CN113423246B - Light device for efficient heat dissipation of cubic satellite electronic equipment - Google Patents
Light device for efficient heat dissipation of cubic satellite electronic equipment Download PDFInfo
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- CN113423246B CN113423246B CN202110724019.0A CN202110724019A CN113423246B CN 113423246 B CN113423246 B CN 113423246B CN 202110724019 A CN202110724019 A CN 202110724019A CN 113423246 B CN113423246 B CN 113423246B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64G—COSMONAUTICS; VEHICLES OR EQUIPMENT THEREFOR
- B64G1/00—Cosmonautic vehicles
- B64G1/10—Artificial satellites; Systems of such satellites; Interplanetary vehicles
- B64G1/1021—Earth observation satellites
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
- H05K7/1447—External wirings; Wiring ducts; Laying cables
- H05K7/1451—External wirings; Wiring ducts; Laying cables with connections between circuit boards or units
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- Aviation & Aerospace Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A light device for efficient heat dissipation of cubic satellite electronic equipment belongs to the technical field of aerospace. The invention solves the problems that the existing cubic satellite electronic equipment has limited heat dissipation area, excessive parts required by a heat transfer path and larger thermal resistance, is not beneficial to the heat dissipation of high-power electronic equipment, and causes the cubic satellite to be difficult to operate in an on-orbit business normal state. The second heat conduction copper layers are clamped between the upper insulating material plate and the lower insulating material plate in parallel, the third heat conduction copper layers are two and are oppositely and fixedly arranged at two ends of the first heat conduction copper layers, the top surfaces of the printed circuit boards are respectively provided with a socket, each socket is correspondingly connected with a pin on the printed circuit board above the socket, electrical connection between two adjacent printed circuit boards is realized, two ends of the printed circuit boards are correspondingly clamped in the side grooves of the clamping groove type structure shells, and the top surface special-shaped end covers are covered at the top ends of the two clamping groove type structure shells.
Description
Technical Field
The invention relates to a light device for efficient heat dissipation of cubic satellite electronic equipment, and belongs to the technical field of aerospace.
Background
Compared with the traditional large satellite, the cubic satellite has the characteristics of low development cost, short period and high power density, and can form a constellation through rapid emission networking so as to realize monitoring on ocean, atmospheric environment and the like and be used for aspects such as a new technology test platform. In recent years, thanks to the development of microelectronics, micromachines, new materials and manufacturing technologies and the application of the new materials and manufacturing technologies to satellites, cubic satellites with extremely low development cost are moving from demonstration and demonstration to business application as subversive innovation.
With the increasingly complex functions and the increasing power density of various electronic devices in satellite application loads, cubic satellites are increasingly difficult to control the local heat flow density (the local heat flow density can reach more than 100W/cm < 2 >) and the low thermal inertia of the electronic devices due to small volume and light weight. Electronic components on the electronic module can generate a large amount of heat during working, and if the heat cannot be dissipated in time, the components can be burnt due to overheating, so that the whole electronic equipment fails or breaks down, and the performance and the service life of the whole cubic satellite are further influenced; meanwhile, electronic equipment of each cubic satellite needs to have a good fixing mode on the satellite so as to respond to complex mechanical environments such as vibration and impact.
In the prior art, the cubic satellite electronic equipment has limited heat dissipation area, excessive parts required by a heat transfer path and large thermal resistance, and is not beneficial to heat dissipation of high-power electronic equipment, so that the satellite is difficult to operate in an on-orbit business normal state; in addition, the existing satellite electronic equipment has more heat dissipation parts and mechanical parts, is complex in assembly steps and is not beneficial to the mass production of the cubic satellites. Therefore, a heat dissipation device is urgently needed, which can conveniently and reliably solve the problem of overhigh temperature of electronic components caused by large heat flux density of electronic equipment in the design and use process of a cubic satellite on the premise of not introducing extra mechanical design and not increasing the mass of the cubic satellite.
Disclosure of Invention
The invention aims to solve the technical problems and further provides a light device for efficient heat dissipation of cubic satellite electronic equipment.
The technical scheme adopted by the invention for solving the technical problems is as follows:
a light device for efficient heat dissipation of cubic satellite electronic equipment comprises a top surface special-shaped end cover, two clamping groove type structure shells which are oppositely arranged, and a plurality of printed circuit boards which are sequentially and parallelly arranged from top to bottom, wherein each printed circuit board comprises heating electronic components, insulating material boards and first to third heat conduction copper layers, the number of the insulating material boards is two, the insulating material boards are parallelly arranged from top to bottom, the second heat conduction copper layers are clamped between the upper insulating material board and the lower insulating material board in parallel, the number of the third heat conduction copper layers is two, the third heat conduction copper layers are fixedly arranged at two ends of the second heat conduction copper layers relatively, at least one through hole is formed in the insulating material board which is positioned at the upper layer in each printed circuit board, the quantity of through-hole, the quantity on first heat conduction copper layer and the quantity of the electronic components that generate heat of installation on it all equal and the one-to-one is arranged, the pin header is all installed to every printed circuit board's bottom surface, the lower surface mounting of top surface dysmorphism end cover has a plurality of bosss, and a plurality of bosss and the electronic components that generate heat that are located the printed circuit board top surface of top one-to-one and high complementary setting, the socket is installed respectively to the top surface of all the other printed circuit boards, every socket corresponds the pin header rather than on the printed circuit board of top and is connected, realize the electrical connection between two printed circuit boards that face each other, the both ends correspondence of a plurality of printed circuit boards clamps in the side recess of draw-in groove formula structure shell, top surface dysmorphism end cover lid dress is on two draw-in groove formula structure shell tops.
Furthermore, after the printed circuit boards are inserted between the two slot type structure shells, the printed circuit boards are fastened and clamped through bolts penetrating through the slot type structure shells, and the top surface special-shaped end cover is fixedly connected with the two slot type structure shells through the bolts.
Furthermore, heat-conducting interface materials are arranged between the heating electronic component and the boss corresponding to the upper part of the heating electronic component, between the heating electronic component and the first heat-conducting copper layer corresponding to the lower part of the heating electronic component, and between the third heat-conducting copper layer and the inner wall of the groove on the side surface of the clamping groove type structure shell.
Further, a heat dissipation coating is sprayed on the outer surface, facing the space, of the clamping groove type structure shell.
Further, the insulating material plate is an epoxy resin plate.
Further, the number of printed circuit boards is five.
Further, each printed circuit board has a size of 100mm × 100mm × 2mm, wherein the thickness of the third heat conductive copper layer is 2mm, and the thickness of the second heat conductive copper layer is 0.2mm.
Further, the thickness of the heat conducting interface material is 0.25mm or 0.5mm.
Furthermore, the height of each side groove on the clamping groove type structure shell is 0.25-0.5 mm higher than that of the printed circuit board clamped in the clamping groove type structure shell.
Further, the thickness of the heat-conducting interface material between the third heat-conducting copper layer and the inner wall of the groove on the side surface of the clamping groove type structure shell is 0.25mm.
Compared with the prior art, the invention has the following effects:
through set up pin header and socket on printed circuit board, each printed circuit board of being convenient for is from the top electrical connection to end, compares with every circuit board all needs an extra socket among the prior art, saves connecting cable and welded operation.
This application is through the special heat dissipation design to printed circuit board, draw-in groove formula structure shell, top abnormal shape end cover, enables the device under lower manufacturing cost, assembly requirement, reduces the inside thermal resistance from electronic components to between the satellite cooling surface by a wide margin to play the effect that reduces the last electronic components temperature of printed circuit board by a wide margin. The power range of the cubic satellite application load is expanded.
The pin header on the printed circuit board at the bottom is used for being connected with other components of the satellite, so that a large number of cable components and sockets required by each printed circuit board and a single machine in the satellite assembly process are saved, and the satellite quality and the launching cost are saved. Meanwhile, the circuit board is convenient and concise in installation process, strong in adaptability, not prone to making mistakes and convenient for batch production and assembly.
Drawings
FIG. 1 is a schematic illustration of an explosive structure of the present application;
FIG. 2 is a schematic front view of the present application;
FIG. 3 is a schematic perspective view of a top surface profiled end cap;
FIG. 4 is a side view schematic of a top surface profiled end cap;
FIG. 5 is a schematic perspective view of a housing with a slot structure;
FIG. 6 is a schematic cross-sectional view of a printed circuit board;
fig. 7 is a schematic diagram illustrating the principle of heat flow transfer of the device of the present application.
Detailed Description
The first embodiment is as follows: the embodiment is described with reference to fig. 1 to 7, and a lightweight device for efficient heat dissipation of cubic satellite electronic equipment comprises a top surface special-shaped end cover 1, two oppositely arranged clamping groove type structure shells 2 and a plurality of printed circuit boards 3 which are sequentially arranged in parallel from top to bottom, wherein each printed circuit board 3 comprises a heating electronic component 31, insulating material plates 32 and first to third heat conducting copper layers 35, the number of the insulating material plates 32 is two, and the insulating material plates are arranged in parallel from top to bottom, the second heat conducting copper layers 34 are clamped between the upper and lower insulating material plates 32 in parallel, the number of the third heat conducting copper layers 35 is two, and the third heat conducting copper layers 35 are relatively fixedly arranged at two ends of the second heat conducting copper layers 34, and each printed circuit board 3, which is positioned at the upper layer, is provided with at least one through hole, the quantity of through-hole, the quantity of first heat conduction copper layer 33 and the quantity of the electronic components 31 that generate heat of installing on it all equals and the one-to-one is arranged, row needle 4 is all installed to the bottom surface of every printed circuit board 3, a plurality of bosss 6 are installed to the lower surface of top surface abnormal shape end cover 1, and a plurality of bosss 6 correspond one-to-one and highly complementary setting with the electronic components 31 that generate heat that are located the 3 top surfaces of the printed circuit board of top, socket 5 is installed respectively to the top surface of all the other printed circuit boards 3, every socket 5 corresponds the row needle 4 on the printed circuit board 3 rather than the top and is connected, realize facing the electrical connection between two printed circuit boards 3 mutually, the both ends correspondence of a plurality of printed circuit boards 3 clamps in the side recess of draw-in groove formula structure shell 2, top surface abnormal shape end cover 1 lid dress is on two draw-in-groove formula structure shell 2 tops.
The number, power and the position of the heat-generating electronic component 31 mounted on the insulating material plate 32 are determined according to actual requirements of different cubic satellite electronic devices. The satellite is a high-power integrated cubic microsatellite.
The first to third heat-conducting copper layers 35 may be integrally and fixedly connected, and the second heat-conducting copper layer may be discontinuous, i.e., a block structure, and the planar heat conductivity is enhanced by disposing the second heat-conducting copper layer. The third heat-conducting copper layer 35 is an edge bare copper layer. The first heat-conductive copper layer 33 is preferably provided under the heat-generating electronic component 31 having a watt density exceeding 1.5W/cm 2. The sum of the average power consumption of each rail of all electronic components on the circuit board is about 5W, and the peak power consumption is about 32W.
By providing the first heat-conducting copper layer 33, the corresponding heat-generating electronic component 31 and the second heat-conducting copper layer 34 are conveniently connected in a heat-conducting manner.
The other stand-alone components of the cubic satellite electronics are mounted inside a card-slot type structural housing 2 below a number of printed circuit boards 3. The other stand-alone components 9 of the cubic satellite electronics are prior art and their construction and operation will not be described in detail here.
Through set up pin header 4 and socket 5 on printed circuit board 3, be convenient for each printed circuit board 3 from the top to the electric connection on earth, compare with every circuit board all needs an extra socket 5 among the prior art, save connecting cable and welded operation.
This application is through the special heat dissipation design to printed circuit board 3, draw-in groove formula structure shell 2, top abnormal shape end cover, enables the device under lower manufacturing cost, assembly requirement, reduces the inside thermal resistance from electronic components to satellite cooling surface by a wide margin to play the effect that reduces the electronic components temperature on printed circuit board 3 by a wide margin. The power range of the cubic satellite application load is expanded.
In the specific implementation process, the temperature difference from the copper layer in the printed circuit board 3 to the heat dissipation surface of the slot-type structure shell 2 can be reduced to about 4 ℃, and the temperature difference from the electronic component shell to the heat dissipation surface of the slot-type structure shell 2 can be reduced to about 6 ℃ at least (generally, the temperature difference between the electronic component in the satellite and the heat dissipation surface is about 20 ℃).
On the basis that the mass of the cubic satellite is not increased, the structure design and the thermal control design of the cubic satellite are integrated, extra parts do not need to be added, the structure number and the plug-in quantity are reduced, the mass is reduced, the assembly process is simplified, the assembly efficiency is improved, the heat generated by high-power density electronic equipment is efficiently and reliably conducted to the satellite shell, and the heat is finally dissipated to the space by radiation. The emission cost of the cubic satellite caused by the mass increase is greatly reduced, and the cubic satellite is convenient to produce and apply in batches.
The pin header 4 on the printed circuit board 3 at the lowest position is used for being connected with other components of the satellite, thereby saving a large number of cable components and sockets 5 required by each printed circuit board 3 and a single machine in the satellite assembly process, and saving the satellite quality and the launching cost. Meanwhile, the circuit board is convenient and simple in installation process, strong in adaptability, not easy to make mistakes and convenient for batch production and assembly.
The clamping groove type structure shell 2 is integrally formed by hard aluminum alloy or other metal/alloy with better heat conductivity in a machining mode, can play a role in quickly equalizing temperature, and is used as a shell supporting structure of a cubic satellite. The clamping groove type structure shell 2 can be used as a whole satellite main bearing structure and used for installing other single machines or components of a satellite, such as a flywheel, a central machine, a load and the like. The number of the side grooves is determined according to the number of the printed circuit boards 3, the distance between the upper side groove and the lower side groove is determined according to the heights of the printed circuit boards 3 and the electronic components on the printed circuit boards 3, the size of the bayonet of a single side groove is slightly higher than the thickness of the printed circuit boards 3, and the surface of the inner wall of the side groove is polished smoothly;
the boss 6 arranged on the lower surface of the top surface special-shaped end cover 1 is designed according to the layout of the high-power density electronic components of the topmost printed circuit board 3 and is polished smoothly.
From engineering application perspective, the heat dissipation design of this application operation is convenient, and the roughness requirement of each part installation face of the device is lower, is convenient for improve the yields, improves assembly efficiency, is favorable to the mass production of cube satellite, the reduction in production cost of very big degree.
The method can be generally used under the trend of cube satellite modularized production networking, can be popularized and copied extremely strongly, and can inestimate the reduction in financial resources, material resources and manpower.
The working principle is as follows:
the outer surfaces of the clamping groove type structure shell 2 and the top surface special-shaped end cover 1 are sprayed with thermal control heat dissipation coatings in advance, and the inner surfaces are blackened;
the printed circuit boards 3 are electrically connected into a whole in sequence from top to bottom through the sockets 5 and the pin headers 4, wherein the printed circuit board 3 with the largest power consumption is arranged on the top layer. The whole formed by connecting a plurality of printed circuit boards 3 is inserted into the clamping groove type structure shell 2 through the heat conduction interface material 8;
the top surface special-shaped end cover 1 is arranged at the top of the clamping groove type structure shell 2 and is in heat conduction connection with an electronic component of the printed circuit board 3 at the top through the heat conduction interface material 8, and finally, the four bolts 7 are screwed into the reserved threaded holes to play a role in fixing the whole heat dissipation device, apply certain pressure to the heat conduction interface material 8 and enhance the heat conduction performance of the heat conduction interface material 8.
The high-power electronic component installed on the printed circuit board 3 generates heat after working, the heat is quickly transferred to the third heat-conducting copper layers 35 on two sides of the printed circuit board 3 through the first and second heat-conducting copper layers 34 at the bottom of the electronic component, and is conveniently transferred to the clamping groove type structural shell 2 or the top surface special-shaped end cover 1 through the heat-conducting interface material 8, and finally the heat transferred to the structural component is dissipated into the whole space through the surface with high radiance.
After the printed circuit boards 3 are inserted between the two clamping groove type structure shells 2, the clamping groove type structure shells 2 are fastened and clamped through bolts 7 penetrating through the clamping groove type structure shells 2, and the top surface special-shaped end cover 1 is fixedly connected with the two clamping groove type structure shells 2 through the bolts 7. The clamping groove type structure shell 2 is provided with a plurality of threaded holes from the top to the bottom for the bolts 7 to pass through, and 1.4 N.m of torque is applied to the tops of the bolts 7, and the bolts 7 can be threaded rods. Pressing force can be applied to each side groove through the bolts 7, and the heat conducting interface material 8 is guaranteed to be filled in the gap between the two grooves, so that the thermal resistance between the two grooves is small, and heat can be conveniently conducted to the clamping groove type structure shell 2.
Heat conducting interface materials 8 are arranged between the heating electronic component 31 and the boss 6 corresponding to the upper part of the heating electronic component, between the heating electronic component 31 and the first heat conducting copper layer 33 corresponding to the lower part of the heating electronic component, and between the third heat conducting copper layer 35 and the side groove inner wall of the clamping groove type structure shell 2. By such design, the thermal interface material 8 is a thermal insulating pad. The heat generated by the electronic component can be directly transferred to the top surface special-shaped end cover 1 through the heat-conducting interface material 8 and directly radiated into the low-temperature space through the outer surface of the special-shaped end cover, so that the heat transfer path of the medium is effectively reduced, and the thermal resistance is further reduced integrally. Therefore, the printed circuit board 3 having the highest power density among all the electronic devices is suitably disposed at the topmost end. The thermal interface material 8 may be a thermal grease, an insulating thermal pad, or the like.
The outer surface of the clamping groove type structure shell 2 facing the space is sprayed with a heat dissipation coating. The heat dissipation coating has low solar absorptivity (0.17) and high infrared emissivity (0.9), such as S781 white paint, KS-ZA white paint and the like, and can radiate heat conducted to the shell into space with lower ambient temperature in a large amount. The surfaces of the clamping groove type structure shell 2 and the top surface special-shaped end cover 1 facing the interior of the satellite are subjected to blackening treatment so as to enhance the radiation heat exchange of the interior.
The insulating material sheet 32 is an epoxy resin sheet.
The number of printed circuit boards 3 is five.
Each printed circuit board 3 has dimensions of 100mm x 2mm, wherein the third thermally conductive copper layer 35 has a thickness of 2mm and the second thermally conductive copper layer 34 has a thickness of 0.2mm.
The thickness of the heat-conducting interface material 8 is 0.25mm or 0.5mm.
The height of each side groove on the clamping groove type structure shell 2 is 0.25-0.5 mm higher than that of the printed circuit board 3 clamped in the clamping groove type structure shell.
The thickness of the heat-conducting interface material 8 between the third heat-conducting copper layer 35 and the inner wall of the groove on the side surface of the slot-type structure shell 2 is 0.25mm.
Claims (9)
1. The utility model provides a light-duty device that is used for high-efficient heat dissipation of cubic satellite electronic equipment which characterized in that: the printed circuit board comprises a top surface special-shaped end cover (1), two clamping groove type structure shells (2) which are oppositely arranged, and a plurality of printed circuit boards (3) which are sequentially and parallelly arranged from top to bottom, wherein each printed circuit board (3) comprises heating electronic components (31), insulating material plates (32) and first to third heat conduction copper layers (35), the number of the insulating material plates (32) is two and is parallelly arranged from top to bottom, the second heat conduction copper layers (34) are parallelly clamped between the upper and lower insulating material plates (32), the number of the third heat conduction copper layers (35) is two and is fixedly arranged at two ends of the second heat conduction copper layers (34) relatively, at least one through hole is arranged on the insulating material plate (32) which is positioned at the upper layer in each printed circuit board (3), the number of the through holes, the number of the first heat conduction copper layers (33) and the number of the heating electronic components (31) which are arranged on the first heat conduction copper layers are all equal and are arranged correspondingly one by one, the bottom surface of each printed circuit board (3) is provided with a plurality of pins (4), a plurality of bosses (6) are arranged on the lower surface of the top surface special-shaped end cover (1), a plurality of bosses (6) and a plurality of printed circuit boards (3) which are positioned above the uppermost side of the corresponding sockets (5) and are arranged corresponding to the printed circuit boards (3), and are connected with the corresponding sockets (5) of the printed circuit boards (3), and the printed circuit boards (3) one by one, the two adjacent printed circuit boards (3) are electrically connected, two ends of the printed circuit boards (3) are correspondingly clamped in the side grooves of the clamping groove type structure shells (2), and the top surface special-shaped end cover (1) is covered at the top ends of the two clamping groove type structure shells (2);
heat-conducting interface materials (8) are arranged between the heating electronic component (31) and the boss (6) corresponding to the upper part of the heating electronic component, between the heating electronic component (31) and the first heat-conducting copper layer (33) corresponding to the lower part of the heating electronic component, and between the third heat-conducting copper layer (35) and the inner wall of the groove on the side surface of the clamping groove type structure shell (2);
the high-power electronic component mounted on the printed circuit board (3) generates heat after working, the heat is quickly transferred to third heat-conducting copper layers (35) on two sides of the printed circuit board (3) through first and second heat-conducting copper layers (34) at the bottom of the electronic component, and is conveniently transferred to the clamping groove type structure shell (2) or the top surface special-shaped end cover (1) through the heat-conducting interface material (8), and finally the heat transferred to a structural component is dissipated to the whole space through the surface with high radiance.
2. A lightweight means for efficient heat dissipation for cubic satellite electronics as claimed in claim 1, wherein: after the printed circuit boards (3) are inserted between the two clamping groove type structure shells (2), the printed circuit boards are fastened and clamped through bolts (7) penetrating through the clamping groove type structure shells (2), and the top surface special-shaped end cover (1) is fixedly connected with the two clamping groove type structure shells (2) through the bolts (7).
3. A lightweight means for efficient heat dissipation for cubic satellite electronics as claimed in claim 1, wherein: the outer surface of the clamping groove type structure shell (2) facing the space is sprayed with a heat dissipation coating.
4. A lightweight means for efficient heat dissipation for cubic satellite electronics as claimed in claim 1, wherein: the insulating material plate (32) is an epoxy resin plate.
5. A lightweight means for efficient heat dissipation for cubic satellite electronics as claimed in claim 1, wherein: the number of the printed circuit boards (3) is five.
6. A lightweight means for efficient heat dissipation for cubic satellite electronics as claimed in claim 1, wherein: each printed circuit board (3) has dimensions of 100mm x 2mm, wherein the third thermally conductive copper layer (35) has a thickness of 2mm and the second thermally conductive copper layer (34) has a thickness of 0.2mm.
7. A lightweight means for efficient heat dissipation for cubic satellite electronics as claimed in claim 1, wherein: the thickness of the heat-conducting interface material (8) is 0.25mm or 0.5mm.
8. The lightweight mechanism for efficient heat dissipation in cubic satellite electronics as recited in claim 1, wherein: the height of each side surface groove on the clamping groove type structure shell (2) is 0.25-0.5 mm higher than that of the printed circuit board (3) clamped in the clamping groove type structure shell.
9. A lightweight means for efficient heat dissipation for cubic satellite electronics as claimed in claim 1, wherein: the thickness of the heat-conducting interface material (8) between the third heat-conducting copper layer (35) and the inner wall of the groove on the side surface of the clamping groove type structure shell (2) is 0.25mm.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110724019.0A CN113423246B (en) | 2021-06-29 | 2021-06-29 | Light device for efficient heat dissipation of cubic satellite electronic equipment |
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| CN202110724019.0A CN113423246B (en) | 2021-06-29 | 2021-06-29 | Light device for efficient heat dissipation of cubic satellite electronic equipment |
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| CN114413060B (en) * | 2021-12-20 | 2024-07-26 | 上海空间推进研究所 | Device for reducing on-orbit temperature of control valve of space engine |
| CN114771875B (en) * | 2022-05-06 | 2023-09-01 | 南京理工大学 | Design method of direct-insert type main bearing structure of high-heat-flow-density cube star |
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| CN113423246A (en) | 2021-09-21 |
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Address after: No. 1299, Mingxi Road, Beihu science and Technology Development Zone, Changchun City, Jilin Province Applicant after: Changguang Satellite Technology Co.,Ltd. Address before: No. 1299, Mingxi Road, Beihu science and Technology Development Zone, Changchun City, Jilin Province Applicant before: CHANG GUANG SATELLITE TECHNOLOGY Co.,Ltd. |
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