduction. By connecting the heat dissipating fan 6 fixed by the diagonal support plate 5 in the protective frame 1, the heat dissipating fan 6 is prompted to work to blow air to the area where the heat dissipating fins 8 are located. Combined with the setting of the plurality of ventilation holes 4 provided on the side of the protective frame 1, the ventilation effect between the protective frame 1 and the outside is increased, so as to achieve the purpose of rapid heat dissipation of the circuit board body 2. The heat dissipating fan 6 installed in the protective frame 1 is connected to the external power supply through the power connector to power the heat dissipating fan 6. The protective frame 1 is made of metal material to transfer the heat of the heat dissipating fins 8.

In one embodiment, the diagonal support plate 5 is composed of a horizontal portion and an inclined portion, and a vent is provided on the surface of the inclined portion of the diagonal support plate 5. The cooling fan 6 is fixed on the inclined portion of the diagonal support plate 5. The cooling fan 6 is installed at an angle through the inclined portion of the diagonal support plate 5 so as to blow air to dissipate heat for the circuit board body 2 and the cooling fins 8.

In one embodiment, the heat-conducting frame 7 is a rectangular structure as a whole, and a plurality of rectangular openings 10 are provided on the surface of the heat-conducting frame 7. The provision of the plurality of rectangular openings 10 increases the ventilation effect of the heat-conducting frame 7, so that the wind blown out by the cooling fan 6 can directly reach the circuit board body 2.

In one embodiment, the heat dissipation fins 8 are of a square sheet structure as a whole, and the heat dissipation fins 8 are in contact with the inner wall of the protective frame 1. Through the setting of the heat dissipation fins 8, it can be regarded as an extension structure of the thermal conductive frame 7, so as to transfer the circuit board body 2 and achieve the purpose of rapid heat conduction by expanding the surface area.

In one embodiment, a circular metal mesh is embedded in the ventilation hole 4 to prevent dust.

In one embodiment, two mounting ears 3 are welded on both sides of the protection frame 1 , and circular mounting holes are provided on the surfaces of the two mounting ears 3 , so that the protection frame 1 can be installed easily through the arrangement of the mounting ears 3 .

Working principle:

When in use, firstly, screws are used to penetrate the mounting ears 3 and fix them to the mounting area of the protection frame 1 to install the circuit board body 2, and then the cooling fan 6 installed inside the protection frame 1 is connected to the external power supply through the power connector to supply power to the cooling fan 6. A heat-conducting frame 7 is arranged on the inner side of the protection frame 1 corresponding to the mounting area of the circuit board body 2, and the top surface of the heat-conducting frame 7 is kept in contact with the metal pins at the bottom edge of the circuit board body 2 through the heat-conducting adhesive layer 9, so that the heat generated by the circuit board body 2 during operation is transferred to the heat-conducting frame 7 and a plurality of cooling fins 8 arranged at the bottom thereof in the form of heat conduction. When dissipating heat, the cooling fan 6 fixed by the diagonal support plate 5 in the protection frame 1 is turned on to encourage the cooling fan 6 to work and blow air to the area where the cooling fins 8 are located. Combined with the arrangement of a plurality of ventilation holes 4 opened on the side of the protection frame 1, the ventilation effect between the protection frame 1 and the outside world is increased, so as to achieve the purpose of rapid heat dissipation of the circuit board body 2.

Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims (6)

1. Heat dissipation type circuit board, including protection frame (1), its characterized in that: the heat-conducting plate is characterized in that the heat-conducting frame (7) is embedded and installed on the inner side of the opening of the top surface of the protection frame (1), the circuit board body (2) is arranged above the heat-conducting frame (7), a heat-conducting glue layer (9) is arranged between the circuit board body (2) and the heat-conducting frame (7), the heat-conducting glue layer (9) is in contact with metal pins at the edge of the bottom surface of the circuit board body (2), a plurality of radiating fins (8) are integrally cast at the bottom of the heat-conducting frame (7), inclined stay plates (5) are welded at the inner bottom of the protection frame (1), radiating fans (6) are fixedly installed on the surfaces of the inclined stay plates (5) through screws, and air blowing openings of the radiating fans (6) face the radiating fins (8), and a plurality of vent holes (4) are formed in the side surface of the protection frame (1).

2. The heat dissipation circuit board according to claim 1, wherein: the inclined support plate (5) is formed by combining a horizontal part and an inclined part, a vent is formed in the surface of the inclined part of the inclined support plate (5), and the cooling fan (6) is fixed on the inclined part of the inclined support plate (5).

3. The heat dissipation circuit board according to claim 1, wherein: the whole heat conduction frame (7) is of a rectangular structure, and a plurality of rectangular openings (10) are formed in the surface of the heat conduction frame (7).

4. The heat dissipation circuit board according to claim 1, wherein: the radiating fins (8) are integrally of a square plate structure, and the radiating fins (8) are in contact with the inner wall of the protective frame (1).

5. The heat dissipation circuit board according to claim 1, wherein: a circular wire mesh is embedded and installed in the vent hole (4).

6. The heat dissipation circuit board according to claim 1, wherein: two mounting lugs (3) are welded on the left side and the right side of the protective frame (1), and circular mounting holes are formed in the surfaces of the two mounting lugs (3).