CN205491603U - Liquid cooling radiator and rack system assembly - Google Patents
Liquid cooling radiator and rack system assembly Download PDFInfo
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- CN205491603U CN205491603U CN201620059916.9U CN201620059916U CN205491603U CN 205491603 U CN205491603 U CN 205491603U CN 201620059916 U CN201620059916 U CN 201620059916U CN 205491603 U CN205491603 U CN 205491603U
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- coldplate
- joint
- liquid cooling
- runner
- cooling
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Abstract
The utility model provides a liquid cooling radiator and rack system assembly relates to relevant heat dissipation such as electronic equipment, communications facilities and cooling technique field, and the liquid cooling radiator includes: the liquid cooling base plate, set up a plurality of cooling plates on the liquid cooling base plate, wherein the inside of each cooling plate is provided with the runner that is used for coolant liquid circulation, and each cooling plate is respectively including the cooling terminal surface that is used for with wait to cool off the object laminating, wherein cooling terminal surface high difference on the first direction of two at least cooling plates in a plurality of cooling plates, wherein, connect through connecting portion between the adjacent cooling plate, the runner of runner, the adjacent cooling plate of runner intercommunication in the connecting portion has been seted up to the inside of connecting portion, the first joint and the second that set up on the liquid cooling base plate connect, and first joint and second are linked together through the runner of a plurality of cooling plates and the runner of connecting portion between connecting. This scheme is suitable for the heat dissipation that the object was waited to cool off by multiple not co -altitude, effective heat dissipation soaking efficiency that improves.
Description
Technical field
This utility model relates to the relevant heat radiation such as electronic equipment, communication apparatus and cooling technology field, specifically
Relate to a kind of liquid cooling heat radiator and cabinet system assembly.
Background technology
Along with electronic equipment, the technology development of communication apparatus, the power consumption of chip is also continuously increased, especially
It is that the various chips power consumption in whole feature board all increases.The most effective by Gao Gong multiple in whole feature board
The heat of consumption chip takes away or soaking is to reduce chip temperature, becomes the key issue of restriction electronic equipment development.
In electronics, communications industry, liquid refrigeration technique is gradually taken seriously.Wherein, liquid cooling heat radiator is the cold skill of liquid
The key core part of art.Liquid cooling heat radiator refers to there is serial or parallel connection passage inside radiator, cools down liquid stream
Through radiator passage, utilize coolant circulating the heat band of high power dissipating chip in radiator passage
Walk or soaking.Common liquid cooling heat radiator bottom surface mostly is plane, and its runner is in same plane height, works as core
When sheet height is inconsistent, generally requiring employing heat conduction mud and carry out filling interface material, radiating effect is poor, is treating
When heat radiation object height is inconsistent, heat radiation and all thermal effects are bad.
Utility model content
In order to overcome the problems referred to above, this utility model provides a kind of liquid cooling heat radiator and cabinet system assembly, comes
Overcome when object height of dispelling the heat is inconsistent, the heat radiation of existing liquid cooling heat radiator and the problem that all thermal effect is bad.
In order to solve above-mentioned technical problem, this utility model adopts the following technical scheme that
On the one hand, the utility model discloses a kind of liquid cooling heat radiator, including:
Liquid cooling base；
The multiple coldplates being arranged on described liquid cooling base, being internally provided with of coldplate described in each of which
For the runner of coolant circulation, each described coldplate includes respectively for cold with what object to be cooled was fitted
But end face, the cooling end face of at least two coldplate height in a first direction in plurality of described coldplate
Different；
Wherein, being connected by connecting portion between adjacent described coldplate, the inside of described connecting portion offers stream
Road, the runner of the adjacent described coldplate of flow passage in described connecting portion；
The first joint being arranged on described liquid cooling base and the second joint, described first joint and described second
It is connected by the runner of multiple described coldplates and the runner of described connecting portion between joint.
Alternatively, described first direction is the direction perpendicular with described liquid cooling base.
Alternatively, described coldplate includes coldplate substrate and cover plate, and described coldplate substrate is provided with out
Groove, described cover plate is covered on described coldplate substrate closes described fluting formation runner.
Alternatively, multiple described coldplates include the first coldplate and the second coldplate, described first cooling
Fluting on plate and described second coldplate is towards contrary both direction.
Alternatively, described liquid cooling base, described coldplate substrate and described connecting portion are formed in one.
Alternatively, described cover plate is weldingly fixed on described coldplate substrate.
Alternatively, described coldplate quantity is two.
On the other hand, the invention also discloses a kind of cabinet system assembly, cold including liquid as above
Radiator, and rack；
The 3rd joint for connecting inlet channel it is provided with on described rack, and for connecting outlet conduit
4th joint, described 3rd joint is connected with described first joint, and described 4th joint connects with described second
Head is connected.
Alternatively, described cabinet system assembly also includes: the multiple single board systems being positioned in described rack,
Described liquid cooling heat radiator and multiple chip are installed on each described single board system, each of which chip respectively with
The cooling end face of coldplate described in is fitted and connected.
Alternatively, described 3rd joint and described 4th joint on described rack are multiple, and multiple institute
State the 3rd joint and multiple described 4th joint is the most arranged in parallel.
The beneficial effects of the utility model are:
Such scheme, the coldplate different by designing the height with runner on liquid cooling heat radiator, for
The most different objects to be cooled, carries out liquid-cooling heat radiation to it, is effectively improved radiating efficiency, and equal thermal effect is bright
Aobvious, flow resistance is little, is suitable for the heat radiation of multiple differing heights object to be cooled, the technical scheme of this liquid cooling heat radiator
And the equal thermal efficiency of structure integral heat sink is high, low cost, lightweight.
Accompanying drawing explanation
Fig. 1 represents liquid cooling heat radiator scheme of installation in this utility model；
Fig. 2 represents liquid cooling heat radiator front schematic view in this utility model；
Fig. 3 represents liquid cooling heat radiator schematic rear view in this utility model；
Fig. 4 represents cabinet system assembly schematic diagram in this utility model.
Reference:
1 liquid cooling base, 11 first joints, 12 second joints, 2 coldplates, 21 coldplate substrates, 22
Cover plate, 3 racks, 31 the 3rd joints, 32 the 4th joints, 4 single board systems, 5 chips.
Detailed description of the invention
It is more fully described the exemplary embodiment of the disclosure below with reference to accompanying drawings.Although accompanying drawing shows
The exemplary embodiment of the disclosure, it being understood, however, that may be realized in various forms the disclosure and should be by
Embodiments set forth here is limited.On the contrary, it is provided that these embodiments are able to be best understood from this
Open, and complete for the scope of the present disclosure can be conveyed to those skilled in the art.
As it is shown in figure 1, this utility model provides a kind of liquid cooling heat radiator, including: liquid cooling base 1；If
Being placed in the multiple coldplates 2 on described liquid cooling base 1, described in each of which, coldplate 2 is internally provided with
For the runner of coolant circulation, each described coldplate 2 includes respectively for fitting with object to be cooled
Cooling end face, in plurality of described coldplate 2, the cooling end face of at least two coldplate 2 is in a first direction
Upper height is different；Wherein, connected by connecting portion between adjacent described coldplate 2, described connecting portion interior
Portion offers runner, the runner of the adjacent described coldplate 2 of flow passage in described connecting portion；It is arranged at institute
State the first joint 11 and the second joint 12 on liquid cooling base 1, described first joint 11 and described second
It is connected by multiple runners of described coldplate 2 and the runner of described connecting portion between joint 12.
Specifically, in above-mentioned liquid cooling heat radiator, object to be cooled is specifically as follows chip, liquid cooling base 1
On multiple coldplates 2 at least two there is different height, this can be highly relative to install carry
For the mounting plane of body, it is also possible to be relative to the concrete height of the binding face of object to be cooled for,
Wherein, the connecting portion connection of runner, the stream in coldplate 2 are offered between adjacent coldplate 2 by inside
Road connects also by the runner in this connecting portion and finally forms what entirety was mutually communicated on liquid cooling base 1
Runner, the runner layout of different levels is internal to reach equal thermal effect at liquid cooling base 1, and reduces system stream
Resistance, not only makes coolant flow, also at vertical direction stream at coldplate 2 in-plane of liquid cooling heat radiator
Dynamic, this kind of flowing can play turbulent flow effect to greatest extent, and wherein, the runner in this connecting portion can be perpendicular
Straight channel, couples together the runner in the coldplate 2 of differing heights, in order to coolant is at liquid-cooling heat radiation
Flow circuit in device, specifically, above-mentioned first direction is the direction perpendicular with liquid cooling base 1, coldplate
2 relative altitudes to each other on this direction perpendicular from liquid cooling base 1 are different, and then at liquid cooling base
Coldplate 2 and the runner of different levels is formed on 1.
During specifically used, the coldplate 2 of this different height is for the most different on single board system
Chip, coordinates and is arranged on the support carrier of chip, it is possible to for the chip that height is different, it is carried out liquid cold
Heat radiation, is effectively improved radiating efficiency, and equal thermal effect is obvious, and flow resistance is little, is suitable for multiple differing heights chip
Heat radiation, wherein, the runner related in this utility model all can design difformity according to demand, and this liquid is cold
The advantages such as it is high that the technical scheme of radiator and structure have the equal thermal efficiency of heat radiation, low cost, lightweight.
Further, as shown in Figure 2 and Figure 3, described coldplate 2 includes coldplate substrate 21 and cover plate
22, described coldplate substrate 21 is provided with fluting, described cover plate 22 is covered on described coldplate substrate
To close described fluting formation runner on 21.
Here, coldplate 2 includes coldplate substrate 21 and cover plate 22, coldplate 2 be internally provided with use
In the runner of coolant circulation, the concrete composition of this runner within coldplate 2 can be to be covered by cover plate 22
It is located on the fluting of coldplate substrate 21, forms airtight flow channel space, flow through for liquid, the shape of this fluting
Becoming can be specifically that milling forms on coldplate substrate 21, designs cover plate 22 at correspondence fluting, will lid
Plate 22 seals lid and is located on coldplate substrate 21, forms runner, by liquid in level and vertical direction
Flowing, increase turbulent flow, strengthen heat transfer effect, and make coldplate 2 be directly applied for the core of differing heights
Sheet.Specifically, cover plate 22 is weldingly fixed on described coldplate substrate 21, and this welding manner is the most permissible
For vacuum brazing, agitating friction welds, also or be direct gluing connection；Coldplate substrate 21 and cover plate 22
Can be that copper material can also be for aluminium material, both closely weld together.
Further, multiple described coldplates 2 include the first coldplate and the second coldplate, described
Fluting on one coldplate and described second coldplate is towards contrary both direction.For needs of production,
The different flutings on coldplate 2 is oriented contrary direction.Cover plate 22 now when concrete welding,
Can be by towards upper and towards under runner fluting on respectively with cover plate by holder, and from two-sided
Weld simultaneously, form the runner that separation is different.And by connecting between the different runner of this separation
The runner in portion is connected, it is ensured that liquid flows at three-dimensional planar.Specifically, the runner of connecting portion can be perpendicular
Nogata to runner, vertical with coldplate 2 plane upper runner.
Correspondingly, liquid cooling base 1, coldplate substrate 21 and described connecting portion are formed in one, the cold base of liquid
Plate 1, connecting portion are all the part on coldplate substrate 21；Liquid cooling base 1 and cover plate 22 now can
Thinking that copper material can also be for aluminium material, both closely weld together.Preferably, this coldplate 2 quantity
It it is two.
As shown in Figure 4, this utility model additionally provides a kind of cabinet system assembly, including liquid as above
Cold heat sink, and rack 3；The 3rd joint 31 for connecting inlet channel it is provided with on described rack 3,
And for connecting the 4th joint 32 of outlet conduit, described 3rd joint 31 and described first joint 11 phase
Connection, described 4th joint 32 is connected with described second joint 12.
Specifically, inlet channel and outlet conduit can be provided in rack 3 both sides, and inlet channel is provided with
3rd joint 31, outlet conduit is provided with the 4th joint 32, and the 3rd joint 31 is connected with the first joint 11,
4th joint 32 is connected with the second joint 12, thus a circulation waterway is integrally formed so that coolant energy
In enough runners being entered liquid cooling heat radiator by inlet channel, and flow out from outlet conduit, it is achieved heat sinking function.
Wherein, this first joint the 11, second joint the 12, the 3rd joint the 31, the 4th joint 32 can be blindmate joint,
It can also be non-blind connection-peg.
Further, this cabinet system assembly also includes: be positioned over the multiple single board systems in described rack 3
4, each described single board system 4 is provided with described liquid cooling heat radiator and multiple chip 5, each of which core
Sheet 5 cooling end face with coldplate described in one 2 respectively is fitted and connected.
Wherein, rack 3 is placed with single board system 4, single board system 4 is provided with multiple chip 5, should
The height of multiple chips 5 is incomplete same, and liquid cooling heat radiator is fixedly mounted on single board system 4, and liquid is cold to be dissipated
After hot device installation the most different according to chip 5 at vertical direction, differing heights aspect coldplate can be divided into,
The cooling end face of the coldplate that its camber is relatively low fits tightly, highly with low clearance chip on single board system 4
The cooling end face of higher coldplate fits tightly with high altitude chip on single board system 4.Liquid cooling heat radiator
Coldplate 2 is directly in close contact with chip 5 or other electronic equipments, contact gap employing high-efficiency heat conduction interface
Its heat transfer characteristic of Material reinforcement, strengthens radiating effect.Herein, this colling end mask body can be with on chip
The lower surface of the coldplate 2 that end face is corresponding.
Further, described 3rd joint 31 and described 4th joint 32 on described rack 3 are multiple,
And multiple described 3rd joints 31 and multiple described 4th joint 32 the most arranged in parallel.Due to multiple
Single board system 4 is placed for horizontal parallel in rack 3, multiple 3rd joints 31 and multiple 4th joint 32
The most arranged in parallel be easy to single board system 4 on install liquid cooling heat radiator on the first joint 11 and
Second joint 12 connects, easy for installation.
Although have been described for the preferred embodiment of this utility model embodiment, but those skilled in the art one
Denier knows basic creative concept, then these embodiments can be made other change and amendment.So,
Claims are intended to be construed to include preferred embodiment and fall into this utility model scope of embodiments
All changes and amendment.
Finally, in addition it is also necessary to explanation, in this article, the relational terms of such as first and second or the like is only
Only be used for by an entity or operation separate with another entity or operating space, and not necessarily require or
Imply relation or the order that there is any this reality between these entities or operation.And, term " bag
Include ", " comprising " or its any other variant be intended to comprising of nonexcludability, so that include one
The process of list of elements, method, article or terminal unit not only include those key elements, but also include not
There are other key elements being expressly recited, or also include for this process, method, article or terminal unit
Intrinsic key element.In the case of there is no more restriction, by wanting that statement " including ... " limits
Element, it is not excluded that there is also additionally in including the process of described key element, method, article or terminal unit
Identical element.
Above-described is preferred implementation of the present utility model, it should be pointed out that general for the art
For logical personnel, some improvement and profit can also be made under without departing from principle premise described in the utility model
Decorations, these improvements and modifications are also in protection domain of the present utility model.
Claims (10)
1. a liquid cooling heat radiator, it is characterised in that including:
Liquid cooling base (1)；
The multiple coldplates (2) being arranged on described liquid cooling base (1), coldplate (2) described in each of which
Be internally provided with for coolant circulation runner, each described coldplate (2) include respectively for
The cooling end face of object to be cooled laminating, at least two coldplate (2) in plurality of described coldplate (2)
Cooling end face the most different；
Wherein, being connected by connecting portion between adjacent described coldplate (2), the inside of described connecting portion is opened
It is provided with runner, the runner of the adjacent described coldplate of the flow passage (2) in described connecting portion；
The first joint (11) being arranged on described liquid cooling base (1) and the second joint (12), described
Between one joint (11) and described second joint (12) by the runner of multiple described coldplates (2) and
The runner of described connecting portion is connected.
Liquid cooling heat radiator the most according to claim 1, it is characterised in that described first direction be with
The direction that described liquid cooling base (1) is perpendicular.
Liquid cooling heat radiator the most according to claim 1, it is characterised in that
Described coldplate (2) includes coldplate substrate (21) and cover plate (22), described coldplate substrate (21)
On be provided with fluting, described cover plate (22) is covered on that described coldplate substrate (21) is upper closes described fluting
Form runner.
Liquid cooling heat radiator the most according to claim 3, it is characterised in that
Multiple described coldplates (2) include the first coldplate and the second coldplate, described first coldplate
With the fluting on described second coldplate towards contrary both direction.
Liquid cooling heat radiator the most according to claim 3, it is characterised in that
Described liquid cooling base (1), described coldplate substrate (21) and described connecting portion are formed in one.
Liquid cooling heat radiator the most according to claim 3, it is characterised in that described cover plate (22) welds
Connect and be fixed on described coldplate substrate (21).
Liquid cooling heat radiator the most according to claim 1, it is characterised in that described coldplate (2) number
Amount is two.
8. a cabinet system assembly, it is characterised in that include the liquid as described in any one of claim 1-7
Cold heat sink, and rack (3)；
It is provided with the 3rd joint (31) for connecting inlet channel on described rack (3), and is used for connecting
4th joint (32) of outlet conduit, described 3rd joint (31) is connected with described first joint (11)
Logical, described 4th joint (32) is connected with described second joint (12).
Cabinet system assembly the most according to claim 8, it is characterised in that described cabinet system is total
Become also to include: the multiple single board systems (4) being positioned in described rack (3), each described single board system
(4) being provided with described liquid cooling heat radiator and multiple chip on, each of which chip cools down with described in one respectively
The cooling end face of plate (2) is fitted and connected.
Cabinet system assembly the most according to claim 9, it is characterised in that described rack (3)
On described 3rd joint (31) and described 4th joint (32) be multiple, and the multiple described 3rd connects
Head (31) and multiple described 4th joint (32) are the most arranged in parallel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620059916.9U CN205491603U (en) | 2016-01-21 | 2016-01-21 | Liquid cooling radiator and rack system assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620059916.9U CN205491603U (en) | 2016-01-21 | 2016-01-21 | Liquid cooling radiator and rack system assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205491603U true CN205491603U (en) | 2016-08-17 |
Family
ID=56638252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620059916.9U Active CN205491603U (en) | 2016-01-21 | 2016-01-21 | Liquid cooling radiator and rack system assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205491603U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111587045A (en) * | 2020-05-28 | 2020-08-25 | 北京无线电测量研究所 | Liquid cooling circulating device for airborne radar |
-
2016
- 2016-01-21 CN CN201620059916.9U patent/CN205491603U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111587045A (en) * | 2020-05-28 | 2020-08-25 | 北京无线电测量研究所 | Liquid cooling circulating device for airborne radar |
| CN111587045B (en) * | 2020-05-28 | 2022-08-30 | 北京无线电测量研究所 | Liquid cooling circulating device for airborne radar |
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|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |