CN211089430U

CN211089430U - Heat dissipation device of switching power supply

Info

Publication number: CN211089430U
Application number: CN201920087545.9U
Authority: CN
Inventors: 于锁平
Original assignee: Nanjing Bolande Power Technology Development Co ltd
Current assignee: Nanjing Bolande Power Technology Development Co ltd
Priority date: 2019-01-19
Filing date: 2019-01-19
Publication date: 2020-07-24
Anticipated expiration: 2029-01-19

Abstract

The utility model provides a switching power supply's heat abstractor, mainly includes a shell, and this shell has a bottom plate, wallboard and upper cover, the bottom plate is fixed in the bottom of wallboard, the upper cover is fixed in the upper portion of wallboard, the front end of wallboard is equipped with preceding vent, the rear end of wallboard is equipped with the back vent preceding vent with be equipped with a radiator between the back vent, the radiator has a well cavity, is provided with heat radiation fins in the well cavity, the front end and the rear end opening of well cavity, the front end of radiator with the preceding vent of wallboard corresponds the setting, the rear end of radiator with the back vent of wallboard corresponds the setting. The outer surface of the radiator absorbs heat from the shell, the heat flows out of the front vent or the rear vent through the hollow cavity, air flows rapidly in the hollow cavity of the radiator, pollutants are prevented from entering the shell to pollute the circuit module, and the dustproof and waterproof effect is good.

Description

Heat dissipation device of switching power supply

Technical Field

The present invention relates to a switching power supply, and more particularly, to heat dissipation of the switching power supply.

Background

In the known technology, a fan is installed on one side of a switching power supply, and a blowing or exhausting mode is adopted to dissipate heat of a heating component inside the power supply. The life of fan is shorter, but because it is inside the power casing, so it is more troublesome to change, in addition, this kind of radiating mode can bring the dust into inside the casing, can influence inside device work after long-time work very likely, reduces the power life-span.

To the encapsulating power that has waterproof requirement, the inside electronic components of encapsulating power assembles on the fin, and the fin closely laminates the heat dissipation with encapsulating shell top, and power components and parts lead the heat to encapsulating shell top through the heat conduction material, and encapsulating shell top has installed the fan, and fan direct-blow encapsulating shell top. The fan and the glue-pouring shell are finally installed into a whole. The heat dissipation mode of the fan direct-blowing glue-pouring shell has limited heat dissipation effect, so that the power density of the power supply cannot be further improved, and the size of the power supply cannot be smaller.

Disclosure of Invention

The invention is based on the idea that a channel for forced air cooling is arranged in the switching power supply, the channel is composed of radiators, and two side walls in the channel can be fully distributed with toothed heat dissipation fins, so that the heat dissipation area is increased, and good heat dissipation conditions are provided for electronic components of the switching power supply. The fans are arranged at the two ends of the channel, and the fan can be easily replaced without opening the shell. When the switch power supply works, the fan provides heat dissipation for components inside the power supply in a mode of blowing the hollow cavity of the heat radiator.

The utility model provides a switching power supply's heat abstractor, includes a shell, the shell has a bottom plate, wallboard and upper cover, the bottom plate is fixed in the bottom of wallboard, the upper cover is fixed in the upper portion of wallboard, the front end of wallboard is equipped with preceding vent, the rear end of wallboard is equipped with the back vent preceding vent with be equipped with a radiator between the back vent, the radiator has a well cavity, the front end and the rear end opening of well cavity, the front end of radiator with the preceding vent of wallboard corresponds the setting, the rear end of radiator with the back vent of wallboard corresponds the setting.

In a preferred embodiment of the present invention, the hollow cavity is provided with heat dissipation fins therein.

In a preferred embodiment of the present invention, the front vent of the wall plate and the rear vent of the wall plate are formed by perforations.

In a preferred embodiment of the present invention, a first fan is disposed between the front end of the hollow cavity of the heat sink and the front vent of the wall plate.

In a preferred embodiment of the present invention, the circuit module of the switching power supply is disposed on the bottom plate.

In a preferred embodiment of the present invention, the circuit module of the switching power supply is disposed on the outer surface of the heat sink.

In a preferred embodiment of the present invention, a second fan is disposed between the rear end of the cavity in the heat sink and the rear vent of the wall plate.

In a preferred embodiment of the present invention, the circuit module of the switching power supply is disposed in the colloid housing, and the colloid housing is connected to the heat sink to transfer heat to the heat sink.

The utility model discloses a preferred embodiment, the circuit module with the radiator sets up in a colloid shell, the front end and the rear end of cavity expose in the radiator, the front end of cavity with the preceding vent of wallboard corresponds the setting in the radiator, the rear end of radiator with the back vent of wallboard corresponds the setting.

In a preferred embodiment of the present invention, the device on the circuit module is in contact with the outer surface of the heat sink through a heat conductive material, and transfers heat to the heat sink.

Through above-mentioned scheme, the heat that the circuit module produced is absorbed to the radiator to distribute away fast through the air in its cavity, the air flows fast in the cavity of radiator moreover, can avoid the pollutant to get into and pollute circuit module in the shell, has good dustproof and waterproof effect.

In order to make the aforementioned and other features and advantages of the invention more comprehensible, embodiments accompanied with figures are described in detail below.

Drawings

Fig. 1 is an exploded view of a first embodiment of the switching power supply of the present invention.

Fig. 2 is a longitudinal sectional view of the switching power supply of fig. 1.

Fig. 3 is a transverse cross-sectional view of the switching power supply of fig. 1.

Fig. 4 is an exploded view of a switching power supply according to a second embodiment of the present invention.

Fig. 5 is a transverse cross-sectional view of a third embodiment of the switching power supply of the present invention.

Detailed Description

In order to make the purpose and technical solution of the embodiments of the present invention clearer, the technical solution of the embodiments of the present invention will be clearly and completely described below with reference to the drawings of the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention without any inventive step, are within the scope of protection of the invention.

As shown in fig. 1, the first embodiment of the present invention is a switching power supply, which includes a housing 1 and a circuit module 5, where the housing 1 includes a bottom plate 13, a wall plate 12 and an upper cover 11, the bottom plate 13 is fixed to the bottom of the wall plate 12, the upper cover 11 is fixed to the upper portion of the wall plate 12, in this embodiment, a pillar 131 is provided on the bottom plate 13, the pillar 131 passes through the inside of the wall plate 12 and the screw hole 111 on the upper cover 11, the front end of the wall plate 12 is provided with a front vent 121, the rear end of the wall plate 12 is provided with a rear vent 122, the front vent 121 and the rear vent 122 are composed of a plurality of perforations, but the present invention is not limited thereto, and the front vent 121 and the rear vent 122 are an opening.

Referring to fig. 3, a heat sink 2 is disposed between the front vent 121 and the rear vent 122, the heat sink 2 has a hollow cavity 23, and referring to fig. 2, a heat dissipation fin 24 is disposed in the hollow cavity 23, two ends of the hollow cavity 23 are open, namely, a front port 21 and a rear port 22, respectively, to form an air duct. The radiator 2 is fixed in 13 on the bottom plate or on the circuit module 5, the preceding port 21 of radiator 2 with the preceding vent 121 of wallboard 12 corresponds the setting, the back port 22 of radiator 2 with the back vent 122 of wallboard 12 corresponds the setting, the utility model discloses in preferred, the preceding port 21 of radiator 2 with the preceding vent 121 of wallboard 12 and the back port 22 of radiator 2 with the back vent 122 shape and the size of wallboard 12 are the same, or the preceding port 21 of radiator 2 slightly is less than the preceding vent 121 of wallboard 12, the back port 22 of radiator 2 slightly is less than the back vent 122 of wallboard 12, the preceding port 21 of radiator 2 sets up to the shape of loudspeaker mouth so that more air flows through cavity 23 of radiator 2. A fan 4 is disposed between the front port 21 of the heat sink 2 and the front vent 121, and the flow of air in the hollow cavity 23 of the heat sink 2 is accelerated by the suction effect of the fan 4. A fan, not shown in fig. 1, may also be disposed between the rear port 22 of the heat sink 2 and the rear vent 122.

In fig. 2, the heat sink 2 is fixed on the circuit module 5 through a fixing bracket 31, a fixing bracket 32, and a fixing bracket 33, but the present invention is not limited thereto, and the heat sink 2 may also be fixed on the housing 1. The heat sink 2 may also be fixed to the circuit module 5 or the housing 1 by pins.

The bracket 33 is further used for fixing the fan 4, preferably, the fan 4 is fixed in the bracket 33, the bracket 33 is tightly connected with the edge of the front vent 121, so that the air sucked by the fan 4 flows through the hollow cavity 23 of the heat sink 2, but does not flow through the inside of the housing 1.

The outer surface of the heat sink 2 absorbs heat from the inside of the housing 1, and flows out of the front vent 121 or the rear vent 122 through the hollow cavity 23.

The utility model discloses in circuit module 5 is fixed in on the bottom plate 13, the part components and parts on circuit module 5 can directly transmit the heat for through media such as metal or heat conduction silicone grease radiator 2 to the heat dissipation of components and parts in the circuit module 5 is accelerated.

The present invention is preferable that the circuit module 5 is further fixable to the outer surface of the heat sink 5.

In an application occasion with a waterproof requirement, the circuit module 5 is wrapped by a colloid, as shown in fig. 5, the switching power supply includes two circuit modules 5, the circuit modules 5 are separated from two sides of the heat sink 2, the circuit modules 5 have colloid shells 51, and the colloid shells 51 of the circuit modules 5 are close to the heat sink 2 for heat dissipation. Referring to fig. 5, heat generated by circuit components in the circuit module 5 is transferred to the heat sink 2 through the colloid housing 51, and the heat sink 2 dissipates the heat through the hollow cavity 23.

Referring to fig. 4 again, in another embodiment of the present invention, in this embodiment, the circuit module 5 and the heat sink 2 are wrapped by glue to form a glue-pouring module 6, the glue-pouring module 6 is fixed on the shell 12 through the exposed edges of the front port 21 and the rear port 22 of the heat sink 2, the front port 21 of the heat sink 2 corresponds to the front vent 121 of the wall plate 12, and the rear port 22 of the heat sink 2 corresponds to the rear vent 122 of the wall plate 12.

The utility model discloses in, the air flows fast in the cavity intracavity of radiator, has avoided the pollutant to get into and has polluted circuit module in the shell, has good dustproof and waterproof effect.

Although the present invention has been described with reference to the above embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention.

Claims

1. The utility model provides a switching power supply's heat abstractor, its characterized in that, includes a shell, the shell has a bottom plate, wallboard and upper cover, the bottom plate is fixed in the bottom of wallboard, the upper cover is fixed in the upper portion of wallboard, the front end of wallboard is equipped with preceding vent, the rear end of wallboard is equipped with the back vent preceding vent with be equipped with a radiator between the back vent, the radiator has a well cavity, well cavity front end and rear end opening, the front end of radiator with the preceding vent of wallboard corresponds the setting, the rear end of radiator with the back vent of wallboard corresponds the setting.

2. The heat dissipating device for a switching power supply according to claim 1, wherein the hollow cavity has heat dissipating fins disposed therein.

3. The heat dissipating device for a switching power supply according to claim 1, wherein the front vent of the wall plate and the rear vent of the wall plate are formed of perforations.

4. The heat dissipating device for a switching power supply according to claim 1, wherein a first fan is disposed between a front end of the cavity of the heat sink and the front vent of the wall plate.

5. The heat dissipation device of claim 1, wherein the circuit module of the switching power supply is disposed on the bottom plate.

6. The heat dissipation device of claim 1, wherein the circuit module of the switching power supply is disposed on an outer surface of the heat sink.

7. The heat dissipating device for a switching power supply according to claim 4, wherein a second fan is disposed between a rear end of the cavity of the heat sink and the rear vent of the wall plate.

8. The heat dissipation device of a switching power supply according to claim 1, wherein the circuit module of the switching power supply is disposed in a colloid housing, and the colloid housing is connected to the heat sink to transfer heat to the heat sink.

9. The heat dissipating device for a switching power supply according to claim 6, wherein the circuit module and the heat sink are disposed in a gel housing, and a front end and a rear end of a cavity of the heat sink are exposed.

10. The heat dissipating device for the switching power supply according to claim 5 or 6, wherein the device on the circuit module is in contact with an outer surface of the heat sink through a heat conductive material to transfer heat to the heat sink.