CN212276036U

CN212276036U - Novel SFP optical module heat radiation structure

Info

Publication number: CN212276036U
Application number: CN202020569224.5U
Authority: CN
Inventors: 周四海; 孙全意; 齐鹏远
Original assignee: Sunus Photoelectronic Wuxi Co ltd
Current assignee: Sunus Photoelectronic Wuxi Co ltd
Priority date: 2020-04-16
Filing date: 2020-04-16
Publication date: 2021-01-01
Anticipated expiration: 2030-04-16

Abstract

The utility model discloses a novel SFP optical module heat radiation structure, including casing, optical module body and top cap, the inner wall movable mounting of casing has the optical module body, the inner wall fixedly connected with of casing cuts off the frame, the louvre has been seted up on the surface that cuts off the frame, the last fixed surface who cuts off the frame is connected with the fin, the inner wall swing joint who cuts off the frame has the heat conduction to glue the piece, the last fixed surface of top cap is connected with the stationary blade, the equal fixedly connected with card frame in both sides of casing, the inner wall of card frame with the surface swing joint of stationary blade. This neotype SFP optical module heat radiation structure through the cooperation setting between casing, wall frame, louvre and the fin, can make the produced heat of optical module body when the operation give off the outside by wall frame and fin, and because the inside cavity that leaves of wall frame can avoid because adopt zonulae occludens between casing and the optical module body to the heat dissipation difficulty that leads to.

Description

Novel SFP optical module heat radiation structure

Technical Field

The utility model relates to a SFP optical module technical field specifically is a novel SFP optical module heat radiation structure.

Background

The SFP optical module is a hot-plug small-package module and can be simply understood as an upgrade version of a GBIC (ground-based integrated circuit), the volume of the SFP optical module is reduced by half compared with that of the GBIC module, the SFP optical module is only thumb-sized, more than one time of ports can be configured on the same panel, the SFP optical module is more and more widely applied along with the development of the society, and the SFP optical module has smaller volume and higher running speed, so the heat generation is relatively larger.

The existing SFP optical module has poor heat dissipation effect, is easy to lose working performance due to heating in the operation process, and is even scrapped, so that the service life is greatly reduced, and the heat dissipation structure of the existing SFP optical module is mostly tightly connected with the protective shell, so that the heat dissipation performance is further reduced.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

Not enough to prior art, the utility model provides a novel SFP optical module heat radiation structure has solved the problem that proposes in the above-mentioned background art.

(II) technical scheme

In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: the utility model provides a novel SFP optical module heat radiation structure, includes casing, optical module body and top cap, the inner wall movable mounting of casing has the optical module body, the inner wall fixedly connected with of casing cuts off the frame, the louvre has been seted up on the surface that cuts off the frame, the last fixed surface who cuts off the frame is connected with the fin, the inner wall swing joint who cuts off the frame has the heat conduction to glue the piece, the last fixed surface of top cap is connected with the stationary blade, the equal fixedly connected with card frame in both sides of casing, the inner wall of card frame with the surface swing joint of stationary blade.

Optionally, a through hole is formed in the surface of the top cover, and the inner wall of the through hole is movably connected with the surface of the radiating fin.

Optionally, the inner side wall of the partition frame is fixedly connected with a partition plate, and one end of the partition frame is movably connected with a baffle plate.

Optionally, the number of the fixing pieces is four, and the four fixing pieces are fixedly connected to the upper surface of the top cover in a rectangular array.

Optionally, the heat sink is made of copper, and the heat conducting rubber block is made of silica gel.

(III) advantageous effects

The utility model provides a novel SFP optical module heat radiation structure, possess following beneficial effect:

1. this neotype SFP optical module heat radiation structure through the cooperation setting between casing, wall frame, louvre and the fin, can make the produced heat of optical module body when the operation give off the outside by wall frame and fin, and because the inside cavity that leaves of wall frame can avoid because adopt zonulae occludens between casing and the optical module body to the heat dissipation difficulty that leads to.

2. This novel SFP optical module heat radiation structure through the cooperation setting between casing, top cap, louvre and the heat conduction glue piece, can make the fin not have the heat of heat dissipation, through the heat conduction glue piece to conduct the top cap, give off the outside via the top cap, also can reach radiating purpose, make the device can be convenient for dispel the heat convenient to use to the optical module body.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is an exploded view of the present invention;

FIG. 3 is a schematic view of the housing structure of the present invention;

FIG. 4 is an enlarged schematic view of the structure at A of FIG. 1 according to the present invention;

FIG. 5 is an enlarged schematic view of the structure of FIG. 3B according to the present invention;

fig. 6 is a schematic view of the structure of the thermal conductive adhesive block of the present invention.

In the figure: 1. a housing; 2. an optical module body; 3. a top cover; 4. a partition frame; 5. heat dissipation holes; 6. a heat sink; 7. a heat-conducting rubber block; 8. a fixing sheet; 9. clamping a frame; 10. a through hole; 11. a partition plate; 12. and a baffle plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1 to 6, the present invention provides a technical solution: a novel SFP optical module heat radiation structure comprises a shell 1, an optical module body 2 and a top cover 3, wherein the optical module body 2 is movably arranged on the inner wall of the shell 1;

in order to enable the utility model to facilitate heat dissipation between the tightly connected casing 1 and the optical module body 2, therefore, a partition frame 4 is fixedly connected to the inner wall of the casing 1, a heat dissipation hole 5 is opened on the surface of the partition frame 4, a heat dissipation fin 6 is fixedly connected to the upper surface of the partition frame 4, through the matching arrangement between the casing 1, the partition frame 4, the heat dissipation hole 5 and the heat dissipation fin 6, the heat generated during the operation of the optical module body 2 can be dissipated to the outside by the partition frame 4 and the heat dissipation fin 6, and because a cavity is left inside the partition frame 4, the tight connection between the casing 1 and the optical module body 2 can be avoided, thereby leading to the difficulty in heat dissipation;

in order to facilitate the heat dissipation of the optical module body 2, a heat conducting rubber block 7 is movably connected to the inner wall of the partition frame 4, the heat dissipating fin 6 does not dissipate heat through the matching arrangement of the shell 1, the top cover 3, the heat dissipating holes 5 and the heat conducting rubber block 7, the heat conducting rubber block 7 is used for conducting heat to the top cover 3 and dissipating the heat to the outside through the top cover 3, and the purpose of heat dissipation can be achieved, so that the device can facilitate the heat dissipation of the optical module body 2 and is convenient to use, the upper surface of the top cover 3 is fixedly connected with a fixing sheet 8, the two sides of the shell 1 are both fixedly connected with clamping frames 9, the inner wall of each clamping frame 9 is movably connected with the surface of the fixing sheet 8, the surface of the top cover 3 is provided with a through hole 10, the inner wall of the through hole 10 is movably connected with the surface of the heat dissipating fin 6, the inner side, the quantity of stationary blade 8 is four, and four stationary blades 8 use the form fixed connection of rectangular array at the upper surface of top cap 3, and the material of fin 6 is copper, and the material of heat conduction glue piece 7 is silica gel, and stationary blade 8 can be pulled, thereby inserts the inside back of card frame when stationary blade 8, through pulling the relative position between stationary blade 8 fixed casing 1 and top cap 3.

To sum up, in the novel SFP optical module heat dissipation structure, when in use, the heat conducting rubber block 7 is installed inside the partition frame 4, and the top of the heat conducting rubber block 7 is in contact with the lower surface of the top cover 3, through the matching arrangement among the housing 1, the partition frame 4, the heat dissipation holes 5 and the heat dissipation fins 6, the heat generated by the optical module body 2 during operation can be dissipated to the outside through the partition frame 4 and the heat dissipation fins 6, and because the cavity is left inside the partition frame 4, the difficulty in heat dissipation caused by the tight connection between the housing 1 and the optical module body 2 can be avoided, through the matching arrangement among the housing 1, the top cover 3, the heat dissipation holes 5 and the heat conducting rubber block 7, the heat which is not dissipated by the heat conducting rubber block 7 can be conducted to the top cover 3 and dissipated to the outside through the top cover 3, the purpose of heat dissipation can be achieved, so that the device can conveniently dissipate the heat of the optical module, is convenient for use.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. The utility model provides a novel SFP optical module heat radiation structure, includes casing (1), optical module body (2) and top cap (3), its characterized in that: the optical module comprises a shell (1), an optical module body (2) and a partition frame (4) fixedly connected with the inner wall of the shell (1), heat dissipation holes (5) are formed in the surface of the partition frame (4), heat dissipation fins (6) are fixedly connected with the upper surface of the partition frame (4), a heat conduction rubber block (7) is movably connected with the inner wall of the partition frame (4), a fixing piece (8) is fixedly connected with the upper surface of a top cover (3), clamping frames (9) are fixedly connected with the two sides of the shell (1), and the inner wall of each clamping frame (9) is movably connected with the surface of the corresponding fixing piece (8).

2. The novel SFP optical module heat dissipation structure as defined in claim 1, wherein: the surface of the top cover (3) is provided with a through hole (10), and the inner wall of the through hole (10) is movably connected with the surface of the radiating fin (6).

3. The novel SFP optical module heat dissipation structure as defined in claim 1, wherein: the inner side wall of the partition frame (4) is fixedly connected with a partition plate (11), and one end of the partition frame (4) is movably connected with a baffle plate (12).

4. The novel SFP optical module heat dissipation structure as defined in claim 1, wherein: the number of the fixing pieces (8) is four, and the four fixing pieces (8) are fixedly connected to the upper surface of the top cover (3) in a rectangular array mode.

5. The novel SFP optical module heat dissipation structure as defined in claim 1, wherein: the material of fin (6) is copper, the material of heat-conducting rubber piece (7) is silica gel.