CN219627982U

CN219627982U - Improved HDI high-density laminated circuit board

Info

Publication number: CN219627982U
Application number: CN202320460641.XU
Authority: CN
Inventors: 吴利辉; 吴会龙; 吴伟红
Original assignee: Shenzhen Wanchuangxing Electronics Co ltd
Current assignee: Shenzhen Wanchuangxing Electronics Co ltd
Priority date: 2023-03-13
Filing date: 2023-03-13
Publication date: 2023-09-01
Anticipated expiration: 2033-03-13

Abstract

The utility model discloses an improved HDI high-density laminated circuit board which comprises a main body board, wherein a plurality of installation seats are installed on the outer surface of the main body board, positioning sleeves are installed on the upper surfaces of the installation seats, positioning sliding rods are embedded on the inner surfaces of the positioning sleeves, movable seats are welded on the outer surfaces of the positioning sliding rods, mounting frames are welded on the outer surfaces of the movable seats, sliding sleeves are welded on the outer surfaces of the mounting frames, rotating grooves are formed in the inner surfaces of the sliding sleeves, rotating blocks are embedded on the inner surfaces of the rotating grooves, and regulating blocks are welded on the upper surfaces of the rotating blocks. According to the improved HDI high-density laminated circuit board, the mounting frame is welded on the outer surface of the movable seat, the threaded rod is welded on the outer surface of the fixed seat, then the adjusting block is welded on the outer surface of the rotating block embedded in the rotating groove, and the distance between the inner surface of the threaded sleeve and the outer surface of the threaded rod is conveniently adjusted by using the threaded connection between the inner surface of the threaded sleeve and the outer surface of the threaded rod, so that the problem that heat cannot be rapidly dissipated due to too narrow distance can be avoided.

Description

Improved HDI high-density laminated circuit board

Technical Field

The utility model belongs to the technical field of circuit boards, and particularly relates to an improved HDI high-density laminated circuit board.

Background

The HDI high-density circuit board is a circuit board with relatively high circuit distribution density by using micro blind buried hole technology, and is provided with an inner layer circuit and an outer layer circuit, and the inner part of each layer of circuit is connected by using processes such as drilling, in-hole metallization and the like.

When the existing HDI circuit board is manufactured by adopting a lamination method, the interval between the circuit boards is fixed and cannot be adjusted, and the heat dissipation capacity of the circuit boards used in different electronic equipment is different, so that the heat cannot be rapidly dissipated due to the fact that the interval is too narrow; and because the circuit structure is precise and complex and the blind hole density is high, the circuit on the circuit board is easy to be damaged to a certain extent after the blind hole collides with other elements. Therefore, we propose an improved HDI high density build-up wiring board.

Disclosure of Invention

The utility model aims to provide an improved HDI high-density laminated circuit board which can effectively solve the problems in the background technology.

In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:

the utility model relates to an improved HDI high-density laminated circuit board which comprises a main body board, wherein a plurality of installation seats are arranged on the outer surface of the main body board, positioning sleeves are arranged on the upper surface of the installation seats, positioning slide bars are embedded on the inner surfaces of the positioning sleeves, movable seats are welded on the outer surfaces of the positioning slide bars, mounting frames are welded on the outer surfaces of the movable seats, sliding sleeves are welded on the outer surfaces of the mounting frames, rotating grooves are formed in the inner surfaces of the sliding sleeves, rotating blocks are embedded on the inner surfaces of the rotating grooves, regulating blocks are welded on the upper surfaces of the rotating blocks, threaded sleeves are welded on the outer surfaces of the regulating blocks, fixing seats are welded on the lower surfaces of the movable seats, threaded rods are welded on the lower surfaces of the fixing seats, the inner surfaces of the threaded sleeves are in threaded connection with the outer surfaces of the threaded rods, and then the regulating blocks are welded on the outer surfaces of the rotating blocks embedded in the rotating grooves.

Preferably, the mount pad upper surface welding has the mount pad, it has the removal sleeve to remove the welding of mount pad lower surface, the mount sleeve internal surface gomphosis has damping spring, damping spring external surface gomphosis is at the removal sleeve internal surface, positioning sleeve internal surface welding has the mounting panel, positioning slide bar lower surface welding has the connecting plate, surface mounting has the attenuator on the mounting panel, the attenuator upper surface is connected with the connecting plate lower surface, through with the mount pad welding at the mount pad surface and with remove the sleeve welding at the mount pad surface, then installs at mount pad and removal sleeve internal surface with damping spring, utilizes the installation of mounting panel and connecting plate surface attenuator simultaneously to conveniently carry out shock attenuation protection to the main part board, thereby can avoid the main part board to bump the problem of the circuit damage on the main part board after appearance with other components.

Preferably, the main body plate comprises a copper foil layer and a plate body, wherein the substrate layer is arranged on the outer surface of the copper foil layer, the heat conducting layer is arranged on the outer surface of the substrate layer, the heat radiating layer is arranged on the outer surface of the plate body, the outer surface of the heat radiating layer is connected with the outer surface of the heat conducting layer, and the insulating layer is arranged on the outer surface of the plate body.

The utility model has the following beneficial effects:

1. according to the utility model, the mounting frame is welded on the outer surface of the movable seat, the threaded rod is welded on the outer surface of the fixed seat, and then the adjusting block is welded on the outer surface of the rotating block embedded in the rotating groove, so that the distance between the main body plates is conveniently adjusted by utilizing the threaded connection between the inner surface of the threaded sleeve and the outer surface of the threaded rod, and the problem that heat cannot be rapidly dissipated due to too narrow distance can be avoided.

2. According to the utility model, the mounting sleeve is welded on the outer surface of the mounting seat, the movable sleeve is welded on the outer surface of the movable seat, then the damping springs are mounted on the inner surfaces of the mounting sleeve and the movable sleeve, and meanwhile, the mounting plate and the damper on the outer surface of the connecting plate are utilized for mounting, so that the damping protection of the main body plate is facilitated, and the problem that the circuit on the main body plate is damaged after the main body plate collides with other elements can be avoided.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of an improved HDI high-density laminated circuit board according to the present utility model;

FIG. 2 is a schematic diagram of a front view of an improved HDI high-density laminated circuit board according to the present utility model;

FIG. 3 is a schematic view of the cross-sectional structure A-A in FIG. 2;

FIG. 4 is an enlarged partial view of portion A of FIG. 3;

fig. 5 is a schematic cross-sectional view of a body plate according to the present utility model.

In the figure: 1. a main body plate; 2. a mounting base; 3. a mounting sleeve; 4. positioning a sleeve; 5. positioning a slide bar; 6. a movable seat; 7. a mounting frame; 8. a sliding sleeve; 9. a rotating groove; 10. a rotating block; 11. an adjusting block; 12. a threaded sleeve; 13. a threaded rod; 14. moving the sleeve; 15. a damping spring; 16. a mounting plate; 17. a connecting plate; 18. a damper; 19. a fixing seat; 101. a copper foil layer; 102. a substrate layer; 103. a heat conducting layer; 104. a heat dissipation layer; 105. a plate body; 106. an insulating layer.

Detailed Description

The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.

In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

As shown in fig. 1-5, an improved HDI high-density laminated circuit board comprises a main body board 1, a plurality of installation seats 2 are installed on the outer surface of the main body board 1, a positioning sleeve 4 is installed on the upper surface of the installation seat 2, a positioning slide rod 5 is embedded on the inner surface of the positioning sleeve 4, a movable seat 6 is welded on the outer surface of the positioning slide rod 5, a mounting frame 7 is welded on the outer surface of the movable seat 6, a sliding sleeve 8 is welded on the outer surface of the mounting frame 7, a rotating groove 9 is arranged on the inner surface of the sliding sleeve 8, a rotating block 10 is embedded on the inner surface of the rotating groove 9, an adjusting block 11 is welded on the upper surface of the rotating block 10, a threaded sleeve 12 is welded on the outer surface of the adjusting block 11, a fixing seat 19 is welded on the lower surface of the movable seat 6, a threaded rod 13 is welded on the lower surface of the fixing seat 19, and the inner surface of the threaded sleeve 12 is in threaded connection with the outer surface of the threaded rod 13.

The installation sleeve 3 is welded on the upper surface of the installation seat 2, the moving sleeve 14 is welded on the lower surface of the moving seat 6, the damping spring 15 is embedded on the inner surface of the installation sleeve 3, the outer surface of the damping spring 15 is embedded on the inner surface of the moving sleeve 14, the installation plate 16 is welded on the inner surface of the positioning sleeve 4, the connecting plate 17 is welded on the lower surface of the positioning slide rod 5, the damper 18 is arranged on the upper surface of the installation plate 16, the upper surface of the damper 18 is connected with the lower surface of the connecting plate 17, the damping spring 15 is installed on the inner surface of the installation sleeve 3 and the moving sleeve 14, and meanwhile, the installation of the damper 18 on the outer surface of the installation plate 16 and the connecting plate 17 is utilized, so that damping protection is convenient for the main body plate 1, and the problem that circuit damage on the main body plate 1 occurs after the main body plate 1 collides with other elements can be avoided.

The main body board 1 comprises a copper foil layer 101 and a board body 105, wherein the substrate layer 102 is arranged on the outer surface of the copper foil layer 101, the heat conducting layer 103 is arranged on the outer surface of the substrate layer 102, the heat radiating layer 104 is arranged on the outer surface of the board body 105, the outer surface of the heat radiating layer 104 is connected with the outer surface of the heat conducting layer 103, the insulating layer 106 is arranged on the outer surface of the board body 105, the heat conducting layer 103 made of a heat conducting phase-change material can conduct rapid dredging and transferring on heat generated by the circuit board, damage of components and parts caused by heat concentration can be prevented, gaps are reserved between the heat radiating layer 104 and the insulating layer 106 through convex strips in the heat radiating layer 104, heat circulation and diffusion are facilitated, heat radiating performance is improved, deformation of a product due to high temperature is avoided, and the service life of the circuit board is prolonged.

The utility model relates to an improved HDI high-density laminated circuit board, which is characterized in that a mounting frame 7 is welded on the outer surface of a movable seat 6, a threaded rod 13 is welded on the outer surface of a fixed seat 19, then an adjusting block 11 is welded on the outer surface of a rotating block 10 embedded in a rotating groove 9, and the inner surface of a threaded sleeve 12 is connected with the outer surface of the threaded rod 13 by utilizing threads, so that the distance between main body boards 1 is conveniently adjusted, and the problem that heat cannot be rapidly dissipated due to too narrow distance can be avoided.

The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. An improved generation HDI high density lamination circuit board, includes main part board (1), its characterized in that: the utility model discloses a body board, including main part board (1), mounting bracket (2) upper surface installs positioning sleeve (4), positioning sleeve (4) internal surface gomphosis has positioning slide bar (5), positioning slide bar (5) external surface welding has movable seat (6), movable seat (6) external surface welding has mounting bracket (7), mounting bracket (7) external surface welding has sliding sleeve (8), sliding sleeve (8) internal surface is provided with rotation groove (9), rotation groove (9) internal surface gomphosis has rotating block (10), rotating block (10) upper surface welding has regulating block (11), regulating block (11) external surface welding has threaded sleeve (12).

2. The improved HDI high density laminated circuit board of claim 1, wherein: the movable seat is characterized in that a fixed seat (19) is welded on the lower surface of the movable seat (6), a threaded rod (13) is welded on the lower surface of the fixed seat (19), and the inner surface of the threaded sleeve (12) is in threaded connection with the outer surface of the threaded rod (13).

3. The improved HDI high density laminated circuit board of claim 1, wherein: the upper surface of the mounting seat (2) is welded with a mounting sleeve (3), and the lower surface of the movable seat (6) is welded with a movable sleeve (14).

4. An improved HDI high density laminated wiring board according to claim 3, wherein: the damping spring (15) is embedded on the inner surface of the mounting sleeve (3), and the outer surface of the damping spring (15) is embedded on the inner surface of the moving sleeve (14).

5. The improved HDI high density laminated circuit board of claim 1, wherein: the inner surface of the positioning sleeve (4) is welded with a mounting plate (16), the lower surface of the positioning slide rod (5) is welded with a connecting plate (17), the upper surface of the mounting plate (16) is provided with a damper (18), and the upper surface of the damper (18) is connected with the lower surface of the connecting plate (17).

6. The improved HDI high density laminated circuit board of claim 1, wherein: the main body plate (1) comprises a copper foil layer (101) and a plate body (105), wherein the substrate layer (1) is arranged on the outer surface of the copper foil layer (101), and the heat conducting layer (103) is arranged on the outer surface of the substrate layer (102).

7. The improved HDI high density laminated wiring board of claim 6, wherein: the heat dissipation layer (104) is arranged on the outer surface of the plate body (105), the outer surface of the heat dissipation layer (104) is connected with the outer surface of the heat conduction layer (103), and the insulating layer (106) is arranged on the outer surface of the plate body (105).