CN108133920B - A cooling water channel structure suitable for Pin-Fin power semiconductor modules - Google Patents
A cooling water channel structure suitable for Pin-Fin power semiconductor modules Download PDFInfo
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- CN108133920B CN108133920B CN201810132794.5A CN201810132794A CN108133920B CN 108133920 B CN108133920 B CN 108133920B CN 201810132794 A CN201810132794 A CN 201810132794A CN 108133920 B CN108133920 B CN 108133920B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
- H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
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Abstract
The invention provides a cooling water channel structure suitable for a Pin-Fin power semiconductor module, which ensures that the whole power semiconductor module achieves a consistent cooling effect through an optimized flow channel design, and ensures the whole service life of the power semiconductor module. The power semiconductor device comprises a water channel shell, a liquid inlet cavity, a cooling cavity and a liquid outlet cavity are arranged in parallel in an inner cavity formed by the water channel shell, the liquid inlet cavity and the liquid outlet cavity are respectively arranged on two sides of a long side of the cooling cavity, the lower end parts of Pin-Fin pins at the bottom of the power semiconductor module are arranged in the cooling cavity uniformly, a liquid inlet port is formed in one end of the liquid inlet cavity, a liquid outlet port is formed in the outer wall of the liquid outlet cavity, a first guide area is formed in a connecting area of the liquid inlet port and the liquid inlet cavity, N liquid inlet guide plates are arranged behind the first guide area corresponding to the liquid flow direction, and the height area of liquid in the liquid inlet is covered by the liquid inlet guide plates in the height direction.
Description
Technical Field
The invention relates to the technical field of cooling water channel structures, in particular to a cooling water channel structure suitable for a Pin-Fin power semiconductor module.
Background
The cooling water channel of the existing Pin-Fin power semiconductor module has good cooling effect near the inlet of the flow channel, poor cooling effect near the outlet of the flow channel, and long-term unbalanced heat dissipation is not beneficial to the overall service life of the power semiconductor module.
Disclosure of Invention
In order to solve the problems, the invention provides a cooling water channel structure suitable for a Pin-Fin power semiconductor module, which ensures that the whole power semiconductor module achieves a consistent cooling effect through an optimized flow channel design, and ensures the whole service life of the power semiconductor module.
The utility model provides a be suitable for Pin-Fin power semiconductor module's cooling water course structure which characterized in that: the liquid inlet and outlet device comprises a water channel shell, a liquid inlet cavity, a cooling cavity and a liquid outlet cavity are arranged in parallel in an inner cavity formed by the water channel shell, the liquid inlet cavity and the liquid outlet cavity are respectively arranged on two sides of a long side of the cooling cavity, the lower end parts of pins at the bottom Pin-Fin of the power semiconductor module are uniformly arranged in the cooling cavity, one end of the liquid inlet cavity is provided with a liquid inlet port, the outer wall of the liquid outlet cavity is provided with a liquid outlet port, the liquid inlet port and a connecting area of the liquid inlet cavity are provided with a first guide area, the first guide area corresponds to the rear of the liquid flow direction, N liquid inlet guide plates are arranged in the height area of liquid inlet, each liquid inlet guide plate comprises a liquid surface area direction drainage part and a liquid inlet liquid outlet cavity drainage part, each liquid inlet guide plate is arranged along the width direction of the liquid inlet cavity, the liquid flowing in the width direction of the liquid inlet cavity is divided into (N+1) areas, and each liquid inlet guide plate is arranged along the length of the liquid inlet cavity and the liquid inlet cavity is divided into the liquid inlet area and the liquid inlet area (N+1) along the length of the liquid inlet cavity).
It is further characterized by:
the liquid inlet guide plate comprises M first-stage liquid inlet guide plates and (N-M) second-stage liquid inlet guide plates, the liquid surface area direction drainage part of the first-stage liquid inlet guide plate is specifically a first parallel plate which is arranged in parallel along the length direction of a liquid inlet cavity, the M adjacent first parallel plates divide liquid flowing into a width direction area of the liquid inlet cavity corresponding to the rear of a first guide area into (M+1) first areas, each first area is selectively provided with a corresponding number of second-stage liquid inlet guide plates according to the situation, and the liquid surface area direction drainage parts of the second-stage liquid inlet guide plates positioned in the same first area are distributed behind the tail end of the first parallel plate of the previous first-stage liquid inlet guide plate and are sequentially arranged;
a liquid outlet interface is arranged at the joint of the liquid outlet cavity corresponding to the same end face of the liquid inlet interface;
n liquid outlet guide plates with the same quantity as the liquid inlet guide plates are arranged in the liquid outlet cavity, each liquid outlet guide plate comprises a liquid area direction liquid outlet drainage part and a liquid outlet cavity drainage part, the liquid area direction liquid outlet drainage parts of each liquid outlet guide plate are arranged along the width direction of the liquid outlet cavity, the liquid flowing in the width direction of the liquid outlet cavity is divided into (N+1) areas, the liquid outlet cavity drainage parts of each liquid outlet are arranged along the length direction of the liquid outlet cavity, and the liquid flowing in the length direction of the liquid inlet cavity is divided into (N+1) areas;
preferably, the liquid outlet guide plates comprise M primary liquid outlet guide plates and (N-M) secondary liquid outlet guide plates, and the arrangement positions of the liquid outlet guide plates and the positions of the corresponding liquid inlet guide plates are symmetrically arranged about the central axis of the cooling cavity in the width direction, so that smooth and uniform water flow of the whole cooling water channel is ensured;
the transition part between the liquid area direction drainage part of each liquid inlet guide plate and the liquid inlet liquid cavity drainage part is in arc transition;
the transition part between the liquid outlet drainage part in the liquid surface area direction of each liquid outlet guide plate and the liquid outlet cavity drainage part is in arc transition;
the connecting area of the liquid outlet interface and the liquid outlet cavity is provided with a second guiding area, and N liquid outlet guide plates are arranged in front of the second guiding area corresponding to the liquid flow direction;
the outlet position of the first guide area corresponding to the liquid inlet interface is a hemispherical surface or an arc surface, and the position of the second guide area corresponding to the liquid outlet interface is a hemispherical surface or an arc surface, so that smooth water flow is ensured;
the joint of the adjacent long side and short side of the water channel shell is in arc transition, so that smooth water flow is ensured;
the pressure of the water flow flowing out of the outlet end of the liquid inlet interface ensures that the water flows into the corresponding (n+1) areas uniformly;
preferably, the volumes and the sizes of the liquid inlet cavity and the liquid outlet cavity are the same, and the two cavities can be replaced.
After the structure of the invention is adopted, as the liquid inlet cavity and the liquid outlet cavity are respectively arranged at the two sides of the long side of the cooling cavity, the first guide area is provided with N liquid inlet guide plates corresponding to the rear part of the liquid flow direction, the liquid inlet guide plates are arranged in the height direction of the liquid, each liquid inlet guide plate comprises a liquid surface area direction drainage part and a liquid inlet liquid cavity drainage part, the liquid surface area direction drainage parts of each liquid inlet guide plate are arranged along the width direction of the liquid inlet cavity, the liquid flowing in the width direction of the liquid inlet cavity is divided into (N+1) areas, the liquid flowing in the length direction of the liquid inlet cavity is divided into (N+1) areas, the side parts of the liquid inlet cavity and the liquid outlet cavity are open areas, so that the cooling liquid entering the cooling cavity is divided into (N+1) corresponding cooling liquids, and then enters the cooling cavity to cool the power semiconductor module respectively, the cooling liquid flowing from the Fin-cooling cavity is led to flow out from the semiconductor module through the whole design of the semiconductor channel, the service life of the semiconductor power semiconductor module is guaranteed, and the service life of the semiconductor power semiconductor module is guaranteed to be consistent.
Drawings
FIG. 1 is a schematic top view of the present invention;
FIG. 2 is a schematic perspective view of the present invention;
fig. 3 is a schematic diagram of a front view structure of a power semiconductor module mounted in the invention;
the names corresponding to the serial numbers in the figures are as follows:
the liquid inlet and outlet guide plate comprises a water channel shell 1, a liquid inlet cavity 2, a cooling cavity 3, a liquid outlet cavity 4, a power semiconductor module 5, pin-Fin pins 6, a liquid inlet interface 7, a liquid outlet interface 8, a first guide area 9, a liquid inlet guide plate 10, a liquid area direction drainage part 11, a liquid inlet liquid outlet cavity drainage part 12, a primary liquid inlet guide plate 13, a secondary liquid inlet guide plate 14, a first area 15, a liquid outlet guide plate 16, a liquid area direction liquid outlet drainage part 17, a liquid outlet cavity drainage part 18, a primary liquid outlet guide plate 19, a secondary liquid outlet guide plate 20 and a second guide area 21.
Detailed Description
A cooling water channel structure suitable for Pin-Fin power semiconductor module is shown in figures 1-3: the liquid inlet and outlet device comprises a water channel shell 1, a liquid inlet cavity 2, a cooling cavity 3 and a liquid outlet cavity 4 are arranged in parallel in an inner cavity formed by the water channel shell 1, the liquid inlet cavity 2 and the liquid outlet cavity 4 are respectively arranged on two sides of the long side of the cooling cavity 3, the lower end parts of pins 6 at the bottom Pin-Fin of a power semiconductor module 5 are uniformly arranged in the cooling cavity 3, a liquid inlet port 7 is arranged at one end of the liquid inlet cavity 3, a liquid outlet port 8 is arranged on the outer wall of the liquid outlet cavity 4, a first guide area 9 is arranged in a connecting area of the liquid inlet port 7 and the liquid inlet cavity 2, the first guide area 9 corresponds to the rear part of the liquid flow direction, N liquid inlet guide plates are arranged, the height area of liquid inlet is covered by the liquid inlet guide plates 10, each liquid inlet guide plate comprises a liquid area direction drainage part 11 and a liquid inlet liquid outlet cavity drainage part 12, the liquid inlet liquid area direction drainage part 11 of each liquid inlet guide plate 10 is arranged along the width direction of the liquid inlet cavity 2, the liquid flowing in the width direction of the liquid inlet cavity 2 is divided into (N+1) areas, the liquid flowing in the width direction of the liquid inlet cavity 2 is divided into the liquid inlet area and the liquid inlet area 2 and the liquid inlet area is divided into the liquid inlet area and the liquid inlet area 2 and the liquid outlet area 2 corresponds to the length of the liquid inlet area 2.
The liquid inlet guide plate 10 comprises M first-stage liquid inlet guide plates 13 and (N-M) second-stage liquid inlet guide plates 14, the liquid surface area direction drainage part 11 of the first-stage liquid inlet guide plates 13 is specifically first parallel plates which are arranged in parallel along the length direction of the liquid inlet cavity, the liquid flowing in the width direction area of the liquid inlet cavity 2 corresponding to the rear of the first guide area is divided into (M+1) first areas 15 by the M adjacent first parallel plates, each first area 15 is selectively provided with a corresponding number of second-stage liquid inlet guide plates 14 according to the situation, and the liquid surface area direction drainage parts 11 of the second-stage liquid inlet guide plates 14 positioned in the same first area 15 are arranged behind the tail ends of the first parallel plates of the previous first-stage liquid inlet guide plates 13 and are sequentially arranged;
the liquid outlet port 8 is arranged at the joint of the liquid outlet cavity 4 corresponding to the same end face of the liquid inlet port 7;
n liquid outlet guide plates 16 with the same number as the liquid inlet guide plates are arranged in the liquid outlet cavity 4, each liquid outlet guide plate 16 comprises a liquid area direction liquid outlet drainage part 17 and a liquid outlet cavity drainage part 18, the liquid area direction liquid outlet drainage parts 17 of each liquid outlet guide plate 16 are arranged along the width direction of the liquid outlet cavity 4, the liquid flowing in the width direction of the liquid outlet cavity 4 is divided into (N+1) areas, each liquid outlet cavity drainage part 18 is arranged along the length direction of the liquid outlet cavity 4, and the liquid flowing in the length direction of the liquid inlet cavity 4 is divided into (N+1) areas;
preferably, the liquid outlet guide plate 16 comprises M primary liquid outlet guide plates 19 and (N-M) secondary liquid outlet guide plates 20, and the arrangement positions of the liquid outlet guide plates 16 and the positions of the corresponding liquid inlet guide plates 10 are symmetrically arranged about the central axis of the cooling cavity 3 in the width direction, so that smooth and uniform water flow of the whole cooling water channel is ensured;
the transition part between the liquid area direction drainage part 11 of each liquid inlet guide plate 10 and the liquid inlet liquid cavity drainage part 12 is arc transition;
the transition part between the liquid surface area direction liquid outlet drainage part 17 and the liquid outflow liquid cavity drainage part 18 of each liquid outlet guide plate 16 is in arc transition;
the joint of the adjacent long side and short side of the water channel shell 1 is in arc transition, so that smooth water flow is ensured;
the connecting area of the liquid outlet port 8 and the liquid outlet cavity 4 is provided with a second guiding area 21, and N liquid outlet guide plates 16 are arranged in front of the second guiding area 21 corresponding to the liquid flow direction;
the position of the first guiding area 9 corresponding to the outlet of the liquid inlet interface 7 is a hemispherical surface or an arc surface, the position of the second guiding area 21 corresponding to the liquid outlet interface 8 is a hemispherical surface or an arc surface, ensuring smooth water flow,
the pressure of the water flow flowing out of the outlet end of the liquid inlet interface 7 ensures that the water flows into the corresponding (n+1) areas uniformly;
in a specific embodiment, the volumes and the sizes of the liquid inlet cavity 2 and the liquid outlet cavity 4 are the same, and the two cavities can be replaced.
The working principle is as follows: because the liquid inlet cavity and the liquid outlet cavity are respectively arranged at the two sides of the long side of the cooling cavity, the first guide area is provided with the N liquid inlet guide plates corresponding to the rear of the liquid flow direction, the liquid inlet guide plates are arranged in the height direction of the liquid inlet guide plates and cover the liquid height area of the liquid inlet cavity, each liquid inlet guide plate comprises a liquid surface area direction drainage part and a liquid inlet liquid outlet cavity drainage part, the liquid surface area direction drainage parts of each liquid inlet guide plate are arranged along the width direction of the liquid inlet cavity, the liquid flowing in the width direction of the liquid inlet cavity is divided into (N+1) areas, each liquid inlet liquid outlet cavity drainage part is arranged along the length direction of the liquid inlet cavity, the liquid flowing in the length direction of the liquid inlet cavity is divided into (N+1) areas, the liquid outlet cavity is arranged in the side part of the liquid inlet cavity and the liquid outlet cavity, and is divided into (N+1) corresponding cooling liquids, and then the cooling liquid entering the cooling cavity respectively to cool the power semiconductor module, the cooling liquid flowing out of the cooling cavity from the liquid inlet cavity and the cooling liquid flowing out of the semiconductor module are enabled to flow from the width direction of the liquid inlet cavity and the liquid cavity.
The foregoing describes the embodiments of the present invention in detail, but the description is only a preferred embodiment of the invention and should not be construed as limiting the scope of the invention. All equivalent changes and modifications made in accordance with the scope of the present invention shall fall within the scope of the present patent.
Claims (7)
1. The utility model provides a be suitable for Pin-Fin power semiconductor module's cooling water course structure which characterized in that: the liquid inlet and outlet device comprises a water channel shell, wherein a liquid inlet cavity, a cooling cavity and a liquid outlet cavity are arranged in parallel in an inner cavity formed by the water channel shell, the liquid inlet cavity and the liquid outlet cavity are respectively arranged on two sides of a long side of the cooling cavity, the lower end parts of pins at the bottom Pin-Fin of a power semiconductor module are uniformly arranged in the cooling cavity, one end of the liquid inlet cavity is provided with a liquid inlet port, the outer wall of the liquid outlet cavity is provided with a liquid outlet port, the liquid inlet port and a connecting area of the liquid inlet cavity are provided with a first guide area, the first guide area corresponds to the rear part of the liquid flow direction, N liquid inlet guide plates are arranged in the height direction of liquid inlet, each liquid inlet guide plate covers the height area of liquid inlet, each liquid inlet guide plate comprises a liquid area direction drainage part and a liquid inlet liquid outlet cavity drainage part, each liquid area direction drainage part of each liquid inlet guide plate is arranged along the width direction of the liquid inlet cavity, the liquid flowing in the liquid inlet cavity is divided into (N+ areas) along the width direction of the liquid inlet cavity, each liquid inlet area is divided into a liquid inlet area (N+ area) and each liquid inlet area corresponds to the length of the liquid inlet cavity (1);
the liquid inlet guide plate comprises M first-stage liquid inlet guide plates and (N-M) second-stage liquid inlet guide plates, the liquid surface area direction drainage part of the first-stage liquid inlet guide plate is specifically a first parallel plate which is arranged in parallel along the length direction of a liquid inlet cavity, the liquid flowing in a width direction area of the liquid inlet cavity corresponding to the rear of a first guide area is divided into (M+1) first areas by the M adjacent first parallel plates, each first area is selectively provided with a corresponding number of second-stage liquid inlet guide plates according to the situation, and the liquid surface area direction drainage parts of the second-stage liquid inlet guide plates positioned in the same first area are distributed behind the tail end of the first parallel plate of the previous first-stage liquid inlet guide plate and are sequentially arranged;
a liquid outlet interface is arranged at the joint of the liquid outlet cavity corresponding to the same end face of the liquid inlet interface;
the liquid outlet guide plates are arranged in the liquid outlet cavity, the number of the liquid outlet guide plates is the same as that of the liquid inlet guide plates, each liquid outlet guide plate comprises a liquid surface area direction liquid outlet guide part and a liquid outlet cavity guide part, each liquid outlet guide plate is arranged in the liquid surface area direction liquid outlet guide part along the width direction of the liquid outlet cavity, liquid flowing in the width direction of the liquid outlet cavity is divided into (N+1) areas, and each liquid outlet cavity guide part is arranged in the length direction of the liquid outlet cavity, and liquid flowing in the length direction of the liquid inlet cavity is divided into (N+1) areas.
2. A cooling water channel structure suitable for Pin-Fin power semiconductor module as claimed in claim 1, wherein: the liquid outlet guide plates comprise M first-stage liquid outlet guide plates and (N-M) second-stage liquid outlet guide plates, and the arrangement positions of the liquid outlet guide plates and the positions of the corresponding liquid inlet guide plates are symmetrically arranged about the central axis of the cooling cavity in the width direction.
3. A cooling water channel structure suitable for Pin-Fin power semiconductor module as claimed in claim 2, wherein: the transition part between the liquid area direction drainage part of each liquid inlet guide plate and the liquid inlet liquid cavity drainage part is in arc transition; the transition part between the liquid outlet drainage part in the liquid surface area direction of each liquid outlet guide plate and the liquid outlet cavity drainage part is in arc transition.
4. A cooling water channel structure suitable for Pin-Fin power semiconductor module as claimed in claim 1, wherein: the liquid outlet interface and the connecting area of the liquid outlet cavity are provided with second guide areas, and N liquid outlet guide plates are arranged in front of the second guide areas corresponding to the liquid flow direction.
5. The cooling water channel structure suitable for the Pin-Fin power semiconductor module as claimed in claim 4, wherein: the position of the first guiding area corresponding to the outlet of the liquid inlet interface is a hemispherical surface or an arc surface, and the position of the second guiding area corresponding to the liquid outlet interface is a hemispherical surface or an arc surface.
6. A cooling water channel structure suitable for Pin-Fin power semiconductor module as claimed in claim 1, wherein: the pressure of the water flow flowing out of the outlet end of the liquid inlet port ensures that the water flows into the corresponding (n+1) areas uniformly.
7. A cooling water channel structure suitable for Pin-Fin power semiconductor module as claimed in claim 2, wherein: the volumes and the sizes of the liquid inlet cavity and the liquid outlet cavity are the same, and the two cavities can be replaced.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810132794.5A CN108133920B (en) | 2018-02-09 | 2018-02-09 | A cooling water channel structure suitable for Pin-Fin power semiconductor modules |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810132794.5A CN108133920B (en) | 2018-02-09 | 2018-02-09 | A cooling water channel structure suitable for Pin-Fin power semiconductor modules |
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| Publication Number | Publication Date |
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| CN108133920A CN108133920A (en) | 2018-06-08 |
| CN108133920B true CN108133920B (en) | 2023-10-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810132794.5A Active CN108133920B (en) | 2018-02-09 | 2018-02-09 | A cooling water channel structure suitable for Pin-Fin power semiconductor modules |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111295078B (en) * | 2019-12-20 | 2021-12-03 | 杭州中豪电动科技有限公司 | Motor control system cooling water route reposition of redundant personnel structure |
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| EP1795852A1 (en) * | 2005-12-09 | 2007-06-13 | Danfoss Silicon Power GmbH | Cooling device for semiconductor elements |
| CN101426359A (en) * | 2007-11-02 | 2009-05-06 | 康奈可关精株式会社 | Heat exchanger |
| CN201994284U (en) * | 2011-02-23 | 2011-09-28 | 比亚迪股份有限公司 | Cooling device and power module |
| CN206789539U (en) * | 2017-04-18 | 2017-12-22 | 中国第一汽车股份有限公司 | A kind of cooling device for the unbalanced assembly that generates heat |
-
2018
- 2018-02-09 CN CN201810132794.5A patent/CN108133920B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2596552Y (en) * | 2002-12-27 | 2003-12-31 | 鸿富锦精密工业（深圳）有限公司 | Heat exchanger |
| CN2842735Y (en) * | 2005-10-24 | 2006-11-29 | 比亚迪股份有限公司 | Flatboard type water-cooling radiator of insulating-grid two-pole transistor |
| EP1795852A1 (en) * | 2005-12-09 | 2007-06-13 | Danfoss Silicon Power GmbH | Cooling device for semiconductor elements |
| CN101426359A (en) * | 2007-11-02 | 2009-05-06 | 康奈可关精株式会社 | Heat exchanger |
| CN201994284U (en) * | 2011-02-23 | 2011-09-28 | 比亚迪股份有限公司 | Cooling device and power module |
| CN206789539U (en) * | 2017-04-18 | 2017-12-22 | 中国第一汽车股份有限公司 | A kind of cooling device for the unbalanced assembly that generates heat |
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| CN108133920A (en) | 2018-06-08 |
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