CN105960143A - Modularization and heat radiation structure for power supply cabinet - Google Patents
Modularization and heat radiation structure for power supply cabinet Download PDFInfo
- Publication number
- CN105960143A CN105960143A CN201610390201.6A CN201610390201A CN105960143A CN 105960143 A CN105960143 A CN 105960143A CN 201610390201 A CN201610390201 A CN 201610390201A CN 105960143 A CN105960143 A CN 105960143A
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- CN
- China
- Prior art keywords
- module
- modularity
- power case
- casing
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
Abstract
The invention discloses a modularization and heat radiation structure for a power supply cabinet. The modularization and heat radiation structure for a power supply cabinet includes a cabinet assembly, a plurality of AC-DC module assemblies, and a plurality of DC-DC module assemblies, wherein the cabinet assembly includes a cabinet body; an air inlet is formed at the bottom of the cabinet body; an air outlet is formed in the side wall of the cabinet body; the plurality of AC-DC module assemblies are arranged in the cabinet body from top to bottom at intervals; and the plurality of DC-DC module assemblies are arranged in the cabinet body, and are arranged below the lowest AC-DC module assembly; the air enters through the air inlet, successively flows through the DC-DC module assemblies and the AC-DC module assemblies, and then is exhausted through the air outlet. The modularization and heat radiation structure for a power supply cabinet solves the defect that a current launching control power supply cabinet is weak in modularization of structural design and heat radiation design, provides a different launching control power supply cabinet designed by a modularization design idea, and can improve the heat radiation performance and the heat reliability.
Description
Technical field
The present invention relates to send out modularity and the heat radiation structure design of control power case, particularly to modularity and the radiator structure of a kind of power case.
Background technology
Send out at present in the structure design of control power case, general " cabinet-combination-printed board " form (as shown in Figure 1) that uses, general point of AC-DC(AC-DC of combination) power source combination and DC-DC(DC-to-dc) power source combination.The internal form using printed board veneer and motherboard combination of combination.Owing to sending out control power case, typically there is watertightness requirement, and caloric value is bigger.The version of traditional " cabinet-combination-printed board ", its heat dissipation design difficulty is relatively big, or does not the most consider heat dissipation design, and the modularized design of product is poor, and modularized design and the heat dissipation design of product have much room for improvement.
Summary of the invention
It is an object of the invention to provide modularity and the radiator structure of a kind of power case, solve to send out the structure design modularity of control power case, the shortcoming of heat dissipation design difference at present, propose a kind of different modular design concept design that utilizes and send out control power case, and increase heat dispersion design, improve the design structure of thermal reliability.
In order to realize object above, the present invention is achieved by the following technical solutions:
The modularity of a kind of power case and radiator structure, be characterized in, comprises:
Chassis component, it comprises casing, and described box bottom is provided with air inlet, and offers air outlet on the sidewall of casing；
Several AC-DC module assemblies, it is disposed in casing from top to bottom；
DC-DC module assembly, it is arranged in casing, and is positioned at the lower section of bottom AC-DC module assembly；
Air enters via air inlet, flows through DC-DC module assembly and AC-DC module assembly successively, and is discharged by described air outlet.
Described casing also comprises the forward and backward door being arranged on casing both sides.
Each described AC-DC module assembly comprises: AC-DC module, is arranged on the printed board chamber on AC-DC module top and is arranged on the radiator chamber of AC-DC module bottom；Described rear portion, radiator chamber is provided with the first radiator fan.
Described DC-DC module assembly comprises:
If dried layer guide rail；
Several DC-DC module, it is separately positioned between the most adjacent two-layer guide rail.
The described guide rail that top is arranged is provided with the second radiator fan.
It is provided with air channel between described Qianmen and DC-DC module assembly.
Each described DC-DC module upper and lower surface is provided with guide groove, and described guide groove is equipped with guide rail.
The present invention compared with prior art, has the advantage that
Utilize the single structure form of " cabinet-combination-printed board " in traditional power case design that instant invention overcomes, and take internal heat dissipation structures design and modularized design measure, not only reach the requirement of power case modularized design, and overcome the shortcoming that conventional power source case radiation is poor.This kind of modularity and heat radiation structure design method, extensively can apply in sending out control power case design.
Accompanying drawing explanation
Fig. 1 is conventional power source cabinet " cabinet-combination-printed board " structure design diagram
Fig. 2 is modularity and the structural representation of radiator structure of a kind of power case of the present invention；
Fig. 3 is the generalized section in A-A direction in Fig. 2；
Fig. 4 A is DC-DC module rearview provided by the present invention；
Fig. 4 B is DC-DC module schematic diagram provided by the present invention；
Fig. 4 C is DC-DC module schematic diagram provided by the present invention.
Detailed description of the invention
Below in conjunction with accompanying drawing, by describing a preferably specific embodiment in detail, the present invention is further elaborated.
As shown in Figure 2,3, the modularity of a kind of power case and radiator structure, comprise: chassis component, it comprises casing 1, it is arranged on the forward and backward door (2,3) of casing 1 both sides, being provided with air inlet 6 bottom casing 1, and offer air outlet 7 on the sidewall of casing 1, corresponding is provided with a total fan at air outlet 7；3 AC-DC module assemblies 4, it is disposed in casing 1 from top to bottom；DC-DC module assembly, it is arranged in casing 1, and is positioned at the lower section of bottom AC-DC module assembly；Air enters via air inlet 6, flows through DC-DC module assembly 5 and AC-DC module assembly 4 successively, and is discharged by air outlet 7.Additionally, in addition to bottom air inlet and upper back air outlet, remainder Seal Design.
Each AC-DC module assembly comprises: AC-DC module, is arranged on the printed board chamber 8 on AC-DC module top and is arranged on the radiator chamber 9 of AC-DC module bottom, printed board chamber 8 and the mutual physical isolation in radiator chamber 9, printed board fits tightly with radiator, middle painting heat-conducting glue, opening before and after radiator chamber 9, upper and lower plates seals；Described rear portion, radiator chamber 9 is provided with the first radiator fan 10.
Above-mentioned DC-DC module assembly comprises: 3 layers of guide rail (11,12,13)；18 DC-DC module 14, it is separately positioned between the most adjacent two-layer guide rail, the radiation tooth consistency from top to bottom arrangement of DC-DC module 14.
The guide rail that top is arranged is provided with the second radiator fan 16.
In a particular embodiment, air channel 15 it is provided with between above-mentioned Qianmen and DC-DC module assembly.
Each DC-DC module upper and lower surface is provided with guide groove 17, guide groove 1 is equipped with guide rail, and DC-DC module both sides are provided with radiator chamber 18 and printed board chamber 19, Square Connector plug is installed at DC-DC module rear portion, and Square Connector plug 20 coordinates (seeing Fig. 4 A, 4B and 4C) with the square plug receptacle 21 on DC-DC subrack internal connector installing plate.
During power case work, power case institute band fan and subrack institute band fan work.Cool exterior air enters casing 1 from power supply bottom air inlet mouth 6, enters DC-DC module component bottom, flows up along the radiation tooth between DC-DC module.In DC-DC module printed board, the produced heat of heating element, is transmitted to printed board from components and parts, is transmitted to radiator from printed board, by conduction, convection current, radiation, fully carries out heat exchange with the cold air flowing through heat radiation between cog.After arriving DC-DC module assembly top panel, air enters air channel 15, under the air draught effect of the second radiator fan 16, flow out DC-DC module assembly, flow to the space between DC-DC module assembly and Qianmen, then air is divided into three stocks and does not flow to the heat radiation between cog of 3 AC-DC module assemblies, the produced heat of heating element in AC-DC module assembly printed board, it is transmitted to printed board from components and parts, it is transmitted to radiator from printed board, by conduction, convection current, radiation, fully carry out heat exchange with the cold air flowing through heat radiation between cog.Under the effect of first radiator fan 10 at each AC-DC module rear portion, flow out AC-DC module assembly, then under the effect of the total fan 22 after casing, flow out power case.
And the printed board of 3 AC-DC module assemblies and the structure outside 18 DC-DC module and inside is by modularized design, as long as carrying out simple software design patterns, can realize interchangeability.Can reach the purpose of modularized design.
In sum, the modularity of a kind of power case of the present invention and radiator structure, solve to send out the structure design modularity of control power case, the shortcoming of heat dissipation design difference at present, propose a kind of different modular design concept design that utilizes and send out control power case, and increase heat dispersion design, improve the design structure of thermal reliability.
Although present disclosure has been made to be discussed in detail by above preferred embodiment, but it should be appreciated that the description above is not considered as limitation of the present invention.After those skilled in the art have read foregoing, multiple amendment and replacement for the present invention all will be apparent from.Therefore, protection scope of the present invention should be limited to the appended claims.
Claims (7)
1. the modularity of a power case and radiator structure, it is characterised in that comprise:
Chassis component, it comprises casing, and described box bottom is provided with air inlet, and offers air outlet on the sidewall of casing；
Several AC-DC module assemblies, it is disposed in casing from top to bottom；
DC-DC module assembly, it is arranged in casing, and is positioned at the lower section of bottom AC-DC module assembly；
Air enters via air inlet, flows through DC-DC module assembly and AC-DC module assembly successively, and is discharged by described air outlet.
2. the modularity of power case as claimed in claim 1 and radiator structure, it is characterised in that described casing also comprises the forward and backward door being arranged on casing both sides.
3. the modularity of power case as claimed in claim 1 and radiator structure, it is characterised in that each described AC-DC module assembly comprises: AC-DC module, be arranged on the printed board chamber on AC-DC module top and be arranged on the radiator chamber of AC-DC module bottom；Described rear portion, radiator chamber is provided with the first radiator fan.
4. the modularity of power case as claimed in claim 1 and radiator structure, it is characterised in that described DC-DC module assembly comprises:
If dried layer guide rail；
Several DC-DC module, it is separately positioned between the most adjacent two-layer guide rail.
5. the modularity of power case as claimed in claim 4 and radiator structure, it is characterised in that be provided with the second radiator fan on the described guide rail that top is arranged.
6. the modularity of power case as claimed in claim 2 and radiator structure, it is characterised in that be provided with air channel between described Qianmen and DC-DC module assembly.
7. the modularity of power case as claimed in claim 4 and radiator structure, it is characterised in that each described DC-DC module upper and lower surface is provided with guide groove, and described guide groove is equipped with guide rail.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610390201.6A CN105960143A (en) | 2016-06-03 | 2016-06-03 | Modularization and heat radiation structure for power supply cabinet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610390201.6A CN105960143A (en) | 2016-06-03 | 2016-06-03 | Modularization and heat radiation structure for power supply cabinet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105960143A true CN105960143A (en) | 2016-09-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610390201.6A Pending CN105960143A (en) | 2016-06-03 | 2016-06-03 | Modularization and heat radiation structure for power supply cabinet |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201590972U (en) * | 2010-01-22 | 2010-09-22 | 中兴通讯股份有限公司 | Connecting post, radiator and heat dissipation structure |
| CN202172365U (en) * | 2010-08-19 | 2012-03-21 | Abb有限公司 | Power module and power conversion system |
| EP2469995A1 (en) * | 2010-12-24 | 2012-06-27 | LG Electronics, Inc. | Inverter stack |
| CN203375191U (en) * | 2012-12-12 | 2014-01-01 | 朱梅芳 | High-power LED lamp with high-performance heat dissipation device |
| CN204012782U (en) * | 2014-06-06 | 2014-12-10 | 天津市三源电力设备制造有限公司 | The split type cover plate of intelligent no maintenance super capacitor DC power supply |
| CN204030949U (en) * | 2014-07-22 | 2014-12-17 | 杨燕平 | DC-DC module power source loss prevention side slat |
| CN204967497U (en) * | 2015-09-16 | 2016-01-13 | 重庆润通科技有限公司 | Send out motor heat dissipation structure |
-
2016
- 2016-06-03 CN CN201610390201.6A patent/CN105960143A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201590972U (en) * | 2010-01-22 | 2010-09-22 | 中兴通讯股份有限公司 | Connecting post, radiator and heat dissipation structure |
| CN202172365U (en) * | 2010-08-19 | 2012-03-21 | Abb有限公司 | Power module and power conversion system |
| EP2469995A1 (en) * | 2010-12-24 | 2012-06-27 | LG Electronics, Inc. | Inverter stack |
| CN203375191U (en) * | 2012-12-12 | 2014-01-01 | 朱梅芳 | High-power LED lamp with high-performance heat dissipation device |
| CN204012782U (en) * | 2014-06-06 | 2014-12-10 | 天津市三源电力设备制造有限公司 | The split type cover plate of intelligent no maintenance super capacitor DC power supply |
| CN204030949U (en) * | 2014-07-22 | 2014-12-17 | 杨燕平 | DC-DC module power source loss prevention side slat |
| CN204967497U (en) * | 2015-09-16 | 2016-01-13 | 重庆润通科技有限公司 | Send out motor heat dissipation structure |
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Application publication date: 20160921 |
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| RJ01 | Rejection of invention patent application after publication |