CN209170719U - A kind of pcb board easy to assembly and inexpensive - Google Patents
A kind of pcb board easy to assembly and inexpensive Download PDFInfo
- Publication number
- CN209170719U CN209170719U CN201821416523.4U CN201821416523U CN209170719U CN 209170719 U CN209170719 U CN 209170719U CN 201821416523 U CN201821416523 U CN 201821416523U CN 209170719 U CN209170719 U CN 209170719U
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- pcb board
- assembly
- inexpensive
- substrate layer
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Abstract
The utility model relates to technical field of PCB board, more particularly to a kind of pcb board easy to assembly and inexpensive, including substrate layer, the upper surface for being set to substrate layer conductive layer, be set on conductive layer several electronic components, be set to substrate layer lower surface absorbing and cooling temperature material layer and through several dissipating vias of conductive layer, substrate layer and absorbing and cooling temperature material layer；Conductive layer offers several inserting grooves for the pin of grafting electronic component, and the notch of inserting groove is provided with several for closing the elastic conducting strip of notch；The two side ends of absorbing and cooling temperature material layer are provided with buckle, and the two side ends of substrate layer are provided with for the clamping block with buckle snapping；Several dissipating vias are to be obliquely installed.The pcb board easy to assembly and inexpensive has thermal diffusivity good, and has the advantages that assembling is easy and convenient, production cost is low.
Description
Technical field
The utility model relates to technical field of PCB board, more particularly to a kind of pcb board easy to assembly and inexpensive.
Background technique
Pcb board namely printed circuit board are the suppliers of electronic component electrical connection.Using the main of circuit board
Advantage is to greatly reduce the mistake of wiring and assembly, improves the gentle productive labor rate of Automated water.Currently, according to pcb layer
Number, pcb board can be divided into single sided board, dual platen, four laminates, six laminates and other multilayer circuit boards.
The structure of pcb board is generally made of substrate layer and the conductive layer above substrate layer, and substrate layer is insulating layer.
Pcb board is existing in use, corresponding electronic component can be welded on the electronic component pad on the conductive layer of pcb board
In technology, the connection of electronic component and conductive layer mostly uses the mode of welding, cumbersome, group that there are techniques by the way of welding
Dress is inconvenient, and the defect of high production cost, and this is fixed on the pin of electronic component on pad by scolding tin
Mode, it is possible to rosin joint phenomenon occur.
In addition, since the heating conduction of the resin composite materials of insulating layer is very poor, and the heat that electronic component work generates
Amount is main to be transferred to outside air by the copper foil of conductive layer, but copper thickness is small-sized, and the capacity of heat transmission is limited, therefore,
It usually requires that heat dissipating layer is arranged in the bottom of insulating layer, in the prior art, heat dissipating layer is usually passed through into crimping or bonding side
Formula is connect with insulating layer, however, these modes have the defects that assembling is inconvenient.
Utility model content
The purpose of this utility model is that aiming at the deficiencies in the prior art and provide it is a kind of easy to assembly and it is low at
This pcb board, the pcb board easy to assembly and inexpensive have thermal diffusivity good, and easy and convenient, production cost is low with assembling
The advantages of.
In order to achieve the above objectives, the utility model is achieved through the following technical solutions.
A kind of pcb board easy to assembly and inexpensive is provided, including substrate layer, the upper surface for being set to the substrate layer
The heat absorption of conductive layer, several electronic components being set on the conductive layer, the lower surface for being set to the substrate layer is dropped
Adiabator layer and through the conductive layer, several dissipating vias of the substrate layer and the absorbing and cooling temperature material layer；
The conductive layer offers several inserting grooves for the pin of electronic component described in grafting, the inserting groove
Notch be provided with several for closing the elastic conducting strip of the notch；
The two side ends of the absorbing and cooling temperature material layer are provided with buckle, and the two side ends of the substrate layer, which are provided with, to be used for
With the clamping block of the buckle snapping；
Several described dissipating vias are to be obliquely installed.
The longitudinal section of the inserting groove is set as U-shaped.
There are four the elastic conducting strips for closing the notch for the notch setting of the inserting groove.
The tilt angle of the dissipating vias is set as 5 degree~10 degree.
Preferably, the tilt angle of the dissipating vias is set as 8 degree.
The both ends of the buckle are provided with the elastic slice extended out.
The elastic slice extended out described in two is relatively arranged on the both ends of the buckle.
The utility model has the beneficial effects that
One kind provided by the utility model pcb board easy to assembly and inexpensive, including substrate layer, is set to substrate layer
The heat absorption of the conductive layer of upper surface, several electronic components being set on conductive layer, the lower surface for being set to substrate layer is dropped
Adiabator layer and several dissipating vias through conductive layer, substrate layer and absorbing and cooling temperature material layer；Conductive layer offers
Several are used for the inserting groove of the pin of grafting electronic component, and the notch of inserting groove is provided with several for closing notch
Elastic conducting strip；The two side ends of absorbing and cooling temperature material layer are provided with buckle, the two side ends of substrate layer be provided with for card
Detain the clamping block of snapping；Several dissipating vias are to be obliquely installed.Due to drawing by the direct grafting electronic component of inserting groove
Foot, and using the pin of elastic conducting strip clamping electronic component and conducting, and then avoid fixation by welding and draw
Foot, and then have process simple, easy to assembly, the low advantage of production cost.In addition, due to making absorbing and cooling temperature by snap fit
Material layer is connected to the bottom of substrate layer, further such that easy to assembly.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of one kind of the utility model pcb board easy to assembly and inexpensive.
Fig. 2 is the overlooking structure diagram of the inserting groove of one kind of the utility model pcb board easy to assembly and inexpensive.
Appended drawing reference:
Substrate layer 1, clamping block 11；
Conductive layer 2；
Electronic component 3, pin 31；
Absorbing and cooling temperature material layer 4, buckle 41, the elastic slice 401 extended out；
Dissipating vias 5；
Inserting groove 6, elastic conducting strip 61.
Specific embodiment
The technical issues of in order to keep the utility model solved, technical solution and beneficial effect are more clearly understood, below
In conjunction with the embodiments and attached drawing, the present invention will be further described in detail.It should be appreciated that specific implementation described herein
Example is only used to explain the utility model, is not used to limit the utility model.
Embodiment 1.
One kind of the present embodiment pcb board easy to assembly and inexpensive, as depicted in figs. 1 and 2, including substrate layer 1, setting
In the upper surface of substrate layer 1 conductive layer 2, be set on conductive layer 2 several electronic components 3, be set to substrate layer 1
The absorbing and cooling temperature material layer 4 of lower surface and through conductive layer 2, substrate layer 1 and absorbing and cooling temperature material layer 4 several dissipate
Hot via hole 5；Wherein, conductive layer 2 offers several inserting grooves 6 for the pin 31 of grafting electronic component 3, inserting groove 6
Notch be provided with several for closing the elastic conducting strip 61 of notch；Wherein, the two side ends of absorbing and cooling temperature material layer 4 are all provided with
It is equipped with buckle 41, the two side ends of substrate layer 1 are provided with for the clamping block 11 with 41 snappings of buckle；Wherein, several radiate
Via hole 5 is to be obliquely installed, and dissipating vias 5 is obliquely installed the heat dissipation area for being capable of increasing dissipating vias 5, is conducive to improve heat dissipation effect
Fruit.Due to passing through the pin 31 of the direct grafting electronic component 3 of inserting groove 6, and utilize 61 clamping electronics member device of elastic conducting strip
The pin 31 of part 3 is simultaneously connected, and then avoids and fix pin by welding, and then have process simple, easy to assembly,
The low advantage of production cost.In addition, due to making absorbing and cooling temperature material layer 4 be connected to the bottom of substrate layer 1 by snap fit, into
One step makes easy to assembly.
In the present embodiment, 6 longitudinal sections of inserting groove are set as U-shaped, so have it is easy to make, and be easily attached electronics member
The advantages of pin 31 of device 3.
In the present embodiment, there are four the elastic conducting strip 61 for closing notch, four are used for for the notch setting of inserting groove 6
The pin 31 of clamping electronic component 3 and pin 31 can be connected well in the elastic conducting strip 61 for closing notch.
In the present embodiment, the tilt angle of dissipating vias 5 is set as 8 degree, and the dissipating vias 5 of the tilt angle is capable of increasing
The heat dissipation area of dissipating vias 5 is conducive to improve heat dissipation effect.
In the present embodiment, the both ends for buckling 41 are provided with the elastic slice 401 extended out, and then convenient for so that absorbing and cooling temperature material
It is clamped between the bed of material 4 and substrate layer 1 compact.
In the present embodiment, two elastic slices 401 extended out are relatively arranged on the both ends of buckle 41, and then are convenient for so that heat absorption
It is clamped between cooling material layer 4 and substrate layer 1 compact.
Embodiment 2.
The embodiment 2 of one kind of the utility model pcb board easy to assembly and inexpensive, the present embodiment and embodiment 1
The difference is that the tilt angle of dissipating vias 5 is set as 5 degree, 5 energy of dissipating vias of the tilt angle in the present embodiment
The heat dissipation area for enough increasing dissipating vias 5 is conducive to improve heat dissipation effect.The other structures and working principle of the present embodiment and implementation
Example 1 is identical, and details are not described herein.
Embodiment 3.
The embodiment 3 of one kind of the utility model pcb board easy to assembly and inexpensive, the present embodiment and embodiment 1
The difference is that the tilt angle of dissipating vias 5 is set as 10 degree, 5 energy of dissipating vias of the tilt angle in the present embodiment
The heat dissipation area for enough increasing dissipating vias 5 is conducive to improve heat dissipation effect.The other structures and working principle of the present embodiment and implementation
Example 1 is identical, and details are not described herein.
Finally it should be noted that above embodiments are merely to illustrate the technical solution of the utility model rather than to this is practical
The limitation of novel protected range, although being explained in detail referring to preferred embodiment to the utility model, the common skill of this field
Art personnel should be appreciated that can be practical without departing from this with the technical solution of the present invention is modified or equivalently replaced
The spirit and scope of new technique scheme.
Claims (7)
1. a kind of pcb board easy to assembly and inexpensive, it is characterised in that: including substrate layer, be set to the upper of the substrate layer
The conductive layer on surface, several electronic components for being set on the conductive layer, the lower surface for being set to the substrate layer
Absorbing and cooling temperature material layer and through the conductive layer, the substrate layer and the absorbing and cooling temperature material layer several dissipate
Hot via hole；
The conductive layer offers several inserting grooves for the pin of electronic component described in grafting, the slot of the inserting groove
Mouth is provided with several for closing the elastic conducting strip of the notch；
The two side ends of the absorbing and cooling temperature material layer are provided with buckle, the two side ends of the substrate layer be provided with for institute
State the clamping block of buckle snapping；
Several described dissipating vias are to be obliquely installed.
2. one kind according to claim 1 pcb board easy to assembly and inexpensive, it is characterised in that: the inserting groove
Longitudinal section is set as U-shaped.
3. one kind according to claim 1 pcb board easy to assembly and inexpensive, it is characterised in that: the inserting groove
There are four the elastic conducting strips for closing the notch for notch setting.
4. one kind according to claim 1 pcb board easy to assembly and inexpensive, it is characterised in that: the dissipating vias
Tilt angle be set as 5 degree~10 degree.
5. one kind according to claim 4 pcb board easy to assembly and inexpensive, it is characterised in that: the dissipating vias
Tilt angle be set as 8 degree.
6. one kind according to claim 1 pcb board easy to assembly and inexpensive, it is characterised in that: the two of the buckle
End is provided with the elastic slice extended out.
7. one kind according to claim 6 pcb board easy to assembly and inexpensive, it is characterised in that: extended out described in two
Elastic slice be relatively arranged on the both ends of the buckle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821416523.4U CN209170719U (en) | 2018-08-29 | 2018-08-29 | A kind of pcb board easy to assembly and inexpensive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821416523.4U CN209170719U (en) | 2018-08-29 | 2018-08-29 | A kind of pcb board easy to assembly and inexpensive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209170719U true CN209170719U (en) | 2019-07-26 |
Family
ID=67330330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821416523.4U Expired - Fee Related CN209170719U (en) | 2018-08-29 | 2018-08-29 | A kind of pcb board easy to assembly and inexpensive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209170719U (en) |
-
2018
- 2018-08-29 CN CN201821416523.4U patent/CN209170719U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190726 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |