CN201994284U - Cooling device and power module - Google Patents

Abstract

The utility model discloses a cooling device, which comprises a cooling bottom plate and a flow splitting device which is arranged below the cooling bottom plate for changing the flow direction of cooling liquid, wherein the flow splitting device comprises a top layer and a bottom layer; a plurality of inlets, a plurality of outlets and partition walls are distributed on the top layer; a flow passage of the cooling liquid is defined by the partition walls; the bottom layer comprises a cooling liquid flow-in region, a cooling liquid flow-out region and a barrier plate; the inlets are formed at the cooling liquid flow-in region; the outlets are formed at the cooling liquid flow-out region; the barrier plate is used for separating the flow-in region from the flow-out region; the flow passage is provided with a turn for changing the flow direction of the liquid; the partition wall at the turn of the flow passage is cambered. The utility model also discloses a power module. The partition wall at the turn of the flow passage is cambered, and bumping positions at the junctions of the cooling liquid and the partition walls are staggered away from one another along the flow direction of the cooling liquid, so that eddy flow can be suppressed and increase in pressure loss due to bumping at the junctions of the cooling liquid and the partition walls can be reduced to achieve better cooling performance.

Description

A cooling device and a power module

technical field

The utility model belongs to the heat dissipation application field of semiconductor modules, in particular to a heat dissipation device and a power module.

Background technique

Semiconductor devices generate heat during their operation, and the heat usually deteriorates the operating conditions of the semiconductor devices. For power semiconductor devices, it must be cooled during operation to maintain acceptable performance of the device, and high power semiconductors are often liquid cooled.

High-power applications such as hybrid vehicles, wind power, solar power, and standard industrial drives place higher demands on long-term reliability, high power density, excellent heat dissipation, and electrical robustness of power modules.

As shown in Figure 1, it is a traditional power module with a water-cooled heat dissipation device. The heat generated by the switching operation of the power device 10 passes through the first soldering layer 20, the copper-clad ceramic substrate 50 (DBC, Direct Bonded Copper), and the second soldering layer in sequence. 30. Copper base plate or AlSiC base plate 60 , thermal conductive silicone grease layer 40 , and finally transferred to the radiator 70 for heat exchange with the circulating cooling water of the radiator 70 .

And Fig. 2 is a kind of use electrode as pressure device, fix DBC substrate 50 on the heat sink. Although the heat transfer path of the module is reduced, it still needs to exchange heat with the heat sink through the thermal conductive silicone grease 40 . For power semiconductor modules using thermally conductive silicone grease, the thermal conductivity of thermally conductive silicone grease is very small, which greatly affects the heat exchange efficiency between the power semiconductor module and the radiator.

Figure 3 is a power module with a heat sink. In the figure, the DBC is connected to the heat dissipation base plate 73 through a solder layer 90. The heat sink 70 contains a columnar heat sink 74; the power module with this structure forms pin fins on the back of the heat dissipation base plate 73. (Pin-fin) structure spoiler column, the spoiler column is a columnar cooling fin 74, which can fully exchange heat with circulating cooling water and improve cooling efficiency, but the cooling method of this structure is unidirectional cooling.

Figure 4 is another power module with a radiator. 70 in the figure is a radiator, and 73 is a heat dissipation bottom plate with a pin-fin structure; there are three groups of DBC cooling water on the heat dissipation bottom plate to cool the heat dissipation bottom plate. 71 flows in and flows out from the outlet 72. The cooling water first exchanges heat with the heat transferred from the power device 10 on the first group of DBC51, then exchanges heat with the heat transferred from the power device 10 on the second group of DBC52, and finally exchanges heat with the third The heat transferred from the power devices on the group DBC53 is used for heat exchange; this results in a temperature difference on the back of the heat dissipation base plate. At T1, T2, and T3 in Figure 4, there is T3>T2>T1, which will affect the heat dissipation performance of the module.

Contents of the invention

The utility model solves the problem of poor heat dissipation performance of semiconductor power modules in the prior art, thereby providing a heat dissipation device and a power module with better heat dissipation performance.

In order to solve the above technical problems, the utility model provides the following technical solutions:

A heat dissipation device, comprising a heat dissipation bottom plate and a flow distribution device arranged under the heat dissipation bottom plate for changing the flow direction of coolant, the flow distribution device includes a top layer and a bottom layer, and a plurality of inlets, a plurality of outlets and a partition wall are distributed on the top layer , the partition wall defines the flow channel of the cooling liquid; the bottom layer includes a cooling liquid inflow area for placing a plurality of inlets, a cooling liquid outflow area for placing a plurality of outlets, and a cooling liquid for separating the inflow area and the outflow area. The blocking plate in the area; the flow channel has a turning point that changes the flow direction of the liquid; the partition wall at the turning point of the flow channel is arc-shaped.

Further, it also includes splitter fins arranged in the flow channel for disturbing the flow and increasing heat dissipation.

Preferably, protrusions are provided on the side of the partition wall at the position corresponding to the splitter in the splitter device.

Preferably, the partition wall at the position corresponding to the splitter in the splitter device has a wave shape.

Preferably, the ends of the partition wall and the splitter are smooth.

Preferably, the flow channel is S-shaped.

Preferably, the heat dissipation base plate is one of a copper base plate, an AlSiC base plate, and an aluminum base plate.

The utility model also provides another power module, which includes the above-mentioned heat dissipation device, a heat dissipation housing, and a power semiconductor arranged on the heat dissipation bottom plate; the heat dissipation housing includes a groove, a liquid inlet connected to the inlet, and an outlet The liquid outlet is connected, and the heat dissipation device is placed in the groove.

Further, a sealing ring is provided at the junction of the heat dissipation housing and the heat dissipation bottom plate.

Compared with the prior art, the utility model has the following beneficial effects: in the cooling device and the power module provided by the utility model, the turning point of the flow channel is arc-shaped, and the collision position of the intersection of the cooling liquid and the partition wall is along the direction of the cooling liquid. The flow directions of the cooling water are staggered from each other, which makes the pressure loss points scattered in the flow direction of the cooling liquid, which can suppress the generation of eddy currents in the cooling water flow channel, and can reduce the impact caused by the collision between the cooling liquid and the partition wall. The increase in pressure loss makes the heat dissipation performance better.

Description of drawings

Fig. 1 is a traditional power module with a water cooling device in the prior art.

Fig. 2 is a heat sink using electrodes as pressure devices in the prior art.

Fig. 3 is a power module with a radiator in the prior art.

Fig. 4 is another power module with a heat sink in the prior art.

Fig. 5 is a schematic diagram of the top structure of the distribution device in the first embodiment of the present invention.

Fig. 6 is a schematic diagram of the underlying structure of the distribution device in the first embodiment of the present invention.

Fig. 7 is a schematic top view of the heat dissipation housing of the embodiment of the present invention.

Fig. 8 is a schematic diagram of the top structure of the distribution device in the second embodiment of the present invention.

Fig. 9 is a schematic diagram of the top structure of the distribution device in the third embodiment of the present invention.

Fig. 10 is a schematic diagram of the top structure of the distribution device in the fourth embodiment of the present invention.

Fig. 11 is a schematic diagram of the top structure of the distribution device in the fifth embodiment of the present invention.

Fig. 12 is a schematic diagram of the structure of the splitter in the fifth embodiment of the present invention.

Detailed ways

In order to make the technical problems, technical solutions and beneficial effects solved by the utility model clearer, the utility model will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model, and are not intended to limit the utility model.

A heat dissipation device, comprising a heat dissipation bottom plate and a flow distribution device arranged under the heat dissipation bottom plate for changing the flow direction of the coolant, the flow distribution device includes a top layer and a bottom layer, as shown in Fig. 5 is the top layer of the flow distribution device in the first embodiment of the present utility model Schematic diagram of the structure, the dotted line in the figure shows the water flow direction; a plurality of inlets 101, a plurality of outlets 102 and a partition wall 103 are distributed on the top layer, and the partition wall 103 defines a cooling liquid flow channel 120, wherein, The flow channel has a turning point that changes the flow direction of the liquid; the partition wall 103 located at the turning point of the flow channel is arc-shaped. Due to the arc shape of the turning point of the flow channel, the collision positions of the intersection of the cooling liquid and the partition wall are staggered from each other along the flow direction of the cooling liquid, which makes the points where the pressure loss occurs scattered in the flow direction of the cooling liquid, which can inhibit the cooling process. The vortex is generated in the water flow channel, and the increase of pressure loss caused by the collision between the cooling liquid and the intersection of the partition wall can be reduced, so that the heat dissipation performance is better. This heat sink adopts the design of direct water-cooled heat dissipation bottom plate, which eliminates the use of thermal conductive silicone grease between the heat dissipation bottom plate and the installation interface of the heat dissipation shell, and uses an independent flow distribution device to change the flow direction of the coolant to ensure that the cooling liquid It can cool the entire heat dissipation bottom plate at the same time, and there will be no temperature difference on the back of the bottom plate. Fig. 6 is a schematic diagram of the bottom layer structure of the distribution device in the first embodiment of the utility model; the bottom layer includes a cooling liquid inflow area 105 for placing a plurality of inlets 101, a cooling liquid outflow area 106 for placing a plurality of outlets 102, and A barrier plate 104 for separating the inflow zone and the outflow zone.

In this embodiment, the end of the partition wall 103 is set as a smooth structure, preferably arc-shaped, or elliptical, so that the position where the pressure loss occurs can be dispersed in the direction of the cooling water flow, thereby reducing the Reduce the pressure loss of cooling water flow and realize smooth cooling water flow. The channel in this embodiment is S-shaped, which increases the utilization efficiency. And the heat dissipation base plate in this embodiment is one of copper base plate, AlSiC base plate and aluminum base plate.

Fig. 7 is a schematic top view of the heat dissipation housing of the embodiment of the present invention; the heat dissipation housing includes a groove 203, a liquid inlet 201 communicating with the inlet 101, and a liquid outlet 202 communicating with the outlet 102; the heat dissipation device is placed in the In the above-mentioned groove 203; After cooling liquid flows in from liquid inlet 201 like this, enters cooling liquid inflow zone 105, then directly enters inlet 101 through the bottom layer of splitter device, passes through inlet 101, and cooling liquid flows into the top layer of splitter device, in flow channel 120, until it enters the outlet 102, and flows through the outlet 102 to the cooling liquid outflow area 106 in the bottom layer of the distribution device, passes through the cooling liquid outflow area 106 and then flows out from the liquid outlet 202 to complete cooling.

Fig. 8 is a schematic diagram of the top layer structure of the distribution device in the second embodiment of the utility model; the difference between this embodiment and the embodiment in Fig. 6 is that the inlet 101 is arranged at the corner of the partition wall 103, and the outlet 102 is arranged at the partition wall 103 The dotted line in the figure is the direction of water flow.

Fig. 9 is a schematic diagram of the top layer structure of the shunt device in the third embodiment of the utility model; compared with the item in Fig. 6, a shunt plate 110 is added in this figure, in order to avoid the cooling caused by increasing the passage length between the inlet and the corresponding outlet Inhomogeneous effect, increase the width of the channel, so that a splitter for turbulence and heat dissipation is arranged in the S-shaped channel, and the splitter is arranged in the channel, and the end of the splitter is connected with the end of the partition wall Stagger in the direction of coolant flow.

The diverter plate 110 serves to increase the heat exchange area and enhance the turbulence, and reduces the cross-sectional area through which water can flow, thereby increasing the flow velocity and improving the heat exchange coefficient between water and the wall surface. And when power devices are welded on the heat dissipation bottom plate, only shunt sheets are added under the power devices, while smooth channels are still used in other parts. In the S-shaped waterway without splitters, the coolant flows relatively smoothly in the S-shaped waterway, and the liquid flow and heat exchange are not sufficient. The heat exchange performance of the S-shaped waterway with the addition of the splitter is greatly improved compared with the S-type waterway without the splitter. The ends of the splitters and the partition walls are staggered in the flow direction of the cooling water, which can suppress the generation of eddy currents and effectively reduce the pressure of the cooling water flow. Both the dividing wall 103 and the end of the splitter plate 110 are arranged in a smooth arc structure, and the positions where pressure loss occurs are dispersed in the direction of cooling water flow. Therefore, the pressure loss of the cooling water flow can be reduced, and a smooth cooling water flow can be realized.

Fig. 10 is a schematic diagram of the top layer structure of the diverter device in the fourth embodiment of the present invention; smooth protrusions are provided on the side of the partition wall corresponding to the position of the diverter in the diverter device in this embodiment. Fig. 11 is a schematic diagram of the top layer structure of the splitter device in the fifth embodiment of the present invention; the partition wall in the splitter device at the position corresponding to the splitter plate is in a wave shape. The wavy structure or the smooth protruding structure is arranged so that it can block the cooling water flow on a part of the section of the cooling water passage where the cooling water has a non-uniform velocity distribution , can improve the cooling efficiency of semiconductor power devices.

The shape of the splitter can be a straight line or a misplaced columnar structure. As shown in Figure 12, the splitter structure is a misplaced columnar structure. When the splitter is cut along a plane perpendicular to the cooling water flow direction, the splitter can also have Cross-sectional shapes such as, but not limited to, herringbone, rectangle or triangle.

A power module includes the above-mentioned heat dissipation device, a heat dissipation housing, and a power semiconductor arranged on a heat dissipation bottom plate. The heat dissipation device includes a heat dissipation bottom plate and a flow distribution device arranged under the heat dissipation bottom plate for changing the flow direction of the coolant. The flow distribution device includes a top layer and a bottom layer, as shown in FIG. , the dotted line in the figure shows the water flow direction; the top layer is distributed with a plurality of inlets 101, a plurality of outlets 102 and a partition wall 103, and the partition wall 103 defines a cooling liquid flow channel 120, wherein the The flow channel has a turning point that changes the flow direction of the liquid; the partition wall located at the turning point of the flow channel is arc-shaped. The heat dissipation housing includes a groove, a liquid inlet connected to the inlet, and a liquid outlet connected to the outlet, and the heat dissipation device is placed in the groove. Due to the arc shape of the turning point of the flow channel, the collision positions of the intersection of the cooling liquid and the partition wall are staggered from each other along the flow direction of the cooling liquid, which makes the points where the pressure loss occurs scattered in the flow direction of the cooling liquid, which can inhibit the cooling process. The vortex is generated in the water flow channel, and the increase of pressure loss caused by the collision between the cooling liquid and the intersection of the partition wall can be reduced, so that the heat dissipation performance is better. This heat sink adopts the design of direct water-cooled heat dissipation bottom plate, which eliminates the use of thermal conductive silicone grease between the heat dissipation bottom plate and the installation interface of the heat dissipation shell, and uses an independent flow distribution device to change the flow direction of the coolant to ensure that the cooling liquid It can cool the entire heat dissipation bottom plate at the same time, and there will be no temperature difference on the back of the bottom plate.

In order to ensure the tightness, a sealing ring 204 is provided at the junction of the heat dissipation shell and the heat dissipation bottom plate, as shown in Figure 7; at the same time, according to the thickness of the heat dissipation bottom plate, a support area is formed to make the surface of the heat dissipation bottom plate and the surface of the heat dissipation shell flat . The support area has screw holes corresponding to the mounting positions of the heat sink. A sealing ring is provided at the junction of the heat dissipation housing and the heat dissipation bottom plate, and the static pressure is exerted on the sealing ring by fastening the heat dissipation bottom plate to the support area. The support area can be coated with waterproof sealant for a second seal. Here, the heat dissipation base plate may be a copper base plate, an AlSiC base plate, or an aluminum base plate.

The above descriptions are only preferred embodiments of the present utility model, and are not intended to limit the present utility model. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present utility model shall be included in this utility model. within the scope of protection of utility models.

Claims (10)

1. A heat dissipation device, comprising a heat dissipation base plate and a flow diverter arranged below the heat dissipation base plate for changing the flow direction of the coolant; it is characterized in that the flow diversion device includes a top layer and a bottom layer, and a plurality of inlets, A plurality of outlets and a partition wall, the partition wall defines the flow channel of the cooling liquid; the bottom layer includes a cooling liquid inflow area for placing a plurality of inlets, a cooling liquid outflow area for placing a plurality of outlets, and a cooling liquid outflow area for placing a plurality of outlets. The barrier plate separating the inflow area and the outflow area; the flow channel has a turning point for changing the flow direction of the liquid; the partition wall located at the turning point of the flow channel is arc-shaped. 2 . The heat dissipation device according to claim 1 , further comprising a splitter disposed in the flow channel for disturbing flow and increasing heat dissipation. 3 . 3 . The heat dissipation device according to claim 2 , wherein a protrusion is provided on a side of the partition wall at a position corresponding to the splitter in the flow splitter. 4 . 4 . The heat dissipation device according to claim 2 , wherein, in the flow splitting device, the partition walls corresponding to the splitter fins are in a wave shape. 5 . 5. The heat dissipation device according to any one of claims 1 to 4, characterized in that, the end portion of the partition wall is a smooth structure. 6. The heat dissipation device according to any one of claims 2 to 4, wherein the ends of the splitters are smooth. 7. The heat dissipation device according to any one of claims 1 to 4, wherein the flow channel is S-shaped. 8. The heat dissipation device according to any one of claims 1 to 4, wherein the heat dissipation base plate is one of a copper base plate, an AlSiC base plate, and an aluminum base plate. 9. A power module, characterized in that it comprises the heat dissipation device according to any one of claims 1 to 8, a heat dissipation housing, and a power semiconductor disposed on a heat dissipation bottom plate; the heat dissipation housing includes grooves, A liquid inlet communicated with the inlet and a liquid outlet communicated with the outlet, the cooling device is placed in the groove. 10 . The power module according to claim 9 , wherein a sealing ring is provided at the junction of the heat dissipation housing and the heat dissipation bottom plate. 11 .

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