CN110632986A - Reinforced sealed case based on MTCA standard and assembling method thereof - Google Patents

Abstract

The invention discloses a reinforced sealed case based on MTCA standard, wherein radiating fins are uniformly arranged on the outer surfaces of a top cover plate and a bottom cover plate of a case body, and the top and the bottom of a front panel assembly and a rear panel assembly are respectively provided with an air duct inlet and an air duct outlet; more than one module is arranged in the case, and the module comprises an AMC module; the module is provided with a reinforced cold conducting plate for transferring heat generated by the AMC module to a heat sink. The reinforced sealing case can improve the environmental adaptability of the conventional electronic equipment for communication, navigation and the like, particularly the electronic equipment for military communication, navigation and the like under severe environmental conditions, so that the equipment has excellent assembly and maintenance, three-proofing capability, heat dissipation capability, vibration and impact resistance capability and structural electromagnetic compatibility capability.

Description

Reinforced sealed case based on MTCA standard and assembling method thereof

Technical Field

The invention relates to the field of electronic equipment such as communication or navigation, in particular to a reinforced sealed case based on MTCA standard and an assembling method thereof.

Background

MTCA is MircoTCA, which is an architecture similar to a simplified version of ATCA. The AMC module is compatible with the ATCA with high performance, high bandwidth and AMC flexibility, creates extremely high integration level, greatly reduces the cost, reduces the system space and scale, and is more convenient to use without the design of a carrier plate. Therefore, the application requirements in the fields of medium and low-end communication, industry, military, medical treatment, multimedia and the like can be well met.

TABLE 1 terms and definitions

A conventional MTCA chassis structure is known as shown in fig. 1. A standard, MTCA compliant, 19 inch shelf-top 3U subrack is shown. The case mainly comprises the following parts: front panel assembly, chassis, top plate, AMC module, radiating unit, backplate, back panel assembly etc..

The chassis shown in fig. 1 reserves board card slot positions according to the MTCA standard requirement and the slot pitch of 30.48mm, each AMC module is loaded into the chassis through the chassis slot position, and is inserted into the backplane, and the backplane transmits a signal to an external connector in the back panel assembly through a cable. Finally, the front panel assembly is assembled to form a complete enclosure which can be placed in a 19 inch standard cabinet.

The chassis is usually composed of an upper cover plate, a lower cover plate, a left side plate, a right side plate, a bracket, a guide rail and other parts, and the parts are fastened through screws and are numerous. Wherein the upper cover plate, the lower cover plate, the left side plate and the right side plate are partially or completely provided with holes for ventilation, the inside of the whole case is communicated with the external environment, and the case is designed in a non-sealing way.

When AMC module is inserted into the chassis, the AMC module is inserted into the chassis along the guide rails of the chassis by means of the edges of the two sides of the printed board in the AMC module, is inserted into the back board, and is fixed in the chassis by mounting screws on the panel of the AMC module after being assembled in place, so that the AMC module is assembled and fixed.

The left side, the right side or the left side and the right side of the inside of the chassis are provided with radiating units, and air flow flows through the surfaces of the AMC modules and other circuit parts through the ventilating holes on the outer parts of the left side and the right side of the chassis, so that the heat dissipation of the AMC modules and other circuit parts in the chassis is realized.

For AMC modules, back boards and other circuit parts, mildew-proof paint is usually sprayed, so that the circuit parts do not lose effectiveness and can work normally under the working environment conditions of common salt spray mold damp heat and the like.

Aiming at the existing electronic equipment for communication, navigation and the like, in particular to the electronic equipment for military communication, navigation and the like under severe environment conditions, the traditional case design form is difficult to meet the application requirement of severe environment.

In the technical scheme of the conventional MTCA case structure, the adopted design form is an open non-sealing design, and the case is usually inconvenient to assemble and maintain, weak in three-proofing capability, weak in heat dissipation capability, weak in vibration and impact resistance capability and weak in structural electromagnetic compatibility, and specifically comprises the following steps:

1. poor assembly and maintenance

The case body is composed of an upper cover plate, a lower cover plate, a left side plate, a right side plate, a bracket, a guide rail and other parts which are connected through screws. The box body is composed of a plurality of parts, the number of the parts is large, the box body is generally dozens of parts, the number of required fasteners is large, the assembly difficulty is large, and the time is long;

when the chassis needs to be maintained or repaired, the chassis is difficult to disassemble and long in time.

2. Weaker three-proofing capability (salt spray resistance, mold resistance, damp-heat resistance)

The case is not a sealed case, the external environment air is in a communicated state with each circuit part in the case, the printed board and the components are exposed in the air of the external environment, the external air can be in direct contact with the printed board and the electronic components, although the printed board and the electronic components can be sprayed with the mildew-proof paint under most conditions, part of the mildew-proof paint can fall off along with the increase of the use time of the case in severe environments such as equipment on an offshore naval vessel, and the surface of the fallen part is easily corroded by mould, salt mist or damp heat;

generally, the inner surface of the case is subjected to surface treatment such as electroplating and the like, and is not subjected to paint spraying, so that the inner surface of the case is easily corroded by mold, salt mist or damp heat.

3. Weak heat dissipation capability

The chassis is in an open design form, external air can enter the interior of the chassis and contact with the printed board in the interior of the chassis, and electronic components are directly exposed in the air.

The case body mostly radiates heat by adopting the following two modes: one is a chassis (ruggedized air cooled specification) which conforms to the air cooling specification, i.e. cooling air flows through the surfaces of AMC modules and other circuit printed boards and devices through the chassis vents, directly dissipates heat of heat dissipation devices and takes away heat; the other type is a chassis (Hardened hybrid air cooled specification) meeting the reinforced hybrid air conduction cooling specification, namely, radiating fins are designed for each AMC module and are assembled on the AMC module, so that heat of heat dissipation devices of the AMC module is conducted to the radiating fins, cooling air flows through the radiating fin surfaces of the AMC modules through the ventilation holes of the chassis, and heat is conducted and taken away.

The surface area participating in heat exchange of the case which accords with the air cooling specification is only the surface of the printed board and the surface of the device, so that the case has less heat exchange area, and meanwhile, the wind resistance of the cooling air flowing through the inside of the case is influenced by the layout of the device of the printed board, so that the wind resistance is larger, and the heat dissipation capability is extremely limited. Typically the thermal design power consumption of a single AMC module does not exceed 10W.

The chassis that conforms to the reinforced hybrid air conduction cooling specification has an improved heat dissipation capability compared to the chassis that conforms to the air cooling specification due to the addition of the heat sink. However, the standard spacing of the cards for AMC modules is 30.48mm, so the AMC modules must be less than 30.48mm thick, typically designed to be 29mm thick. The AMC module heat sink is also limited in design size and heat dissipation area. Meanwhile, when the AMC modules fill the chassis, the wind resistance of the cooling air flowing through the surface of each AMC module is also influenced by the shape of the radiating fins, the wind resistance is large, the radiating capacity is limited, and the thermal design power consumption of a single AMC module is usually not more than 30W.

The maximum operating ambient temperature of the cabinet is typically less than 55 c.

4. Weak vibration and shock resistance

According to the traditional case design, on one hand, the case is assembled by splicing and screwing a plurality of plates, most spliced plates are thin plates or even sheet metal parts, the case has lower natural frequency, and the case body of the case is weaker in strength.

When AMC module is inserted into the chassis, it depends on the edges of two sides of the printed board in AMC module, and inserts into the chassis along the guide rail of chassis for assembly, and there is a gap between the edge of printed board and the guide rail. Through extensive testing, experimental data from vibration of a loose printed board edge rail chassis assembly has shown that the resonant frequency of the printed board is always coupled to the chassis resonant frequency, even when the chassis resonant frequency is increased in an attempt to separate the two frequencies. This produces severe coupling effects in the printed board of the AMC module, which can increase the stress level in the printed board and reduce its fatigue life.

5. Weak structural electromagnetic compatibility

In the traditional case design, on one hand, the case is assembled by splicing and screwing a plurality of plates, and electromagnetic leakage exists at the splicing part; the outer surface of the case is provided with a heat dissipation vent hole which is communicated with a printed board and electronic components in each AMC module in the case, so that electromagnetic leakage is caused, and the electromagnetic compatibility of the whole structure is weaker.

Disclosure of Invention

The invention aims to overcome the defects of the prior art and provide a reinforced sealed case based on MTCA standard, which can improve the environmental adaptability of the existing electronic equipment for communication or navigation, especially the electronic equipment for military communication or navigation under severe environmental conditions, and enables the equipment to have excellent assembly and maintenance, three-proofing capability, heat dissipation capability, vibration and impact resistance capability and structural electromagnetic compatibility capability.

Another object of the present invention is to provide a method of assembling a ruggedized, sealed enclosure based on MTCA standards.

The purpose of the invention is realized by the following technical scheme:

a reinforced sealed chassis based on MTCA standard comprises a chassis body, a front panel assembly, a rear panel assembly, an upper cover plate and a lower cover plate, wherein the front panel assembly, the rear panel assembly, the upper surface and the lower surface of the chassis body are respectively and fixedly covered; a back plate is arranged between the case body and the back plate assembly, one side of the back plate assembly close to the case body is fixed with the back plate through screws, and one side of the back plate assembly far away from the case body is provided with a fan assembly;

the surface of the top cover plate and the bottom cover plate of the case body is evenly provided with radiating fins, the top and the bottom of the front panel assembly and the rear panel assembly are both provided with an air duct inlet and an air duct outlet, and the air inlet flow has two branch circuits: the airflow of the first branch passes through an inlet and an outlet of a top air duct of the front panel assembly, the space where the radiating fins of the top cover plate of the case body are located and an inlet and an outlet of a top air duct of the rear panel assembly in sequence, and the airflow of the second branch passes through an inlet and an outlet of a bottom air duct of the front panel assembly, the space where the radiating fins of the bottom cover plate of the case body are located and an inlet and an outlet of; after the airflows of the first branch and the second branch are converged on the rear panel assembly, the airflows are brought out by a fan assembly on the rear panel assembly;

more than one module is arranged in the case, and the module comprises an AMC module; the module is provided with a reinforced cold conducting plate for transferring heat generated by the AMC module to a heat sink.

The arrangement mode of the radiating fins is as follows: the plane of each radiating fin is perpendicular to the plane of the front panel assembly and the plane of the top cover plate of the case body, and the plane of the top cover plate of the case body is parallel to the plane of the bottom cover plate of the case body. The setting direction of fin and air current pass through the direction parallel this moment, reduce the resistance that meets when the air current passes through the wind channel, improve the radiating efficiency.

The periphery of the top cover plate and the bottom cover plate of the case body are respectively provided with a mounting boss, and the height of the mounting bosses is larger than that of the radiating fins. The arrangement of the mounting boss can facilitate the mounting of the front panel assembly, the rear panel assembly, the upper cover plate and the lower cover plate, and meanwhile, the cooling fins can be protected.

And sealing grooves are formed in the contact positions of the front panel assembly and the case body and the contact positions of the rear panel assembly and the case body, and double-peak conductive sealing rubber strips are assembled in the sealing grooves.

The top cover plate, the bottom cover plate, the left side plate and the right side plate of the case body and more than one vertical plate arranged in the case body form an integrated case with four sealed sides up and down through tailor welding.

The top of the reinforced cold guide plate of the AMC module is provided with more than one locking strip; more than one case guide groove is correspondingly arranged on the inner side of the case body; the locking bar and the AMC module are fixed together and are installed into the case along the case guide groove as a whole to be locked and fixed.

The locking strip is a wedge-shaped locking strip. As the locking strip adopts the wedge-shaped locking device, larger mechanical stress can be generated, the thermal contact resistance between two contact surfaces is reduced, and the heat conduction capability is improved.

And a flexible heat conducting pad is arranged between the reinforcing cold conducting plate of the AMC module and the heating device of the AMC module. In each module reinforcing board card, the reinforcing cold guide plate in each module is tightly attached to the heating device on the printed board, and meanwhile, a flexible heat conducting pad is filled between the component and the reinforcing cold guide plate so as to eliminate air gaps, reduce the contact thermal resistance between the component and the heat conducting plate and quickly transfer the heat generated by the component to the heat conducting plate.

The other purpose of the invention is realized by the following technical scheme:

an MTCA standard-based method for assembling a reinforced sealed case comprises the following steps:

firstly, fixing a back plate and a rear panel assembly together through screws to form a relatively closed whole, then loading the whole into a fan assembly, and fixing the whole together through screws to form a rear panel part;

the outer surfaces of the top cover plate and the bottom cover plate are uniformly provided with a case body of radiating fins, and the case body and the rear panel part are fixed together through screws; the module is arranged in the case body along the case guide groove through an auxiliary pluggable device of the module, is oppositely inserted with the back plate, and is tensioned and fixed in the case through a wedge-shaped locking strip after being assembled in place; and then the front panel assembly and the case body are fixed through screws, and the whole machine is assembled.

The reinforced sealed case based on the MTCA standard has the following heat dissipation paths:

heating device of AMC module → flexible heat conducting pad of AMC module → reinforced cold conducting plate of AMC module → wedge locking strip of AMC module → chassis guide groove of chassis body → chassis air duct heat dissipation surface → forced convection cooling of air around chassis.

Compared with the prior art, the invention has the following advantages and beneficial effects:

the reinforced sealed case based on the MTCA standard has better assembly and maintainability; meanwhile, the anti-vibration and anti-shock structure has better three-proofing performance, heat dissipation performance, anti-vibration and anti-shock performance and structural electromagnetic compatibility.

Drawings

Fig. 1 is a schematic structural diagram of a conventional MTCA chassis.

Fig. 2 is a schematic view of the overall structure of a reinforced sealed chassis based on the MTCA standard according to the present invention.

Fig. 3 is a schematic structural diagram of a chassis.

FIG. 4 is a schematic view of an air duct.

Fig. 5 is a diagram of an AMC module heat dissipation layout.

Wherein the reference numerals have the following meanings:

1-a front panel assembly of a traditional MTCA case, 2-a rear panel assembly of the traditional MTCA case, 3-a case of the traditional MTCA case, 4-a top cover plate of the traditional MTCA case, 5-a back panel of the traditional MTCA case and 6-an AMC module of the traditional MTCA case;

7-a front panel assembly, 8-a rear panel assembly, 9-an upper cover plate, 10-a lower cover plate, 11-a back plate, 12-a fan assembly, 13-a top cover plate, 14-a bottom cover plate, 15-a radiating fin, 16-a left side plate, 17-a right side plate, 18-a vertical plate, 19-AMC modules, 20-a reinforced cold conducting plate, 21-a wedge-shaped locking strip, 22-a case guide groove, 23-a flexible heat conducting pad, 24-a heating device, 25-a first printed board, 26-a second printed board, 27-a case, 28-a front panel upper air inlet, 29-a case upper air channel, 30-a rear panel upper air outlet, 31-a front panel lower air inlet, 32-a case lower air channel and 33-a rear panel lower air outlet.

Detailed Description

The present invention will be described in further detail with reference to examples and drawings, but the present invention is not limited thereto.

As shown in fig. 2 to 4, in order to improve the environmental adaptability of the present electronic equipment for communication or navigation, especially the electronic equipment for military communication or navigation under severe environmental conditions, and make the equipment have excellent assembly and maintainability, three prevention capability, heat dissipation capability, vibration and impact resistance capability, and structural electromagnetic compatibility capability, a novel reinforced sealed case design based on MTCA standard design is proposed, and the specific design is implemented as follows:

1. overall design of structure

The whole machine adopts a standard 19-inch upper frame type 4U case, an external interface (an aerial plug connector) is arranged on a rear panel assembly, the structure of the whole machine adopts a modular design idea based on the MTCA standard, and a reinforcing board card form is adopted, so that the sealing design of the case is realized.

FIG. 2 is a schematic diagram of the overall structure layout of the present invention. The whole machine mainly comprises a front panel assembly, an upper cover plate, a lower cover plate, a chassis, 10 modules (including 6 AMC modules), a back panel, a rear panel assembly, a fan assembly and the like.

The case is formed by welding 6 plates in total, such as a top cover plate, a bottom cover plate, a left side plate, a right side plate, two vertical plates and the like, and an integrated case with sealed upper, lower, left and right sides is formed, as shown in fig. 3. Chassis guide slots are designed on each tailor-welded board to guide and secure 10 modules (including 6 AMC modules). The top cover plate and the bottom cover plate are provided with radiating fins and an air duct for radiating heat of the whole machine. On the front end face and the rear end face of the integrated case and on the inner side of the air duct, a sealing groove is designed for assembling a double-peak conductive sealing rubber strip, so that the case is in conductive sealing when being assembled with the front panel assembly and the rear panel assembly.

The whole machine is blown out after going forward, and the air draft design is adopted. The case, the upper cover plate and the lower cover plate are assembled to form an air duct which is sealed up, down, left and right, and only an air duct inlet and an air duct outlet are reserved at the top and the bottom of the front surface and the back surface of the case. The upper and lower positions of the front panel parts are provided with vent holes for cooling air to enter the top and the bottom of the case. The air channel is designed at the upper position and the lower position of the rear panel part and used for cooling air to flow out of the case and enter the fan at the tail part, and then the fan draws air to take away heat.

2. Assembly and serviceability

The whole machine case is formed by tailor welding, a plurality of case parts are combined into one case, the number of parts is greatly reduced, and the assembly time is shortened;

the assembly process of the whole machine is as follows: the back plate and the back panel assembly are fixed together through screws to form a relatively closed whole, and then the fan assembly is arranged in the back plate and is fixed together through screws to form a back panel part; the case and the back panel part are fixed together through screws. The module comprises 10 modules (including 6 AMC modules), wherein the modules are arranged in a chassis along a chassis guide rail groove through an auxiliary plug-in device of the module, are inserted into a back plate, and are tensioned and fixed in the chassis through a wedge-shaped locking strip after being assembled in place; and then the front panel assembly and the chassis are fixed through screws, and the whole machine is assembled.

Generally, the chassis is often various modules needing to be maintained, and the back plate and the back panel assembly are not easy to damage. Each module is fixed through wedge locking strip with the quick-witted case, and every module has two locking strips, and every locking strip only has a fastening screw, only needs during the dismantlement to unscrew the locking strip screw on each module, then can the dismouting module through supplementary plug ware, and the same process when packing into the module is reverse go on once can. According to actual experience, before a complete machine with complete assembly, the disassembly and assembly of one module in the machine case can be completed within five minutes, so that the disassembly and assembly maintenance requirements of communication and navigation equipment, particularly military equipment, are met, the maintenance time of products is greatly shortened, and the maintainability of the products is improved.

3. Three proofing capability

The whole machine can meet the test requirements of GJB150.9A-2009 humidity and heat test for military equipment laboratory environment test method, GJB150.10A-2009 mould test for military equipment laboratory environment test method and GJB150.11A-2009 salt spray test for military equipment laboratory environment test method.

In order to improve the moisture-proof, mould-proof and salt-fog-proof capabilities of the whole machine, the following measures are mainly taken from the aspects of material protection, process protection, structure protection and the like:

a) material protection

Aluminum alloy with the same electrochemical couple and good protection performance is selected as a structural member material, the surface of the structural member is subjected to conductive oxidation treatment, and screws and the like are made of stainless steel materials, so that the shielding performance is ensured, and the three-prevention requirement is met;

b) surface treatment

The outer surface of the case is coated with a matt three-proofing paint so as to enhance the three-proofing performance of the whole electronic equipment;

c) chassis seal design

In the design, the enclosure is a closed structure, and the air of the cooling system flows through the outer surface of the enclosure and is physically isolated from the modules and the back panel in the enclosure. The chassis is integrally formed by tailor welding, and the joints of the chassis, the front panel, the rear panel, the upper bottom plate and the lower bottom plate are respectively provided with a double-peak conductive rubber strip with a sealing function, so that the interior of the chassis is isolated from the external environment, and the three-proofing performance of the chassis is improved.

4. Heat dissipating capability

The thermal design is aimed at controlling the temperature of the heating elements primarily by rapidly and efficiently transferring the heat generated by the modules to the environment outside the sealed enclosure via a path of low thermal resistance.

The whole machine case mainly adopts a forced air cooling heat dissipation mode, heat is firstly transferred to the case through heat conduction and then transferred to surrounding media through forced convection, and heat dissipation of case equipment is achieved.

The case can meet the test requirements of GJB150.3A-2009 high-temperature test of military equipment laboratory environment test method.

a) Air duct design

A fan is placed in the middle of the rear panel of the whole machine, air inlets are formed in the upper portion and the lower portion of the front panel, the machine case is designed to be of a fully-closed structure with air channels separated from an inner cavity, and the upper air channel and the lower air channel are designed through radiating fins on the upper surface and the lower surface of the machine case, so that cooling air flows into the upper air channel and the lower air channel of the machine case through the upper air inlet and the lower air inlet of the front panel and flows into the axial flow fan at the tail portion through the upper.

The schematic diagram of the air duct is shown in fig. 4.

b) Part material selection

The case module and each structural part are all processed by aluminum alloy with good heat conductivity, so that the heat conductivity and heat resistance are reduced;

c) heat dissipation path

d) In each module reinforcing board card, the reinforcing cold guide plate in each module is tightly attached to the heating device on the printed board, and meanwhile, a flexible heat conducting pad is filled between the component and the reinforcing cold guide plate so as to eliminate air gaps, reduce the contact thermal resistance between the component and the heat conducting plate and quickly transfer the heat generated by the component to the heat conducting plate. The heat conducting plate is connected with the guide groove of the case through the wedge-shaped locking strip, and the wedge-shaped locking strip adopts the wedge-shaped locking device, so that larger mechanical stress can be generated, the thermal contact resistance between two contact surfaces is reduced, and the heat conduction capability is improved. The conduction and heat dissipation path of the printed board card component is as follows: heating element → flexible heat conducting pad → wedge-shaped locking strip → case guide groove → case air duct heat dissipation surface → case ambient air forced convection cooling. FIG. 5 is a diagram of an AMC module layout.

e) Heat sink design

The radiating fins of the case are designed by fins, so that the radiating area of the surface of the case is increased, and the radiating effect is improved; meanwhile, the fins are optimally designed, the large-area radiating fins are changed into the small-area radiating fins, a multi-hollow-grid structure is formed, the resistance when air flows is reduced, the pressure drop of wind pressure is reduced, the forced air cooling convection heat exchange coefficient is improved, and the radiating efficiency of the case is enhanced.

f) Description of Heat dissipation Property

The maximum working environment temperature of the case can reach 70 ℃. Theoretically, the maximum heat consumption of a single module of the chassis can reach 50W.

5. Vibration and shock resistance

The whole machine can meet the test requirements in GJB150.16A-2009 vibration test for military equipment laboratory environment test method and GJB150.18A-2009 impact test for military equipment laboratory environment test method.

The vibration and impact resistance of the whole machine is improved mainly from two aspects of chassis design and module design, and the method comprises the following steps:

a) strength design of whole machine case

The whole machine case is formed into an integral case by welding, and has higher strength and higher natural frequency, so that the vibration resistance and the shock resistance of the whole machine case are improved;

b) module strength design

The anti-vibration capability of the module printed board is improved, the cold guide plate is designed and reinforced for each module, the rigidity of the module printed board is improved, and the deformation of the board card under vibration and impact conditions is reduced. All module plugboards are in a straight-inserting type and are connected with the guide groove of the case in a tensioning mode through wedge-shaped locking strips, the first-order natural frequency of the board cards is greatly improved, and the connecting device is high in tensioning force, strong in vibration isolation and buffering capacity, and high in universality and interchangeability; when the back plate is installed, besides the installation holes are formed in the periphery of the printed board, the structural support is independently designed for the back plate, so that the middle part of the back plate is also supported, and the vibration resistance and the shock resistance of the back plate are enhanced.

6. Structural electromagnetic compatibility capability

The whole machine case and each module are designed mainly from the aspects of material selection, processing technology and electric lapping, and conductive discontinuous points are eliminated by eliminating gaps on the contact surfaces of the case and the front and rear panels, so that electromagnetic leakage is reduced:

a) module single-board magnetic compatibility design

When each module board card is designed, local shielding of the single board is carried out. Designing a box type shielding frame and a shielding cover, and taking shielding measures for local strong interference sources or sensitive circuits on a single board;

b) material and surface treatment

The aluminum alloy with high conductivity is selected as a box body structure material, the outer surface of the box body, particularly the junction surface of the front panel and the rear panel, is subjected to milling finish machining in the aspect of machining, and then the box body, the front panel and the rear panel are subjected to conductive oxidation surface treatment, so that the box body, the front panel and the rear panel are assembled into a closed shell, and the resistance of the detachable junction surface is reduced.

c) Case assembling process

And double-peak conductive adhesive tapes are arranged among the case body, the front panel, the rear panel, the fan assembly and the rear panel assembly, so that the whole electric conduction continuity of the case body is realized.

The above embodiments are preferred embodiments of the present invention, but the present invention is not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be construed as equivalents thereof, and all such changes, modifications, substitutions, combinations, and simplifications are intended to be included in the scope of the present invention.

Claims (10)

1. The utility model provides a consolidate sealed quick-witted case based on MTCA standard which characterized in that: the machine case comprises a machine case body, and also comprises a front panel assembly, a rear panel assembly, an upper cover plate and a lower cover plate which are respectively fixedly covered on the front, the rear, the upper and the lower of the machine case body; a back plate is arranged between the case body and the back plate assembly, one side of the back plate assembly close to the case body is fixed with the back plate through screws, and one side of the back plate assembly far away from the case body is provided with a fan assembly;

the surface of the top cover plate and the bottom cover plate of the case body is evenly provided with radiating fins, the top and the bottom of the front panel assembly and the rear panel assembly are both provided with an air duct inlet and an air duct outlet, and the air inlet flow has two branch circuits: the airflow of the first branch passes through an inlet and an outlet of a top air duct of the front panel assembly, the space where the radiating fins of the top cover plate of the case body are located and an inlet and an outlet of a top air duct of the rear panel assembly in sequence, and the airflow of the second branch passes through an inlet and an outlet of a bottom air duct of the front panel assembly, the space where the radiating fins of the bottom cover plate of the case body are located and an inlet and an outlet of; after the airflows of the first branch and the second branch are converged on the rear panel assembly, the airflows are brought out by a fan assembly on the rear panel assembly;

more than one module is arranged in the case, and the module comprises an AMC module; the module is provided with a reinforced cold conducting plate for transferring heat generated by the AMC module to a heat sink.

2. A MTCA standard based ruggedized, sealed enclosure of claim 1, wherein: the arrangement mode of the radiating fins is as follows: the plane of each radiating fin is perpendicular to the plane of the front panel assembly and the plane of the top cover plate of the case body, and the plane of the top cover plate of the case body is parallel to the plane of the bottom cover plate of the case body.

3. A MTCA standard based ruggedized, sealed enclosure of claim 1, wherein: the periphery of the top cover plate and the bottom cover plate of the case body are respectively provided with a mounting boss, and the height of the mounting bosses is larger than that of the radiating fins.

4. A MTCA standard based ruggedized, sealed enclosure of claim 1, wherein: and sealing grooves are formed in the contact positions of the front panel assembly and the case body and the contact positions of the rear panel assembly and the case body, and double-peak conductive sealing rubber strips are assembled in the sealing grooves.

5. A MTCA standard based ruggedized, sealed enclosure of claim 1, wherein: the top cover plate, the bottom cover plate, the left side plate and the right side plate of the case body and more than one vertical plate arranged in the case body form an integrated case with four sealed sides up and down through tailor welding.

6. A MTCA standard based ruggedized, sealed enclosure of claim 1, wherein: the top of the reinforced cold guide plate of the AMC module is provided with more than one locking strip; more than one case guide groove is correspondingly arranged on the inner side of the case body; the locking bar and the AMC module are fixed together and are installed into the case along the case guide groove as a whole to be locked and fixed.

7. The MTCA standard-based ruggedized, sealed chassis of claim 6, wherein: the locking strip is a wedge-shaped locking strip.

8. A MTCA standard based ruggedized, sealed enclosure of claim 1, wherein: and a flexible heat conducting pad is arranged between the reinforcing cold conducting plate of the AMC module and the heating device of the AMC module.

9. An MTCA standard-based method for assembling a reinforced sealed case is characterized by comprising the following steps of:

firstly, fixing a back plate and a rear panel assembly together through screws to form a relatively closed whole, then loading the whole into a fan assembly, and fixing the whole together through screws to form a rear panel part;

the outer surfaces of the top cover plate and the bottom cover plate are uniformly provided with a case body of radiating fins, and the case body and the rear panel part are fixed together through screws; the module is arranged in the case body along the case guide groove through an auxiliary pluggable device of the module, is oppositely inserted with the back plate, and is tensioned and fixed in the case through a wedge-shaped locking strip after being assembled in place; and then the front panel assembly and the case body are fixed through screws, and the whole machine is assembled.

10. A method of assembling a ruggedized, sealed enclosure based on an MTCA standard of claim 9, wherein: the reinforced sealed case based on the MTCA standard has the following heat dissipation paths:

heating device of AMC module → flexible heat conducting pad of AMC module → reinforced cold conducting plate of AMC module → wedge locking strip of AMC module → chassis guide groove of chassis body → chassis air duct heat dissipation surface → forced convection cooling of air around chassis.

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