CN207854270U - A kind of circuit board of ceramic material - Google Patents
A kind of circuit board of ceramic material Download PDFInfo
- Publication number
- CN207854270U CN207854270U CN201820217867.6U CN201820217867U CN207854270U CN 207854270 U CN207854270 U CN 207854270U CN 201820217867 U CN201820217867 U CN 201820217867U CN 207854270 U CN207854270 U CN 207854270U
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- potsherd
- copper sheet
- fixedly connected
- conductive copper
- circuit board
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Abstract
The utility model discloses a kind of circuit boards of ceramic material, including conductive copper sheet, the first potsherd is fixedly connected at the top of the conductive copper sheet, the bottom of the conductive copper sheet is fixedly connected with the second potsherd, left side at the top of first potsherd is fixedly connected with the first cooling piece, second potsherd is fixedly connected with the second cooling piece on the left of bottom, right side at the top of first potsherd is fixedly connected with the first temperature sensor, second potsherd is fixedly connected with second temperature sensor on the right side of bottom, the surface mount of first potsherd has the first protective layer, the surface mount of second potsherd has the second protective layer.The cooperation that the utility model passes through the first cooling piece, the second cooling piece, the first temperature sensor, second temperature sensor, the first protective layer, the second protective layer and piece machine; temperature change can not effectively be controlled by solving available circuit plate, thus the problem of can not ensureing circuit board normal operation.
Description
Technical field
The utility model is related to printed circuit board technology field, specially a kind of circuit board of ceramic material.
Background technology
Common wiring board is all to use epoxy resin fiberglass cloth etc. as base material, according to the requirement of circuit on base material
It is printed to circuit board, then welds the various electronic components such as resistance in need, capacitance on circuit boards, due to electronic component
There is certain volume, can be larger for complicated electric equipment products circuit board, it is compact-sized in order to make, the volume of circuit board is reduced,
Can various electronic components be arranged to electronics member device that is compact, but often needing to connect higher fever on circuit boards
Part, such as the lamp bead of LED, resistance, and the circuit board of common substrate is poor due to heat dissipation performance, it has to increase thermoelectron more occurred frequently
Spacing between component, and increase the area of circuit board, propose a kind of ceramics in Chinese utility model CN202873179U
The printed circuit board of material, the utility model can not effective control circuit board temperature, to can not ensure the normal of circuit board
Operation, for this purpose, it is proposed that a kind of circuit board of ceramic material.
Utility model content
The purpose of this utility model is to provide a kind of circuit board of ceramic material, have effectively control temperature change, from
And the advantages of ensureing circuit board normal operation, temperature change can not effectively be controlled by solving available circuit plate, to ensure
The problem of circuit board normal operation.
To achieve the above object, the utility model provides the following technical solutions：A kind of circuit board of ceramic material, including lead
Electrolytic copper piece is fixedly connected with the first potsherd at the top of the conductive copper sheet, and the bottom of the conductive copper sheet is fixedly connected with
Two potsherds, the left side at the top of first potsherd are fixedly connected with the first cooling piece, a left side for second potsherd bottom
Side is fixedly connected with the second cooling piece, and the right side at the top of first potsherd is fixedly connected with the first temperature sensor, described
Second temperature sensor is fixedly connected on the right side of second potsherd bottom, the surface mount of first potsherd has the first guarantor
The surface mount of sheath, second potsherd has the second protective layer, is welded with microcontroller at the top of second potsherd, institute
It states and is fixedly connected with power cord on the right side of microcontroller；
The input terminal of the microcontroller is unidirectionally electric with the output end of the first temperature sensor and second temperature sensor respectively
Property connection, the output end of the microcontroller is unidirectionally electrically connected with the input terminal of the first cooling piece and the second cooling piece respectively.
Preferably, the left side at the top of the conductive copper sheet, the first potsherd and the second potsherd offers the first installation
Hole, the right side at the top of the conductive copper sheet, the first potsherd and the second potsherd offer the second mounting hole.
Preferably, the first adhered layer is pasted at the top of the conductive copper sheet, the conductive copper sheet passes through the first adhered layer
It is fixedly connected with the first potsherd.
Preferably, the bottom of the conductive copper sheet is pasted with the second adhered layer, and the conductive copper sheet passes through the second adhered layer
It is fixedly connected with the second potsherd.
Compared with prior art, the beneficial effects of the utility model are as follows：
1, the utility model is by being provided with the first potsherd and the second potsherd, since ceramics have preferable thermal conductivity
Can and insulating properties, to improve the heat-sinking capability and insulation performance of circuit board, by being provided with the first temperature sensor and the
Two temperature sensors can detect the temperature of the first potsherd and the second potsherd surface, by being provided with the first refrigeration respectively
Piece and the second cooling piece, cooling piece are also thermoelectric semiconductor cooling assembly, are divided into two sides, absorb heat on one side, radiate on one side, play and lead
The patch of heat, itself not will produce it is cold, by by one side and the first potsherd of the first cooling piece and the heat absorption of the second cooling piece and
Second potsherd contacts, and achievees the effect that cooling, passes through the first cooling piece, the second cooling piece, the first temperature sensor, the second temperature
The cooperation for spending sensor, the first protective layer, the second protective layer and piece machine, temperature change can not effectively be controlled by solving available circuit plate
Change, thus the problem of can not ensureing circuit board normal operation.
2, the utility model facilitates staff to pass through the first installation by being provided with the first mounting hole and the second mounting hole
Circuit board is fixed in hole and the second mounting hole, by being provided with the first adhered layer so that the first potsherd and conductive copper sheet
Connect it is even closer, by being provided with the second adhered layer so that the second potsherd connect even closer with conductive copper sheet.
Description of the drawings
FIG. 1 is a schematic structural view of the utility model；
Fig. 2 is Tthe utility model system schematic diagram.
In figure：1 conductive copper sheet, 2 first potsherds, 3 second potsherds, 4 first cooling pieces, 5 second cooling pieces, 6 first
Temperature sensor, 7 second temperature sensors, 8 first protective layers, 9 second protective layers, 10 microcontrollers, 11 power cords, 12 first peaces
Fill hole, 13 second mounting holes, 14 first adhered layers, 15 second adhered layers.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
The every other embodiment obtained, shall fall within the protection scope of the present invention.
- 2 are please referred to Fig.1, company is fixed at a kind of circuit board of ceramic material, including conductive copper sheet 1, the top of conductive copper sheet 1
It is connected to the first potsherd 2, the bottom of conductive copper sheet 1 is fixedly connected with the second potsherd 3, and the left side at 2 top of the first potsherd is solid
Surely it is connected with the first cooling piece 4, the second cooling piece 5, the first potsherd 2 top are fixedly connected on the left of 3 bottom of the second potsherd
It is fixedly connected with the first temperature sensor 6 on the right side of portion, second temperature sensing is fixedly connected on the right side of 3 bottom of the second potsherd
The surface mount of device 7, the first potsherd 2 has the first protective layer 8, the surface mount of the second potsherd 3 to have the second protective layer 9, the
The top of two potsherds 3 is welded with microcontroller 10, and the right side of microcontroller 10 is fixedly connected with power cord 11；
The input terminal of microcontroller 10 is unidirectionally electric with the output end of the first temperature sensor 6 and second temperature sensor 7 respectively
Property connection, the input terminal of the output end of microcontroller 10 respectively with the first cooling piece 4 and the second cooling piece 5 is unidirectionally electrically connected, leads
The left side at 3 top of electrolytic copper piece 1, the first potsherd 2 and the second potsherd offers the first mounting hole 12, conductive copper sheet 1, first
The right side at potsherd 2 and the top of the second potsherd 3 offers the second mounting hole 13, by being provided with the first mounting hole 12 and the
Two mounting holes 13 facilitate staff that circuit board is fixed by the first mounting hole 12 and the second mounting hole 13, conductive copper
The top of piece 1 is pasted with the first adhered layer 14, and conductive copper sheet 1 is fixedly connected by the first adhered layer 14 with the first potsherd 2, leads to
It crosses and is provided with the first adhered layer 14 so that the first potsherd 2 connect even closer with conductive copper sheet 1, and the bottom of conductive copper sheet 1 is glued
The second adhered layer 15 is posted, conductive copper sheet 1 is fixedly connected by the second adhered layer 15 with the second potsherd 3, by being provided with
Two adhered layers 15 so that the second potsherd 3 connect with conductive copper sheet 1 it is even closer, by being provided with the first potsherd 2 and second
Potsherd 3, since ceramics have preferable heat conductivility and insulating properties, to improve the heat-sinking capability and insulating properties of circuit board
Can, by being provided with the first temperature sensor 6 and second temperature sensor 7, the first potsherd 2 and second pottery can be detected respectively
The temperature on 3 surface of tile, by being provided with the first cooling piece 4 and the second cooling piece 5, cooling piece is also thermoelectric semiconductor refrigeration train
Part is divided into two sides, absorbs heat on one side, radiates on one side, plays the patch of heat conduction, itself not will produce it is cold, by by the first cooling piece 4
It is contacted with the first potsherd 2 and the second potsherd 3 with the one side of the second cooling piece 5 heat absorption, achievees the effect that cooling, pass through first
Cooling piece 4, the second cooling piece 5, the first temperature sensor 6, second temperature sensor 7, the first protective layer 8,9 and of the second protective layer
The cooperation of piece machine, temperature change can not effectively be controlled by solving available circuit plate, to ensure circuit board normal operation
Problem.
In use, by being provided with the first potsherd 2 and the second potsherd 3, since ceramics have preferable heat conductivility
And insulating properties, to improve the heat-sinking capability and insulation performance of circuit board, by being provided with the first temperature sensor 6 and second
Temperature sensor 7 can detect the temperature on 3 surface of the first potsherd 2 and the second potsherd, by being provided with the first refrigeration respectively
Piece 4 and the second cooling piece 5, cooling piece are also thermoelectric semiconductor cooling assembly, are divided into two sides, absorb heat on one side, radiate on one side, play
The patch of heat conduction, itself not will produce cold, pass through one side that the first cooling piece 4 and the second cooling piece 5 absorb heat and the first ceramics
Piece 2 and the contact of the second potsherd 3, achieve the effect that cooling, pass through the first cooling piece 4, the second cooling piece 5, the first temperature sensing
The cooperation of device 6, second temperature sensor 7, the first protective layer 8, the second protective layer 9 and piece machine, solving available circuit plate can not
Effectively control temperature change, thus the problem of can not ensureing circuit board normal operation.
In summary：The circuit board of the ceramic material passes through conductive copper sheet 1, the first potsherd 2, the second potsherd 3,
One cooling piece 4, the second cooling piece 5, the first temperature sensor 6, second temperature sensor 7, the first protective layer 8, the second protective layer
9, the cooperation of microcontroller 10 and power cord 11, temperature change can not effectively be controlled by solving available circuit plate, to ensure
The problem of circuit board normal operation.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is appreciated that can these embodiments be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (4)
1. a kind of circuit board of ceramic material, including conductive copper sheet (1), it is characterised in that：The top of the conductive copper sheet (1) is solid
Surely it is connected with the first potsherd (2), the bottom of the conductive copper sheet (1) is fixedly connected with the second potsherd (3), first pottery
Left side at the top of tile (2) is fixedly connected with the first cooling piece (4), is fixedly connected on the left of the second potsherd (3) bottom
There is the second cooling piece (5), the right side at the top of first potsherd (2) is fixedly connected with the first temperature sensor (6), and described
Second temperature sensor (7), the surface mount of first potsherd (2) are fixedly connected on the right side of two potsherds (3) bottom
There are the first protective layer (8), the surface mount of second potsherd (3) to have the second protective layer (9), second potsherd (3)
Top be welded with microcontroller (10), be fixedly connected with power cord (11) on the right side of the microcontroller (10)；
The input terminal of the microcontroller (10) output end with the first temperature sensor (6) and second temperature sensor (7) respectively
It is unidirectional to be electrically connected, the output end of the microcontroller (10) input terminal with the first cooling piece (4) and the second cooling piece (5) respectively
It is unidirectional to be electrically connected.
2. a kind of circuit board of ceramic material according to claim 1, it is characterised in that：The conductive copper sheet (1), first
Left side at the top of potsherd (2) and the second potsherd (3) offers the first mounting hole (12), the conductive copper sheet (1), first
Right side at the top of potsherd (2) and the second potsherd (3) offers the second mounting hole (13).
3. a kind of circuit board of ceramic material according to claim 1, it is characterised in that：The top of the conductive copper sheet (1)
Portion is pasted with the first adhered layer (14), and the conductive copper sheet (1) connects by the way that the first adhered layer (14) and the first potsherd (2) are fixed
It connects.
4. a kind of circuit board of ceramic material according to claim 1, it is characterised in that：The bottom of the conductive copper sheet (1)
Portion is pasted with the second adhered layer (15), and the conductive copper sheet (1) connects by the way that the second adhered layer (15) and the second potsherd (3) are fixed
It connects.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820217867.6U CN207854270U (en) | 2018-02-06 | 2018-02-06 | A kind of circuit board of ceramic material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820217867.6U CN207854270U (en) | 2018-02-06 | 2018-02-06 | A kind of circuit board of ceramic material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207854270U true CN207854270U (en) | 2018-09-11 |
Family
ID=63411618
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820217867.6U Active CN207854270U (en) | 2018-02-06 | 2018-02-06 | A kind of circuit board of ceramic material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207854270U (en) |
-
2018
- 2018-02-06 CN CN201820217867.6U patent/CN207854270U/en active Active
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