CN102403444A - Radiating structure of high-power LED - Google Patents
Radiating structure of high-power LED Download PDFInfo
- Publication number
- CN102403444A CN102403444A CN2011103514624A CN201110351462A CN102403444A CN 102403444 A CN102403444 A CN 102403444A CN 2011103514624 A CN2011103514624 A CN 2011103514624A CN 201110351462 A CN201110351462 A CN 201110351462A CN 102403444 A CN102403444 A CN 102403444A
- Authority
- CN
- China
- Prior art keywords
- heating column
- pcb board
- radiator structure
- heat conduction
- great power
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0323—Working metal substrate or core, e.g. by etching, deforming
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention relates to the technical field of radiating device, specifically to a radiating structure of high-power LED. The radiating structure comprises a PCB board, head conducting boards and radiating boards; the PCB board is provided with locating holes; the locating holes are connected with the two sides of the PCB board; one lateral surface of the PCB board is provided with a copper board layer while the other lateral surface of the PCB board is provided with an electrode welding leg; one lateral surface of the heat conducting board is provided with a heat conducting column; the heat conducting column is matched with the locating hole in terms of shape and size; the height of the heat conducting column is equal to the sum of the thickness of the PCB board and the electrode welding leg; the upper end plane of the heat conducting column and the upper surface of the electrode welding leg are in the same plane; and the radiating board is glued on the other lateral surface of the heat conducting board. The invention is featured with simple and compacted structure and good heat conducting and radiating effects.
Description
Technical field
The present invention relates to the heat abstractor technical field, particularly a kind of radiator structure of great power LED.
Background technology
LED is long with its theoretical life-span, energy consumption is low and characteristics such as environmental protection and be widely used in every field such as indication, indoor and outdoor lighting.As everyone knows, the factor that influences the most critical in LED useful life is exactly the heat dissipation problem of LED, and great power LED is especially true.The radiator structure of existing great power LED is mainly by heat sink; Parts such as aluminium base, heat-conducting silicone grease, radiating panel connect and compose successively; LED is connected with aluminium base through heat sink; This radiator structure exists defective and deficiencies such as heat conduction and heat radiation poor performance, thereby has influenced application and the range of application of LED greatly, and the main cause of its heat conduction and heat radiation poor performance is the structure setting of aluminium base.Aluminium base is generally by protection oil reservoir, copper foil layer; Insulating barrier and aluminum layer are formed by stacking successively; Wherein, though insulating barrier plays good and effective positive role aspect insulation, also produced heat insulation counter productive simultaneously; The heat that LED produced can't in time be derived rapidly, thereby has greatly influenced the useful life of LED.So be necessary existing LED radiator structure is carried out technological innovation, solve the heat dissipation problem of LED most effectively.
Summary of the invention
The objective of the invention is to defective and deficiency to prior art, a kind of radiator structure of great power LED of simple and compact for structure, good heat dissipation effect is provided.
For realizing above-mentioned purpose, the present invention adopts following technical scheme:
The radiator structure of a kind of great power LED of the present invention comprises pcb board, heat conduction plate and radiating panel; Said pcb board is provided with location hole; Location hole connects the pcb board both sides, and said pcb board one side is provided with the copper coin layer, and the pcb board another side is provided with the electrode leg; Said heat conduction plate one side is provided with heating column; The shape size of said heating column is complementary with the shape size of location hole; The height of said heating column equals the copper coin layer; Pcb board and electrode leg three's thickness sum, said heating column cooperate to be located in the location hole, and side and copper coin layer that the heat conduction plate is provided with heating column are welded to connect; The upper surface of the upper surface of said heating column and electrode leg is in the same plane; Said radiating panel is attached on the another side of heat conduction plate.
Further, said radiating panel is provided with some fin.
Wherein, said heating column and the heat conduction plate setting that is formed in one.Certain said heating column and heat conduction plate also can be the split welding and fixedly install.
Further, the rounded setting of the cross section of said heating column; Said location hole inwall is provided with internal thread, and the sidewall of said heating column is provided with external screw thread, and said heating column is threaded with location hole.The cross section of said heating column can also be made as ellipse, triangle or regular hexagon setting.
Wherein, said heat conduction plate is by the red copper material, and the heat conduction plate also can be made by aluminum certainly.
Wherein, said radiating panel is made by aluminium or copper product.
Wherein, said heating column is by the red copper material.
After adopting said structure; Beneficial effect of the present invention is: the LED base bottom surface is attached on electrode leg of the present invention and the heating column; Because of the upper end surface of the upper surface of electrode leg according to the invention and heating column in same plane, do not influencing under LED base bottom surface and the situation that the electrode leg is electrically connected, the LED base bottom surface can realize fully contacting with the upper surface of heating column and be welded to connect; Effectively increase the contact area of the upper surface of LED base bottom surface thermal conduction portions and heating column; Be provided with like this, radiator structure of the present invention can be derived heat that LED produces rapidly through heating column and heat conduction plate, and its heat conduction and heat radiation function strengthens greatly.
Description of drawings
Fig. 1 is the whole sectional structure sketch map of the present invention;
Fig. 2 is a decomposition texture sketch map of the present invention.
Among the figure:
1, LED; 2, pedestal; 3, electrode leg; 4, pcb board;
5, copper coin layer; 6, heat conduction plate; 7, location hole; 8, heating column;
9, radiating panel; 10, fin.
Embodiment
Below in conjunction with accompanying drawing the present invention is further described.
Like Fig. 1, shown in Figure 2, the radiator structure of a kind of great power LED of the present invention comprises pcb board 4, and heat conduction plate 6 and radiating panel 9 also are pcb board 4, and heat conduction plate 6 and radiating panel 9 constitute main element of the present invention.Wherein, said heat conduction plate 6 is by material such as red copper and aluminium, and said radiating panel 9 is made by aluminium or copper product, and said heating column 8 is by the red copper material.The all concrete good heat conduction and heat radiation function of red copper and aluminum, heat conduction plate 6 according to the invention and radiating panel 9 adopt red copper and aluminum to make, and help realizing the present invention's purpose.Certainly, the said structure main body also can adopt other metal material with good heat conductive heat dispersion to make.
Wherein, said pcb board 4 is provided with location hole 7, and location hole 7 connects pcb board 4 both sides, and said pcb board 4 one sides are provided with copper coin layer 5, are used to weld fixedly heat conduction plate 6; Pcb board 4 another sides are provided with electrode leg 3, the electrode part on being used to connect at the bottom of 2 of the pedestals of LED 1.
Said heat conduction plate 6 one sides are provided with heating column 8, and settings that can be formed in one of said heating column 8 and heat conduction plate 6 also can be welded for split and fixedly installed.The radiating panel 9 that has been sticked on the another side of said heat conduction plate 6 is so that in time shed the heat of heat conduction plate 6.Said radiating panel 9 is provided with some fin 10, to increase the area of dissipation of radiating panel 9, further strengthens the radiating effect of radiating panel 9.
The shape size of said heating column 8 is complementary with the shape size of location hole 7; Particularly; The cross section of heating column 8 is rounded, oval, triangle or regular hexagon setting, and when the cross section of heating column 8 is rounded when being provided with, said location hole 7 inwalls are provided with internal thread; The sidewall of said heating column 8 is provided with external screw thread, and said heating column 8 is threaded with location hole 7.Heating column 8 is threaded with location hole 7, can make structure tightness of the present invention, improves the heat conduction and heat radiation function indirectly.
The height of said heating column 8 equals copper coin layer 5, pcb board 4 and electrode leg 3 threes' thickness sum, and said heating column 8 cooperates to be located in the location hole 7.The side that is provided with heating column 8 when heat conduction plate 6 through heating column 8 and location hole 7 be connected with copper coin layer 5 fit tightly and weld fixing after; The upper surface of the upper surface of said heating column 8 and electrode leg 3 is in the same plane; So be provided with; Pedestal 2 bottom surfaces can be simultaneously carried out abundant card with the upper surface of the upper surface of heating column 8 and electrode leg 3 and are closed, when promptly the electrode of pedestal 2 bottom surfaces part fully contacts welding with electrode leg 3, also can realize pedestal 2 bottom surface thermal conduction portions and plume 8 the upper surface fully contact welding; Increase the contact area of the upper surface of pedestal 2 bottom surface thermal conduction portions and heating column 8 as far as possible; To guarantee that LED 1 heat that produced can be in time rapidly via heating column 8, heat conduction plate 6 conducts to radiating panel 9, and sheds through radiating panel 9.
Radiator structure of the present invention can be derived heat that LED produces rapidly, and its heat conduction and heat radiation effect strengthens than prior art greatly.
Table one, the temperature data test chart of existing radiator structure (old) and radiator structure according to the invention (newly)
Can find out from last table; To adopting the great power LED of new radiator structure and old radiator structure respectively; All pass to identical electric current; And under new radiator structure ambient temperature condition with higher; New radiator structure heating column temperature is starkly lower than old radiator structure heat sink temperature, and the temperature of the heat conduction plate of new radiator structure and radiating panel is apparently higher than the temperature of the aluminium base and the radiating panel of old radiator structure, and this has proved absolutely the better effects if of the radiating effect of new radiator structure than the radiator structure of old radiator structure.
The above only is a preferred embodiments of the present invention, so all equivalences of doing according to the described structure of patent claim of the present invention, characteristic and principle change or modify, includes in patent claim of the present invention.
Claims (9)
1. the radiator structure of a great power LED; It is characterized in that: comprise pcb board (4); Heat conduction plate (6) and radiating panel (9), said pcb board (4) is provided with location hole (7), and location hole (7) connects pcb board (4) both sides; Said pcb board (4) one sides are provided with copper coin layer (5), and pcb board (4) another side is provided with electrode leg (3); Said heat conduction plate (6) one sides are provided with heating column (8); The shape size of said heating column (8) is complementary with the shape size of location hole (7); The height of said heating column (8) equals copper coin layer (5); Pcb board (4) and electrode leg (3) three's thickness sum, said heating column (8) cooperate to be located in the location hole (7), and side and copper coin layer (5) that heat conduction plate (6) is provided with heating column (8) are welded to connect; The upper surface of the upper surface of said heating column (8) and electrode leg (3) is in the same plane; Said radiating panel (9) is attached on the another side of heat conduction plate (6).
2. the radiator structure of great power LED according to claim 1, it is characterized in that: said radiating panel (9) is provided with some fin (10).
3. the radiator structure of great power LED according to claim 2 is characterized in that: the setting that is formed in one of said heating column (8) and heat conduction plate (6).
4. the radiator structure of great power LED according to claim 2 is characterized in that: said heating column (8) welds for split with heat conduction plate (6) and fixedly installs.
5. according to the radiator structure of claim 3 or 4 described great power LEDs, it is characterized in that: the rounded setting of cross section of said heating column (8); Said location hole (7) inwall is provided with internal thread, and the sidewall of said heating column (8) is provided with external screw thread, and said heating column (8) is threaded with location hole (7).
6. according to the radiator structure of claim 3 or 4 described great power LEDs, it is characterized in that: the cross section ovalize of said heating column (8), triangle or regular hexagon setting.
7. according to the radiator structure of the arbitrary described great power LED of claim 1-4, it is characterized in that: said heat conduction plate (6) is by the red copper material.
8. according to the radiator structure of the arbitrary described great power LED of claim 1-4, it is characterized in that: said radiating panel (9) is made by aluminium or copper product.
9. according to the radiator structure of the arbitrary described great power LED of claim 1-4, it is characterized in that: said heating column (8) is by the red copper material.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103514624A CN102403444A (en) | 2011-11-09 | 2011-11-09 | Radiating structure of high-power LED |
| PCT/CN2012/080764 WO2013067841A1 (en) | 2011-11-09 | 2012-08-30 | Heat sink structure for high-power led |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103514624A CN102403444A (en) | 2011-11-09 | 2011-11-09 | Radiating structure of high-power LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102403444A true CN102403444A (en) | 2012-04-04 |
Family
ID=45885436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103514624A Pending CN102403444A (en) | 2011-11-09 | 2011-11-09 | Radiating structure of high-power LED |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102403444A (en) |
| WO (1) | WO2013067841A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013067841A1 (en) * | 2011-11-09 | 2013-05-16 | 东莞勤上光电股份有限公司 | Heat sink structure for high-power led |
| CN108167773A (en) * | 2018-02-11 | 2018-06-15 | 上海小糸车灯有限公司 | LED luminescent systems and car light |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR3124849B1 (en) * | 2021-06-30 | 2023-10-13 | Valeo Vision | Heat distribution system of a monolithic light source |
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| CN201576701U (en) * | 2009-12-25 | 2010-09-08 | 上海必威电机电器有限公司 | Metal cooling device for LED lamp chip |
| CN201739805U (en) * | 2010-05-11 | 2011-02-09 | 广州市花都区旺通五金电器厂 | Novel efficient radiating LED lamp |
| CN202352730U (en) * | 2011-11-09 | 2012-07-25 | 东莞勤上光电股份有限公司 | Radiating structure for large-power LED (Light-emitting Diode) |
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| CN201425286Y (en) * | 2009-04-16 | 2010-03-17 | 华宏光电子(深圳)有限公司 | Heat dissipation structure of LED lamp |
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| CN101881393A (en) * | 2010-07-06 | 2010-11-10 | 中国计量学院 | LED lamp structure capable of conducting heat by using metal base plate and metal solder |
| CN202008046U (en) * | 2011-04-28 | 2011-10-12 | 东莞勤上光电股份有限公司 | Cup-shaped light emitting diode (LED) lamp |
| CN102403444A (en) * | 2011-11-09 | 2012-04-04 | 东莞勤上光电股份有限公司 | Radiating structure of high-power LED |
-
2011
- 2011-11-09 CN CN2011103514624A patent/CN102403444A/en active Pending
-
2012
- 2012-08-30 WO PCT/CN2012/080764 patent/WO2013067841A1/en active Application Filing
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US20100033976A1 (en) * | 2008-08-08 | 2010-02-11 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation module for light emitting diode |
| CN101359604A (en) * | 2008-08-26 | 2009-02-04 | 深圳华为通信技术有限公司 | Method, apparatus and system for strengthening chip cooling |
| CN101764184A (en) * | 2008-12-25 | 2010-06-30 | 中国电子为华实业发展有限公司 | Device and method for welding cooling of light-emitting diode |
| CN201576701U (en) * | 2009-12-25 | 2010-09-08 | 上海必威电机电器有限公司 | Metal cooling device for LED lamp chip |
| CN201739805U (en) * | 2010-05-11 | 2011-02-09 | 广州市花都区旺通五金电器厂 | Novel efficient radiating LED lamp |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013067841A1 (en) * | 2011-11-09 | 2013-05-16 | 东莞勤上光电股份有限公司 | Heat sink structure for high-power led |
| CN108167773A (en) * | 2018-02-11 | 2018-06-15 | 上海小糸车灯有限公司 | LED luminescent systems and car light |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013067841A1 (en) | 2013-05-16 |
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Application publication date: 20120404 |