CN108133920A - A kind of cooling water channel structure for being applicable in Pin-Fin power semiconductor modulars - Google Patents

A kind of cooling water channel structure for being applicable in Pin-Fin power semiconductor modulars Download PDF

Info

Publication number
CN108133920A
CN108133920A CN201810132794.5A CN201810132794A CN108133920A CN 108133920 A CN108133920 A CN 108133920A CN 201810132794 A CN201810132794 A CN 201810132794A CN 108133920 A CN108133920 A CN 108133920A
Authority
CN
China
Prior art keywords
liquid
guide plate
chamber
power semiconductor
pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201810132794.5A
Other languages
Chinese (zh)
Other versions
CN108133920B (en
Inventor
李磊
张雷
黄全安
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Green Control Amperex Technology Ltd
Original Assignee
Suzhou Green Control Amperex Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Green Control Amperex Technology Ltd filed Critical Suzhou Green Control Amperex Technology Ltd
Priority to CN201810132794.5A priority Critical patent/CN108133920B/en
Publication of CN108133920A publication Critical patent/CN108133920A/en
Application granted granted Critical
Publication of CN108133920B publication Critical patent/CN108133920B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/40Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

本发明提供了一种适用Pin‑Fin功率半导体模块的冷却水道结构,其通过优化的流道设计,保证整个功率半导体模块达到一致的冷却效果,保证了功率半导体模块的整体寿命。其包括水道壳体,所述水道壳体所形成的内腔内平行布置有进液腔、冷却腔、出液腔,所述冷却腔的长边的两侧分别布置有所述进液腔、出液腔,功率半导体模块的底部Pin‑Fin引脚的下端部分置于所述冷却腔内均匀布置,所述进液腔的一端设置有进液接口,所述出液腔的外壁设置有出液接口,所述进液接口和所述进液腔的连接区域设置有第一导向区域,所述第一导向区域对应于液体流向的后方设置有N块进液导向板,所述进液导向板的高度方向覆盖进液的液体的高度区域。

The present invention provides a cooling channel structure suitable for Pin-Fin power semiconductor modules, which ensures consistent cooling effect of the entire power semiconductor module through optimized flow channel design, and ensures the overall life of the power semiconductor module. It includes a waterway housing, and the inner cavity formed by the waterway housing is arranged in parallel with a liquid inlet chamber, a cooling chamber, and a liquid outlet chamber, and the two sides of the long side of the cooling chamber are respectively arranged with the liquid inlet chamber, In the liquid outlet chamber, the lower end of the Pin-Fin pin at the bottom of the power semiconductor module is placed in the cooling chamber and arranged uniformly, one end of the liquid inlet chamber is provided with a liquid inlet interface, and the outer wall of the liquid outlet chamber is provided with an outlet The liquid interface, the connection area between the liquid inlet interface and the liquid inlet chamber is provided with a first guide area, and the first guide area is provided with N pieces of liquid inlet guide plates corresponding to the rear of the liquid flow direction, and the liquid inlet guide The height direction of the plate covers the height area of the liquid entering the liquid.

Description

一种适用Pin-Fin功率半导体模块的冷却水道结构A cooling channel structure suitable for Pin-Fin power semiconductor modules

技术领域technical field

本发明涉及冷却水道结构的技术领域,具体为一种适用Pin-Fin功率半导体模块的冷却水道结构。The invention relates to the technical field of cooling water channel structures, in particular to a cooling water channel structure suitable for Pin-Fin power semiconductor modules.

背景技术Background technique

现有的Pin-Fin功率半导体模块的冷却水道,靠近流道入口部分冷却效果好,靠近流道出口部分冷却效果差,长期不均衡散热不利于功率半导体模块的整体寿命。In the existing cooling channel of the Pin-Fin power semiconductor module, the cooling effect is good near the inlet of the channel, and the cooling effect is poor near the outlet of the channel. Long-term unbalanced heat dissipation is not conducive to the overall life of the power semiconductor module.

发明内容Contents of the invention

针对上述问题,本发明提供了一种适用Pin-Fin功率半导体模块的冷却水道结构,其通过优化的流道设计,保证整个功率半导体模块达到一致的冷却效果,保证了功率半导体模块的整体寿命。In view of the above problems, the present invention provides a cooling channel structure suitable for Pin-Fin power semiconductor modules, which ensures consistent cooling effect of the entire power semiconductor module through optimized flow channel design, and ensures the overall life of the power semiconductor module.

一种适用Pin-Fin功率半导体模块的冷却水道结构,其特征在于:其包括水道壳体,所述水道壳体所形成的内腔内平行布置有进液腔、冷却腔、出液腔,所述冷却腔的长边的两侧分别布置有所述进液腔、出液腔,功率半导体模块的底部Pin-Fin引脚的下端部分置于所述冷却腔内均匀布置,所述进液腔的一端设置有进液接口,所述出液腔的外壁设置有出液接口,所述进液接口和所述进液腔的连接区域设置有第一导向区域,所述第一导向区域对应于液体流向的后方设置有N块进液导向板,所述进液导向板的高度方向覆盖进液的液体的高度区域,每块所述进液导向板包括液体面域方向引流部分、液体进入出液腔引流部分,每块所述进液导向板的液体面域方向引流部分沿着所述进液腔的宽度方向布置、将进液腔的宽度方向所流入的液体划分为(N+1)个区域,每块所述液体进入出液腔引流部分沿着所述进液腔的长度方向布置、将进液腔的长度方向所流入的液体划分为(N+1)个区域,所述冷却腔对应于所述进液腔、出液腔的侧部为敞开区域。A cooling water channel structure suitable for Pin-Fin power semiconductor modules, characterized in that it includes a water channel housing, and the inner cavity formed by the water channel housing is arranged in parallel with a liquid inlet cavity, a cooling cavity, and a liquid outlet cavity. The liquid inlet chamber and the liquid outlet chamber are respectively arranged on both sides of the long side of the cooling chamber, and the lower end of the Pin-Fin pin at the bottom of the power semiconductor module is placed in the cooling chamber and evenly arranged, and the liquid inlet chamber One end of one end is provided with a liquid inlet interface, the outer wall of the liquid outlet chamber is provided with a liquid outlet interface, and the connection area between the liquid inlet interface and the liquid inlet chamber is provided with a first guide area, and the first guide area corresponds to N pieces of liquid inlet guide plates are arranged at the rear of the liquid flow direction, and the height direction of the liquid inlet guide plates covers the height area of the liquid entering the liquid. The drainage part of the liquid chamber, the liquid surface direction drainage part of each liquid inlet guide plate is arranged along the width direction of the liquid inlet chamber, and the liquid flowing in the width direction of the liquid inlet chamber is divided into (N+1) Each block of the liquid entering the liquid outlet chamber is arranged along the length direction of the liquid inlet chamber, and the liquid flowing in the length direction of the liquid inlet chamber is divided into (N+1) regions, and the cooling The sides of the chamber corresponding to the liquid inlet chamber and the liquid outlet chamber are open areas.

其进一步特征在于:It is further characterized by:

所述进液导向板包括M块一级进液导向板、(N-M)块二级进液导向板,所述一级进液导向板的液体面域方向引流部分具体为沿着进液腔长度方向平行布置的第一平行板,M块所述相邻的第一平行板将第一导向区域后方所对应的进液腔的宽度方向区域所流入的液体划分为(M+1)个第一区域,每个所述第一区域根据情况选择布置对应数量的二级进液导向板,位于同一第一区域内的所述二级进液导向板的液体面域方向引流部分布置于前一块所述一级进液导向板的第一平行板的末端后方、且顺次布置;The liquid inlet guide plate includes M primary liquid inlet guide plates and (N-M) secondary liquid inlet guide plates. The liquid surface direction drainage part of the primary liquid inlet guide plate is specifically along the length of the liquid inlet cavity The first parallel plates arranged in parallel, M pieces of adjacent first parallel plates divide the liquid flowing into the width direction area of the liquid inlet chamber corresponding to the rear of the first guide area into (M+1) first area, each of the first areas selects and arranges a corresponding number of secondary liquid inlet guide plates according to the situation, and the liquid surface area direction drainage part of the secondary liquid inlet guide plates located in the same first area is arranged in the previous one behind the end of the first parallel plate of the first-stage liquid inlet guide plate, and arranged in sequence;

所述出液腔对应于所述进液接口的同一端面的连接处设置有出液接口;A liquid outlet port is provided at the joint of the liquid outlet chamber corresponding to the same end face of the liquid inlet port;

所述出液腔内布置有和进液导向板数量相同的N块出液导向板,每块所述出液导向板包括液体面域方向出液引流部分、液体流出出液腔引流部分,每块所述出液导向板的液体面域方向出液引流部分沿着所述出液腔的宽度方向布置、将出液腔的宽度方向所流入的液体划分为(N+1)个区域,每块所述液体流出出液腔引流部分沿着所述出液腔的长度方向布置、将进液腔的长度方向所流入的液体划分为(N+1)个区域;N pieces of liquid outlet guide plates having the same number as the number of liquid inlet guide plates are arranged in the liquid outlet cavity, and each of the liquid outlet guide plates includes a liquid outlet and drainage part in the direction of the liquid surface area, and a liquid outlet and liquid outlet drainage part. The liquid outlet and drainage part in the direction of the liquid area of the liquid outlet guide plate is arranged along the width direction of the liquid outlet chamber, and the liquid flowing in the width direction of the liquid outlet chamber is divided into (N+1) regions, each The drainage part of the liquid flowing out of the liquid chamber is arranged along the length direction of the liquid outlet chamber, and the liquid flowing in the length direction of the liquid inlet chamber is divided into (N+1) regions;

优选地,所述出液导向板包括M块一级出液导向板、(N-M)块二级出液导向板,所述出液导向板的布置位置和对应的进液导向板的位置位于关于所述冷却腔的宽度方向中心轴对称布置,确保整个冷却水道的水流顺畅均匀;Preferably, the liquid outlet guide plates include M primary liquid outlet guide plates and (N-M) secondary liquid outlet guide plates, and the arrangement positions of the liquid outlet guide plates and the corresponding liquid inlet guide plates are located about The central axis of the width direction of the cooling cavity is symmetrically arranged to ensure smooth and uniform water flow in the entire cooling channel;

每块所述进液导向板的液体面域方向引流部分、液体进入出液腔引流部分之间的过渡部分为圆弧过渡;The transition part between the drainage part in the direction of the liquid area of each liquid inlet guide plate and the drainage part where the liquid enters the liquid outlet cavity is a circular arc transition;

每块所述出液导向板的液体面域方向出液引流部分、液体流出出液腔引流部分之间的过渡部分为圆弧过渡;The transition part between the liquid outlet and drainage part in the direction of the liquid area of each of the liquid outlet guide plates and the liquid outflow cavity drainage part is a circular arc transition;

所述出液接口和所述出液腔的连接区域设置有第二导向区域,所述第二导向区域对应于液体流向的前方设置有N块出液导向板;The connection area between the liquid outlet interface and the liquid outlet chamber is provided with a second guide area, and the second guide area is provided with N pieces of liquid outlet guide plates corresponding to the front of the liquid flow direction;

所述第一导向区域对应于所述进液接口的出口位置为半球面或圆弧面,所述第二导向区域对应于所述出液接口的位置为半球面或圆弧面,确保水流顺畅;The outlet position of the first guide area corresponding to the liquid inlet interface is a hemispherical or arc surface, and the position of the second guide area corresponding to the liquid outlet interface is a hemispherical or arc surface to ensure smooth water flow ;

所述水道壳体的相邻的长边和短边的连接处为圆弧过渡,确保水流顺畅;The connection between the adjacent long sides and short sides of the water channel housing is a circular arc transition to ensure smooth water flow;

所述进液接口的出口端所流出的水流的压力确保均匀流入到对应的所述(N+1)个区域内;The pressure of the water flowing out of the outlet end of the liquid inlet interface ensures that it flows evenly into the corresponding (N+1) areas;

优选地,所述进液腔、出液腔的体积和大小相同,两个腔体可以置换使用。Preferably, the liquid inlet chamber and the liquid outlet chamber have the same volume and size, and the two chambers can be used interchangeably.

采用本发明的结构后,由于冷却腔的长边的两侧分别布置有进液腔、出液腔,且第一导向区域对应于液体流向的后方设置有N块进液导向板,进液导向板的高度方向覆盖进液的液体的高度区域,每块进液导向板包括液体面域方向引流部分、液体进入出液腔引流部分,每块进液导向板的液体面域方向引流部分沿着进液腔的宽度方向布置、将进液腔的宽度方向所流入的液体划分为(N+1)个区域,每块液体进入出液腔引流部分沿着进液腔的长度方向布置、将进液腔的长度方向所流入的液体划分为(N+1)个区域,冷却腔对应于进液腔、出液腔的侧部为敞开区域,使得进入冷却腔的冷却液被分割为(N+1)个对应的冷却液、之后分别进入到冷却腔内对功率半导体模块进行冷却,使得冷却液从Pin-Fin散热结构的长边流入流出,通过优化的流道设计,保证整个功率半导体模块达到一致的冷却效果,保证了功率半导体模块的整体寿命。After adopting the structure of the present invention, since the two sides of the long side of the cooling chamber are respectively arranged with a liquid inlet chamber and a liquid outlet chamber, and the first guide area is provided with N pieces of liquid inlet guide plates corresponding to the rear of the liquid flow direction, the liquid inlet guide The height direction of the plate covers the height area of the liquid that enters the liquid. Each liquid inlet guide plate includes a liquid surface area direction drainage part, and a liquid enters the liquid outlet cavity drainage part. The liquid area direction drainage part of each liquid inlet guide plate is along the The width direction of the liquid inlet chamber is arranged, and the liquid flowing in the width direction of the liquid inlet chamber is divided into (N+1) areas. The liquid flowing in the length direction of the liquid chamber is divided into (N+1) regions, and the sides of the cooling chamber corresponding to the liquid inlet chamber and the liquid outlet chamber are open regions, so that the cooling liquid entering the cooling chamber is divided into (N+ 1) A corresponding cooling liquid enters the cooling cavity to cool the power semiconductor module respectively, so that the cooling liquid flows in and out from the long side of the Pin-Fin heat dissipation structure, and the optimized flow channel design ensures that the entire power semiconductor module reaches A consistent cooling effect ensures the overall lifetime of the power semiconductor modules.

附图说明Description of drawings

图1为本发明的俯视图结构示意图;Fig. 1 is a top view structural representation of the present invention;

图2为本发明的立体图结构示意图;Fig. 2 is a perspective view structural representation of the present invention;

图3为功率半导体模块安装于该发明的主视图结构示意图;Fig. 3 is a schematic structural diagram of a front view of a power semiconductor module installed in the invention;

图中序号所对应的名称如下:The names corresponding to the serial numbers in the figure are as follows:

水道壳体1、进液腔2、冷却腔3、出液腔4、功率半导体模块5、Pin-Fin引脚6、进液接口7、出液接口8、第一导向区域9、进液导向板10、液体面域方向引流部分11、液体进入出液腔引流部分12、一级进液导向板13、二级进液导向板14、第一区域15、出液导向板16、液体面域方向出液引流部分17、液体流出出液腔引流部分18、一级出液导向板19、二级出液导向板20、第二导向区域21。Water channel housing 1, liquid inlet chamber 2, cooling chamber 3, liquid outlet chamber 4, power semiconductor module 5, Pin-Fin pin 6, liquid inlet interface 7, liquid outlet interface 8, first guide area 9, liquid inlet guide Plate 10, liquid area direction drainage part 11, liquid entering liquid outlet cavity drainage part 12, primary liquid inlet guide plate 13, secondary liquid inlet guide plate 14, first area 15, liquid outlet guide plate 16, liquid area Directional liquid outlet and drainage part 17 , liquid outflow and liquid cavity drainage part 18 , primary liquid outlet guide plate 19 , secondary liquid outlet guide plate 20 , and second guide area 21 .

具体实施方式Detailed ways

一种适用Pin-Fin功率半导体模块的冷却水道结构,见图1-图3:其包括水道壳体1,水道壳体1所形成的内腔内平行布置有进液腔2、冷却腔3、出液腔4,冷却腔3的长边的两侧分别布置有进液腔2、出液腔4,功率半导体模块5的底部Pin-Fin引脚6的下端部分置于冷却腔3内均匀布置,进液腔3的一端设置有进液接口7,出液腔4的外壁设置有出液接口8,进液接口7和进液腔2的连接区域设置有第一导向区域9,第一导向区域9对应于液体流向的后方设置有N块进液导向板,进液导向板10的高度方向覆盖进液的液体的高度区域,每块进液导向板包括液体面域方向引流部分11、液体进入出液腔引流部分12,每块进液导向板10的液体面域方向引流部分11沿着进液腔2的宽度方向布置、将进液腔2的宽度方向所流入的液体划分为(N+1)个区域,每块液体进入出液腔引流部分12沿着进液腔2的长度方向布置、将进液腔2的长度方向所流入的液体划分为(N+1)个区域,冷却腔3对应于进液腔2、出液腔4的侧部为敞开区域。A cooling water channel structure suitable for Pin-Fin power semiconductor modules, see Figure 1-Figure 3: it includes a water channel housing 1, and the inner cavity formed by the water channel housing 1 is arranged in parallel with a liquid inlet chamber 2, a cooling chamber 3, The liquid outlet chamber 4 and the two sides of the long side of the cooling chamber 3 are respectively arranged with a liquid inlet chamber 2 and a liquid outlet chamber 4, and the lower end of the bottom Pin-Fin pin 6 of the power semiconductor module 5 is placed in the cooling chamber 3 and arranged evenly , one end of the liquid inlet chamber 3 is provided with a liquid inlet port 7, the outer wall of the liquid outlet chamber 4 is provided with a liquid outlet port 8, and the connection area between the liquid inlet port 7 and the liquid inlet chamber 2 is provided with a first guide area 9, and the first guide Area 9 is provided with N pieces of liquid inlet guide plates corresponding to the rear of the liquid flow direction. The height direction of the liquid inlet guide plates 10 covers the height area of the liquid entering the liquid. Each liquid inlet guide plate includes a liquid area direction drainage part 11, a liquid Entering the liquid outlet chamber drainage part 12, the liquid surface area direction drainage part 11 of each liquid inlet guide plate 10 is arranged along the width direction of the liquid inlet chamber 2, and the liquid that flows into the width direction of the liquid inlet chamber 2 is divided into (N +1) areas, each piece of liquid enters the liquid outlet chamber and the drainage part 12 is arranged along the length direction of the liquid inlet chamber 2, and the liquid flowing in the length direction of the liquid inlet chamber 2 is divided into (N+1) areas, cooling The sides of the chamber 3 corresponding to the liquid inlet chamber 2 and the liquid outlet chamber 4 are open areas.

进液导向板10包括M块一级进液导向板13、(N-M)块二级进液导向板14,一级进液导向板13的液体面域方向引流部分11具体为沿着进液腔长度方向平行布置的第一平行板,M块相邻的第一平行板将第一导向区域后方所对应的进液腔2的宽度方向区域所流入的液体划分为(M+1)个第一区域15,每个第一区域15根据情况选择布置对应数量的二级进液导向板14,位于同一第一区域15内的二级进液导向板14的液体面域方向引流部分11布置于前一块一级进液导向板13的第一平行板的末端后方、且顺次布置;The liquid inlet guide plate 10 includes M primary liquid inlet guide plates 13, (N-M) secondary liquid inlet guide plates 14, and the liquid surface direction drainage part 11 of the primary liquid inlet guide plate 13 is specifically along the direction of the liquid inlet chamber. The first parallel plates arranged in parallel in the length direction, M pieces of adjacent first parallel plates divide the liquid flowing into the width direction area of the liquid inlet chamber 2 corresponding to the rear of the first guide area into (M+1) first Area 15, each first area 15 selects and arranges a corresponding number of secondary liquid inlet guide plates 14 according to the situation, and the liquid area direction drainage part 11 of the secondary liquid inlet guide plate 14 located in the same first area 15 is arranged in the front A first-stage liquid inlet guide plate 13 is arranged behind the end of the first parallel plate and arranged in sequence;

出液腔4对应于进液接口7的同一端面的连接处设置有出液接口8;A liquid outlet port 8 is provided at the joint of the liquid outlet chamber 4 corresponding to the same end face of the liquid inlet port 7;

出液腔4内布置有和进液导向板数量相同的N块出液导向板16,每块出液导向板16包括液体面域方向出液引流部分17、液体流出出液腔引流部分18,每块出液导向板16的液体面域方向出液引流部分17沿着出液腔4的宽度方向布置、将出液腔4的宽度方向所流入的液体划分为(N+1)个区域,每块液体流出出液腔引流部分18沿着出液腔4的长度方向布置、将进液腔4的长度方向所流入的液体划分为(N+1)个区域;N pieces of liquid outlet guide plates 16 having the same number as the number of liquid inlet guide plates are arranged in the liquid outlet chamber 4, and each liquid outlet guide plate 16 includes a liquid outlet drainage part 17 in the direction of the liquid surface area and a fluid outlet drainage part 18 in the liquid outlet cavity. The liquid outlet and drainage part 17 of each liquid outlet guide plate 16 is arranged along the width direction of the liquid outlet chamber 4, and the liquid flowing in the width direction of the liquid outlet chamber 4 is divided into (N+1) regions, The drainage part 18 of each piece of liquid flowing out of the liquid chamber is arranged along the length direction of the liquid outlet chamber 4, and the liquid flowing in the length direction of the liquid inlet chamber 4 is divided into (N+1) regions;

优选地,出液导向板16包括M块一级出液导向板19、(N-M)块二级出液导向板20,出液导向板16的布置位置和对应的进液导向板10的位置位于关于冷却腔3的宽度方向中心轴对称布置,确保整个冷却水道的水流顺畅均匀;Preferably, the liquid outlet guide plate 16 includes M primary liquid outlet guide plates 19 and (N-M) secondary liquid outlet guide plates 20, and the arrangement positions of the liquid outlet guide plates 16 and the corresponding positions of the liquid inlet guide plates 10 are The central axis of the width direction of the cooling cavity 3 is symmetrically arranged to ensure smooth and uniform water flow in the entire cooling channel;

每块进液导向板10的液体面域方向引流部分11、液体进入出液腔引流部分12之间的过渡部分为圆弧过渡;The transition part between the liquid surface direction drainage part 11 of each liquid inlet guide plate 10 and the liquid entering the liquid outlet chamber drainage part 12 is a circular arc transition;

每块出液导向板16的液体面域方向出液引流部分17、液体流出出液腔引流部分18之间的过渡部分为圆弧过渡;The transition part between the liquid outlet and drainage part 17 in the direction of the liquid surface area of each liquid outlet guide plate 16 and the liquid outflow cavity drainage part 18 is a circular arc transition;

水道壳体1的相邻的长边和短边的连接处为圆弧过渡,确保水流顺畅;The connection between the adjacent long sides and short sides of the water channel housing 1 is a circular arc transition to ensure smooth water flow;

出液接口8和出液腔4的连接区域设置有第二导向区域21,第二导向区域21对应于液体流向的前方设置有N块出液导向板16;The connection area between the liquid outlet interface 8 and the liquid outlet chamber 4 is provided with a second guide area 21, and the second guide area 21 is provided with N pieces of liquid outlet guide plates 16 corresponding to the front of the liquid flow direction;

第一导向区域9对应于进液接口7的出口位置为半球面或圆弧面,第二导向区域21对应于出液接口8的位置为半球面或圆弧面,确保水流顺畅,The outlet position of the first guide area 9 corresponding to the liquid inlet port 7 is a hemispherical surface or an arc surface, and the position of the second guide area 21 corresponding to the liquid outlet interface 8 is a hemispherical surface or an arc surface to ensure smooth flow of water.

进液接口7的出口端所流出的水流的压力确保均匀流入到对应的(N+1)个区域内;The pressure of the water flowing out from the outlet end of the liquid inlet interface 7 ensures that it flows evenly into the corresponding (N+1) areas;

具体实施例中,进液腔2、出液腔4的体积和大小相同,两个腔体可以置换使用。In a specific embodiment, the volume and size of the liquid inlet chamber 2 and the liquid outlet chamber 4 are the same, and the two chambers can be used interchangeably.

其工作原理如下:由于冷却腔的长边的两侧分别布置有进液腔、出液腔,且第一导向区域对应于液体流向的后方设置有N块进液导向板,进液导向板的高度方向覆盖进液的液体的高度区域,每块进液导向板包括液体面域方向引流部分、液体进入出液腔引流部分,每块进液导向板的液体面域方向引流部分沿着进液腔的宽度方向布置、将进液腔的宽度方向所流入的液体划分为(N+1)个区域,每块液体进入出液腔引流部分沿着进液腔的长度方向布置、将进液腔的长度方向所流入的液体划分为(N+1)个区域,出液腔对应于进液腔、出液腔的侧部为敞开区域,使得进入冷却腔的冷却液被分割为(N+1)个对应的冷却液、之后分别进入到冷却腔内对功率半导体模块进行冷却,使得冷却液从Pin-Fin散热结构的长边流入流出,通过优化的流道设计,保证整个功率半导体模块达到一致的冷却效果,保证了功率半导体模块的整体寿命。Its working principle is as follows: Since the two sides of the long side of the cooling chamber are respectively arranged with a liquid inlet chamber and a liquid outlet chamber, and the first guide area is provided with N pieces of liquid inlet guide plates corresponding to the rear of the liquid flow direction, the liquid inlet guide plates The height direction covers the height area of the liquid entering the liquid. Each liquid inlet guide plate includes a drainage part in the direction of the liquid area and a drainage part where the liquid enters the liquid outlet cavity. The drainage part in the direction of the liquid area of each liquid inlet guide plate is along the The width direction of the chamber is arranged, and the liquid flowing in the width direction of the liquid inlet chamber is divided into (N+1) regions. The drainage part of each piece of liquid entering the liquid outlet chamber is arranged along the length direction of the liquid inlet chamber, and the liquid inlet chamber The liquid flowing into the length direction of the cooling chamber is divided into (N+1) areas, the liquid outlet chamber corresponds to the liquid inlet chamber, and the side of the liquid outlet chamber is an open area, so that the cooling liquid entering the cooling chamber is divided into (N+1) ) corresponding coolant, and then enter the cooling cavity to cool the power semiconductor module, so that the coolant flows in and out from the long side of the Pin-Fin heat dissipation structure, and the optimized flow channel design ensures that the entire power semiconductor module is consistent The cooling effect ensures the overall life of the power semiconductor module.

以上对本发明的具体实施例进行了详细说明,但内容仅为本发明创造的较佳实施例,不能被认为用于限定本发明创造的实施范围。凡依本发明创造申请范围所作的均等变化与改进等,均应仍归属于本专利涵盖范围之内。The specific embodiments of the present invention have been described in detail above, but the contents are only preferred embodiments of the present invention, and cannot be considered as limiting the implementation scope of the present invention. All equal changes and improvements made according to the application scope of the present invention shall still belong to the scope covered by this patent.

Claims (10)

1. a kind of cooling water channel structure for being applicable in Pin-Fin power semiconductor modulars, it is characterised in that:It includes water channel housing, The interior intracavitary parallel arrangement that the water channel housing is formed has admission chamber, cooling chamber, goes out sap cavity, and the two of the long side of the cooling chamber Side is respectively disposed with the admission chamber, goes out sap cavity, and the end portion of the bottom Pin-Fin pins of power semiconductor modular is placed in institute State in cooling chamber and be evenly arranged, one end of the admission chamber is provided with into liquid interface, it is described go out sap cavity outer wall be provided with out liquid Interface, the join domain into liquid interface and the admission chamber are provided with the first guiding area, first guiding area pair Should the rear that liquid flows to be provided with N block feed liquor guide plates, the liquid of the short transverse covering feed liquor of the feed liquor guide plate Height region, every piece of feed liquor guide plate includes liquid side domain direction drainage portion, liquid enters sap cavity drainage portion, The liquid side domain direction drainage portion of every piece of feed liquor guide plate along the width direction arrangement of the admission chamber, by admission chamber The liquid that is flowed into of width direction be divided into (N+1) a region, every block of liquid enters sap cavity drainage portion along institute It states the length direction arrangement of admission chamber, the liquid that the length direction of admission chamber is flowed into is divided into (N+1) a region, it is described cold But chamber correspond to the admission chamber, go out sap cavity side be open region.
2. a kind of cooling water channel structure for being applicable in Pin-Fin power semiconductor modulars as described in claim 1, feature exist In:The feed liquor guide plate includes M block level-one feed liquors guide plate, (N-M) block two level feed liquor guide plate, and the level-one feed liquor is oriented to The liquid side domain direction drainage portion of plate is specially the first parallel-plate for being arranged in parallel along admission chamber length direction, described in M blocks The liquid that the first adjacent parallel-plate is flowed into the width direction region of the admission chamber corresponding to the first guiding area rear is drawn It is divided into (M+1) a first area, the two level feed liquor guide plate of each first area according to circumstances choice arrangement corresponding number, The liquid side domain direction drainage portion of the two level feed liquor guide plate in same first area is arranged in described in previous piece It the end rear of first parallel-plate of level-one feed liquor guide plate and sequentially arranges.
3. a kind of cooling water channel structure for being applicable in Pin-Fin power semiconductor modulars as described in claim 1, feature exist In:It is described go out sap cavity correspond to and described the junction of the same end face of liquid interface be provided with out liquid interface.
4. a kind of cooling water channel structure for being applicable in Pin-Fin power semiconductor modulars as claimed in claim 2, feature exist In:It is described go out sap cavity in be disposed with the N block identical with feed liquor guide plate quantity and go out liquid guide plate, liquid guide plate packet is gone out described in every piece It includes that liquid side domain direction goes out liquid drainage portion, liquid flows out sap cavity drainage portion, the liquid side of liquid guide plate is gone out described in every piece Domain direction go out liquid drainage portion along it is described go out the width direction arrangement of sap cavity, the liquid that is flowed into the width direction for sap cavity Be divided into (N+1) a region, every block of liquid flow out sap cavity drainage portion along it is described go out sap cavity length direction arrangement, The liquid that the length direction of admission chamber is flowed into is divided into (N+1) a region.
5. a kind of cooling water channel structure for being applicable in Pin-Fin power semiconductor modulars as claimed in claim 4, feature exist In:It is described go out liquid guide plate goes out liquid guide plate including M block level-ones, (N-M) block two level goes out liquid guide plate, it is described go out liquid guide plate The position of position and corresponding feed liquor guide plate is located at the width direction arrangement substantially symmetrical about its central axis about the cooling chamber.
6. a kind of cooling water channel structure for being applicable in Pin-Fin power semiconductor modulars as claimed in claim 5, feature exist In:Liquid side domain direction drainage portion, the liquid of every piece of feed liquor guide plate enter the transition between sap cavity drainage portion Part is arc transition;The liquid side domain direction for going out liquid guide plate described in every piece goes out liquid drainage portion, liquid flows out sap cavity and draws Transition portion between stream part is arc transition.
7. a kind of cooling water channel structure for being applicable in Pin-Fin power semiconductor modulars as claimed in claim 4, feature exist In:It is described go out liquid interface and it is described go out sap cavity join domain be provided with the second guiding area, second guiding area corresponds to The front of liquid flow direction is provided with N blocks and goes out liquid guide plate.
8. a kind of cooling water channel structure for being applicable in Pin-Fin power semiconductor modulars as claimed in claim 7, feature exist In:First guiding area is hemisphere face or arc surface into the outlet port of liquid interface corresponding to described in, and described second is oriented to The position that region goes out liquid interface corresponding to described in is hemisphere face or arc surface.
9. a kind of cooling water channel structure for being applicable in Pin-Fin power semiconductor modulars as described in claim 1, feature exist In:The pressure of flow that the port of export into liquid interface is flowed out ensures uniformly to be flowed into corresponding described (N+1) a region It is interior.
10. a kind of cooling water channel structure for being applicable in Pin-Fin power semiconductor modulars as claimed in claim 5, feature exist In:The admission chamber, the volume for going out sap cavity are identical with size, and two cavitys can replace use.
CN201810132794.5A 2018-02-09 2018-02-09 A cooling water channel structure suitable for Pin-Fin power semiconductor modules Active CN108133920B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810132794.5A CN108133920B (en) 2018-02-09 2018-02-09 A cooling water channel structure suitable for Pin-Fin power semiconductor modules

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810132794.5A CN108133920B (en) 2018-02-09 2018-02-09 A cooling water channel structure suitable for Pin-Fin power semiconductor modules

Publications (2)

Publication Number Publication Date
CN108133920A true CN108133920A (en) 2018-06-08
CN108133920B CN108133920B (en) 2023-10-24

Family

ID=62430825

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810132794.5A Active CN108133920B (en) 2018-02-09 2018-02-09 A cooling water channel structure suitable for Pin-Fin power semiconductor modules

Country Status (1)

Country Link
CN (1) CN108133920B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111295078A (en) * 2019-12-20 2020-06-16 杭州中豪电动科技有限公司 Motor control system cooling water route reposition of redundant personnel structure

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2596552Y (en) * 2002-12-27 2003-12-31 鸿富锦精密工业(深圳)有限公司 Heat exchanger
CN2842735Y (en) * 2005-10-24 2006-11-29 比亚迪股份有限公司 Flatboard type water-cooling radiator of insulating-grid two-pole transistor
EP1795852A1 (en) * 2005-12-09 2007-06-13 Danfoss Silicon Power GmbH Cooling device for semiconductor elements
CN101426359A (en) * 2007-11-02 2009-05-06 康奈可关精株式会社 Heat exchanger
CN201994284U (en) * 2011-02-23 2011-09-28 比亚迪股份有限公司 Cooling device and power module
CN206789539U (en) * 2017-04-18 2017-12-22 中国第一汽车股份有限公司 A kind of cooling device for the unbalanced assembly that generates heat

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2596552Y (en) * 2002-12-27 2003-12-31 鸿富锦精密工业(深圳)有限公司 Heat exchanger
CN2842735Y (en) * 2005-10-24 2006-11-29 比亚迪股份有限公司 Flatboard type water-cooling radiator of insulating-grid two-pole transistor
EP1795852A1 (en) * 2005-12-09 2007-06-13 Danfoss Silicon Power GmbH Cooling device for semiconductor elements
CN101426359A (en) * 2007-11-02 2009-05-06 康奈可关精株式会社 Heat exchanger
CN201994284U (en) * 2011-02-23 2011-09-28 比亚迪股份有限公司 Cooling device and power module
CN206789539U (en) * 2017-04-18 2017-12-22 中国第一汽车股份有限公司 A kind of cooling device for the unbalanced assembly that generates heat

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111295078A (en) * 2019-12-20 2020-06-16 杭州中豪电动科技有限公司 Motor control system cooling water route reposition of redundant personnel structure

Also Published As

Publication number Publication date
CN108133920B (en) 2023-10-24

Similar Documents

Publication Publication Date Title
ES2584435T3 (en) Hybrid heater
WO2018210067A1 (en) Radiator and communication device
CN106505223B (en) A lithium battery cooling device
CN108133920A (en) A kind of cooling water channel structure for being applicable in Pin-Fin power semiconductor modulars
CN210136989U (en) Double channel power battery liquid cold plate
JP2016017737A (en) TED heat exchanger
TWM561985U (en) Water cooling module
CN205001057U (en) Water conservancy diversion radiator
KR20120104698A (en) Heat exchanger
CN103090716B (en) For the fluid distributor of plate type heat exchanger
CN204404847U (en) With the vehicle water radiator of guiding device
CN103410585B (en) The oil filter base that oil cooler is connected with engine cylinder-body optimization
CN201156539Y (en) Radiator for DC transmission thyristor converter valve assembly
CN101285656B (en) Annular shell and tube heat exchanger with rectification
CN207223754U (en) A kind of lower polishing disk water-cooling structure of chip Twp-sided polishing machine
CN207097923U (en) Battery bag
TW201940053A (en) Water cooling module
CN104768356B (en) A kind of water cooling hardened structure of application 3D printing technique
CN207938598U (en) A kind of cooling water channel structure being applicable in Pin-Fin power semiconductor modulars
CN204963625U (en) High -efficient graphite heat exchanger
CN204987959U (en) Casing heat exchanger
WO2018024185A1 (en) Heat exchange device
CN203810781U (en) Efficient water cooling machine
CN203810992U (en) Deduster dust-discharging cooling device
CN204346211U (en) A kind of vertical array tubular cooler for the cooling of sulphur gas

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant