CN207505220U - A kind of wiring high density double-sided wiring board - Google Patents
A kind of wiring high density double-sided wiring board Download PDFInfo
- Publication number
- CN207505220U CN207505220U CN201721731566.7U CN201721731566U CN207505220U CN 207505220 U CN207505220 U CN 207505220U CN 201721731566 U CN201721731566 U CN 201721731566U CN 207505220 U CN207505220 U CN 207505220U
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- copper sheet
- heat conduction
- conduction copper
- fixedly connected
- semiconductor chilling
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Abstract
The utility model discloses a kind of wiring high density double-sided wiring boards, including conductive copper sheet, the first insulating layer is fixedly connected at the top of the conductive copper sheet, the bottom of the conductive copper sheet is fixedly connected with second insulating layer, the first heat conduction copper sheet is fixedly connected at the top of first insulating layer, the bottom of second insulating layer is fixedly connected with the second heat conduction copper sheet, both sides at the top of first heat conduction copper sheet are installed with the first semiconductor chilling plate, the both sides of second heat conduction copper sheet bottom are installed with the second semiconductor chilling plate, the surface of first heat conduction copper sheet is bonded with the first temperature sensor.The cooperation that the wiring high density double-sided wiring board passes through the first heat conduction copper sheet, the second heat conduction copper sheet, the first semiconductor chilling plate, the second semiconductor chilling plate, the first temperature sensor, second temperature sensor, battery and microcontroller, solves existing line plate Distribution density height, the problem of causing heat dissipation effect poor, influencing circuit board service life.
Description
Technical field
The utility model is related to technical field of electronic products, specially a kind of wiring high density double-sided wiring board.
Background technology
LED has significant energy saving and service life advantage as a forth generation lighting source.It is with the development of society, daily
Lighting energy consumption problem in life becomes increasingly conspicuous, and therefore, the LED power module with notable power savings advantages has increasingly by people
Favor.The LED lamp cost requirement of the prior art is tight, all must be strictly controlled from light source, lamps and lanterns, wiring board etc., existing skill
The LED circuit board of art, use flat full copper conductor or thick copper plate side by side, complex process is of high cost, Chinese utility model
A kind of double-sided wiring board is proposed in CN204994057U, although which reduces production cost, but the utility model
Distribution density is high, causes heat dissipation effect poor, influences circuit board service life, for this purpose, it is proposed that a kind of wiring high density is two-sided
Wiring board.
Utility model content
The purpose of this utility model is to provide a kind of wiring high density double-sided wiring boards, have good heat dissipation effect, use
The advantages of long lifespan, solves existing line plate Distribution density height, causes heat dissipation effect poor, influence asking for circuit board service life
Topic.
To achieve the above object, the utility model provides following technical solution：A kind of wiring high density double-sided wiring board, packet
Conductive copper sheet is included, the first insulating layer is fixedly connected at the top of the conductive copper sheet, the bottom of the conductive copper sheet is fixedly connected
There is second insulating layer, the first heat conduction copper sheet, the bottom of the second insulating layer are fixedly connected at the top of first insulating layer
It is fixedly connected with the second heat conduction copper sheet, the both sides at the top of first heat conduction copper sheet are installed with the first semiconductor refrigerating
Piece, the both sides of the second heat conduction copper sheet bottom are installed with the second semiconductor chilling plate, first heat conduction copper sheet
Surface is bonded with the first temperature sensor, and the surface of second heat conduction copper sheet is bonded with second temperature sensor, and described first
Battery is fixedly connected at the top of heat conduction copper sheet, microcontroller is welded at the top of the battery；
The output terminal of first temperature sensor and the input terminal of microcontroller are unidirectionally electrically connected, and the second temperature passes
The output terminal of sensor and the input terminal of microcontroller are unidirectionally electrically connected, the output terminal of the microcontroller respectively with the first semiconductor system
The input terminal of cold and the second semiconductor chilling plate is unidirectionally electrically connected, the input terminal of the microcontroller and the output terminal list of battery
Electrotropism connects.
Preferably, the top of the battery and display screen is inlaid on the right side of the microcontroller, the display screen uses LCD
Display screen.
Preferably, the input terminal of the display screen and the output terminal of microcontroller are unidirectionally electrically connected, the left side of the battery
It is fixedly connected with power cord.
Preferably, the surface of first heat conduction copper sheet is fixedly connected with the first protective layer, second heat conduction copper sheet
Surface is fixedly connected with the second protective layer.
Compared with prior art, the beneficial effects of the utility model are as follows：
1st, the utility model can detect first respectively by being provided with the first temperature sensor and second temperature sensor
The temperature change of heat conduction copper sheet and the second heat conduction copper sheet, so as to detect the variation of the bulk temperature of wiring board, when circuit plate temperature mistake
Gao Shi, starts the first semiconductor chilling plate by microcontroller automatically and the second semiconductor chilling plate freezes, the first semiconductor
Cooling piece and the second semiconductor utilize the peltier effect of semi-conducting material, when direct current passes through two kinds of different semi-conducting material strings
During the galvanic couple being unified into, heat can be absorbed respectively at the both ends of galvanic couple and release heat, can realize the purpose of refrigeration, by the
One heat conduction copper sheet, the second heat conduction copper sheet, the first semiconductor chilling plate, the second semiconductor chilling plate, the first temperature sensor, second
The cooperation of temperature sensor, battery and microcontroller solves existing line plate Distribution density height, causes heat dissipation effect poor, influences
The problem of circuit board service life.
2nd, the utility model, can be with the temperature change of display circuit board, by being provided with power supply by being provided with display screen
Line facilitates user to connect electricity for battery, by being provided with the first protective layer, strengthens the protection to wiring board, extend wiring board
Service life, by being provided with the second protective layer, equally strengthen the protection to wiring board, extend wiring board uses the longevity
Life.
Description of the drawings
FIG. 1 is a schematic structural view of the utility model；
Fig. 2 is Tthe utility model system schematic diagram.
In figure：1 conductive copper sheet, 2 first insulating layers, 3 second insulating layers, 4 first heat conduction copper sheets, 5 second heat conduction copper sheets, 6
First semiconductor chilling plate, 7 second semiconductor chilling plates, 8 first temperature sensors, 9 second temperature sensors, 10 batteries, 11
Microcontroller, 12 display screens, 13 power cords, 14 first protective layers, 15 second protective layers.
Specific embodiment
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out
It clearly and completely describes, it is clear that the described embodiments are only a part of the embodiments of the utility model rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are without making creative work
All other embodiments obtained shall fall within the protection scope of the present invention.
- 2 are please referred to Fig.1, a kind of wiring high density double-sided wiring board, including conductive copper sheet 1, the top of conductive copper sheet 1 is consolidated
Surely the first insulating layer 2 is connected with, the bottom of conductive copper sheet 1 is fixedly connected with second insulating layer 3, and the top of the first insulating layer 2 is consolidated
Surely the first heat conduction copper sheet 4 is connected with, the bottom of second insulating layer 3 is fixedly connected with the second heat conduction copper sheet 5, the first heat conduction copper sheet 4
The both sides at top are installed with the first semiconductor chilling plate 6, and the both sides of 5 bottom of the second heat conduction copper sheet are installed with
Two semiconductor chilling plates 7, the surface of the first heat conduction copper sheet 4 are bonded with the first temperature sensor 8, the surface of the second heat conduction copper sheet 5
Second temperature sensor 9 is bonded with, the top of the first heat conduction copper sheet 4 is fixedly connected with battery 10, and the top of battery 10 is welded with
Microcontroller 11；
The output terminal of first temperature sensor 8 is unidirectionally electrically connected with the input terminal of microcontroller 11, second temperature sensor 9
The input terminal of output terminal and microcontroller 11 be unidirectionally electrically connected, the output terminal of microcontroller 11 respectively with the first semiconductor chilling plate
6 and second the input terminal of semiconductor chilling plate 7 be unidirectionally electrically connected, the output terminal of the input terminal and battery 10 of microcontroller 11 is unidirectional
It is electrically connected, the top of battery 10 and is inlaid with display screen 12 positioned at the right side of microcontroller 11, display screen 12 is shown using LCD
Screen, can be with the temperature change of display circuit board by being provided with display screen 12, and the input terminal of display screen 12 is defeated with microcontroller 11
Outlet is unidirectionally electrically connected, and the left side of battery 10 is fixedly connected with power cord 13, by being provided with power cord 13, facilitates the user to be
Battery 10 connects electricity, and the surface of the first heat conduction copper sheet 4 is fixedly connected with the first protective layer 14, and the surface of the second heat conduction copper sheet 5 is fixed
The second protective layer 15 is connected with, by being provided with the first protective layer 14, the protection to wiring board is strengthened, extends wiring board
Service life by being provided with the second protective layer 15, equally strengthens the protection to wiring board, extend wiring board uses the longevity
Life, by being provided with the first temperature sensor 8 and second temperature sensor 9, can detect the first heat conduction copper sheet 4 and second respectively
The temperature change of heat conduction copper sheet 5, so as to detect the bulk temperature of wiring board variation, when wiring board when the temperature is excessively high, pass through monolithic
Machine 11 starts the first semiconductor chilling plate 6 automatically and the second semiconductor chilling plate 7 freezes, 6 He of the first semiconductor chilling plate
Second semiconductor utilizes the peltier effect of semi-conducting material, when the electricity that direct current is connected by two kinds of different semi-conducting materials
When even, heat can be absorbed respectively at the both ends of galvanic couple and release heat, the purpose of refrigeration can be realized, pass through the first conduction copper
Piece 4, the second heat conduction copper sheet 5, the first semiconductor chilling plate 6, the second semiconductor chilling plate 7, first the 8, second temperature of temperature sensor
The cooperation of sensor 9, battery 10 and microcontroller 11 is spent, existing line plate Distribution density height is solved, causes heat dissipation effect poor, shadow
The problem of ringing circuit board service life.
In use, by being provided with the first temperature sensor 8 and second temperature sensor 9, first can be detected respectively and is led
The temperature change of hot 4 and second heat conduction copper sheet 5 of copper sheet, so as to detect the variation of the bulk temperature of wiring board, when circuit plate temperature mistake
Gao Shi is started the first semiconductor chilling plate 6 and the second semiconductor chilling plate 7 by microcontroller 11 and freezed automatically, and the first half
6 and second semiconductor of conductor cooling piece utilizes the peltier effect of semi-conducting material, when direct current passes through two kinds of different semiconductors
Material in series into galvanic couple when, heat can be absorbed respectively at the both ends of galvanic couple and release heat, can realize the purpose of refrigeration,
Pass through the first heat conduction copper sheet 4, the second heat conduction copper sheet 5, the first semiconductor chilling plate 6, the second semiconductor chilling plate 7, the first temperature
The cooperation of sensor 8, second temperature sensor 9, battery 10 and microcontroller 11 solves existing line plate Distribution density height, leads
The problem of causing heat dissipation effect poor, influencing circuit board service life.
In summary：The wiring high density double-sided wiring board passes through the first heat conduction copper sheet 4, the second heat conduction copper sheet 5, first
Semiconductor chilling plate 6, the second semiconductor chilling plate 7, the first temperature sensor 8, second temperature sensor 9, battery 10 and monolithic
The cooperation of machine 11 solves existing line plate Distribution density height, causes heat dissipation effect poor, influence asking for circuit board service life
Topic.
While there has been shown and described that the embodiment of the utility model, for the ordinary skill in the art,
It is appreciated that can these embodiments be carried out with a variety of variations in the case of the principle and spirit for not departing from the utility model, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (4)
1. a kind of wiring high density double-sided wiring board, including conductive copper sheet (1), it is characterised in that：The top of the conductive copper sheet (1)
Portion is fixedly connected with the first insulating layer (2), and the bottom of the conductive copper sheet (1) is fixedly connected with second insulating layer (3), and described
The first heat conduction copper sheet (4) is fixedly connected at the top of one insulating layer (2), the bottom of the second insulating layer (3) is fixedly connected with
Second heat conduction copper sheet (5), the both sides at the top of first heat conduction copper sheet (4) are installed with the first semiconductor chilling plate (6),
The both sides of second heat conduction copper sheet (5) bottom are installed with the second semiconductor chilling plate (7), first heat conduction copper sheet
(4) surface is bonded with the first temperature sensor (8), and the surface of second heat conduction copper sheet (5) is bonded with second temperature sensing
Device (9) is fixedly connected with battery (10) at the top of first heat conduction copper sheet (4), list is welded at the top of the battery (10)
Piece machine (11)；
The input terminal of the output terminal and microcontroller (11) of first temperature sensor (8) is unidirectionally electrically connected, second temperature
The input terminal of the output terminal and microcontroller (11) of degree sensor (9) is unidirectionally electrically connected, the output terminal point of the microcontroller (11)
Input terminal not with the first semiconductor chilling plate (6) and the second semiconductor chilling plate (7) is unidirectionally electrically connected, the microcontroller
(11) output terminal of input terminal and battery (10) is unidirectionally electrically connected.
2. a kind of wiring high density double-sided wiring board according to claim 1, it is characterised in that：The top of the battery (10)
Portion and display screen (12) is inlaid on the right side of the microcontroller (11), the display screen (12) is using LCD display.
3. a kind of wiring high density double-sided wiring board according to claim 2, it is characterised in that：The display screen (12)
The output terminal of input terminal and microcontroller (11) is unidirectionally electrically connected, and power cord is fixedly connected on the left of the battery (10)
(13)。
4. a kind of wiring high density double-sided wiring board according to claim 1, it is characterised in that：First heat conduction copper sheet
(4) surface is fixedly connected with the first protective layer (14), and the surface of second heat conduction copper sheet (5) is fixedly connected with the second protection
Layer (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721731566.7U CN207505220U (en) | 2017-12-11 | 2017-12-11 | A kind of wiring high density double-sided wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721731566.7U CN207505220U (en) | 2017-12-11 | 2017-12-11 | A kind of wiring high density double-sided wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207505220U true CN207505220U (en) | 2018-06-15 |
Family
ID=62509468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721731566.7U Active CN207505220U (en) | 2017-12-11 | 2017-12-11 | A kind of wiring high density double-sided wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207505220U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109714884A (en) * | 2019-02-18 | 2019-05-03 | 上海微小卫星工程中心 | A kind of solar battery array PCB substrate of entirety isothermal |
| CN113423246A (en) * | 2021-06-29 | 2021-09-21 | 长光卫星技术有限公司 | Light device for efficient heat dissipation of cubic satellite electronic equipment |
-
2017
- 2017-12-11 CN CN201721731566.7U patent/CN207505220U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109714884A (en) * | 2019-02-18 | 2019-05-03 | 上海微小卫星工程中心 | A kind of solar battery array PCB substrate of entirety isothermal |
| CN113423246A (en) * | 2021-06-29 | 2021-09-21 | 长光卫星技术有限公司 | Light device for efficient heat dissipation of cubic satellite electronic equipment |
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