CN203375191U - High-power LED lamp with high-performance heat dissipation device - Google Patents
High-power LED lamp with high-performance heat dissipation device Download PDFInfo
- Publication number
- CN203375191U CN203375191U CN201320269670.4U CN201320269670U CN203375191U CN 203375191 U CN203375191 U CN 203375191U CN 201320269670 U CN201320269670 U CN 201320269670U CN 203375191 U CN203375191 U CN 203375191U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- led lamp
- metal heat
- heat sink
- dissipation device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model discloses a high-power LED lamp with a high-performance heat dissipation device. The high-power LED lamp with the high-performance heat dissipation device comprises a lampshade, a PCB, heat-conducting glue, the metal heat dissipation device and a heat dissipation fan. The heat-conducting glue, the metal heat dissipation device and the heat dissipation fan are sequentially arranged on the back face of the PCB. Locating holes and fixing holes are formed in the PCB. The locating holes and the fixing holes penetrate through the PCB to locate the metal heat dissipation device and the heat dissipation fan. Lamp beads or a connected circuit system with a driving power supply is arranged on the front face of the PCB. The surface layer of the back face of the PCB is a conducting metal layer made of copper or aluminum. Electrode welding pins are arranged on the conducting metal layer. A locating hole is formed in the center of the metal heat dissipation device, and a wire lead is fixed through welding, a screw and a plastic clamp. According to the high-power LED lamp with the high-performance heat dissipation device, groove type design is applied to the metal heat dissipation device, all grooves form concentric circles, and therefore the heat dissipation area is greatly increased; the heat dissipation fan is arranged at the bottom of the metal heat dissipation device, heat generated by the LED lamp and spread to the metal heat dissipation device can be dissipated to air in time, and therefore the heat of the LED lamp can be dissipated at the highest speed to the maximum extent.
Description
Technical field
the utility model relates to the high-power LED illumination field, particularly a kind of high-power LED radiating structure.
Background technology
lamp, due to green, environmental protection and long service life, therefore is able to apply more and more widely.But, in some highlight illumination occasions, the application of LED is not also very extensive.Main reason is that the radiating effect of great power LED is undesirable.
the Main Function of radiator is that the heat will produced in LED chip work is constantly derived and is dispersed in environment, the temperature of chip is remained in desired scope, thereby guarantee that the light decay that reduces LED lamp pearl exhausts, make the LED lamp can brightness with light decay, not exhaust and change and dimmed, guarantee the LED normal operation long-life simultaneously.The quality of radiator depends primarily on the thermal resistance of radiator, and thermal resistance is less, and under the same terms, LED lamp junction temperature is lower, and the LED junction temperature is lower, and chip service life will be longer.The thermal resistance of radiator should comprise thermal conduction resistance and heat radiation thermal resistance two parts.For the radiator of definite shape, thermal conduction resistance is main relevant with the thermal conductivity factor of radiator material, and thermal conductivity factor is larger, and thermal conduction resistance is less, and heat-conducting effect is better; Under the certain environment condition, the heat radiation thermal resistance depends primarily on the area of dissipation of radiator and the radiation coefficient of spreader surface material, and area of dissipation is larger, radiation coefficient is higher, and the heat radiation thermal resistance is less, and radiating effect is better.Therefore, the LED lamp radiator must have certain area of dissipation, and the material of simultaneously making radiator must have certain thermal conductivity and higher heat emissivity coefficient; In addition, Heat Conduction Material itself also should have the characteristics such as lightweight, easy processing, price is low.
the radiator structure of existing great power LED is mainly by heat sink, aluminium base, heat conductive silica gel, the parts such as radiating panel connect and compose successively, LED is connected with aluminium base through heat sink, this radiator structure exists defect and the deficiencies such as heat conduction and heat radiation poor performance, thereby has greatly affected the range of application of LED, and the main cause of its heat conduction and heat radiation poor performance is that the structural design of the whole light fixture of LED and the design of aluminium base are also contents.Aluminium base is generally by protection oil reservoir, copper foil layer, and insulating barrier and aluminum layer are formed by stacking successively.Wherein, although insulating barrier plays good effectively positive role aspect insulation, also produced heat insulation counter productive, the heat that LED produces can't be derived rapidly in time, thereby has greatly affected the service life of LED simultaneously.Therefore be necessary existing LED radiator structure is carried out to technological innovation, realize the high efficiency and heat radiation of LED, improve use power and the range of application of LED.
Summary of the invention
the utility model purpose is: for solving the technical problem of existing LED lamp heat dispersion deficiency, the invention provides a kind of LED lamp that has the high-capacity LED heat spreader structures of excellent heat dispersion performance and this radiator structure is housed.
the technical solution of the utility model is: a kind of high-capacity LED lamp of high radiator, comprise lampshade, pcb board, heat-conducting glue, metal heat sink, radiator fan, the pcb board back side is provided with heat-conducting glue, metal heat sink and radiator fan successively, locating hole and fixing hole are arranged on pcb board, and locating hole and fixing hole connect pcb board to metal heat sink, radiator fan location; The pcb board front is provided with the lamp pearl or with the turning circuit system of driving power, the pcb board back surface layer is conductive metal layer, and as copper or aluminium, this conductive metal layer is provided with the electrode leg, described metal heat sink central authorities are provided with locating hole, by welding and screw and plastic clips, conductor leading are fixed.
preferably, described metal heat sink can be made by aluminium or copper metal material.
preferably, metal heat sink adopts groove-shaped design, and each groove forms concentric circles, and the metal heat sink side is helicitic texture, with increasing heat radiation area.
preferably, described metal heat sink bottom is provided with radiator fan, radiator fan by screw or thermal paste hydropexis on metal heat sink.
preferably, described radiator fan is with series connection or parallel way access LED main circuit.
preferably, lamp pearl and integrated LED driving power are arranged on described pcb board.
the utility model advantage is:
1. in the utility model, metal heat sink adopts groove-shaped design, and each groove formation concentric circles, thereby has increased area of dissipation.
. in the utility model, metal heat sink bottom is provided with radiator fan, and the heat that LED can be produced and is diffused on metal heat sink diffuses in air in time, thus the heat of prestissimo reduction LED lamp to greatest extent.
. in the utility model on pcb board design be not only that the lamp pearl has also had the LED driving power integrated, make LED modulated structure compact, take up room and reduce, good looking appearance, the advantage such as production cost is low.
The accompanying drawing explanation
below in conjunction with drawings and Examples, the utility model is further described:
the lateral plan of the embodiment that Fig. 1 is the utility model high-capacity LED lamp;
the back side top view of the embodiment that Fig. 2 is the utility model LED lamp;
fig. 3 is metal heat sink side schematic view of the present utility model;
fig. 4 is metal heat sink top view of the present utility model;
fig. 5 is radiator fan of the present utility model;
the pcb board that Fig. 6 is the utility model front (removing the top view of lampshade).
wherein, 1 is pcb board, and 2 is heat-conducting glue, and 3 is metal heat sink, and 4 is radiator fan, and 5 is lampshade, and 6 are and the screw thread of lamp housing interface, and 7 is helicitic texture; 11 is radiating groove, and 12 is fixing hole, and 13 is threading hole, and 14 is locating hole, and 15 is the lamp pearl, and 16 is pin, and 17 is integrated power supply.
The specific embodiment
embodiment: as shown in the side view of figure utility model, a kind of high-capacity LED lamp of high radiator, comprise lampshade 5, pcb board 1, heat-conducting glue 2, metal heat sink 3, radiator fan 4, pcb board 1 back side is provided with heat-conducting glue 2, metal heat sink 3 and radiator fan 4 successively, on described pcb board 1, locating hole and fixing hole are arranged, locating hole and fixing hole connect 1 pair of metal heat sink 3 of pcb board, radiator fan 4 location; Pcb board 1 front is provided with the lamp pearl or with the turning circuit system of driving power, pcb board 1 back surface layer is conductive metal layer, and as copper or aluminium, this conductive metal layer is provided with the electrode leg, metal heat sink central authorities are provided with locating hole, by welding and screw and plastic clips, conductor leading are fixed;
in the utility model, by the locating hole on pcb board, to metal heat sink 3, radiator fan 4 is located.The location that LED lamp pearl 15 and driving power are arranged on pcb board, and LED lamp pearl 15 pins are welded on to the electrode leg on pcb board 1.Carry out adhesion by heat-conducting glue 2 between pcb board 1 and metal heat sink 3, and be fixed by fixing hole 12 use screws and the metal heat sink 3 on pcb board 1.Simultaneously, integrated LED driving power on pcb board 1.
in the utility model, metal heat sink adopts groove-shaped design, between each groove, forms concentric circles, has increased area of dissipation.The metal materials such as metal heat sink available metal aluminium or copper are made.The metal heat sink middle part is provided with fixing hole, by screw and plastic clips, power lead is fixed, and the metal heat sink bottom is provided with fixing hole, for fixing of radiator fan.Radiator fan accesses the LED main circuit in series connection (or in parallel) mode.
above demonstration and described basic principle of the present utility model, principal character and advantage of the present utility model.The technical staff of the industry should understand; the utility model is not subject to the restriction of above-mentioned example; that in above-mentioned example and specification, describes just illustrates principle of the present utility model; under the prerequisite that does not break away from the utility model spirit and scope, the utility model also has various changes and modifications, and these changes and improvements all fall in claimed the utility model scope.The claimed scope of the utility model is defined by appending claims and equivalent thereof.
Claims (7)
1. the high-capacity LED lamp of a high radiator, comprise lampshade (5), pcb board (1), heat-conducting glue (2), metal heat sink (3), radiator fan (4), pcb board (1) back side is provided with heat-conducting glue (2), metal heat sink (3) and radiator fan (4) successively, described pcb board has locating hole and fixing hole on (1), and described locating hole and fixing hole connect pcb board (1) to metal heat sink (3), radiator fan (4) location; Pcb board (1) front is provided with the lamp pearl or with the turning circuit system of driving power, pcb board (1) back surface layer is conductive metal layer, this conductive metal layer is provided with the electrode leg, described metal heat sink central authorities are provided with locating hole, by welding and screw and plastic clips, conductor leading are fixed.
2. the high-capacity LED lamp of high radiator according to claim 1, it is characterized in that: described metal heat sink (3) is made by metallic aluminium or copper product.
3. the high-capacity LED lamp of high radiator according to claim 1, it is characterized in that: metal heat sink (3) adopts groove-shaped design, and each groove forms concentric circles, and the metal heat sink side is helicitic texture, with increasing heat radiation area.
4. the high-capacity LED lamp of high radiator according to claim 1 is characterized in that: described metal heat sink (3) bottom is provided with radiator fan (4), and radiator fan is fixed on metal heat sink by screw or thermal paste.
5. according to the high-capacity LED lamp of the described high radiator of claim 1-4 any one, it is characterized in that: described radiator fan (4) is with series connection or parallel way access LED main circuit.
6. the high-capacity LED lamp of high radiator according to claim 1 is characterized in that: the upper integrated LED driving power of described pcb board (1).
7. the high-capacity LED lamp of high radiator according to claim 1, it is characterized in that: the conductive metal layer of described pcb board (1) back surface layer is copper layer or aluminium lamination.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320269670.4U CN203375191U (en) | 2012-12-12 | 2013-05-16 | High-power LED lamp with high-performance heat dissipation device |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220698839.3 | 2012-12-12 | ||
| CN201220698839 | 2012-12-12 | ||
| CN201320269670.4U CN203375191U (en) | 2012-12-12 | 2013-05-16 | High-power LED lamp with high-performance heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203375191U true CN203375191U (en) | 2014-01-01 |
Family
ID=49837720
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320269670.4U Expired - Fee Related CN203375191U (en) | 2012-12-12 | 2013-05-16 | High-power LED lamp with high-performance heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203375191U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105960143A (en) * | 2016-06-03 | 2016-09-21 | 上海机电工程研究所 | Modularization and heat radiation structure for power supply cabinet |
-
2013
- 2013-05-16 CN CN201320269670.4U patent/CN203375191U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105960143A (en) * | 2016-06-03 | 2016-09-21 | 上海机电工程研究所 | Modularization and heat radiation structure for power supply cabinet |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102401360B (en) | High-power light emitting diode (LED) radiating structure | |
| CN203375191U (en) | High-power LED lamp with high-performance heat dissipation device | |
| CN204629144U (en) | Cross-ventilation radiating type LED lamp | |
| CN203363722U (en) | Sandwich type LED light source module with two sides emitting light | |
| CN203250791U (en) | Large power LED heat radiating structure | |
| CN205065472U (en) | A superconductive aluminium base board of thermoelectric separation for projecting lamp | |
| CN202598179U (en) | A power LED module | |
| CN203656653U (en) | Novel light-emitting assembly | |
| CN206694870U (en) | A kind of LED filament lamp of specular removal | |
| CN203413562U (en) | Mounting seat used for arranging light-emitting components, and lighting device | |
| CN102588926A (en) | Combination type three-dimensional light-emitting diode (LED) radiator | |
| CN202469628U (en) | Light-emitting diode (LED) lamp with high-efficiency heat dissipation structure | |
| CN201903030U (en) | Radiating structure used for high power LED (light emitting diode) lamp | |
| CN203340400U (en) | Printed circuit board with heat conduction column for LED installation | |
| CN202469989U (en) | Combined three-dimensional LED (light-emitting diode) radiator | |
| CN202423393U (en) | Radiating structure of LED (Light Emitting Diode) | |
| CN203533297U (en) | LED bulb lamp provided with ceramic radiator | |
| CN204834676U (en) | LED light source module based on mirror aluminum substrate | |
| CN202613354U (en) | Novel two-side illumination light source direct insertion bracket | |
| CN203607408U (en) | High-voltage LED multipoint packaged light source and high-voltage LED lamp | |
| CN204592990U (en) | For the multicore array integrated morphology of LED light source | |
| CN204647939U (en) | A kind of LED of high rate of heat dissipation | |
| CN204554420U (en) | A kind of LED bulb | |
| CN203596351U (en) | LED-COB (chip on board) light source | |
| CN203325964U (en) | Light-emitting diode (LED) heat radiation structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140101 Termination date: 20180516 |