CN220755279U - Insulating multilayer aluminum-based circuit board - Google Patents
Insulating multilayer aluminum-based circuit board Download PDFInfo
- Publication number
- CN220755279U CN220755279U CN202322263779.3U CN202322263779U CN220755279U CN 220755279 U CN220755279 U CN 220755279U CN 202322263779 U CN202322263779 U CN 202322263779U CN 220755279 U CN220755279 U CN 220755279U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- layer
- aluminum
- based circuit
- damper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 32
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 32
- 239000004411 aluminium Substances 0.000 claims abstract description 6
- 230000017525 heat dissipation Effects 0.000 claims description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 14
- 238000010521 absorption reaction Methods 0.000 claims description 9
- 239000000945 filler Substances 0.000 claims description 7
- 239000003063 flame retardant Substances 0.000 claims description 7
- 239000004745 nonwoven fabric Substances 0.000 claims description 5
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 4
- 238000013016 damping Methods 0.000 description 6
- 230000035939 shock Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The application relates to the technical field of multilayer aluminum-based circuit boards and discloses an insulating multilayer aluminum-based circuit board. In this application, four spouts have been seted up on the surface of mounting panel, the slider has been placed to the inside of spout, the upper end fixedly connected with fixed block of slider, the surface connection of fixed block has the connecting rod, the other end swing joint of connecting rod has the spliced pole, the other end fixedly connected with spliced pole, the bottom of spliced pole is connected with damper, damper's the other end is connected with the mounting panel, the surface connection of fixed column has the bolt, the one end fixedly connected with pull ring of bolt can alleviate impact force through damper when aluminium base circuit board takes place to shake, and the slider of being connected with the fixed block can slide in the inside of spout, and the bolt of being connected with the fixed column can ask the circuit board, and this setting can alleviate vibrations through damper and slider's combination by a wide margin to can protect the circuit board.
Description
Technical Field
The application belongs to the technical field of circuit boards, and particularly relates to an insulating multilayer aluminum-based circuit board.
Background
The circuit board is also called as a circuit board, and the name of the circuit board is as follows: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, PCB boards, aluminum substrates, high frequency boards, thick copper plates, impedance boards, PCBs, ultra-thin circuit boards, printed (copper etching technology) circuit boards, etc., which make circuits miniaturized, visualized, play an important role in mass production of fixed circuits and optimizing the layout of electrical appliances, and are classified into three major categories of single-sided boards, double-sided boards, and multi-layer circuit boards, if the circuit boards are classified by the number of layers.
The utility model discloses an aluminium base circuit board of high load, including mounting panel, circuit layer, high load insulating layer and radiating component, high load insulating layer includes non-woven fabrics layer, fire-retardant layer, filler layer and high temperature resistant layer, the bottom on non-woven fabrics layer is provided with fire-retardant layer, the bottom on fire-retardant layer is provided with the filler layer, the bottom on filler layer is provided with the high temperature resistant layer. According to the utility model, the high-load insulating layer is arranged, so that the aluminum-based circuit board can work normally when the load is large, the normal use of the circuit layer is not affected, the heat dissipation assembly is arranged, the aluminum-based circuit board can be ensured to be used stably and normally when the load is high, the problems that the load of the aluminum-based circuit board is higher and higher, the heating value of the aluminum-based circuit board is increased, and if the temperature of the aluminum-based circuit board cannot be reduced in time, the aluminum-based circuit board is extremely fragile and cannot well meet the daily demands of people are solved.
However, in this application, although the heat dissipation structure is provided, there is no buffer structure, and excessive vibration easily damages the electrical components in the circuit board, and the service life thereof is easily affected.
Disclosure of Invention
The purpose of the present application is: in order to solve the damping problem, an insulating multilayer aluminum-based circuit board is provided.
The technical scheme adopted by the application is as follows: the utility model provides an aluminium base circuit board of insulating multilayer, includes the mounting panel, four spouts have been seted up on the surface of mounting panel, the slider has been placed to the inside of spout, the upper end fixedly connected with fixed block of slider, the surface connection of fixed block has the connecting rod, the other end swing joint of connecting rod has the spliced pole, the other end fixedly connected with fixed column of spliced pole, the bottom of fixed column is connected with damper, damper's the other end is connected with the mounting panel, the surface connection of fixed column has the bolt, the one end fixedly connected with pull ring of bolt.
Through adopting above-mentioned technical scheme, when aluminium base circuit board takes place to shake, can slow down the impact force through damper, and damper connects the fixed column both ends are connected with the spliced pole, and the other end swing joint of two spliced poles has the connecting rod, and the other end of connecting rod is connected with the fixed block, and the slider of being connected with the fixed block can slide in the inside of spout, and the draw bolt of being connected with the fixed column can ask the circuit board, and this setting can slow down vibrations by a wide margin through damper and slider's combination to can protect the circuit board.
In a preferred embodiment, four mounting holes are formed around the outer surface of the mounting plate.
By adopting the technical scheme, the mounting holes are convenient for the installation of the circuit board and other components.
In a preferred embodiment, a limiting frame is arranged in the upper end of the fixing column, the pull bolt penetrates through the fixing column to be connected with a clamping plate, a spring is arranged in the limiting frame, and the surface of the pull bolt is connected with the spring.
Through adopting above-mentioned technical scheme, spacing frame can play limiting displacement to spring and draw bolt, and the splint of being convenient for are better firm to the circuit board.
In a preferred embodiment, the inner side of the clamping plate is connected with a circuit board layer and an insulating layer, the lower part of the circuit board layer is connected with the insulating layer, and the lower part of the insulating layer is connected with a substrate.
Through adopting above-mentioned technical scheme, the protection circuit board that the multilayer sets up can be better improves work efficiency greatly.
In a preferred embodiment, a heat absorbing plate is connected to the lower portion of the base plate, heat absorbing strips are arranged on two sides of the base plate, a plurality of second heat dissipation copper tubes are arranged below the heat absorbing plate, and fixing columns are connected to two ends of the heat absorbing plate.
Through adopting above-mentioned technical scheme, absorber plate and heat absorption strip can absorb the heat, and heat dissipation copper pipe two can give off the heat, improves the life-span of circuit board.
In a preferred embodiment, the insulating layer is internally provided with a nonwoven layer, a flame retardant layer, a filler layer and a high temperature resistant layer.
Through adopting above-mentioned technical scheme, this setting has still added high temperature resistant when insulating, can protect the circuit board by a wide margin.
In a preferred embodiment, the upper surface of the circuit board layer is provided with a plurality of heat dissipation holes, and a first heat dissipation copper pipe is arranged in the middle of the circuit board layer.
By adopting the technical scheme, heat can be conducted out through the first heat dissipation copper pipe, and the heat dissipation holes can be used for rapidly dissipating heat.
In summary, due to the adoption of the technical scheme, the beneficial effects of the application are as follows:
in this application, when aluminium base circuit board takes place to shake, can slow down the impact force through damper, and the fixed column both ends that damper connects are connected with the spliced pole, and the other end swing joint of two spliced poles has the connecting rod, and the other end of connecting rod is connected with the fixed block, and the slider of being connected with the fixed block can slide in the inside of spout, and the draw bolt of being connected with the fixed column can ask the circuit board, and this setting can slow down vibrations by a wide margin through damper and slider's combination to can protect the circuit board.
Drawings
Fig. 1 is a schematic top view of an aluminum-based circuit board of the present application;
FIG. 2 is a schematic side view of an aluminum-based circuit board in the present application;
fig. 3 is a schematic cross-sectional structure of an aluminum-based circuit board in the present application.
The marks in the figure: 1. a mounting plate; 2. a chute; 3. a mounting hole; 4. a heat absorbing plate; 5. a wiring board layer; 6. an insulating layer; 61. a non-woven fabric layer; 62. a flame retardant layer; 63. a filler layer; 64. a high temperature resistant layer; 7. a substrate; 8. a heat radiation hole; 9. a first heat dissipation copper pipe; 10. fixing the column; 11. a pull ring; 12. pulling a bolt; 13. a clamping plate; 14. a heat absorbing strip; 15. a second heat dissipation copper pipe; 16. a connecting column; 17. a shock absorbing assembly; 18. a connecting rod; 19. a fixed block; 20. a slide block; 21. a limit frame; 22. and (3) a spring.
Detailed Description
For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
Examples:
referring to fig. 1-3, an insulation multilayer aluminum-based circuit board comprises a mounting plate 1, four sliding grooves 2 are formed in the surface of the mounting plate 1, sliding blocks 20 are arranged in the sliding grooves 2, fixed blocks 19 are fixedly connected to the upper ends of the sliding blocks 20, connecting rods 18 are connected to the surface of the fixed blocks 19, connecting rods 16 are movably connected to the other ends of the connecting rods 18, fixed columns 10 are fixedly connected to the other ends of the connecting rods 16, damping components 17 are connected to the bottom ends of the fixed columns 10, the other ends of the damping components 17 are connected to the mounting plate 1, a pull bolt 12 is connected to the outer surface of the fixed columns 10, one end of the pull bolt 12 is fixedly connected with a pull ring 11, when the aluminum-based circuit board vibrates, impact force can be relieved through the damping components 17, two ends of the fixed columns 10 connected with the damping components 17 are connected with the connecting rods 16, the other ends of the connecting rods 18 are connected with the fixed blocks 19, the sliding blocks 20 connected with the sliding blocks 19 can slide in the inner parts of the sliding grooves 2, the pull bolt 12 connected with the fixed columns 10 can be used for the circuit board, and the circuit board can be protected by combining the damping components 17 with the sliding components greatly.
Referring to fig. 1, four mounting holes 3 are formed around the outer surface of the mounting plate 1, and the mounting holes 3 facilitate mounting of the circuit board and other components.
Referring to fig. 3, a limiting frame 21 is arranged inside the upper end of the fixing column 10, the pull bolt 12 penetrates through the fixing column 10 to be connected with the clamping plate 13, a spring 22 is arranged inside the limiting frame 21, the surface of the pull bolt 12 is connected with the spring 22, and the limiting frame 21 can limit the spring 22 and the pull bolt 12, so that the clamping plate 13 can be better and stably connected with the circuit board.
Referring to fig. 1-3, the inner side of the clamping plate 13 is connected with the circuit board layer 5 and the insulating layer 6, the lower part of the circuit board layer 5 is connected with the insulating layer 6, the lower part of the insulating layer 6 is connected with the substrate 7, and the multilayer arrangement can better protect the circuit board, so that the working efficiency is greatly improved.
Referring to fig. 3, the heat absorbing plate 4 is connected to the lower portion of the base plate 7, heat absorbing strips 14 are disposed on two sides of the base plate 7, a plurality of second heat dissipation copper tubes 15 are disposed under the heat absorbing plate 4, fixing columns 10 are connected to two ends of the heat absorbing plate 4, the heat absorbing plate 4 and the heat absorbing strips 14 can absorb heat, the second heat dissipation copper tubes 15 can dissipate heat, and service life of the circuit board is prolonged.
Referring to fig. 3, the insulating layer 6 is provided with a nonwoven fabric layer 61, a flame retardant layer 62, a filler layer 63 and a high temperature resistant layer 64, and the insulating layer is insulated and also has high temperature resistance, so that the circuit board can be largely protected.
Referring to fig. 1, a plurality of heat dissipation holes 8 are formed in the upper surface of the circuit board layer 5, a first heat dissipation copper pipe 9 is arranged in the middle of the circuit board layer 5, heat can be conducted out through the first heat dissipation copper pipe 9, and the heat dissipation holes 8 can be used for rapidly dissipating heat.
The implementation principle of the embodiment of the insulating multilayer aluminum-based circuit board is as follows:
when the aluminum-based circuit board vibrates, impact force can be relieved through the shock absorption component 17, the two ends of the fixed column 10 connected with the shock absorption component 17 are connected with the connecting columns 16, the other ends of the two connecting columns 16 are movably connected with the connecting rods 18, the other ends of the connecting rods 18 are connected with the fixed blocks 19, the sliding blocks 20 connected with the fixed blocks 19 slide in the sliding grooves 2, the pull bolts 12 connected with the fixed columns 10 can be used for asking the circuit board, and vibration can be relieved greatly through the combination of the shock absorption component 17 and the sliding component, so that the circuit board can be protected.
The above embodiments are only for illustrating the technical solution of the present application, and are not limiting thereof; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the corresponding technical solutions.
Claims (7)
1. An insulating multilayer aluminium base circuit board, includes mounting panel (1), its characterized in that: four spouts (2) have been seted up on the surface of mounting panel (1), slider (20) have been placed to the inside of spout (2), the upper end fixedly connected with fixed block (19) of slider (20), the surface connection of fixed block (19) has connecting rod (18), the other end swing joint of connecting rod (18) has spliced pole (16), the other end fixedly connected with fixed column (10) of spliced pole (16), the bottom of fixed column (10) is connected with damper (17), the other end of damper (17) is connected with mounting panel (1), the surface connection of fixed column (10) has draw bolt (12), the one end fixedly connected with pull ring (11) of draw bolt (12).
2. The insulated multi-layer aluminum-based circuit board of claim 1, wherein: four mounting holes (3) are formed in the periphery of the outer surface of the mounting plate (1).
3. The insulated multi-layer aluminum-based circuit board of claim 1, wherein: the fixing device is characterized in that a limiting frame (21) is arranged inside the upper end of the fixing column (10), a clamp plate (13) penetrates through the fixing column (10), a spring (22) is arranged inside the limiting frame (21), and the surface of the pulling bolt (12) is connected with the spring (22).
4. The insulated multi-layer aluminum-based circuit board of claim 3, wherein: the inside of splint (13) is connected with circuit board layer (5) and insulating layer (6), the below of circuit board layer (5) is connected with insulating layer (6), the below of insulating layer (6) is connected with base plate (7).
5. The insulating multilayer aluminum-based circuit board of claim 4, wherein: the heat absorption plate is characterized in that the heat absorption plate (4) is connected to the lower portion of the base plate (7), heat absorption strips (14) are arranged on two sides of the base plate (7), a plurality of heat dissipation copper tubes (15) are arranged below the heat absorption plate (4), and fixing columns (10) are connected to the two ends of the heat absorption plate (4).
6. The insulating multilayer aluminum-based circuit board of claim 4, wherein: the insulating layer (6) is internally provided with a non-woven fabric layer (61), a flame-retardant layer (62), a filler layer (63) and a high-temperature-resistant layer (64).
7. The insulating multilayer aluminum-based circuit board of claim 4, wherein: a plurality of heat dissipation holes (8) are formed in the upper surface of the circuit board layer (5), and a first heat dissipation copper pipe (9) is arranged in the middle of the circuit board layer (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322263779.3U CN220755279U (en) | 2023-08-23 | 2023-08-23 | Insulating multilayer aluminum-based circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322263779.3U CN220755279U (en) | 2023-08-23 | 2023-08-23 | Insulating multilayer aluminum-based circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220755279U true CN220755279U (en) | 2024-04-09 |
Family
ID=90554337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322263779.3U Active CN220755279U (en) | 2023-08-23 | 2023-08-23 | Insulating multilayer aluminum-based circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220755279U (en) |
-
2023
- 2023-08-23 CN CN202322263779.3U patent/CN220755279U/en active Active
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| GR01 | Patent grant |