CN222827426U - Circuit board components and electronic devices - Google Patents
Circuit board components and electronic devices Download PDFInfo
- Publication number
- CN222827426U CN222827426U CN202421610463.5U CN202421610463U CN222827426U CN 222827426 U CN222827426 U CN 222827426U CN 202421610463 U CN202421610463 U CN 202421610463U CN 222827426 U CN222827426 U CN 222827426U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- electronic device
- substrate
- board assembly
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本申请涉及电路板技术领域，公开了一种电路板组件及电子设备，电路板组件包括第一基板、第一电子器件、散热器和子电路板。所述第一电子器件设置于所述第一基板的第一表面。所述散热器设置于所述第一表面，所述散热器与所述第一基板的接地端电连接。所述子电路板设置于所述散热器背向所述第一电子器件的一侧，所述子电路板与所述第一基板电连接，所述子电路板与所述散热器热接触，所述子电路板设置有第二电子器件。通过上述方式，本申请实施例的电路板组件的散热器同时兼具对第二电子器件的散热作用和对电磁干扰的屏蔽作用，结构简单，空间占用率小。
The present application relates to the technical field of circuit boards, and discloses a circuit board assembly and an electronic device, wherein the circuit board assembly includes a first substrate, a first electronic device, a heat sink and a sub-circuit board. The first electronic device is arranged on the first surface of the first substrate. The heat sink is arranged on the first surface, and the heat sink is electrically connected to the ground terminal of the first substrate. The sub-circuit board is arranged on the side of the heat sink facing away from the first electronic device, the sub-circuit board is electrically connected to the first substrate, the sub-circuit board is in thermal contact with the heat sink, and the sub-circuit board is provided with a second electronic device. In the above manner, the heat sink of the circuit board assembly of the embodiment of the present application has both the heat dissipation effect on the second electronic device and the shielding effect on electromagnetic interference, and has a simple structure and a small space occupancy rate.
Description
Technical Field
The present application relates to the field of circuit boards, and in particular, to a circuit board assembly and an electronic device.
Background
The power tube is one of important devices of the power module, and in order to meet the heat dissipation requirement and electromagnetic compatibility of the power tube, the current power module is provided with a radiator and an electromagnetic shielding cover on a circuit board so as to be used for respectively dissipating heat of the power tube and protecting the power tube from electromagnetic interference of other electronic devices of the circuit board.
However, in the current trend of increasingly miniaturized and modularized design, the reasonable utilization of space is increasingly important, and the current separate arrangement mode of the power module radiator and the electromagnetic shielding cover has larger occupied space, so that the miniaturization design requirement of the product is difficult to meet.
Disclosure of utility model
In view of the foregoing problems with the background art, it is an object of the present application to provide a circuit board assembly and an electronic device, which overcome or at least partially solve the foregoing problems.
According to a first aspect of the present application, a circuit board assembly is provided that includes a first substrate, a first electronic device, a heat sink, and a sub-circuit board. The first electronic device is arranged on the first surface of the first substrate. The radiator is arranged on the first surface and is electrically connected with the grounding end of the first substrate. The sub-circuit board is arranged on one side, facing away from the first electronic device, of the radiator, is electrically connected with the first substrate, is in thermal contact with the radiator, and is provided with a second electronic device.
In one or more of the above alternative embodiments, the sub-circuit board includes a second substrate and the second electronic device, a surface of the second substrate is in thermal contact with a surface of the heat spreader facing away from the first electronic device, and the second electronic device is disposed on another surface of the second substrate.
In one or more of the above alternative embodiments, the second substrate is disposed vertically on the first surface.
In one or more of the above optional embodiments, the first substrate is provided with a mounting hole, one end of the second substrate is provided with a mounting protrusion, the mounting protrusion is inserted into the mounting hole, and the mounting protrusion is welded to the mounting hole.
In one or more of the above alternative embodiments, a surface of the heat spreader facing the first electronic device is provided with heat dissipating fins.
In one or more of the above alternative embodiments, the heat sink is provided with a soldering stud, and the first substrate is provided with a soldering hole to which the soldering stud is soldered.
In one or more of the above alternative embodiments, the heat sink is made of a metallic material.
According to a second aspect of the present application there is provided an electronic device comprising a circuit board assembly as described above.
In one or more of the above alternative embodiments, the heat sink is electrically connected to the housing, and the housing is provided with a receiving cavity, and the circuit board assembly is disposed in the receiving cavity.
In one or more of the above optional embodiments, a threaded hole is provided at an end of the heat sink away from the first surface, the electronic device further includes a connection bolt, the connection bolt passes through the housing and is then screwed and fixed to the threaded hole, and the heat sink is electrically connected to the housing through the connection bolt.
In one or more of the above alternative embodiments, according to a second aspect of the present application, there is provided an energy storage power supply including the housing, the battery module, and the control board as described above, the battery module being disposed in the second cavity. The control panel set up in first cavity, the control panel with the second connecting portion electricity is connected.
The heat radiator of the circuit board assembly has the beneficial effects that the heat radiator of the circuit board assembly is in thermal contact with the sub-circuit board, so that the heat of the sub-circuit board can be absorbed to play a role in radiating the second electronic device, the sub-circuit board is arranged on one side of the heat radiator, which is opposite to the first electronic device, and the heat radiator is electrically connected with the grounding end of the first substrate, so that the heat radiator can play a role in electromagnetic shielding between the first electronic device and the second electronic device. The radiator has the heat radiation effect on the second electronic device and the shielding effect on electromagnetic interference, and has the advantages of simple structure and small space occupation rate.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. Like elements or portions are generally identified by like reference numerals throughout the several figures. In the drawings, elements or portions thereof are not necessarily drawn to scale.
Fig. 1 is a perspective view of a circuit board assembly according to an embodiment of the present application;
fig. 2 is an exploded view of a circuit board assembly according to an embodiment of the present application;
fig. 3 is a schematic view of a circuit board assembly according to an embodiment of the present application when viewed along a direction opposite to a first direction;
Fig. 4 is a schematic view of another circuit board assembly according to an embodiment of the present application when viewed along a direction opposite to the first direction.
Detailed Description
In order that the application may be readily understood, a more particular description thereof will be rendered by reference to specific embodiments that are illustrated in the appended drawings. It will be understood that when an element is referred to as being "fixed" to another element, it can be directly on the other element or one or more intervening elements may be present therebetween. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or one or more intervening elements may be present therebetween. The terms "vertical," "horizontal," "left," "right," "inner," "outer," and the like are used in this specification for purposes of illustration only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and/or" as used in this specification includes any and all combinations of one or more of the associated listed items.
In the description of the present specification, unless explicitly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may, for example, be fixedly connected, detachably connected, or integrally formed, mechanically connected, electrically connected, directly connected, indirectly connected through an intermediary, or communicate between two elements or interact between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
In addition, the technical features mentioned in the different embodiments of the application described below can be combined with one another as long as they do not conflict with one another.
Referring to fig. 1 and 2, a circuit board assembly 1000 includes a first substrate 1, a first electronic device 2, a heat sink 3, and a sub-circuit board 4. The first electronic device 2 and the heat sink 3 are disposed on the first surface 11 of the first substrate 1, and the heat sink 3 is electrically connected to the ground terminal of the first substrate 1. The sub-circuit board 4 is arranged on the side of the heat sink 3 facing away from the first electronic device 2, the sub-circuit board 4 is electrically connected with the first substrate 1, the sub-circuit board 4 is in thermal contact with the heat sink 3, and the sub-circuit board 4 is provided with the second electronic device 42.
By "the sub-circuit board 4 is in thermal contact with the heat sink 3" is meant that the sub-circuit board 4 is in direct contact with the heat sink 3 or in indirect contact with the heat conducting medium, so that a heat transfer path exists between the sub-circuit board 4 and the heat sink 3, and heat can be transferred from an object with a higher temperature to an object with a lower temperature.
By thermal contact with the sub-circuit board 4, the heat sink 3 is able to absorb heat from the sub-circuit board 4 to act as a heat sink for the second electronic device 42. The sub-circuit board 4 is disposed on a side of the heat sink 3 facing away from the first electronic device 2, and the heat sink 3 is electrically connected to the ground terminal of the first substrate 1, so that the heat sink 3 can play a role of electromagnetic shielding between the first electronic device 2 and the second electronic device 42. When the circuit board assembly 1000 provided by the embodiment of the application is applied to a power module, a power tube of the power module is used as the second electronic device 42, devices such as voltage and inductance which can generate larger electromagnetic interference on the power tube when working on a circuit board of the power module are used as the first electronic device 2, and the radiator 3 has both the heat dissipation effect on the power tube and the electromagnetic interference shielding effect, so that compared with the traditional power module, the structure of the electromagnetic shielding cover can be omitted, and the structure is simple, and the space occupation rate is small.
In some embodiments, the heat sink 3 is made of a metal material, which may be copper, aluminum, silver or other metals, and may be an alloy. In some embodiments, the heat spreader 3 may also be made of graphite, graphene material.
Referring to fig. 3, in some embodiments, the sub-circuit board 4 includes a second substrate 41 and a second electronic device 42, where a surface 411 of the second substrate 41 is in thermal contact with a surface of the heat sink 3 facing away from the first electronic device 2, and the second electronic device 42 is disposed on another surface 412 of the second substrate 41.
In some embodiments, a thermal interface material is disposed between the surface 411 of the second substrate 41 and the surface of the heat sink 3 facing away from the first electronic device 2, and the second substrate 41 is in thermal contact with the heat sink 3 through the thermal interface material, and the thermal interface material may be a thermal silicone grease, a thermal silicone gel, a heat dissipation pad, a phase change material, a phase change metal sheet, a thermal adhesive, or the like.
It will be appreciated that referring to fig. 4, in other embodiments, the second electronic device 42 may be disposed on the surface 411 of the second substrate 41 facing the heat sink 3, and thermally contact the surface of the heat sink 3 facing away from the first electronic device 2 through the second electronic device 42 to achieve the heat dissipation function of the heat sink 3 on the second electronic device 42, and a thermal interface material may be disposed between the second electronic devices 42 to improve the heat transfer efficiency, and some thermal interface materials may also play a role of filling the gap between the second electronic device 42 and the surface of the heat sink 3 facing away from the first electronic device 2, so that when the second electronic device 2 is a plurality of electronic devices with different thicknesses, the thermal interface material may be connected to the surface of the heat sink 3 facing away from the first electronic device 2 through the thermal interface material, which is an exemplary thermal interface material may be a thermally conductive silica gel 5. In other embodiments, the gap between the surface 411 of the second substrate 41 and the second electronic device 42 arranged on the surface 411 is filled with a thermal interface material, so that the surface 411 of the second substrate 41 and the second electronic device 42 arranged on the surface 411 can be simultaneously in thermal contact with the surface of the heat sink 3 facing away from the first electronic device 2.
In some implementations, the second substrate 41 is disposed perpendicularly to the first surface 11.
Referring to fig. 2, in some embodiments, the first substrate 1 is provided with a mounting hole 12, one end of the second substrate 41 is provided with a mounting protrusion 413, the mounting protrusion 413 is inserted into the mounting hole 12, and the mounting protrusion 413 is soldered to the mounting hole 12, so that the second substrate 41 is electrically connected to the first substrate 1.
In some embodiments, the outer sidewall of the mounting protrusion 413 is provided with a first pad electrically connected to the circuit of the second substrate 41, the inner wall of the mounting hole 12 is provided with a second pad electrically connected to the circuit of the first substrate 1, and the first pad is soldered to the second pad.
It will be appreciated that the first substrate 1 and the second substrate 41 are not limited to being fixed and electrically connected by soldering through the fitting of the mounting protrusions 413 and the mounting holes 12, and that in other embodiments, the first substrate 1 and the second substrate 41 may be connected by an inter-circuit board connector.
Referring to fig. 2 and 3, in some embodiments, the heat sink 3 includes a heat dissipation plate 31 and heat dissipation fins 32, the heat dissipation plate 31 is vertically disposed on the first surface 11, the heat dissipation plate 31 is disposed opposite to the second substrate 41, the surface of the heat dissipation plate 31 facing the second substrate 41 is connected to the surface 411 of the second substrate 41, and the heat dissipation fins 32 are disposed on the surface of the heat dissipation plate 31 facing away from the second substrate 41.
In some embodiments, the heat dissipation fins 32 are disposed along a first direction X, the number of the heat dissipation fins 32 is plural, the plurality of heat dissipation fins 32 are sequentially disposed at intervals along a second direction Y, and a heat dissipation air channel 33 disposed along the first direction X is formed between the adjacent heat dissipation fins 32, wherein the first direction X is parallel to the first surface 11, and the second direction Y is perpendicular to the first direction X.
In some embodiments, the heat sink 3 is provided with a soldering post 34, the first substrate 1 is provided with a soldering hole 13, and the soldering post 34 is inserted into and soldered to the soldering hole 13, so that the heat sink 3 is electrically connected to the ground terminal of the first substrate 1.
It will be appreciated that the heat sink 3 is not limited to being electrically connected to the ground of the first substrate 1 by means of soldering as described above, for example in other embodiments the heat sink 3 may be screwed to the first substrate 1 by means of conductive bolts.
Based on the same inventive concept, the present application also provides an electronic device, including the circuit board assembly 1000 in any of the above embodiments. Electronic devices include, but are not limited to, power modules.
In some embodiments, the electronic device includes a housing provided with a receiving cavity, the circuit board assembly 1000 is disposed within the receiving cavity, and the heat sink 3 is electrically connected to the housing.
In some embodiments, a threaded hole is provided at an end of the heat sink 3 remote from the first surface 11, and the electronic device further includes a connection bolt that passes through the housing and is screwed to be fixed to the threaded hole, and the heat sink 3 is electrically connected to the housing through the connection bolt.
In some embodiments, the first substrate 1 is fixed to the bottom plate of the housing, the first surface 11 is disposed toward the top plate of the housing, and the connecting bolt passes through the top plate of the housing and is then screwed and fixed to the threaded hole.
The foregoing description is only illustrative of the present application and is not intended to limit the scope of the application, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present application.
Claims (10)
1. A circuit board assembly, comprising:
a first substrate;
the first electronic device is arranged on the first surface of the first substrate;
The radiator is arranged on the first surface and is electrically connected with the grounding end of the first substrate;
The sub-circuit board is arranged on one side, facing away from the first electronic device, of the radiator, is electrically connected with the first substrate, is in thermal contact with the radiator, and is provided with a second electronic device.
2. The circuit board assembly of claim 1, wherein,
The sub-circuit board comprises a second substrate and the second electronic device, wherein one surface of the second substrate is in thermal contact with the surface of the radiator, which is opposite to the first electronic device, and the second electronic device is arranged on the other surface of the second substrate.
3. The circuit board assembly of claim 2, wherein,
The second substrate is vertically arranged on the first surface.
4. The circuit board assembly of claim 2, wherein,
The first base plate is provided with the mounting hole, the one end of second base plate is provided with the installation arch, the installation arch cartridge in the mounting hole, the installation arch weld in the mounting hole.
5. The circuit board assembly of claim 1, wherein,
And the surface of the radiator facing the first electronic device is provided with radiating fins.
6. The circuit board assembly of claim 1, wherein,
The radiator is provided with a welding column, the first substrate is provided with a welding hole, and the welding column is welded to the welding hole.
7. The circuit board assembly according to any one of claims 1-6, wherein,
The radiator is made of metal materials.
8. An electronic device comprising a circuit board assembly according to any one of claims 1-7.
9. The electronic device of claim 8, wherein the electronic device comprises a memory device,
The circuit board assembly comprises a shell, wherein the shell is provided with an accommodating cavity, the circuit board assembly is arranged in the accommodating cavity, and the radiator is electrically connected with the shell.
10. The electronic device of claim 9, wherein the electronic device comprises a memory device,
The radiator is far away from one end of first surface is provided with the screw hole, electronic equipment still includes connecting bolt, connecting bolt passes behind the casing spiro union is fixed in the screw hole, the radiator pass through connecting bolt with the casing electricity is connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421610463.5U CN222827426U (en) | 2024-07-08 | 2024-07-08 | Circuit board components and electronic devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421610463.5U CN222827426U (en) | 2024-07-08 | 2024-07-08 | Circuit board components and electronic devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222827426U true CN222827426U (en) | 2025-05-02 |
Family
ID=95492767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202421610463.5U Active CN222827426U (en) | 2024-07-08 | 2024-07-08 | Circuit board components and electronic devices |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN222827426U (en) |
-
2024
- 2024-07-08 CN CN202421610463.5U patent/CN222827426U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201104378Y (en) | Shielding and Heat Dissipation | |
| CN114379393A (en) | Cooling flow channel structure of multiplexing metal-based circuit board and vehicle-mounted charger | |
| CN217145669U (en) | Cooling flow channel structure of multiplexing metal-based circuit board and vehicle-mounted charger | |
| CN217160294U (en) | Metal substrate electronic component with radiator | |
| CN222827426U (en) | Circuit board components and electronic devices | |
| CN111615305A (en) | Plug box and magnetic resonance system | |
| CN221151828U (en) | Heat radiation structure of power device in controller | |
| CN220023400U (en) | Electric vehicle controller based on high-efficient heat radiation structure and electric vehicle | |
| CN215991724U (en) | Circuit board with heat dissipation function | |
| CN214672591U (en) | Power device packaging structure | |
| CN213183986U (en) | Capacitor assembly for suppressing electromagnetic interference | |
| CN212649850U (en) | Control box and consumer | |
| CN111030426B (en) | Heat pipe heat dissipation converter rack | |
| CN211297517U (en) | Heat radiation structure | |
| CN222108414U (en) | Vehicle-mounted terminal with shielding and heat dissipation structure | |
| CN223987030U (en) | Power module and inverter | |
| CN114498223A (en) | Controller and electric automobile | |
| CN212086780U (en) | Electric appliance box and air conditioner that radiating efficiency is high | |
| CN215682725U (en) | Vehicle-mounted power supply device | |
| CN215934955U (en) | Camera with camera lens | |
| CN223415108U (en) | A vehicle charger | |
| CN223515197U (en) | Electronic device | |
| CN219576843U (en) | Power supply device | |
| CN223885164U (en) | Photovoltaic power optimizer and photovoltaic system | |
| CN223428622U (en) | Power module PCB board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |