CN207783398U - A kind of radiator structure and intelligent electronic device - Google Patents
A kind of radiator structure and intelligent electronic device Download PDFInfo
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- CN207783398U CN207783398U CN201721796308.7U CN201721796308U CN207783398U CN 207783398 U CN207783398 U CN 207783398U CN 201721796308 U CN201721796308 U CN 201721796308U CN 207783398 U CN207783398 U CN 207783398U
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- radiator structure
- heat dissipation
- electronic device
- dissipation base
- shell
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Abstract
The utility model discloses the intelligent electronic device of a kind of radiator structure and the use radiator structure, radiator structure is applied to the heating part of intelligent electronic device, and radiator structure includes：Heat dissipation base and the radiating fin being set on heat dissipation base；Heat dissipation base is the tubular construction that both ends open has tubular air duct, and outer wall is provided with heat source-contacting surface, and radiating fin is set on the internal face of heat dissipation base.Intelligent electronic device using the radiator structure includes shell, and shell is built-in with heating part, and shell is provided with the air inlet and air outlet of corresponding radiator structure both ends open.Radiator structure disclosed by the utility model greatly improves the heat dissipating state of system, while also saving the manufacturing cost of radiator structure in the case where meeting compact structure layout.The intelligent electronic device of above-mentioned radiator structure not only excellent radiation performance is used, but also small, service life is long.
Description
Technical field
The utility model is related to electronic product radiating technical fields more particularly to a kind of radiator structure and smart electronics to set
It is standby.
Background technology
With the high speed development of current electronic technology, electronic component constantly develops to miniaturization and densification, and from
The power of body also constantly improves so that the heat that electronic product unit area generates is continuously increased, if heat cannot be timely
It distributes, it will form localized hyperthermia, to make electronic component generate failure, influence the even shortening of its job stability and use the longevity
Life.
Currently, for most electronic products, such as intelligent sound box, at main heating source component usually more than one, in order to
Increase heat dissipation, if conventionally, a radiator structure is equipped in every place's thermal source component, in order to avoid two radiator structures
Between interfere, usually also need to reserve enough gaps.This be not only difficult to meet increasingly compact structure layout, also so that at
This is high.
Utility model content
To overcome above-mentioned the deficiencies in the prior art, the technical problem to be solved by the utility model is to provide a kind of heat dissipation knots
Structure and the intelligent electronic device for using the radiator structure, not only topology layout is compact for the radiator structure, but also can improve electronics and set
Standby heat dissipating state.
The one side of the utility model provides a kind of radiator structure, is applied to the heating part of intelligent electronic device, dissipates
Heat structure includes：Heat dissipation base and the radiating fin being set on heat dissipation base；Heat dissipation base, which is both ends open, has tubular wind
The tubular construction in road, outer wall are provided with heat source-contacting surface, and radiating fin is set on the internal face of heat dissipation base.
Preferably, there are two heat source-contacting surfaces, two heat source-contacting surfaces are oppositely arranged.
Preferably, radiating fin is arranged on internal face corresponding with heat source-contacting surface.
Preferably, extending direction of the radiating fin along tubular air duct extends.
Preferably, radiator structure is made of aluminium alloy extrusions.
Preferably, the heat source-contacting surface of the heat dissipation base of radiator structure is connect with heating part, constitutes interconnecting piece.
Preferably, interconnecting piece includes thermal conductive material layer or thermally conductive sheet.
Preferably, heating part includes mainboard or chip.
The other side of the utility model additionally provides a kind of intelligent electronic device, including above-mentioned radiator structure and outer
Shell, shell are built-in with heating part, and shell is provided with the air inlet and air outlet of corresponding radiator structure both ends open.
Preferably, shell includes：It is set to the first cover board of shell air inlet, and is set to the second of air outlet of casing
It is provided with ventilation hole on cover board, the first cover board and the second cover board.
Radiator structure provided by the utility model, topology layout is compact, when heat by Heat Conduction Material or is led by heat source
After backing is transferred to the tubular heat dissipation base of radiator structure, due to the high thermal conductivity of radiator structure, heat is rapidly in radiator structure
Interior diffusion, while diffusing on the radiating fin of tubular radiator structure internal face；At this point, passing through air pair in cigarette cylindrical channel
Stream, the heat on radiator structure cylindrical inner wall face and radiating fin is distributed, and substantially improves the heat dissipation effect of radiator structure
Fruit.
To sum up, radiator structure disclosed by the utility model greatly improves in the case where meeting compact structure layout
The heat dissipating state of system, while also saving the manufacturing cost of radiator structure.The smart electronics of above-mentioned radiator structure are used
Equipment not only excellent radiation performance, and it is small, and service life is long.
Description of the drawings
Fig. 1 is the decomposition texture schematic diagram of the utility model intelligent sound box embodiment；
Fig. 2 is the positive direction view of intelligent sound box embodiment shown in Fig. 1；
Fig. 3 is the transverse sectional view at A-A in Fig. 2；
Fig. 4 is the dimensional structure diagram of the radiator structure of intelligent sound box shown in Fig. 1；
In figure：1- shells, the second cover boards of 2-, the first cover boards of 3-, 4- sound box brackets, 5- speaker mainboards, 6- camera modules,
7- cameras, 8-LED lamps, 9- camera wiring boards, 10- mainboard thermally conductive sheets, 11- camera module thermally conductive sheets, 12- heat dissipation knots
Structure, 121- heat dissipation bases, 122- radiating fins, 21- ventilation holes, 31- ventilation holes.
Specific implementation mode
The utility model is further illustrated with reference to the accompanying drawings and examples.
As Fig. 1 to Fig. 3 jointly shown in, radiator structure is applied to a kind of intelligent sound box, the shell 1 of speaker is arranged to cylinder
Shape can also select the shell of such as rectangular other shapes, the shell 1 of speaker to be mounted on sound box bracket 4, and 1 inside of shell is main
Other speaker component (not shown)s such as microphone, the loudspeaker of camera module 6, speaker mainboard 5 and its control are installed.
Camera module 6 includes mainly camera circuit board 9, camera 7 and LED light 8, wherein speaker mainboard 5 and camera circuit board
9 be heating part.
Radiator structure 12 is installed, the outer wall setting of the heat dissipation base 121 of radiator structure 12 connects there are two heat source in shell 1
Contacting surface, speaker mainboard 5 and camera wiring board 9 are connect with a heat source-contacting surface of heat dissipation base 121 respectively.
As shown in figure 4, radiator structure 12 is made of heat dissipation base 121 and radiating fin 122, heat dissipation base 121 is both ends
Be open the tubular construction with tubular air duct, and two heat source-contacting surfaces being arranged in the outer wall of heat dissipation base 121 are oppositely arranged, and are dissipated
Hot fin 122 is arranged on the internal face of heat dissipation base 121, and is preferably provided at internal face corresponding with heat source-contacting surface
On, extending direction of the radiating fin 122 along tubular air duct extends.In the present embodiment, radiator structure 12 is made of aluminium alloy extrusions,
Specifically aluminium extruded type technique is used to be integrally formed.Radiator structure 12 can also select the preferable material of other thermal diffusivities.
Mainboard is provided in order to improve heat conductivity, between speaker mainboard 5 and a heat source-contacting surface of heat dissipation base 121 to lead
It is provided with camera module thermally conductive sheet between another heat source-contacting surface of backing 10, camera wiring board 9 and heat dissipation base 121
11, thermally conductive sheet is preferably heat-conducting silica gel sheet, can also be other materials for being easy to heat conduction.In addition to using thermally conductive sheet, can also divide
Thermal conductive material layer is not coated between two heating parts and the heat source-contacting surface of heat dissipation base 121, thermal conductive material layer, which can be used, leads
Hot silicone grease coating or other materials for being easy to heat conduction.
As shown in Figure 1, shell 1 is provided with the air inlet and air outlet of 12 both ends open of corresponding radiator structure, radiator structure
12 are vertically arranged, and air inlet is set to lower part, and air outlet is set to top, and air inlet is equipped with the first cover board 3, at air outlet
Second cover board 2 is installed, the first cover board 3 offers ventilation hole 31, ventilation hole 21 is offered on the second cover board 2.To prevent dust
Enter in speaker with air-flow, dust cover (not shown) be additionally provided in air inlet, cool ambient air by air inlet into
Enter into the tubular air duct of radiator structure, internal hot-air flows out the external world by air outlet, forms free convection channel, reaches
The purpose of heat dissipation.
The radiating principle of intelligent sound box is as follows：It is fan-free Natural Heat Convection frame inside the intelligent sound box of the present embodiment
Structure, radiator structure 12 are placed vertically, in this way, as chimney, when the heat of speaker mainboard 5 is transferred to by mainboard thermally conductive sheet 10
The heat of heat dissipation base 121, camera wiring board 9 is also transmitted to heat dissipation base 121 by thermally conductive sheet 11, due to radiator structure
High thermal conductivity, heat are spread in radiator structure rapidly, while being diffused on the radiating fin 122 of 121 internal face of heat dissipation base,
Hot-air in tubular air duct is since density is small, under buoyance lift force effect, flows up air outlet above effusion tubular air duct, from
And making the reduction of original region atmospheric density, pressure reduces, and certain pressure difference is formed with external atmosphere pressure.Cool ambient air exists
Under this differential pressure action, entered by the lower section air inlet in tubular air duct, then from the bottom to top, skips over 12 internal face of radiator structure and dissipate
Hot fin 122 radiates, and becomes hot-air, and escape from top air outlet, so recycles, form the nature with suitable flow velocity
Wind.
Alternatively, it is also possible to which in the enclosure of speaker setting radiator fan, radiator structure is used in combination with radiator fan,
Forced convertion heat radiating structure is formed, in such structure, radiator structure 12 need not be arranged vertically, can be according to fan air draught or blowing side
To placement position is adjusted, finally make distinguished and admirable can smoothly skip over tubular heat dissipation wind channel.
To sum up, radiator structure disclosed by the utility model greatly improves in the case where meeting compact structure layout
The heat dissipating state of system, while also saving the manufacturing cost of radiator structure.The intelligent sound box of above-mentioned radiator structure is used
Not only excellent radiation performance, and it is small, and service life is long.
The utility model is not limited to above-mentioned specific embodiment, for example, radiator structure 12 can also be applied to it is other
In intelligent electronic device, the heat source-contacting surface of radiator structure 12 is not limited to two, and particular number can be set according to smart electronics
How much determinations of standby heating part.Those skilled in the art are done from above-mentioned design without performing creative labour
The various transformation gone out, all fall in the scope of protection of the utility model.
Claims (10)
1. a kind of radiator structure, it is applied to the heating part of intelligent electronic device, which is characterized in that the radiator structure includes：It dissipates
Hot basal body and the radiating fin being set on the heat dissipation base；
The heat dissipation base is the tubular construction that both ends open has tubular air duct, and outer wall is provided with heat source-contacting surface, described
Radiating fin is set on the internal face of the heat dissipation base.
2. radiator structure as described in claim 1, which is characterized in that there are two the heat source-contacting surfaces, two heat sources
Contact surface is oppositely arranged.
3. radiator structure as described in claim 1, which is characterized in that radiating fin setting with the heat source-contacting surface
On corresponding internal face.
4. radiator structure as described in claim 1, which is characterized in that extension side of the radiating fin along the tubular air duct
To extension.
5. radiator structure as described in claim 1, which is characterized in that the radiator structure is made of aluminium alloy extrusions.
6. radiator structure as described in claim 1, which is characterized in that the heat source-contacting surface of the heat dissipation base of the radiator structure
It is connect with the heating part, constitutes interconnecting piece.
7. radiator structure as claimed in claim 6, which is characterized in that the interconnecting piece includes thermal conductive material layer or thermally conductive sheet.
8. radiator structure as described in claim 1, which is characterized in that the heating part includes mainboard or chip.
9. a kind of intelligent electronic device, which is characterized in that the intelligent electronic device includes：
Such as claim 1-8 any one of them radiator structures；And
Shell, the shell are built-in with the heating part, the shell be provided with the corresponding radiator structure both ends open into
Air port and air outlet.
10. intelligent electronic device as claimed in claim 9, which is characterized in that the shell includes：Be set to the shell into
First cover board in air port, and it is set to the second cover board of the air outlet of casing, first cover board and second lid
Ventilation hole is provided on plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721796308.7U CN207783398U (en) | 2017-12-20 | 2017-12-20 | A kind of radiator structure and intelligent electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721796308.7U CN207783398U (en) | 2017-12-20 | 2017-12-20 | A kind of radiator structure and intelligent electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207783398U true CN207783398U (en) | 2018-08-28 |
Family
ID=63227057
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721796308.7U Active CN207783398U (en) | 2017-12-20 | 2017-12-20 | A kind of radiator structure and intelligent electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207783398U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110234047A (en) * | 2019-06-04 | 2019-09-13 | 恒大智慧科技有限公司 | Intelligent sound box |
| CN110430490A (en) * | 2019-08-27 | 2019-11-08 | 恒大智慧科技有限公司 | Radiator structure and speaker with the radiator structure |
| CN112074112A (en) * | 2020-08-13 | 2020-12-11 | 华为技术有限公司 | Electronic equipment and extension assembly |
| CN113163677A (en) * | 2021-03-25 | 2021-07-23 | 联想(北京)有限公司 | Electronic equipment |
-
2017
- 2017-12-20 CN CN201721796308.7U patent/CN207783398U/en active Active
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110234047A (en) * | 2019-06-04 | 2019-09-13 | 恒大智慧科技有限公司 | Intelligent sound box |
| CN110430490A (en) * | 2019-08-27 | 2019-11-08 | 恒大智慧科技有限公司 | Radiator structure and speaker with the radiator structure |
| CN112074112A (en) * | 2020-08-13 | 2020-12-11 | 华为技术有限公司 | Electronic equipment and extension assembly |
| CN112074112B (en) * | 2020-08-13 | 2021-10-19 | 华为技术有限公司 | Electronic equipment and extension assembly |
| WO2022033361A1 (en) * | 2020-08-13 | 2022-02-17 | 华为技术有限公司 | Electronic device and extension assembly |
| EP4192210A4 (en) * | 2020-08-13 | 2024-01-24 | Huawei Tech Co Ltd | Electronic device and extension assembly |
| CN113163677A (en) * | 2021-03-25 | 2021-07-23 | 联想(北京)有限公司 | Electronic equipment |
| CN113163677B (en) * | 2021-03-25 | 2023-01-17 | 联想(北京)有限公司 | Electronic equipment |
| US11723169B2 (en) | 2021-03-25 | 2023-08-08 | Lenovo (Beijing) Limited | Electronic apparatus |
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