CN101668410A - Heat dissipation system of heating modules - Google Patents
Heat dissipation system of heating modules Download PDFInfo
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- CN101668410A CN101668410A CN200910196471A CN200910196471A CN101668410A CN 101668410 A CN101668410 A CN 101668410A CN 200910196471 A CN200910196471 A CN 200910196471A CN 200910196471 A CN200910196471 A CN 200910196471A CN 101668410 A CN101668410 A CN 101668410A
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Abstract
The invention provides a heat dissipation system of heating modules, wherein the plurality of heating modules are respectively fixed on the two sides of a circuit board; and two heat dissipation modules are respectively covered on the surfaces of the heating modules at the two sides of the circuit board and lead the plurality of heating modules and the circuit board to be clamped and fixed betweenthe two heat dissipation modules, so that a sandwich structure is formed. The heat dissipation system has compact structure, large heat dissipation area and good heat dissipation effect, and can effectively shield electromagnetic radiation.
Description
Technical field
The present invention relates to a kind of cooling system of heating module, particularly a kind of while can effectively be reduced the cooling system of the heating module of electromagnetic radiation.
Background technology
The development of electrical equipment is obvious to all, and along with in being widely used in life and producing of electrical equipment, the negative effect of its generation begins to allow people pay close attention to gradually, each electric equipment for example, all need electricity consumption to drive, thereby power supply is particularly important to the negative effect that people bring.
In the equipment of electricity consumption miscellaneous, for example in each subsystem of mask aligner, power supply is the energy source of each system, and the processing of power module is seemed particularly important.Power module provides stable voltage and current for the next stage module, drives the normal operation of next stage module.And power supply itself often exists two problems that will deal carefully with, i.e. heat dissipation problem and electromagnetic radiation.The alternating current 220V high pressure is converted to the DC low-voltage that driving next stage module needs, in this process, will certainly produce the lot of energy loss, concentrate at high power module and produce a large amount of heat.Traditional treatment method is the same side that heater members is placed circuit board, adds fin simultaneously on heater members.
Discover, the heat-sinking capability of fin and the overall volume of fin, promptly profile envelope volume is relevant, and profile envelope volume is big more, and heat-sinking capability is strong more.For tending to use a plurality of high power devices on the same power module, guarantee in time shedding of heat, the profile envelope volume of fin will be very big, the size of single fin will be very big, this often brings the inconvenience of structure installation and the increase of cost, thereby has produced the main body of a pair of contradiction.
On the other hand, electric current is the true cause that causes electromagnetic radiation, and the signal that switching frequency is high is EMI (electromagnetic interference) emission source.In power module, the work of the generation of big drive current and a large amount of switching devices can produce bigger electromagnetic radiation to the space, produces stronger electromagnetic interference.
At present power panel mostly is single sided board or double sided board, all to be to add the box body that plays electromagnetic shielding in entire circuit plate outside for the processing of electromagnetic radiation, but in order dispelling the heat, to open ventilating window.Also have other buttons simultaneously, display lamp etc. is wanted perforate, can't accomplish real shielding, electromagnetic exposure will produce, in addition, because box body needs electromagnetic radiation shielding, so must adopt metal material, limited its selection and profile structure greatly, even gained in weight and volume, seriously restricted to diversity and legerity type direction and developed.How satisfying the heat radiation requirement under the cramped construction, reduce the external electromagnetic radiation ability of whole power module simultaneously, is nowadays to high-performance power supply product requirement.
In view of this, how to provide a kind of cooling system of heating module, comprehensively solving the problems of the technologies described above becomes the technical problem that industry needs to be resolved hurrily.
Summary of the invention
Technical problem solved by the invention is to provide a kind of cooling system of heating module, compact conformation, and area of dissipation is big, good heat dissipation effect.
Technical problem solved by the invention is to provide a kind of cooling system of heating module, compact conformation not only, and area of dissipation is big, good heat dissipation effect, effective electromagnetic radiation shielding simultaneously.
For solving the problems of the technologies described above, the invention provides a kind of cooling system of heating module, mainly be the two sides that a plurality of described heating modules are separately fixed at a circuit board; Two radiating modules cover the surface of the described heating module on circuit board two sides respectively, and a plurality of described heating modules and circuit board are clamped on wherein, form sandwich.
In specific embodiment, has fastening securing member mutually between the described sandwich.Cooling system can also comprise the radiator fan of being located at described sandwich one side, to help heat radiation.Described heating module is crisscross arranged in the both sides of circuit board.Be provided with the heat conduction pad between described heating module and radiating module.
Described heating module is a high power device.Described radiating module is the heat dissipation metal chip architecture, all is ground connection also, thereby makes effectively electromagnetic radiation shielding of radiating module.
System can also comprise the side panel that is arranged on described circuit board both sides, has the clamping structure and the securing member that described side panel can be embedded described sandwich between described side panel and described sandwich.
The cooling system of heating module of the present invention by the requirement to circuit board, disperses radiating module to be arranged on the two sides, covers radiating module again on the two sides respectively, thereby has the following advantages: compact conformation, and area of dissipation is big, good heat dissipation effect; While is electromagnetic radiation shielding effectively.
Description of drawings
Fig. 1 is the schematic layout pattern of an embodiment of the cooling system of heating module of the present invention;
Fig. 2 is the assembling schematic diagram of cooling system one embodiment of heating module of the present invention;
Fig. 3 is the envelope structural representation of a radiating module;
Fig. 4 is a strip lines configuration electric field radiation schematic diagram.
Embodiment
Below by specific instantiation explanation embodiments of the present invention, those skilled in the art can understand other advantages of the present invention and effect easily by the content that this specification disclosed.The present invention also can be implemented or used by other different instantiations, and the every details in this specification also can be based on different viewpoints and application, carries out various modifications and change under the spirit of the present invention not deviating from.
The technical basis and the characteristics of the cooling system of heating module of the present invention are as follows:
Seeing also Fig. 1, is the schematic layout pattern of cooling system one embodiment of a kind of heating module of the present invention.As shown in the figure, A, B, C, D are respectively four heating modules 14, circuit board 10 front and backs two heating modules 14 that are staggeredly placed respectively, all adopt a radiating module 12 to dispel the heat separately, in the present embodiment, described radiating module is the monoblock fin, and described heating module 14 is high power devices, for example power supply etc.Adopt the air blast wind-cooling heat dissipating, promptly fan 11 is set up in the left side among the figure.Radiating module 12 adopts securing member 16 and side plate 18, heating module 14, PCB circuit board 10 to fix.Like this, two radiating modules 12 link together up and down, have increased the envelope volume of heat radiation, strengthen capacity of heat transmission, and heat can in time leave.Two radiating modules 12 all are to be connected with ground simultaneously, form strip lines configuration with circuit board, can serve as the reference layer of circuit board 10 upward wirings, complete return flow path is provided, play good electromagnetic shielding action, greatly reduced the intensity of the outside radiation field of signal.Here, described circuit board 10, heating module 14, and radiating module 12 tighten together by securing member 16, form sandwich.
Representing above-mentioned sandwich for clearer, see also Fig. 2, is the assembling schematic diagram of cooling system one embodiment of a kind of heating module of the present invention.Wherein, in the present embodiment, described securing member 16 comprises: fixed screw 161, internal thread screw 162, and double-screw bolt 163, be engaged in the perforating that is provided with on radiating module 12, heating module 14, circuit board 10 and side panel 18, the heat conduction pad 13 these parts are tightened together, make compact conformation neat, wherein the perforating 120 on the radiating module 12 is arranged in the radiating fin interval.In the present embodiment, described heat conduction pad 13 is to be affixed between heating module 14 and the radiating module 12; Power module, promptly heating module 12, totally four, are positioned over the both sides of circuit board 10; Both sides panel 18 has the connection perforating 180 of fixed screw 161 up and down, and the clamping structure 181 of fixing circuit board, is groove structure.
The envelope volume of radiating module 12 and the relation of heat-sinking capability can be used formula (1) expression:
lgQ＝(lgV+0.8)/1.4(1)
Wherein Q is the total power dissipation of radiating module 12, and V is the envelope volume of radiating module 12.By formula (1) as can be known, for certain dissipation power, the envelope volume of radiating module 12 must reach certain value.The envelope volume V of radiating module 12 is big more, and its heat dissipation capacity Q is also big more.
Seeing also Fig. 3, is the envelope structural representation of a radiating module, and it is long to be L, and wide is W, and height is H:
Its overall envelope volume is V1=L*W*H, and can calculate corresponding heat dissipation capacity according to formula (1) is Q1.
And for using screw, the integral body that two fin that nut links to each other with side panel are formed, promptly above-mentioned sandwich if each radiating module size is single fin half, longly is L, and wide is 0.5W, and height is H., and the height of side panel is h,
Its whole envelope volume V2=L*0.5W* (2H+h)=L*W*H+0.5L*W*h then, corresponding heat dissipation capacity is Q2.
So obvious V2＞V1 is heat dissipation capacity Q2＞Q1.
Its envelope volume of integral heat sink structure that such two radiating modules 12 are formed is greater than single radiating module structure, and radiating effect is better than the structure of single radiating module, and this timely heat radiation for the bigger power device of power consumption has good effect.
Seeing also Fig. 4, is strip lines configuration electric field radiation schematic diagram.Current signal on the holding wire will produce electric field to external radiation, can produce induced current on reference layer, finally can form the return electric current with current opposite in direction on reference layer.When return path is imperfect, just can produce electromagnetic radiation.As seen when signal lead has complete reference layer, just can reduce the electromagnetic radiation ability greatly.
In like manner, the high power device that is provided with on the circuit board 10 in the present embodiment, power supply for example, power panel all is single sided board or double sided board generally so, does not have custom-designed reference layer.And the cooling system of the heating module of the invention described above, utilizing radiating module is the metal structure characteristic, in heat radiation, has served as the reference layer of circuit board 10 upward wirings.Two radiating modules 12 are connected with ground up and down, entire circuit plate 10 is clipped between two radiating modules 12, forms on the whole the cabling on the circuit board 10 from radiating module 12 and circuit board 10, formed strip lines configuration, radiating module 12 is reference layers that return flow path is provided for holding wire.In this structure, do not increase the number of plies of power panel 10, but, played the same effect of multi-layer sheet, reduced electromagnetic radiation by the integral body that radiating module 12 and circuit board 10 constitute.
In addition, because the cooling system of heating module of the present invention is on the source effective shielding have been carried out in electromagnetic radiation, so, can select material arbitrarily in this system outside as housing, even do not need other housing, can be various on material is selected, also can be so that entire equipment become lighter and handier, given sufficient design space for the structure of outside.
In sum, utilize the cooling system of heating module of the present invention, use the radiator structure method for designing of a plurality of high power devices, heating module is placed apart in the heteropleural of circuit board, i.e. Top face and Bottom face adopt the method for the staggered layout thermal source that scatter.Simultaneously on the device of top face and bottom face, respectively add the radiating module that a monoblock is big, two radiating modules are fixedly connected by securing member up and down, increase the envelope volume of radiating module again, strengthen heat-sinking capability.Radiating module links to each other with power supply ground, has served as the reference layer of entire circuit plate plate, and the integral body by radiating module and circuit board constitute forms strip lines configuration, has reduced radiation intensity from the source.This structural design can make compact conformation, increases area of dissipation, strengthens radiating effect, and the strip lines configuration that is made of radiating module and circuit board simultaneously can reduce external electromagnetic radiation ability greatly.
The foregoing description only is illustrative principle of the present invention and effect thereof, but not is used to limit the present invention.Any those skilled in the art all can be under spirit of the present invention and category, and the foregoing description is modified and changed.Therefore, the scope of the present invention should be foundation with the scope of claims.
Claims (10)
1, a kind of cooling system of heating module is characterized in that: a plurality of heating modules are separately fixed at the two sides of a circuit board; Two radiating modules cover the surface of the described heating module on circuit board two sides respectively, and a plurality of described heating modules and circuit board are clamped on wherein, form sandwich.
2, the cooling system of heating module as claimed in claim 1 is characterized in that, has fastening securing member mutually between the described sandwich.
3, the cooling system of heating module as claimed in claim 1 is characterized in that, also comprises the radiator fan of being located at described sandwich one side.
4, the cooling system of heating module as claimed in claim 1 is characterized in that, described heating module is crisscross arranged in the both sides of circuit board.
5, the cooling system of heating module as claimed in claim 1 is characterized in that, is provided with the heat conduction pad between described heating module and radiating module.
6, the cooling system of heating module as claimed in claim 1 is characterized in that, described heating module is a high power device.
7, the cooling system of heating module as claimed in claim 1 is characterized in that, described radiating module is the heat dissipation metal chip architecture.
8, the cooling system of heating module as claimed in claim 1 is characterized in that, also comprises the side panel that is arranged on described circuit board both sides.
9, the cooling system of heating module as claimed in claim 8 is characterized in that, has the clamping structure and the securing member that described side panel can be embedded described sandwich between described side panel and described sandwich.
10, the cooling system of heating module as claimed in claim 1 is characterized in that, two described radiating modules are ground connection all.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910196471A CN101668410A (en) | 2009-09-25 | 2009-09-25 | Heat dissipation system of heating modules |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910196471A CN101668410A (en) | 2009-09-25 | 2009-09-25 | Heat dissipation system of heating modules |
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| CN101668410A true CN101668410A (en) | 2010-03-10 |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102612300A (en) * | 2012-02-23 | 2012-07-25 | 华为技术有限公司 | Remote radio head module and method for assembling the same, base station and communication system |
| CN105228416A (en) * | 2015-10-19 | 2016-01-06 | 吴江市莘塔前进五金厂 | A kind of electronic devices and components radiator structure |
| CN106469693A (en) * | 2015-08-21 | 2017-03-01 | 冯文标 | High power semi-conductor and the package assembly of radiator |
| CN108702859A (en) * | 2016-02-26 | 2018-10-23 | 三星电子株式会社 | Electronic equipment including cooling structure |
| CN109714426A (en) * | 2019-01-09 | 2019-05-03 | 田凤香 | Network program automatic downloading method |
| CN113615325A (en) * | 2019-03-19 | 2021-11-05 | 思科技术公司 | Closed loop hybrid cooling |
-
2009
- 2009-09-25 CN CN200910196471A patent/CN101668410A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102612300A (en) * | 2012-02-23 | 2012-07-25 | 华为技术有限公司 | Remote radio head module and method for assembling the same, base station and communication system |
| CN102612300B (en) * | 2012-02-23 | 2015-07-29 | 华为技术有限公司 | A kind of radio frequency remoto module and assemble method, base station and communication system |
| CN106469693A (en) * | 2015-08-21 | 2017-03-01 | 冯文标 | High power semi-conductor and the package assembly of radiator |
| CN105228416A (en) * | 2015-10-19 | 2016-01-06 | 吴江市莘塔前进五金厂 | A kind of electronic devices and components radiator structure |
| CN108702859A (en) * | 2016-02-26 | 2018-10-23 | 三星电子株式会社 | Electronic equipment including cooling structure |
| US10699985B2 (en) | 2016-02-26 | 2020-06-30 | Samsung Electronics Co., Ltd. | Electronic device including cooling structure |
| US10957620B2 (en) | 2016-02-26 | 2021-03-23 | Samsung Electronics Co., Ltd. | Electronic device including cooling structure |
| CN109714426A (en) * | 2019-01-09 | 2019-05-03 | 田凤香 | Network program automatic downloading method |
| CN113615325A (en) * | 2019-03-19 | 2021-11-05 | 思科技术公司 | Closed loop hybrid cooling |
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Open date: 20100310 |