CN210325776U

CN210325776U - A turbulent liquid cooling device

Info

Publication number: CN210325776U
Application number: CN201921528601.4U
Authority: CN
Inventors: 喻望春; 夏波涛; 陈久义
Original assignee: Anhui Xenbo Heat Transfer Technology Co ltd
Current assignee: Anhui Xenbo Heat Transfer Technology Co ltd
Priority date: 2019-09-16
Filing date: 2019-09-16
Publication date: 2020-04-14
Anticipated expiration: 2029-09-16

Abstract

The utility model relates to the technical field of radiators, and provides a turbulent liquid-cooling heat-dissipating device, which aims to solve the problem that the existing liquid cooling system cannot adapt to the existing power electronic equipment in rail transit, new energy, power grid, and power electronic equipment. The problem of increased power and heat generation of IGBT semiconductor components includes a cover plate, an upper brazing plate, a lower brazing plate and a base plate arranged in sequence from top to bottom. The cover plate is welded to the base plate through the upper and lower brazing plates. A closed liquid cooling space is formed between the cover plate and the base plate. The lower end of the cover plate 001 is provided with a spoiler net composed of a number of polygonal fins that are evenly arranged in dislocation. The utility model is especially suitable for the liquid cooling and heat dissipation of the IGBT semiconductor elements in the existing power electronic equipment, and has high social use value and application prospect.

Description

Turbulent flow type liquid cooling heat abstractor

Technical Field

The utility model relates to a radiator technical field, concretely relates to vortex formula liquid cooling heat abstractor.

Background

Modern power electronic equipment further improves the requirements on reliability, performance indexes, power density and the like, and the thermal design of the power electronic equipment is more and more important. The IGBT element is a key device in rail transit and new energy power electronic equipment, the reliability, the safety and the service life of the whole machine are directly influenced by the working state, and the heat dissipation of the IGBT element is of great importance.

At present, IGBT components and parts can generate conduction and switching loss when in work, so that cooling equipment needs to be installed for heat dissipation to reduce the junction temperature of power devices and ensure that the IGBT components and parts can normally and reliably run at an allowable temperature. At present, the cooling modes of the IGBT device mainly comprise air cooling, liquid cooling, a heat pipe and the like, and along with the further improvement of the performance requirement and the power density of the device, the requirement on heat dissipation is more and more strict. In view of reliability, a liquid cooling radiator with high heat dissipation efficiency is generally selected to cool the power device, and because small flow and large power consumption are a trend, the conventional straight channel structure is difficult to realize the requirement of high power density cooling, and a reinforced heat dissipation technology is required.

The traditional liquid cooling radiator is through opening the straight flute on the liquid cooling base plate, again with liquid cooling apron and base plate with the intermediate layer brazing filler metal piece of clamp pass through vacuum brazing welding together, at apron face installation electron device, the apron of adoption is mostly thin-walled plate structure in order to reduce radiator conduction thermal resistance requirement, it is simple to see current liquid cooling plate runner, water cools off on the individual layer coplanar, heat dispersion hangs down the security risk height, the problem that IGBT semiconductor element power increases and generates heat among the current power electronic equipment can't be adapted to prior art liquid cooling system.

Therefore, a turbulent flow type liquid cooling heat dissipation device is provided.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model provides a not enough to prior art, the utility model provides a vortex formula liquid cooling heat abstractor has overcome prior art not enough, reasonable in design, compact structure aims at solving among track traffic, the new forms of energy, electric wire netting, the power electronic equipment, and the problem that IGBT semiconductor element power increases and generates heat among the current power electronic equipment can't be adapted to prior art liquid cooling system.

(II) technical scheme

In order to achieve the above purpose, the utility model discloses a following technical scheme realizes:

a turbulent flow type liquid cooling heat dissipation device comprises a cover plate, an upper brazing plate, a lower brazing plate and a base plate which are sequentially arranged from top to bottom, wherein the cover plate is welded with the base plate into a whole through the upper brazing plate and the lower brazing plate, a closed liquid cooling space is formed between the cover plate and the base plate, and a turbulent flow net formed by a plurality of polygonal fins in staggered and uniform arrangement is arranged at the lower end of the cover plate;

the base plate laminating is on the vortex net, and with the vortex net forms a plurality of vortex liquid cooling passageway, the inside water conservancy diversion basin that is equipped with of base plate, apron face are equipped with into liquid mouth and last liquid outlet, and go up the surface corresponding position of going into liquid mouth and last liquid outlet and be equipped with entry water injection well choke and export water injection well choke respectively.

Furthermore, a C-shaped diversion water tank is arranged at the upper end of the substrate along the edge of the inner cavity of the liquid cooling space.

Furthermore, the upper surface of the cover plate is provided with a plurality of semiconductor mounting surfaces which are arranged in a matrix.

Further, mesh grooves are formed in gaps between adjacent polygonal fins, and the polygonal fins and the mesh grooves intersect with each other and communicate with each other, forming liquid flow paths intersecting in an X-shape.

Furthermore, go up brazing sheet and brazing sheet down and be the structure that matches each other registrates, and go up and to braze on the lateral wall of sheet and set up first liquid cooling passageway and the second liquid cooling passageway that link up with last liquid inlet and last liquid outlet respectively on the symmetry.

Furthermore, the polygonal fin is in any one of a parallelogram structure, a square structure and a rhombus structure.

(III) advantageous effects

The embodiment of the utility model provides a vortex formula liquid cooling heat abstractor possesses following beneficial effect:

1. through the innovative design, the polygonal fin turbulent flow water channel can effectively enhance the heat dissipation area, reduce the heat dissipation energy consumption and greatly improve the heat dissipation efficiency and the heat dissipation performance of the high-power electronic component.

2. The polygonal fins and the mesh grooves are mutually crossed and communicated with each other, so that the cooling liquid flows along an X-shaped cross route when flowing through the polygonal fins, a plurality of turbulent flow water channels are formed, the efficient turbulent flow effect is achieved, the heat dissipation energy consumption is reduced, and the heat dissipation efficiency and the heat dissipation performance of the high-power electronic component are greatly improved.

3. The inside polygon fin runner of apron is any one in parallelogram, square, the rhombus structure, is not limited to a shape structure, and utility model innovation degree is high, and processing is realized easily.

Drawings

The above features, technical features, advantages and implementations of a turbulent liquid-cooled heat sink will be further described in the following detailed description of preferred embodiments with reference to the accompanying drawings.

FIG. 1 is a schematic view of the overall assembly of the present invention;

FIG. 2 is an exploded view of the present invention;

FIG. 3 is a schematic view of the middle cover plate of the present invention;

fig. 4 is an enlarged schematic view of the combined structure of the polygonal fins and the mesh grooves of the present invention.

In the figure: cover plate 001, semiconductor mounting surface 002, upper brazing sheet 003, lower brazing sheet 004, base plate 005, inlet nozzle 006, water flow channel inlet 007, outlet nozzle 008, water flow channel outlet 009, water flow channel inlet 010, water flow channel outlet 011, diversion water tank 012 and mesh groove 013.

Detailed Description

The invention will be further described with reference to the following figures 1-4 and examples:

as shown in fig. 1, fig. 2 and fig. 3, a turbulent-flow liquid-cooled heat dissipation device includes: the liquid cooling structure comprises a cover plate 001, an upper brazing plate 003, a lower brazing plate 004 and a base plate 005 which are sequentially arranged from top to bottom, wherein the cover plate 001 is welded with the base plate 005 into a whole through the upper brazing plate 003 and the lower brazing plate 004, a closed liquid cooling space is formed between the cover plate 001 and the base plate 005, and a turbulence net formed by a plurality of polygonal fins 015 which are staggered and uniformly arranged is arranged at the lower end of the cover plate 001;

base plate 005 laminating is on the vortex net, and with the vortex net forms a plurality of vortex liquid cooling passageway, the inside water conservancy diversion basin 012 that is equipped with of base plate 005, apron 001 is equipped with into liquid mouth 007 and last liquid outlet 009, and goes up the surface correspondence position of going into liquid mouth 007 and last liquid outlet 009 and be equipped with entry water injection well choke 006 and export water injection well choke 008 respectively.

In this embodiment, as shown in fig. 2, a C-shaped diversion water tank 012 is disposed at the upper end of the substrate 005 along the edge of the inner cavity of the liquid cooling space, and the liquid inlet 007 and the liquid outlet 009 are effectively matched to form a through liquid cooling channel.

In this embodiment, the coolant liquid gets into from entry water injection well choke 006 and goes into liquid mouth 007 through the vortex net that a plurality of polygon fin 015 dislocation align to form again through the water conservancy diversion basin 012 on the base plate 005, forms a plurality of vortex liquid cooling passageway, then flows out from last outlet water injection well choke 008 on liquid outlet 009, effectively strengthens heat radiating area and vortex effect, improves heat dispersion by a wide margin.

In this embodiment, as shown in fig. 1 and 2, the upper surface of the cover plate 001 is provided with a plurality of semiconductor mounting surfaces 002 arranged in a matrix for mounting the IGBT semiconductor elements, so as to ensure heat dissipation of the IGBT semiconductor elements.

In this embodiment, as shown in fig. 4, mesh grooves 013 are formed in gaps between adjacent polygonal fins 015, the polygonal fins 015 and the mesh grooves 013 intersect with each other and communicate with each other, and X-shaped intersecting liquid flow paths are formed, so that the coolant flows along the X-intersecting paths when passing through the polygonal fins 015, thereby forming a plurality of turbulent water flow paths and securing the cooling effect.

In this embodiment, as shown in fig. 2, the upper brazing sheet 003 and the lower brazing sheet 004 are matched and sleeved with each other, and the side wall of the upper brazing sheet 003 is symmetrically provided with a first liquid cooling channel 010 and a second liquid cooling channel 011 which are respectively communicated with the upper liquid inlet 007 and the upper liquid outlet 009, so that the communication and circulation of the liquid cooling channels are effectively ensured, and the temperature of the cooling liquid during the operation of the IGBT semiconductor element is taken away.

In this embodiment, as shown in fig. 4, the polygonal fin 015 is any one of a parallelogram, a square, and a diamond structure, and is not limited to a shape structure, so that the utility model has high innovation degree, and the processing is easy to implement.

The embodiment of the present invention discloses a preferred embodiment, but not limited thereto, and those skilled in the art can easily understand the spirit of the present invention according to the above embodiment, and make different extensions and changes, but do not depart from the spirit of the present invention, all of which are within the protection scope of the present invention.

Claims

1. A turbulent liquid-cooled heat dissipation device, comprising a cover plate, an upper brazing plate, a lower brazing plate and a base plate arranged in sequence from top to bottom, wherein the cover plate passes through the upper brazing plate and the lower brazing plate. The brazing plate and the base plate are welded into one body, and a closed liquid cooling space is formed between the cover plate and the base plate, and the lower end of the cover plate is provided with a spoiler network composed of a plurality of polygonal fins that are evenly arranged in dislocation;

The base plate is attached to the spoiler net, and forms several spoiler liquid cooling channels with the spoiler net. The base plate is provided with a diversion water tank, and the cover surface is provided with an upper liquid inlet and an upper liquid outlet. , and the corresponding positions of the outer surfaces of the upper liquid inlet and the upper liquid outlet are respectively provided with an inlet water nozzle and an outlet water nozzle.

2 . The turbulent liquid cooling device according to claim 1 , wherein the upper end of the base plate is provided with a C-shaped diversion groove along the edge of the inner cavity of the liquid cooling space. 3 .

3 . The turbulent liquid cooling device according to claim 1 , wherein the upper surface of the cover plate is provided with a plurality of semiconductor mounting surfaces arranged in a matrix. 4 .

4 . The spoiler liquid cooling device according to claim 1 , wherein mesh grooves are formed in the gaps between the adjacent polygonal fins, and the polygonal fins and the mesh grooves intersect each other and communicate with each other, forming an X-shaped intersecting liquid flow path.

5 . The turbulent liquid cooling device according to claim 1 , wherein the upper brazing plate and the lower brazing plate are in a matched structure, and the side wall of the upper brazing plate is in a matching structure. 6 . A first liquid cooling channel and a second liquid cooling channel respectively communicated with the upper liquid inlet and the upper liquid outlet are opened symmetrically on the upper side.

6 . The turbulent liquid cooling device according to claim 1 , wherein the polygonal fins are any one of a parallelogram, a square, and a rhombus. 7 .