CN215421108U - 5G signal transmission plate - Google Patents

Abstract

The utility model discloses a 5G signal transmitting plate, and particularly relates to the field of 5G signals. The utility model has novel design and good heat dissipation effect, so that the electric device on the plate body is not easily influenced by high temperature when working, and simultaneously has good damping effect, so that the plate body is not easily damaged when being vibrated, and the practicability of the plate is greatly improved.

Description

5G signal transmission plate

Technical Field

The utility model relates to the field of 5G signals, in particular to a 5G signal transmitting plate.

Background

The fifth generation mobile communication technology is a new generation broadband mobile communication technology with the characteristics of high speed, low time delay and large connection, and is a network infrastructure for realizing man-machine-object interconnection.

However, the existing 5G signal transmitting plate is easily affected by high temperature after working for a long time, so that the signal transmission speed of an electric device is seriously affected, the plate is easily damaged when being vibrated, the service life of the plate is greatly shortened, and the requirements of people cannot be met.

SUMMERY OF THE UTILITY MODEL

In order to overcome the above defects in the prior art, an embodiment of the present invention provides a 5G signal transmitting plate, and the technical problems to be solved by the present invention are: how to make the panel be difficult to receive high temperature's influence when the during operation, and have good anti-vibration ability.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a panel for 5G signal transmission, includes the panel body, the inside fixed arrangement of panel plate body has the base plate layer, base plate layer bottom fixedly connected with shields the sheet layer, shielding sheet layer bottom fixedly connected with shock attenuation sheet layer, shock attenuation sheet layer bottom fixedly connected with insulation sheet layer, insulation sheet layer bottom fixedly connected with heat dissipation layer, the heat dissipation layer bottom is inlayed and is connected with the heating panel, heat dissipation plate top end fixedly connected with heat-conducting plate, and the heat-conducting plate is located heat dissipation in situ portion, heat dissipation plate bottom fixedly connected with radiating fin.

In a preferred embodiment, a supporting partition board is fixedly connected inside the shock absorption board layer, a vibration absorbing layer is fixedly connected to both sides of the supporting partition board, heat conduction holes are fixedly arranged inside the shock absorption board layer, and the heat conduction holes penetrate through the inside of the vibration absorbing layer.

In a preferred embodiment, heat dissipation bar holes are fixedly arranged inside the insulation board layer, the heat dissipation bar holes are arranged in a criss-cross manner, and the tops of the heat dissipation bar holes are in conduction connection with through holes.

In a preferred embodiment, an insulating coating is sprayed on the top of the substrate layer, a supporting foot block is fixedly connected to the bottom end of the heat dissipation plate, and the supporting foot block is made of insulating rubber.

In a preferred embodiment, the through hole is located at the bottom of the heat conduction hole, and the heat conduction hole is in conductive connection with the heat dissipation bar hole through the through hole.

In a preferred embodiment, the substrate layer is a substrate layer made of a PCB material, the damping plate layer is a damping plate layer made of a nylon material, and the heat dissipation plate, the heat conduction plate and the heat dissipation fins are all made of a copper material.

In a preferred embodiment, the shock absorbing layer is located inside the shock absorbing plate layer, and the shock absorbing layer is made of heat conducting rubber.

In a preferred embodiment, the heat dissipation fins are located at the bottom of the plate body.

The utility model has the technical effects and advantages that:

1. according to the utility model, through the combination of the heat dissipation plate, the heat conduction plate and the heat dissipation fins, the heat dissipation effect of the heat dissipation layer on the plate body can be effectively improved, so that the electric device on the plate body is not easily influenced by high temperature during working, the running speed of the electric device is convenient to improve, and the heat dissipation fins are positioned at the bottom inside the plate body and can be better contacted with air, so that the air cooling heat dissipation effect of the heat dissipation fins is improved.

2. According to the utility model, the damping plate layer made of the nylon material can be used for achieving a good damping effect on the interior of the plate body, so that the plate body is not easy to damage when being vibrated, and the vibration force absorption layer made of the heat-conducting rubber can be used for well absorbing the vibration force generated in the plate body, so that the vibration of the plate body is reduced, the stabilizing effect of the electric device on the plate body is improved, and the damping plate is practical.

Drawings

Fig. 1 is a schematic view of the internal structure of the plate body according to the present invention.

Fig. 2 is a schematic view of the heat dissipation plate structure of the present invention.

FIG. 3 is a schematic view of the construction of the shock absorbing ply of the present invention.

Fig. 4 is a schematic view of the structure of the heat sink strip hole of the present invention.

The reference signs are: 1. a plate body; 2. a substrate layer; 3. a shielding sheet layer; 4. a shock absorbing slab layer; 5. an insulating board layer; 6. a heat dissipation layer; 7. a heat dissipation plate; 8. a heat conducting plate; 9. a heat dissipating fin; 10. supporting the partition plate; 11. a vibration force absorbing layer; 12. a heat conduction hole; 13. a heat dissipating bar hole; 14. insulating paint; 15. a support foot block; 16. and a through hole.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example 1

The utility model provides a 5G signal transmitting plate as shown in figures 1-4, which comprises a plate body 1, wherein a substrate layer 2 is fixedly arranged inside the plate body 1, the bottom end of the substrate layer 2 is fixedly connected with a shielding plate layer 3, the bottom end of the shielding plate layer 3 is fixedly connected with a damping plate layer 4, the bottom end of the damping plate layer 4 is fixedly connected with an insulating plate layer 5, the bottom end of the insulating plate layer 5 is fixedly connected with a heat dissipation layer 6, the bottom end of the heat dissipation layer 6 is embedded and connected with a heat dissipation plate 7, the top end of the heat dissipation plate 7 is fixedly connected with a heat conduction plate 8, the heat conduction plate 8 is positioned inside the heat dissipation layer 6, and the bottom end of the heat dissipation plate 7 is fixedly connected with a heat dissipation fin 9; through the combination of heating panel 7, heat-conducting plate 8 and radiating fin 9, can effectual promotion radiating layer 6 to the radiating effect of panel body 1 to guarantee that panel body 1 is difficult for receiving the influence of high temperature at last electrical part when carrying out the work, so as to promote the functioning speed of electrical part self.

Heat dissipation strip holes 13 are fixedly arranged in the insulating board layer 5, the heat dissipation strip holes 13 are arranged in a criss-cross mode, and the tops of the heat dissipation strip holes 13 are in conduction connection with through holes 16; can promote the insulating effect of panel body 1 self through insulation sheet layer 5, make panel body 1 be difficult for receiving the influence of static at the during operation, can play good forced air cooling effect to insulation sheet layer 5 through heat dissipation strip hole 13 simultaneously to reduce the temperature of panel body 1 inside, it is comparatively practical.

Insulating paint 14 is sprayed and arranged on the top of the substrate layer 2, a supporting foot block 15 is fixedly connected to the bottom end of the heat dissipation plate 7, and the supporting foot block 15 is made of insulating rubber; through the combination of insulating coating 14 and supporting foot piece 15, can further promote the insulating effect of panel body 1, make panel body 1 be difficult for receiving the influence of static.

The through hole 16 is positioned at the bottom of the heat conduction hole 12, and the heat conduction hole 12 is in conduction connection with the heat dissipation strip hole 13 through the through hole 16; through the combination of the heat conduction holes 12, the through holes 16 and the heat dissipation bar holes 13, the temperature inside the shock-absorbing plate layer 4 is conveniently transferred, so that the temperature inside the shock-absorbing plate layer 4 can be reduced.

The base plate layer 2 is made of a PCB material, the damping plate layer 4 is made of a nylon material, and the heat dissipation plate 7, the heat conduction plate 8 and the heat dissipation fins 9 are all made of a copper metal material; the heat dissipation plate 7, the heat conduction plate 8 and the heat dissipation fins 9 made of the copper metal material can absorb and dissipate high temperature inside the heat dissipation layer 6, so that the heat dissipation speed of the heat dissipation layer 6 to the plate body 1 is increased.

The radiating fins 9 are positioned at the bottom of the plate body 1; radiating fin 9 is located the inside bottom of panel body 1, can be better contact with the air to promote the forced air cooling radiating effect of self, it is comparatively practical.

Example 2

As shown in fig. 1 and 3, the embodiment specifically includes: a supporting clapboard 10 is fixedly connected inside the damping plate layer 4, vibration force absorbing layers 11 are fixedly connected on both sides of the supporting clapboard 10, heat conducting holes 12 are fixedly arranged inside the damping plate layer 4, and the heat conducting holes 12 penetrate through the vibration force absorbing layers 11; the damping plate layer 4 made of nylon material can achieve a good damping effect on the interior of the plate body 1, so that the plate body 1 is not easy to damage when being vibrated.

The vibration force absorption layer 11 is positioned in the shock absorption plate layer 4, and the vibration force absorption layer 11 is made of heat-conducting rubber; the vibration force absorbing layer 11 made of the heat-conducting rubber can well absorb the vibration force generated inside the plate body 1, so that the vibration of the plate body 1 is reduced, the stabilizing effect of the electric device on the plate body 1 is improved, and the plate is practical.

The working principle of the utility model is as follows:

referring to the attached drawings 1-4 of the specification, the heat dissipation effect of the heat dissipation layer 6 on the plate body 1 can be effectively improved through the combination of the heat dissipation plate 7, the heat conduction plate 8 and the heat dissipation fins 9, so as to ensure that the upper electric device of the plate body 1 is not easily affected by high temperature when working, so as to improve the running speed of the electric device, and the heat dissipation fins 9 are positioned at the bottom inside the plate body 1 and can better contact with air, so as to improve the air cooling heat dissipation effect of the plate body, and then the temperature inside the damping plate layer 4 can be conveniently transmitted through the combination of the heat conduction holes 12, the through holes 16 and the heat dissipation strip holes 13, so as to reduce the temperature inside the damping plate layer 4, so that the plate body 1 is more practical, wherein the insulation effect of the plate body 1 can be improved through the insulation plate layer 5, so that the plate body 1 is not easily affected by static electricity when working, simultaneously can play good forced air cooling effect to insulation sheet layer 5 through heat dissipation strip hole 13, thereby reduce the temperature of panel body 1 inside, and is comparatively practical, in addition, can carry out good shock attenuation effect to panel body 1 inside through the shock attenuation sheet layer 4 of nylon materials preparation, thereby make panel body 1 difficult emergence damage when receiving vibrations, and the vibrations power absorbed layer 11 through the preparation of heat conduction rubber can carry out good absorption to the vibrations power of the inside production of panel body 1, thereby reduce the vibrations of panel body 1 self, with the stable effect that promotes electric appliance on panel body 1, and is comparatively practical.

The points to be finally explained are: first, in the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounted," "connected," and "connected" should be understood broadly, and may be a mechanical connection or an electrical connection, or a communication between two elements, and may be a direct connection, and "upper," "lower," "left," and "right" are only used to indicate a relative positional relationship, and when the absolute position of the object to be described is changed, the relative positional relationship may be changed;

secondly, the method comprises the following steps: in the drawings of the disclosed embodiments of the utility model, only the structures related to the disclosed embodiments are referred to, other structures can refer to common designs, and the same embodiment and different embodiments of the utility model can be combined with each other without conflict;

and finally: the above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents, improvements and the like that are within the spirit and principle of the present invention are intended to be included in the scope of the present invention.

Claims (8)

1. The utility model provides a panel for 5G signal transmission, includes panel body (1), its characterized in that: the utility model discloses a panel, including panel body (1), board base layer (2) have been arranged to inside fixed, board base (2) bottom fixedly connected with shielding sheet layer (3), shielding sheet layer (3) bottom fixedly connected with shock attenuation sheet layer (4), shock attenuation sheet layer (4) bottom fixedly connected with insulation sheet layer (5), insulation sheet layer (5) bottom fixedly connected with heat dissipation layer (6), inlay in heat dissipation layer (6) bottom and be connected with heating panel (7), heating panel (7) top fixedly connected with heat-conducting plate (8), and heat-conducting plate (8) are located inside heat dissipation layer (6), heating panel (7) bottom fixedly connected with radiating fin (9).

2. The board for 5G signal transmission according to claim 1, wherein: the shock attenuation sheet layer (4) inside fixedly connected with supporting diaphragm (10), the equal fixedly connected with vibrations power absorbed layer (11) in supporting diaphragm (10) both sides, shock attenuation sheet layer (4) inside fixed arrangement has heat conduction hole (12), and inside vibrations power absorbed layer (11) were run through in heat conduction hole (12).

3. The board for 5G signal transmission according to claim 1, wherein: insulating board layer (5) inside fixed arrangement has heat dissipation strip hole (13), and heat dissipation strip hole (13) are criss-cross and arrange, heat dissipation strip hole (13) top turn-on connection has through-hole (16).

4. The board for 5G signal transmission according to claim 1, wherein: insulating coating (14) have been arranged in the spraying of base plate layer (2) top, heating panel (7) bottom fixedly connected with support foot piece (15), and support foot piece (15) are the support foot piece of insulating rubber preparation.

5. The board for 5G signal transmission according to claim 3, wherein: the through hole (16) is positioned at the bottom of the heat conduction hole (12), and the heat conduction hole (12) is in conduction connection with the heat dissipation strip hole (13) through the through hole (16).

6. The board for 5G signal transmission according to claim 1, wherein: the base plate layer (2) is the base plate layer of PCB material preparation, shock attenuation sheet layer (4) are the shock attenuation sheet layer of nylon materials preparation, heating panel (7), heat-conducting plate (8) and radiating fin (9) are the copper metal material preparation.

7. The board for 5G signal transmission according to claim 2, wherein: the shock force absorption layer (11) is located inside the shock absorption plate layer (4), and the shock force absorption layer (11) is made of heat conduction rubber.

8. The board for 5G signal transmission according to claim 1, wherein: the radiating fins (9) are positioned at the bottom of the plate body (1).

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