CN102403444A - Heat dissipation structure of a high-power LED - Google Patents
Heat dissipation structure of a high-power LED Download PDFInfo
- Publication number
- CN102403444A CN102403444A CN2011103514624A CN201110351462A CN102403444A CN 102403444 A CN102403444 A CN 102403444A CN 2011103514624 A CN2011103514624 A CN 2011103514624A CN 201110351462 A CN201110351462 A CN 201110351462A CN 102403444 A CN102403444 A CN 102403444A
- Authority
- CN
- China
- Prior art keywords
- heating column
- heat conduction
- radiator structure
- conduction plate
- great power
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 title abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229910052802 copper Inorganic materials 0.000 claims abstract description 23
- 239000010949 copper Substances 0.000 claims abstract description 23
- 238000010438 heat treatment Methods 0.000 claims description 50
- 229910052782 aluminium Inorganic materials 0.000 claims description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 13
- 239000004411 aluminium Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 6
- 230000000295 complement effect Effects 0.000 claims description 3
- 238000003466 welding Methods 0.000 abstract description 6
- 230000000191 radiation effect Effects 0.000 abstract description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 5
- 230000005855 radiation Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0323—Working metal substrate or core, e.g. by etching, deforming
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/858—Means for heat extraction or cooling
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention relates to the technical field of heat dissipation devices, in particular to a heat dissipation structure of a high-power LED, which comprises a PCB, a heat conduction plate and a heat dissipation plate, wherein a positioning hole is formed in the PCB, the positioning hole penetrates through two sides of the PCB, a copper plate layer is arranged on one side surface of the PCB, and an electrode welding foot is arranged on the other side surface of the PCB; the heat conducting column is arranged on one side face of the heat conducting plate, the shape and size of the heat conducting column are matched with those of the positioning hole, the height of the heat conducting column is equal to the sum of the thickness of the PCB and the thickness of the electrode welding leg, the heat conducting column is arranged in the positioning hole in a matched mode, and the side face, provided with the heat conducting column, of the heat conducting plate is connected with the copper plate layer in a welded mode; the upper end surface of the heat-conducting column and the upper surface of the electrode welding foot are positioned in the same plane; the heat dissipation plate is attached to the other side face of the heat conduction plate. The invention has simple and compact structure and good heat conduction and radiation effects.
Description
Technical field
The present invention relates to the heat abstractor technical field, particularly a kind of radiator structure of great power LED.
Background technology
LED is long with its theoretical life-span, energy consumption is low and characteristics such as environmental protection and be widely used in every field such as indication, indoor and outdoor lighting.As everyone knows, the factor that influences the most critical in LED useful life is exactly the heat dissipation problem of LED, and great power LED is especially true.The radiator structure of existing great power LED is mainly by heat sink; Parts such as aluminium base, heat-conducting silicone grease, radiating panel connect and compose successively; LED is connected with aluminium base through heat sink; This radiator structure exists defective and deficiencies such as heat conduction and heat radiation poor performance, thereby has influenced application and the range of application of LED greatly, and the main cause of its heat conduction and heat radiation poor performance is the structure setting of aluminium base.Aluminium base is generally by protection oil reservoir, copper foil layer; Insulating barrier and aluminum layer are formed by stacking successively; Wherein, though insulating barrier plays good and effective positive role aspect insulation, also produced heat insulation counter productive simultaneously; The heat that LED produced can't in time be derived rapidly, thereby has greatly influenced the useful life of LED.So be necessary existing LED radiator structure is carried out technological innovation, solve the heat dissipation problem of LED most effectively.
Summary of the invention
The objective of the invention is to defective and deficiency to prior art, a kind of radiator structure of great power LED of simple and compact for structure, good heat dissipation effect is provided.
For realizing above-mentioned purpose, the present invention adopts following technical scheme:
The radiator structure of a kind of great power LED of the present invention comprises pcb board, heat conduction plate and radiating panel; Said pcb board is provided with location hole; Location hole connects the pcb board both sides, and said pcb board one side is provided with the copper coin layer, and the pcb board another side is provided with the electrode leg; Said heat conduction plate one side is provided with heating column; The shape size of said heating column is complementary with the shape size of location hole; The height of said heating column equals the copper coin layer; Pcb board and electrode leg three's thickness sum, said heating column cooperate to be located in the location hole, and side and copper coin layer that the heat conduction plate is provided with heating column are welded to connect; The upper surface of the upper surface of said heating column and electrode leg is in the same plane; Said radiating panel is attached on the another side of heat conduction plate.
Further, said radiating panel is provided with some fin.
Wherein, said heating column and the heat conduction plate setting that is formed in one.Certain said heating column and heat conduction plate also can be the split welding and fixedly install.
Further, the rounded setting of the cross section of said heating column; Said location hole inwall is provided with internal thread, and the sidewall of said heating column is provided with external screw thread, and said heating column is threaded with location hole.The cross section of said heating column can also be made as ellipse, triangle or regular hexagon setting.
Wherein, said heat conduction plate is by the red copper material, and the heat conduction plate also can be made by aluminum certainly.
Wherein, said radiating panel is made by aluminium or copper product.
Wherein, said heating column is by the red copper material.
After adopting said structure; Beneficial effect of the present invention is: the LED base bottom surface is attached on electrode leg of the present invention and the heating column; Because of the upper end surface of the upper surface of electrode leg according to the invention and heating column in same plane, do not influencing under LED base bottom surface and the situation that the electrode leg is electrically connected, the LED base bottom surface can realize fully contacting with the upper surface of heating column and be welded to connect; Effectively increase the contact area of the upper surface of LED base bottom surface thermal conduction portions and heating column; Be provided with like this, radiator structure of the present invention can be derived heat that LED produces rapidly through heating column and heat conduction plate, and its heat conduction and heat radiation function strengthens greatly.
Description of drawings
Fig. 1 is the whole sectional structure sketch map of the present invention;
Fig. 2 is a decomposition texture sketch map of the present invention.
Among the figure:
1, LED; 2, pedestal; 3, electrode leg; 4, pcb board;
5, copper coin layer; 6, heat conduction plate; 7, location hole; 8, heating column;
9, radiating panel; 10, fin.
Embodiment
Below in conjunction with accompanying drawing the present invention is further described.
Like Fig. 1, shown in Figure 2, the radiator structure of a kind of great power LED of the present invention comprises pcb board 4, and heat conduction plate 6 and radiating panel 9 also are pcb board 4, and heat conduction plate 6 and radiating panel 9 constitute main element of the present invention.Wherein, said heat conduction plate 6 is by material such as red copper and aluminium, and said radiating panel 9 is made by aluminium or copper product, and said heating column 8 is by the red copper material.The all concrete good heat conduction and heat radiation function of red copper and aluminum, heat conduction plate 6 according to the invention and radiating panel 9 adopt red copper and aluminum to make, and help realizing the present invention's purpose.Certainly, the said structure main body also can adopt other metal material with good heat conductive heat dispersion to make.
Wherein, said pcb board 4 is provided with location hole 7, and location hole 7 connects pcb board 4 both sides, and said pcb board 4 one sides are provided with copper coin layer 5, are used to weld fixedly heat conduction plate 6; Pcb board 4 another sides are provided with electrode leg 3, the electrode part on being used to connect at the bottom of 2 of the pedestals of LED 1.
Said heat conduction plate 6 one sides are provided with heating column 8, and settings that can be formed in one of said heating column 8 and heat conduction plate 6 also can be welded for split and fixedly installed.The radiating panel 9 that has been sticked on the another side of said heat conduction plate 6 is so that in time shed the heat of heat conduction plate 6.Said radiating panel 9 is provided with some fin 10, to increase the area of dissipation of radiating panel 9, further strengthens the radiating effect of radiating panel 9.
The shape size of said heating column 8 is complementary with the shape size of location hole 7; Particularly; The cross section of heating column 8 is rounded, oval, triangle or regular hexagon setting, and when the cross section of heating column 8 is rounded when being provided with, said location hole 7 inwalls are provided with internal thread; The sidewall of said heating column 8 is provided with external screw thread, and said heating column 8 is threaded with location hole 7.Heating column 8 is threaded with location hole 7, can make structure tightness of the present invention, improves the heat conduction and heat radiation function indirectly.
The height of said heating column 8 equals copper coin layer 5, pcb board 4 and electrode leg 3 threes' thickness sum, and said heating column 8 cooperates to be located in the location hole 7.The side that is provided with heating column 8 when heat conduction plate 6 through heating column 8 and location hole 7 be connected with copper coin layer 5 fit tightly and weld fixing after; The upper surface of the upper surface of said heating column 8 and electrode leg 3 is in the same plane; So be provided with; Pedestal 2 bottom surfaces can be simultaneously carried out abundant card with the upper surface of the upper surface of heating column 8 and electrode leg 3 and are closed, when promptly the electrode of pedestal 2 bottom surfaces part fully contacts welding with electrode leg 3, also can realize pedestal 2 bottom surface thermal conduction portions and plume 8 the upper surface fully contact welding; Increase the contact area of the upper surface of pedestal 2 bottom surface thermal conduction portions and heating column 8 as far as possible; To guarantee that LED 1 heat that produced can be in time rapidly via heating column 8, heat conduction plate 6 conducts to radiating panel 9, and sheds through radiating panel 9.
Radiator structure of the present invention can be derived heat that LED produces rapidly, and its heat conduction and heat radiation effect strengthens than prior art greatly.
Table one, the temperature data test chart of existing radiator structure (old) and radiator structure according to the invention (newly)
Can find out from last table; To adopting the great power LED of new radiator structure and old radiator structure respectively; All pass to identical electric current; And under new radiator structure ambient temperature condition with higher; New radiator structure heating column temperature is starkly lower than old radiator structure heat sink temperature, and the temperature of the heat conduction plate of new radiator structure and radiating panel is apparently higher than the temperature of the aluminium base and the radiating panel of old radiator structure, and this has proved absolutely the better effects if of the radiating effect of new radiator structure than the radiator structure of old radiator structure.
The above only is a preferred embodiments of the present invention, so all equivalences of doing according to the described structure of patent claim of the present invention, characteristic and principle change or modify, includes in patent claim of the present invention.
Claims (9)
1. the radiator structure of a great power LED; It is characterized in that: comprise pcb board (4); Heat conduction plate (6) and radiating panel (9), said pcb board (4) is provided with location hole (7), and location hole (7) connects pcb board (4) both sides; Said pcb board (4) one sides are provided with copper coin layer (5), and pcb board (4) another side is provided with electrode leg (3); Said heat conduction plate (6) one sides are provided with heating column (8); The shape size of said heating column (8) is complementary with the shape size of location hole (7); The height of said heating column (8) equals copper coin layer (5); Pcb board (4) and electrode leg (3) three's thickness sum, said heating column (8) cooperate to be located in the location hole (7), and side and copper coin layer (5) that heat conduction plate (6) is provided with heating column (8) are welded to connect; The upper surface of the upper surface of said heating column (8) and electrode leg (3) is in the same plane; Said radiating panel (9) is attached on the another side of heat conduction plate (6).
2. the radiator structure of great power LED according to claim 1, it is characterized in that: said radiating panel (9) is provided with some fin (10).
3. the radiator structure of great power LED according to claim 2 is characterized in that: the setting that is formed in one of said heating column (8) and heat conduction plate (6).
4. the radiator structure of great power LED according to claim 2 is characterized in that: said heating column (8) welds for split with heat conduction plate (6) and fixedly installs.
5. according to the radiator structure of claim 3 or 4 described great power LEDs, it is characterized in that: the rounded setting of cross section of said heating column (8); Said location hole (7) inwall is provided with internal thread, and the sidewall of said heating column (8) is provided with external screw thread, and said heating column (8) is threaded with location hole (7).
6. according to the radiator structure of claim 3 or 4 described great power LEDs, it is characterized in that: the cross section ovalize of said heating column (8), triangle or regular hexagon setting.
7. according to the radiator structure of the arbitrary described great power LED of claim 1-4, it is characterized in that: said heat conduction plate (6) is by the red copper material.
8. according to the radiator structure of the arbitrary described great power LED of claim 1-4, it is characterized in that: said radiating panel (9) is made by aluminium or copper product.
9. according to the radiator structure of the arbitrary described great power LED of claim 1-4, it is characterized in that: said heating column (8) is by the red copper material.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103514624A CN102403444A (en) | 2011-11-09 | 2011-11-09 | Heat dissipation structure of a high-power LED |
| PCT/CN2012/080764 WO2013067841A1 (en) | 2011-11-09 | 2012-08-30 | Heat sink structure for high-power led |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103514624A CN102403444A (en) | 2011-11-09 | 2011-11-09 | Heat dissipation structure of a high-power LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102403444A true CN102403444A (en) | 2012-04-04 |
Family
ID=45885436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103514624A Pending CN102403444A (en) | 2011-11-09 | 2011-11-09 | Heat dissipation structure of a high-power LED |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102403444A (en) |
| WO (1) | WO2013067841A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013067841A1 (en) * | 2011-11-09 | 2013-05-16 | 东莞勤上光电股份有限公司 | Heat sink structure for high-power led |
| CN108167773A (en) * | 2018-02-11 | 2018-06-15 | 上海小糸车灯有限公司 | LED luminescent systems and car light |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR3124849B1 (en) * | 2021-06-30 | 2023-10-13 | Valeo Vision | Heat distribution system of a monolithic light source |
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| CN101359604A (en) * | 2008-08-26 | 2009-02-04 | 深圳华为通信技术有限公司 | Method, apparatus and system for strengthening chip cooling |
| US20100033976A1 (en) * | 2008-08-08 | 2010-02-11 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation module for light emitting diode |
| CN101764184A (en) * | 2008-12-25 | 2010-06-30 | 中国电子为华实业发展有限公司 | Device and method for welding cooling of light-emitting diode |
| CN201576701U (en) * | 2009-12-25 | 2010-09-08 | 上海必威电机电器有限公司 | Metal cooling device for LED lamp chip |
| CN201739805U (en) * | 2010-05-11 | 2011-02-09 | 广州市花都区旺通五金电器厂 | Novel efficient radiating LED lamp |
| CN202352730U (en) * | 2011-11-09 | 2012-07-25 | 东莞勤上光电股份有限公司 | Heat dissipation structure of a high-power LED |
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| CN201425286Y (en) * | 2009-04-16 | 2010-03-17 | 华宏光电子(深圳)有限公司 | Heat dissipation structure of LED lamp |
| CN102194966A (en) * | 2010-03-17 | 2011-09-21 | 宏齐科技股份有限公司 | Light-emitting diode structure with high-efficiency heat dissipation effect and manufacturing method thereof |
| CN101881393A (en) * | 2010-07-06 | 2010-11-10 | 中国计量学院 | A LED lamp structure using metal substrate and metal solder to conduct heat |
| CN202008046U (en) * | 2011-04-28 | 2011-10-12 | 东莞勤上光电股份有限公司 | A cup-shaped LED lamp |
| CN102403444A (en) * | 2011-11-09 | 2012-04-04 | 东莞勤上光电股份有限公司 | Heat dissipation structure of a high-power LED |
-
2011
- 2011-11-09 CN CN2011103514624A patent/CN102403444A/en active Pending
-
2012
- 2012-08-30 WO PCT/CN2012/080764 patent/WO2013067841A1/en not_active Ceased
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100033976A1 (en) * | 2008-08-08 | 2010-02-11 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation module for light emitting diode |
| CN101359604A (en) * | 2008-08-26 | 2009-02-04 | 深圳华为通信技术有限公司 | Method, apparatus and system for strengthening chip cooling |
| CN101764184A (en) * | 2008-12-25 | 2010-06-30 | 中国电子为华实业发展有限公司 | Device and method for welding cooling of light-emitting diode |
| CN201576701U (en) * | 2009-12-25 | 2010-09-08 | 上海必威电机电器有限公司 | Metal cooling device for LED lamp chip |
| CN201739805U (en) * | 2010-05-11 | 2011-02-09 | 广州市花都区旺通五金电器厂 | Novel efficient radiating LED lamp |
| CN202352730U (en) * | 2011-11-09 | 2012-07-25 | 东莞勤上光电股份有限公司 | Heat dissipation structure of a high-power LED |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013067841A1 (en) * | 2011-11-09 | 2013-05-16 | 东莞勤上光电股份有限公司 | Heat sink structure for high-power led |
| CN108167773A (en) * | 2018-02-11 | 2018-06-15 | 上海小糸车灯有限公司 | LED luminescent systems and car light |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013067841A1 (en) | 2013-05-16 |
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Application publication date: 20120404 |