CN208093548U - Liquid-cooling heat radiator - Google Patents
Liquid-cooling heat radiator Download PDFInfo
- Publication number
- CN208093548U CN208093548U CN201820635875.2U CN201820635875U CN208093548U CN 208093548 U CN208093548 U CN 208093548U CN 201820635875 U CN201820635875 U CN 201820635875U CN 208093548 U CN208093548 U CN 208093548U
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- China
- Prior art keywords
- liquid
- fin
- cover board
- substrate
- brazing sheet
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of liquid-cooling heat radiators, including cover board and substrate, diversion trench is offered between cover board and substrate, brazing sheet is additionally provided between cover board and substrate, several fins and lower brazing sheet, upper brazing sheet is arranged in the upper surface of fin, lower brazing sheet is arranged in the lower surface of fin, cover board passes through upper brazing sheet, lower brazing sheet and fin and substrate are integrally welded, several grooves being used for for cooling liquid communication and make cooling liquid generation flow-disturbing are offered on fin, groove is connected to diversion trench, fluid passage entrance and liquid channel outlet are offered on cover board, and entrance mouth and outlet mouth is respectively set in its outer surface corresponding position, fluid passage entrance, liquid channel outlet, groove is connected to the diversion trench, form the channel for cooling liquid communication.The utility model diversion trench logical by being designed for cooled liquid stream, effectively enhances heat dissipation area and eddy current effect, reduces radiation energy consumption, radiating efficiency is substantially improved.
Description
Technical field
The utility model is related to heat sink technology fields, more particularly to one kind being suitable for high-power IGBT semiconductor and electric power
The liquid-cooling heat radiator of electronic power components.
Background technology
Modern power electronics devices further increase the requirements such as reliability requirement, performance indicator, power density, electric power electricity
The thermal design of sub- equipment is also more and more important.IGBT device is the Primary Component in rail traffic, new energy electric power electronic equipment,
The quality of its working condition directly affects whole aircraft reliability, safety and service life, and the heat dissipation of IGBT device is heavy to closing
It wants.
Current IGBT components will produce conducting and switching loss at work, it is therefore desirable to which the cooling equipment of installation carries out
Heat dissipation, to reduce the junction temperature of power device, it is ensured that IGBT components normal, reliability service at the allowed temperature.IGBT devices at present
The type of cooling of part mainly has air-cooled, liquid cooling and heat pipe etc., right with further increasing for device performance requirements and power density
Cooling requirements are also more and more harsh.Consider from reliability, the general liquid cooling heat radiator for selecting radiating efficiency high to power device into
Row cooling, since the big power consumption of small flow becomes a kind of trend, and conventional straight channel structure is difficult to realize high power density cooling
It is required that needing using reinforcing heat dissipation technology.
Traditional liquid cooling heat radiator is to be fixed on one by opening straight trough on liquid cooling base, then by liquid cooling cover board and substrate
It rises, electronic device is installed in cover board face.It can be seen that existing liquid cooling plate runner is simple, water is cooling on single layer same plane, thermal diffusivity
Energy is low, security risks are high.
Utility model content
The purpose of the utility model is to overcome the deficiencies in the prior art, provide a kind of liquid-cooling heat radiator, solve rail
Road traffic, new energy, power grid, power electronic equipment prior art liquid cooling system can not adapt to IGBT in existing power electronic equipment
Element power increases the problem of fever.
In order to solve the above technical problems, technical solution provided by the utility model is:
A kind of liquid-cooling heat radiator, including cover board and substrate are offered between cover board and substrate for for cooling liquid
The diversion trench of circulation is additionally provided with brazing sheet, several fins and lower brazing sheet, upper brazing sheet between the cover board and substrate
It is arranged in the upper surface of the fin, the lower brazing sheet is arranged in the lower surface of the fin, and cover board passes through the upper soldering
Plate, lower brazing sheet and the fin and substrate are integrally welded, are offered on the fin several for supplying the cooling liquid
The groove for circulating and cooling liquid being made to generate flow-disturbing, groove are connected to the diversion trench, and fluid passage is offered on the cover board
Entrance and liquid channel outlet, and entrance mouth and outlet mouth is respectively set in its outer surface corresponding position, the fluid passage enters
Mouth, the liquid channel outlet, the groove are connected to the diversion trench, form the channel led to for the cooled liquid stream.
Further, the groove intersects, communicates with each other, make the cooled liquid stream excessively the fin when along S types
Path flows, rather than along streamlined flow.
Further, the protrusion of multiple Heterogeneous Permutations, the gap shape between the adjacent protrusion are fixed on the fin
At the groove.
Further, the cover board is fitted in the protrusion and is above formed with the groove and led to for what the cooled liquid stream was led to
Road.
Further, the protrusion is one or more in diamond shape, parallelogram, and the corner of the protrusion is done
Chamfered does not do chamfered.
Further, the number of the fin needs to increase or decrease according to heat dissipation.
Further, open up fluted on the substrate, the fin is fixedly mounted in the groove.
Further, the fin intersects processing or die sinking molding using metal saw, and the relatively described cover board and substrate are only
Vertical processing.
Further, the upper brazing sheet has one piece, and shape and size are identical as the cover board and substrate, is used for institute
It states cover board and substrate welds together, and form confined space;There are four the lower brazing sheets, shape and size and fin phase
Together.
The beneficial effects of the utility model:
(1) liquid-cooling heat radiator of the utility model, the diversion trench logical by being designed for cooled liquid stream, effectively
Enhance heat dissipation area and eddy current effect, reduces radiation energy consumption, the radiating efficiency of high-power electronic component is substantially improved;
(2) liquid-cooling heat radiator of the utility model, the number of fins inside cover board can be with according to IGBT device heat source
Number is put into corresponding number of fins, and heat source module is versatile and can standardize, it can be achieved that multiple high-power IGBT devices
Heat dissipation;
(3) processing method of the liquid-cooling heat radiator of the utility model, by substrate and fin separate type fabrication design,
Fin is separately machined, and technique intersects processing using metal saw or die sinking molding, processing cost are very low;
(4) a kind of processing method of liquid-cooling heat radiator of the utility model, cover board, fin, substrate welding assembly are at one
Body, the simple cost bottom of processing technology, and the safety of single unit system can be improved.
Description of the drawings
Fig. 1 is the structural decomposition diagram of one preferred embodiment of the utility model liquid-cooling heat radiator;
Fig. 2 is the overall package schematic diagram of one preferred embodiment of the utility model liquid-cooling heat radiator;
Fig. 3 is the structural schematic diagram of the fin of one preferred embodiment of the utility model, groove and protrusion.
Reference numeral includes:
Brazing sheet 003- fins on 001- cover boards 002-
Brazing sheet 005- substrates 006- outlet mouths under 004-
007- liquid channel outlet 008- entrance mouth 009- fluid passage entrances
010- groove 011- diversion trenches 012- protrusions
013- grooves
Specific implementation mode
In order to make technical problem to be solved in the utility model, technical solution and advantageous effect be more clearly understood, with
Lower combination accompanying drawings and embodiments, the present invention will be further described in detail.It should be appreciated that specific reality described herein
It applies example to be only used to explain the utility model, is not used to limit the utility model.
Embodiment 1
As depicted in figs. 1 and 2, it is a preferred embodiment of the utility model, which includes mutually detaining
The cover board 001 and substrate 005 of conjunction are offered between cover board 001 and substrate 005 for the diversion trench 011 for cooling liquid communication,
Brazing sheet 002, several fins 003 and lower brazing sheet 004, upper soldering are additionally provided between the cover board 001 and substrate 005
Plate 002 is arranged in the upper surface of the fin 003, and the lower brazing sheet 004 is arranged in the lower surface of the fin 003, cover board
001 is integrally welded by the upper brazing sheet 002, lower brazing sheet 004 and the fin 003 and substrate 005, the fin
Offer several grooves 010 for lead to and making cooling liquid to generate flow-disturbing for the cooled liquid stream on 003, groove 010 and
The diversion trench 011 is connected to, and offers fluid passage entrance 009 and liquid channel outlet 007 on the cover board 001, and at it
Entrance mouth 008 and outlet mouth 006 is respectively set in outer surface corresponding position, and the fluid passage entrance 009, the fluid passage go out
Mouth 007, the groove 010 are connected to the diversion trench 011, form the channel led to for the cooled liquid stream.The utility model
Heat dissipation area and eddy current effect are effectively enhanced, reduces radiation energy consumption, it can be achieved that the heat dissipation of multiple high-power IGBT devices, substantially carries
Rise the radiating efficiency of high-power electronic component.Above-mentioned each component part is further described in detail respectively below.
In the present embodiment, the plate that cover board 001 is rectangle, the outer surface of cover board 001 and high-power IGBT device etc. are warm
Source contacts, and cover board 001 can reduce the thermal-conduction resistance of radiator using thin-walled plate structures.But the utility model is not intended to limit lid
The concrete shape of plate 001, cover board 001 can also be according to actual needs other shapes.
Fluid passage entrance 009 and liquid channel outlet 007 are offered on cover board 001, and in its outer surface corresponding position
Entrance mouth 008 and outlet mouth 006 is respectively set.Specifically, entrance mouth 008 is connected to fluid passage entrance 009, outlet mouth 006
It is connected to liquid channel outlet 007.Cooling liquid enters the liquid cooling type radiation from entrance mouth 008 and fluid passage entrance 009 and fills
Inside is set, and the liquid-cooling heat radiator is left from liquid channel outlet 007 and outlet mouth 006.In the preferred implementation of the application
In example, cooling liquid is water, and certainly cooling liquid can also be the higher liquid of other specific heat capacities.
In the present embodiment, substrate 005 is rectangle tabular corresponding with 001 shape of cover board, size.Substrate 005 is towards lid
Plate 001 offers diversion trench 011 and groove 013 on one side, and diversion trench 011 is connected to groove 013.Diversion trench 011 is in elongated
Strip, for for cooling liquid communication.Groove 013 is for installing fin 003, it is preferable that shape, size and the wing of groove 013
Piece 003 is corresponding, and fin 003 is made just to be mounted in groove 013.
In the present embodiment, as shown in figure 3, the whole generally rectangular plate of fin 003.It is understood that the application
The shape of fin 003 is not limited, and the shape of fin 003 can be identical as substrate 005, can also be different, but the size of fin 003
Substrate 005 should be less than.
Several grooves 010 are offered on one side towards cover board 001 on fin 003, for for cooling down liquid communication and making cold
But liquid generates flow-disturbing.Groove 010 is connected to diversion trench 011, forms the channel for cooling liquid communication.
Groove 010 intersects, communicates with each other, along S type path flows when cooled liquid stream being made to cross fin 003, rather than
Along streamlined flow.In the prior art, cooling liquid is along streamlined flow, and the utility model is flowed by making cooling liquid bending,
Not only it had enhanced heat dissipation area but also had increased eddy current effect, and can make full use of cooling liquid, and quickly taken away the heat of heat source.
Towards the protrusion 012 for being fixed with multiple Heterogeneous Permutations on one side of cover board 001 on fin 003, between adjacent protrusion 012
Gap form groove 010.001 inner surface of cover board is fitted in protrusion 012 and is formed for cooling liquid communication with groove 010
Channel.
As shown in figure 3, protrusion 012 is the diamond shape of proper alignment.It is understood that the application does not limit protrusion 012
Concrete shape, protrusion 012 can also be round or triangle, parallelogram, rectangle, square, trapezoidal, pentagon etc. are more
One or more in the shape of side, protrusion 012 can also be irregular shape certainly.And the shape and structure of protrusion 012 can be done
Chamfering or processing without chamfering.
In the present embodiment, metal saw may be used and intersect processing or die sinking molding, it is separately machined to go out to offer groove 010
Fin 003, then cover board 001, fin 003 and substrate 005 are fixed together again.
Further, in order to improve the versatility of the liquid-cooling heat radiator, the number of fin 003 can be according to heat dissipation need
It increases or decreases.When production, fin 003 can be produced into same shapes and sizes, assemble liquid cooling type radiation dress
When setting, 003 quantity of corresponding fin is put into according to heat source number, heat source module is versatile and can standardize, it can be achieved that more
The heat dissipation of a high-power IGBT device.
For example, as shown in Figure 1, in the present embodiment, there are four fins 003, is arranged in sphere of movements for the elephants type, and four fins 003
It is not to be in close contact but there is gap each other.
The liquid-cooling heat radiator further includes upper brazing sheet 002 and lower brazing sheet 004, and upper brazing sheet 002 is arranged in fin
003 upper surface, lower brazing sheet 004 are arranged in the lower surface of fin 003, i.e., cover board 001, upper brazing sheet 002, fin 003, under
Brazing sheet 004 and substrate 005 stack gradually from top to bottom.Cover board 001 passes through upper brazing sheet 002, lower brazing sheet 004 and fin
003 and substrate 005 it is integrally welded, make the liquid-cooling heat radiator that there is preferable stability and leakproofness, cooling liquid is not
It can be leaked out from the liquid-cooling heat radiator.
As shown in Figure 1, in the utility model, upper brazing sheet 002 has one piece, shape and size and cover board 001 and substrate
005 is roughly the same, is mainly used for welding together cover board 001 and substrate 005, and form confined space, prevents cooling liquid
Gap exudation between cover board 001 and substrate 005.And there are four lower brazing sheets 004, shape and size are big with fin 003
It causes identical, is mainly used for fin 003 being fixed on substrate 005.
When the lower cooling liquid of temperature enters from entrance mouth 008 and fluid passage entrance 009 close to fluid passage entrance
009 diversion trench 011, again passes through groove 010, fully absorbs the heat of heat source, enters leading close to liquid channel outlet 007
Chute 011, then the liquid-cooling heat radiator is left by liquid channel outlet 007 and outlet mouth 006, cooling liquid is flowing over
Cheng Zhong carries out sufficient heat exchange with heat source, takes away the heat of heat source, to achieve the purpose that reduce heat source temperature.
Embodiment 2
Due to being passed through cooling liquid inside liquid-cooling heat radiator, cannot send out during the work time or in storing process
The phenomenon that raw coolant liquid leakage.Liquid-cooling heat radiator leakproofness in the prior art is poor, in use, may send out
The phenomenon that raw and cold but liquid leakage.
The processing method of the liquid-cooling heat radiator of the utility model, includes the following steps:
S1, cover board 001 and substrate 005 are processed.The prior art may be used and produce cover board 001 and substrate 005, this reality
It is not limited with the novel specific mode of production to cover board 001 and substrate 005.
S2, intersect processing or die sinking molding using metal saw, it is separately machined to go out to offer the fin 003 of groove 010.This
For utility model by 002 separate type fabrication design of substrate 001 and fin, fin 003 is separately machined, and technique is handed over using metal saw
Fork processing or die sinking molding, processing cost are very low.The sequencing of the utility model not conditioning step S1 and this step.
S3, the cover board 001, fin 003 and substrate 005 are sequentially overlapped, and pass through upper brazing sheet 002 and lower brazing sheet
004 welding assembly is integral.Cover board 001, fin 003, substrate 005 are by 004 welding group of upper brazing sheet 002 and lower brazing sheet
One, the simple cost bottom of processing technology are dressed up, and the safety of single unit system can be improved.
The above content is only the preferred embodiment of the utility model, for those of ordinary skill in the art, according to this reality
It, in specific embodiments and applications can be with many changes may be made, as long as these variations are without departing from this with novel thought
The design of utility model, belongs to the scope of protection of the utility model.
Claims (9)
1. a kind of liquid-cooling heat radiator, including cover board (001) and substrate (005), are opened between cover board (001) and substrate (005)
Equipped with for the diversion trench (011) for cooling liquid communication, which is characterized in that between the cover board (001) and substrate (005) also
It is provided with brazing sheet (002), several fins (003) and lower brazing sheet (004), upper brazing sheet (002) is arranged in the wing
The upper surface of piece (003), the lower brazing sheet (004) are arranged in the lower surface of the fin (003), and cover board (001) passes through institute
It is integrally welded to state brazing sheet (002), lower brazing sheet (004) and the fin (003) and substrate (005), the fin
(003) several grooves (010) for leading to and making cooling liquid to generate flow-disturbing for the cooled liquid stream, groove are offered on
(010) it is connected to the diversion trench (011), offers fluid passage entrance (009) on the cover board (001) and fluid passage goes out
Mouth (007), and entrance mouth (008) and outlet mouth (006), the fluid passage entrance is respectively set in its outer surface corresponding position
(009), the liquid channel outlet (007), the groove (010) are connected to the diversion trench (011), are formed and are supplied the cooling
The channel of liquid communication.
2. liquid-cooling heat radiator according to claim 1, which is characterized in that the groove (010) intersects, each other
Connection, make the cooled liquid stream excessively fin (003) when along S chiasma type path flows, rather than along streamlined flow.
3. liquid-cooling heat radiator according to claim 1, which is characterized in that be fixed on the fin (003) multiple
The protrusion (012) of Heterogeneous Permutation, the gap between adjacent raised (012) form the groove (010).
4. liquid-cooling heat radiator according to claim 3, which is characterized in that the cover board (001) is fitted in described convex
It rises and forms the channel led to for the cooled liquid stream with the groove (010) on (012).
5. liquid-cooling heat radiator according to claim 3, which is characterized in that the protrusion (012) is diamond shape, parallel four
It is one or more in the shape of side, and the corner of raised (012) does chamfered or does not do chamfered.
6. liquid-cooling heat radiator according to claim 1, which is characterized in that the number of the fin (003) is according to scattered
Heat needs to increase or decrease.
7. liquid-cooling heat radiator according to claim 1, which is characterized in that opened up on the substrate (005) fluted
(013), the fin (003) is fixedly mounted in the groove (013).
8. liquid-cooling heat radiator according to claim 1, which is characterized in that the fin (003) uses metal saw
Intersect processing or mold separately machined molding, the relatively described cover board (001) and substrate (005) are separately machined.
9. liquid-cooling heat radiator according to claim 1, which is characterized in that the upper brazing sheet (002) has one piece, uses
Weld together in by the cover board (001), raised (012) and substrate (005), and forms confined space;The lower brazing sheet
(004) there are four, for the fin (003) and substrate (005) to be welded together.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201820635875.2U CN208093548U (en) | 2018-04-28 | 2018-04-28 | Liquid-cooling heat radiator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201820635875.2U CN208093548U (en) | 2018-04-28 | 2018-04-28 | Liquid-cooling heat radiator |
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Publication Number | Publication Date |
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CN208093548U true CN208093548U (en) | 2018-11-13 |
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CN201820635875.2U Expired - Fee Related CN208093548U (en) | 2018-04-28 | 2018-04-28 | Liquid-cooling heat radiator |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110416172A (en) * | 2018-04-28 | 2019-11-05 | 深圳市智通电子有限公司 | Liquid-cooling heat radiator and its processing method |
CN110610910A (en) * | 2019-09-16 | 2019-12-24 | 安徽祥博传热科技有限公司 | Turbulent flow type liquid cooling heat dissipation device and processing method thereof |
CN110610912A (en) * | 2019-10-15 | 2019-12-24 | 安徽祥博传热科技有限公司 | Liquid cooling heat dissipation device for copper aluminum pipe and machining method thereof |
CN111081659A (en) * | 2019-11-01 | 2020-04-28 | 锐捷网络股份有限公司 | Chip heat dissipation device and method |
-
2018
- 2018-04-28 CN CN201820635875.2U patent/CN208093548U/en not_active Expired - Fee Related
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110416172A (en) * | 2018-04-28 | 2019-11-05 | 深圳市智通电子有限公司 | Liquid-cooling heat radiator and its processing method |
CN110610910A (en) * | 2019-09-16 | 2019-12-24 | 安徽祥博传热科技有限公司 | Turbulent flow type liquid cooling heat dissipation device and processing method thereof |
CN110610910B (en) * | 2019-09-16 | 2024-04-05 | 安徽祥博传热科技有限公司 | Machining method of turbulent flow type liquid cooling heat dissipation device |
CN110610912A (en) * | 2019-10-15 | 2019-12-24 | 安徽祥博传热科技有限公司 | Liquid cooling heat dissipation device for copper aluminum pipe and machining method thereof |
CN110610912B (en) * | 2019-10-15 | 2024-09-10 | 安徽祥博传热科技有限公司 | Processing method of copper aluminum pipe liquid cooling heat dissipation device |
CN111081659A (en) * | 2019-11-01 | 2020-04-28 | 锐捷网络股份有限公司 | Chip heat dissipation device and method |
CN111081659B (en) * | 2019-11-01 | 2022-04-26 | 锐捷网络股份有限公司 | Chip heat dissipation device and method |
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Granted publication date: 20181113 Termination date: 20200428 |