CN110632986A - A reinforced sealed chassis based on MTCA standard and its assembly method - Google Patents

Abstract

The invention discloses a reinforced and sealed chassis based on the MTCA standard. The outer surfaces of the top cover plate and the bottom cover plate of the chassis body are uniformly provided with cooling fins, and the top and bottom of the front panel assembly and the rear panel assembly are provided with The inlet and outlet of the air duct; the inside of the chassis is used to place more than one module, and the modules include the AMC module; the module is provided with a reinforced cold-conducting plate, which is used to transfer the heat generated by the AMC module to the heat sink. The reinforced and sealed chassis of the present invention can improve the environmental adaptability of current electronic equipment such as communication or navigation, especially the electronic equipment such as military communication or navigation under harsh environmental conditions, so that the equipment has excellent assembly and maintainability, three resistance, heat dissipation, vibration resistance and shock resistance, and structural electromagnetic compatibility.

Description

A reinforced sealed chassis based on MTCA standard and its assembly method

technical field

The invention relates to the field of electronic equipment such as communication or navigation, in particular to a reinforced and sealed chassis based on the MTCA standard and an assembling method thereof.

Background technique

MTCA is MircoTCA, and its architecture is similar to a simplified version of ATCA. It is compatible with the high performance, high bandwidth, and flexibility of AMC of ATCA, creating a very high level of integration, while greatly reducing costs, reducing system space and scale, and the design without a carrier board is more convenient for AMC modules. use. So that it can well meet the application requirements of low-end communication, industry, military, medical, multimedia and other fields.

Table 1 Terms and Definitions

The existing traditional MTCA chassis structure is shown in Figure 1. Shown here is a standard, MTCA-compliant, 19-inch rackmount 3U enclosure. The chassis is mainly composed of the following parts: front panel components, chassis, top cover, AMC module, cooling unit, backplane, rear panel components, etc.

The chassis shown in Figure 1 is in accordance with the MTCA standard. Board slots are reserved according to the slot spacing of 30.48mm. Each AMC module is installed into the chassis through the chassis slot, and plugged into the backplane. The backplane transmits signals to the backplane through cables. in the external connectors in the rear panel assembly. Finally, the front panel assembly is loaded to form a complete chassis that fits into a standard 19-inch cabinet.

The chassis is usually composed of upper cover, lower cover, left side panel, right side panel, bracket, guide rail and other parts, which are fastened by screws and have a large number of parts. The upper cover, the lower cover, the left side panel and the right side panel are partially or fully ventilated, and the entire inside of the chassis is connected to the external environment, with a non-sealed design.

When the AMC module is inserted into the chassis, rely on the two sides of the printed board in the AMC module, insert it into the chassis along the chassis rail, and plug it into the backplane. After the assembly is in place, fix the AMC module to the chassis through the mounting screws on the AMC module panel. Inside, to achieve the assembly and fixation of the AMC module.

Place the cooling unit on the left, right, or left and right sides of the chassis, and through the external ventilation holes on the left and right sides of the chassis, the airflow flows through the surfaces of each AMC module and other circuit parts to realize the cooling of each AMC module and other circuits in the chassis. part of the cooling.

For AMC modules, backplanes and other circuit parts, anti-mildew paint is usually sprayed, so that the circuit parts of the chassis will not fail and can work normally under normal working environment conditions such as salt spray, mildew, humidity and heat.

For the current electronic equipment such as communication or navigation, especially the electronic equipment such as military communication or navigation under harsh environmental conditions, it is difficult for the traditional chassis design to meet the requirements of harsh environmental applications.

In the existing traditional MTCA chassis structure technical scheme, the design form adopted is an open non-sealed design. This type of chassis is usually inconvenient to assemble and maintain, has weaker three defense capabilities, weaker heat dissipation capabilities, and weaker resistance to resistance. Vibration and shock resistance, weak structural electromagnetic compatibility, as follows:

1. Poor assembly and maintainability

The chassis box is composed of upper cover, lower cover, left side panel, right side panel, bracket, guide rail and other parts, and is connected by screws. There are many types and quantities of parts that make up the box. Usually there are dozens of parts, and the number of fasteners required is also relatively large, which is difficult to assemble and takes a long time;

When the chassis needs maintenance or repair, it is difficult and time-consuming to disassemble.

2. Weak three-proof ability (anti-salt spray, anti-mold, anti-humid heat)

The chassis is not a sealed chassis, the external ambient air is in a state of communication with various circuit parts inside the chassis, the printed board and components are exposed to the air of the external environment, and the external air will be in direct contact with the printed board and electronic components. In most cases, the boards and electronic devices will be sprayed with anti-mildew paint, but in harsh environments such as equipment on ships at sea, with the increase of the use time of the chassis, part of the three-proof paint will fall off, and the surface of the falling part will be vulnerable to mold, Corrosion by salt spray or damp heat;

Generally, the inner surface of the chassis is only treated with surface treatment, such as electroplating, etc., without painting, and the inner surface of the chassis is easily corroded by mold, salt spray or damp heat.

3. Weak heat dissipation capacity

The design form of the chassis is open, and the external air can enter the interior of the chassis and contact the printed board inside the chassis, and the electronic components are directly exposed to the air.

The chassis is mostly dissipated by the following two methods: one is the chassis that meets the air cooling specification (Rugged air cooled specification), that is, the cooling air flows through the ventilation holes of the chassis through the AMC modules and other printed circuit board surfaces and devices. The other is the chassis that meets the Hardened hybrid air conduction cooling specification, that is, the heat sink is designed for each AMC module, and the heat sink is assembled to the On the AMC module, the heat of the heat-consuming components of the AMC module is conducted to the heat sink, and the cooling air flows through the surface of the heat sink of each AMC module through the ventilation holes of the chassis, and the heat is transferred by convection to take away the heat.

Chassis that conforms to air cooling specifications, the surface area involved in heat exchange is only the surface of the printed board and the surface of the device, which has less heat exchange area. At the same time, the wind resistance of the cooling air flowing through the chassis is affected by the layout of the components of the printed board, and the wind resistance is large. , the heat dissipation capacity is extremely limited. Usually the thermal design power consumption of a single AMC module does not exceed 10W.

Cases that meet the Rugged Hybrid Air Conduction Cooling specification have increased cooling capacity compared to chassis that meet the Air Cooling specification due to the addition of heatsinks. However, the standard pitch of AMC modules is 30.48mm, so the thickness of AMC modules must be less than 30.48mm, and the design thickness is usually 29mm. The design size of the AMC module heat sink is also limited, and the heat dissipation area is also limited. At the same time, when the AMC modules are full of the chassis, the wind resistance of the cooling air flowing through the surface of each AMC module is also affected by the shape of the heat sink. The wind resistance is large and the heat dissipation capacity is also limited. Generally, the thermal design power consumption of a single AMC module does not exceed 30W.

The maximum working ambient temperature of the chassis is usually lower than 55℃.

4. Weak anti-vibration and anti-shock ability

In the traditional chassis design, on the one hand, the chassis is assembled by multiple boards and screws. Most of the panels are thin plates or even sheet metal parts. The chassis has a low natural frequency and the strength of the chassis is weak.

When the AMC module is inserted into the chassis, rely on the edges on both sides of the printed board in the AMC module, and insert it into the chassis along the chassis guide rail for assembly. There is a gap between the printed board edge and the guide rail. Through extensive testing, experimental vibration data on chassis assemblies with loose printed board edge rails have shown that the resonant frequency of the printed board is always coupled with the chassis resonant frequency, even when the chassis resonant frequency is raised in an attempt to separate the The same is true for both frequencies. In this way, a serious coupling effect is produced in the printed board of the AMC module, which will increase the stress level in the printed board and reduce its fatigue life.

5. Weak structural electromagnetic compatibility

In the traditional chassis design, on the one hand, the chassis is assembled by splicing multiple boards, and there will be electromagnetic leakage at the splicing; The devices are connected, resulting in electromagnetic leakage, and the electromagnetic compatibility of the whole structure is weak.

SUMMARY OF THE INVENTION

The purpose of the present invention is to overcome the shortcomings and deficiencies of the prior art, and to provide a reinforced sealed case based on the MTCA standard, which can improve the current electronic equipment such as communication or navigation, especially the electronic equipment such as military communication or navigation under harsh environmental conditions. The environmental adaptability of the equipment enables the equipment to have excellent assembly and maintainability, three defenses, heat dissipation, vibration resistance and shock resistance, and structural electromagnetic compatibility.

Another object of the present invention is to provide a method for assembling a reinforced sealed chassis based on the MTCA standard.

The object of the present invention is achieved through the following technical solutions:

A reinforced and sealed chassis based on the MTCA standard, comprising a chassis body, and a front panel assembly, a rear panel assembly, an upper cover, and a lower cover that cover the front, rear, upper, and lower sides of the chassis body respectively; A backplane is also arranged between the rear panel components, the side of the rear panel component close to the chassis body is fixed with the backplane by screws, and the side of the rear panel component away from the chassis body is provided with a fan component;

The outer surfaces of the top cover plate and the bottom cover plate of the chassis body are evenly provided with heat sinks, the top and bottom of the front panel assembly and the rear panel assembly are provided with air duct inlets and outlets, and the air intake flow has two branches: The airflow of the first branch passes through the inlet and outlet of the air duct at the top of the front panel assembly, the space where the heat sinks of the top cover of the chassis are located, and the inlet and outlet of the air duct at the top of the rear panel assembly. The airflow of the second branch passes through the front panel assembly in sequence. The inlet and outlet of the bottom air duct, the space where the heat sink of the bottom cover of the chassis body is located, and the inlet and outlet of the air duct at the bottom of the rear panel assembly; after the air flow of the first and second branches converges on the rear panel assembly, the fan on the rear panel assembly The components are exhausted and brought out;

The inside of the chassis is used to place more than one module, and the modules include AMC modules; the modules are provided with reinforced cold-conducting plates for transferring the heat generated by the AMC modules to the heat sink.

The radiating fins are arranged in the following manner: the plane where each radiating fin is located is perpendicular to the plane where the front panel assembly is located, and is perpendicular to the plane where the top cover plate of the chassis body is located, and the plane where the top cover plate of the chassis body is located is the same as the plane of the chassis body. The planes where the bottom cover plates are located are parallel to each other. At this time, the disposition direction of the heat sink is parallel to the air flow passing direction, which reduces the resistance encountered by the air flow when passing through the air duct, and improves the heat dissipation efficiency.

The outer periphery of the top cover plate and the bottom cover plate of the case body are provided with mounting bosses, and the height of the mounting bosses is greater than the height of the heat sink. The setting of the installation boss can facilitate the installation of the front panel assembly, the rear panel assembly, the upper cover plate and the lower cover plate, and at the same time can protect the heat sink.

The contact between the front panel assembly and the chassis body and the contact between the rear panel assembly and the chassis body are provided with sealing grooves, and the sealing grooves are equipped with bimodal conductive sealing strips.

The top cover plate, bottom cover plate, left side plate, right side plate and one or more vertical plates arranged inside the box body of the box body are welded to form an integrated box box with up, down, left, right and four sides sealed.

The top of the reinforced cold-conducting plate of the AMC module is provided with more than one locking strip; the inner side of the chassis body is correspondingly provided with more than one chassis guide groove; the locking strip is fixed with the AMC module, as a whole along the The chassis guide slot is inserted into the chassis and locked and fixed.

The locking bar is a wedge-shaped locking bar. Because the locking bar adopts a wedge-shaped locking device, it can generate a large mechanical stress, reduce the contact thermal resistance between the two contact surfaces, and improve the thermal conductivity.

A flexible heat-conducting pad is arranged between the reinforced cold-conducting plate of the AMC module and the heating device of the AMC module. In each module reinforced board, the reinforced cold-conducting plate in each module is closely attached to the heating device on the printed board, and a flexible heat-conducting pad is filled between the components and the reinforced cold-conducting plate to eliminate the air gap and reduce the The contact thermal resistance between the components and the heat-conducting plate makes the heat generated by the components quickly transfer to the heat-conducting plate.

Another object of the present invention is achieved through the following technical solutions:

A method for assembling a reinforced sealed chassis based on the MTCA standard, comprising the following steps:

First, the back panel and the rear panel components are fixed together by screws to form a relatively closed whole, and then the fan components are installed and fixed together by screws to form the rear panel part;

The outer surface of the top cover plate and the bottom cover plate are evenly provided with heat sinks and the rear panel are fixed together by screws; It can be inserted into the backplane. After the assembly is in place, it is tensioned and fixed in the chassis by wedge-shaped locking strips. Then, the front panel components and the chassis body are fixed by screws, and the whole machine is assembled.

The heat dissipation path of the reinforced sealed chassis based on the MTCA standard is as follows:

Heating device of AMC module → flexible thermal pad of AMC module → reinforced cold-conducting plate of AMC module → wedge-shaped locking strip of AMC module → chassis guide groove of chassis body → heat dissipation surface of chassis air duct → forced convection cooling of air around the chassis.

Compared with the prior art, the present invention has the following advantages and beneficial effects:

The reinforced and sealed chassis based on the MTCA standard of the present invention has better assembly and maintainability; meanwhile, it has better three-proof performance, heat dissipation performance, anti-vibration and shock-resistant performance, and structural electromagnetic compatibility.

Description of drawings

FIG. 1 is a schematic structural diagram of an existing traditional MTCA chassis.

FIG. 2 is a schematic diagram of the overall structure of a reinforced sealed chassis based on the MTCA standard according to the present invention.

FIG. 3 is a schematic diagram of the structure of the chassis.

Figure 4 is a schematic diagram of the air duct.

Figure 5 is the AMC module heat dissipation layout diagram.

Among them, the meanings of the reference signs are as follows:

1- Front panel components of traditional MTCA chassis, 2- Rear panel components of traditional MTCA chassis, 3- Chassis of traditional MTCA chassis, 4- Top cover of traditional MTCA chassis, 5- Back panel of traditional MTCA chassis, 6- Traditional AMC module of MTCA chassis;

7-front panel assembly, 8-rear panel assembly, 9-upper cover, 10-lower cover, 11-backplane, 12-fan assembly, 13-top cover, 14-bottom cover, 15-heat sink , 16-left side panel, 17-right side panel, 18-vertical panel, 19-AMC module, 20-reinforced cold guide plate, 21-wedge locking strip, 22-chassis guide slot, 23-flexible thermal pad, 24 -Heating device, 25-First printed board, 26-Second printed board, 27-Chassis, 28-Air inlet on front panel, 29-Chassis upper air duct, 30-Air outlet on rear panel, 31-Air inlet on front panel , 32- the lower air duct of the chassis, 33- the air outlet under the rear panel.

Detailed ways

The present invention will be described in further detail below with reference to the embodiments and the accompanying drawings, but the embodiments of the present invention are not limited thereto.

As shown in Figure 2-4, in order to improve the environmental adaptability of the current electronic equipment such as communication or navigation, especially the electronic equipment such as military communication or navigation under harsh environmental conditions, so that the equipment has excellent assembly and maintainability, three defenses Capacity, heat dissipation capacity, anti-vibration and shock resistance, and structural electromagnetic compatibility, a new type of reinforced and sealed chassis design based on MTCA standard design is proposed. The specific design implementation is as follows:

1. Overall design of the structure

The whole machine adopts a standard 19-inch rack-mounted 4U chassis, and the external interface (air plug connector) is set on the rear panel components. The whole machine structure adopts the modular design idea based on the MTCA standard, and adopts the form of reinforced boards to realize the sealing design of the chassis.

FIG. 2 is a schematic diagram of the overall structure and layout of the present invention. The whole machine is mainly composed of front panel components, upper cover, lower cover, chassis, 10 modules (including 6 AMC modules), backplane, rear panel components, fan components and other parts.

The chassis is made up of a total of 6 boards such as top cover, bottom cover, left side board, right side board, and two vertical boards, etc., which are welded together to form an integrated chassis with sealed upper, lower, left, right, and four sides, as shown in Figure 3. Chassis guide slots are designed on each tailor-welded board to guide and fix 10 modules (including 6 AMC modules). Heat sinks and air ducts are designed on the top cover and bottom cover to dissipate heat for the whole machine. On the front and rear surfaces of the integrated chassis, on the inner side of the air duct, a sealing groove is designed to assemble the double-peak conductive sealing strip, so that the chassis is conductively sealed when assembling with the front panel components and the rear panel components.

The whole machine is the front air and the back air, and adopts the ventilation design. After the chassis is assembled with the upper cover and the lower cover, an air duct sealed up, down, left and right is formed. Only the top and bottom of the front and rear of the chassis are left with air duct inlets and outlets. Ventilation holes are designed above and below the front panel parts for cooling air to enter the top and bottom of the chassis. Air ducts are designed at the upper and lower positions of the rear panel parts, which are used for cooling air to flow out of the chassis into the fan at the rear, and then the fan exhausts the air to take away the heat.

2. Assembly and maintainability

The chassis of the whole machine is formed by tailor welding, and many chassis parts are combined into one chassis, which greatly reduces the number of parts and shortens the assembly time;

The assembly process of the whole machine is as follows: the back panel and the rear panel components are fixed together by screws to form a relatively closed whole, and then the fan components are installed and fixed together by screws to form the rear panel part; the chassis and the rear panel part are formed by screws. fixed together. 10 modules (including 6 AMC modules) are installed into the chassis along the chassis guide rail slot through the auxiliary plug-in connector provided by the module, and plugged into the backplane. Inside the chassis; then fix the front panel components and the chassis with screws, and the whole machine is assembled.

Under normal circumstances, this type of chassis often needs to be repaired for various modules, and the backplane and rear panel components are not easily damaged. Each module and the chassis are fixed by wedge-shaped locking bars, each module has two locking bars, and each locking bar has only one fastening screw. Auxiliary plug-ins can be used to disassemble and install the module. The same process when loading the module can be done in reverse. According to actual experience, in front of a fully assembled machine, disassembly and assembly of a module inside the chassis can be completed within five minutes, which meets the disassembly and maintenance requirements of communication and navigation equipment, especially military equipment, and greatly reduces The maintenance time of the product improves the maintainability of the product.

3. Three defense capabilities

The whole machine can meet GJB150.9A-2009 "Military Equipment Laboratory Environmental Test Method Damp Heat Test", GJB150.10A-2009 "Military Equipment Laboratory Environmental Test Method Mold Test", GJB150.11A-2009 "Military Equipment Laboratory Environmental Test" Test requirements in Method Salt Spray Test.

In order to improve the three anti-moisture, anti-fungal and anti-salt spray capabilities of the whole machine, the following measures are mainly taken from the aspects of material protection, process protection and structural protection:

a) Material protection

The same electrochemical couple, aluminum alloy with good protection performance is used as the structural material, and the surface is subjected to conductive oxidation treatment, and the screws are all made of stainless steel, which not only ensures the shielding performance, but also meets the "three defenses" requirements;

b) Surface treatment

Apply matt three-proof paint on the outer surface of the chassis to enhance the "three-proof" performance of the entire electronic equipment;

c) Chassis sealing design

In the design, the chassis adopts a closed structure, and the air of the cooling system flows through the outer surface of the chassis and is physically isolated from the modules and backplanes inside the chassis. The chassis is welded and formed as a whole, and double-peaked conductive rubber strips with sealing function are added to the front and rear panels and the upper and lower bottom plates, which isolate the interior of the chassis from the external environment and improve the three-proof performance of the chassis.

4. Heat dissipation capacity

The main goal of thermal design is to control the temperature of the heating element. The main method is to quickly and effectively transfer the heat generated by each module to the external environment of the sealed chassis through a path with low thermal resistance.

The chassis of the whole machine mainly adopts the forced air cooling method.

The chassis can meet the test requirements in GJB150.3A-2009 "High-temperature Test of Military Equipment Laboratory Environmental Test Method".

a) Air duct design

The fan is placed in the middle of the rear panel of the whole machine, and the air inlets are designed at the top and bottom of the front panel. At the same time, the chassis is designed as a fully enclosed structure in which the air duct is isolated from the inner cavity. The cooling air flows into the upper and lower air ducts of the chassis through the upper and lower air inlets on the front panel, and then flows into the axial flow fan at the rear through the upper and lower air outlets on the rear panel to take away the heat of each module.

The schematic diagram of the air duct is shown in Figure 4.

b) Part material selection

The chassis module and various structural parts are made of aluminum alloy with good thermal conductivity to reduce the thermal resistance of thermal conduction;

c) heat dissipation path

d) In the reinforced board of each module, the reinforced cold-conducting plate in each module is closely attached to the heating device on the printed board, and a flexible thermal pad is filled between the components and the reinforced cold-conducting plate to eliminate the air gap, Reduce the contact thermal resistance between the components and the heat-conducting plate, so that the heat generated by the components is quickly transferred to the heat-conducting plate. The heat-conducting plate and the chassis guide groove are connected by a wedge-shaped locking strip. Since the wedge-shaped locking strip adopts a wedge-shaped locking device, it can generate a large mechanical stress, reduce the contact thermal resistance between the two contact surfaces, and improve the heat conduction. ability. In this way, the conduction and heat dissipation path of the printed board card components is: heating components → flexible thermal pads → wedge-shaped locking strips → chassis guide grooves → chassis air duct cooling surface → forced convection cooling of the air around the chassis. Figure 5 is a schematic diagram of the layout of the AMC module.

e) Heat sink design

The heat sink of the chassis is designed with fins, which increases the heat dissipation area on the surface of the chassis and improves the heat dissipation effect; at the same time, the fins are optimized to change the large area heat sink to a small area heat sink, forming a multi-"empty format" structure, reducing the size of the heat sink. The resistance of the air flow reduces the pressure drop of the wind pressure, improves the forced air cooling convection heat transfer coefficient, and enhances the heat dissipation efficiency of the chassis.

f) Description of heat dissipation performance

The maximum working ambient temperature of the chassis can reach 70 ℃. In theory, the maximum heat consumption of a single module of the chassis can reach 50W.

5. Anti-vibration and shock resistance

The whole machine can meet the test requirements in GJB150.16A-2009 "Vibration Test of Military Equipment Laboratory Environmental Test Method" and GJB150.18A-2009 "Military Equipment Laboratory Environmental Test Method Shock Test".

To improve the anti-vibration and shock resistance of the whole machine, it is mainly carried out from the two aspects of chassis design and module design, as follows:

a) The strength design of the chassis of the whole machine

The chassis of the whole machine is made of tailor-welded to form an integrated chassis, which has high strength and high natural frequency, thereby improving its anti-vibration and anti-shock capabilities;

b) Module strength design

Improve the anti-vibration capability of the module printed board, and design and strengthen the cold-conducting plate for each module, improve its own rigidity, and reduce the deformation of the board under vibration and impact conditions. All module boards are in-line, and are tensioned with the guide slot of the chassis through wedge-shaped locking strips, which greatly improves the first-order natural frequency of the board. And the versatility and interchangeability are also high; when the backplane is installed, in addition to the mounting holes around the printed board, a separate structural support is designed for the backplane, so that the middle part of the backplane is also supported, which enhances the anti-vibration of the backplane. and impact resistance.

6. Structural electromagnetic compatibility

The design of the whole machine chassis and each module is mainly considered from the aspects of material selection, processing technology, and electrical overlap. By eliminating the gaps on the contact surface between the chassis and the front and rear panels, the conductive discontinuities are eliminated, thereby reducing electromagnetic leakage:

a) Magnetic compatibility design of module single board

When designing each module board, perform partial shielding of the board. Design box-type shielding frame and shielding cover, and take shielding measures for local strong interference sources or sensitive circuits on the board;

b)Material and surface treatment

The aluminum alloy with high conductivity is selected as the structural material of the box body. In terms of processing, the outer surface of the box body, especially the joint surface with the front and rear panels, is milled and finished, and then the box body, front and rear panels, etc. are subjected to conductive oxidation surface treatment. , to ensure that it is assembled into a closed shell and reduce the resistance of the detachable joint surface.

c) Chassis assembly process

A bimodal conductive rubber strip is placed between the chassis box and the front and rear panels, the fan assembly and the rear panel assembly to achieve the electrical continuity of the entire box.

The above-mentioned embodiments are preferred embodiments of the present invention, but the embodiments of the present invention are not limited by the above-mentioned embodiments, and any other changes, modifications, substitutions, combinations, The simplification should be equivalent replacement manners, which are all included in the protection scope of the present invention.

Claims (10)

1. The utility model provides a consolidate sealed quick-witted case based on MTCA standard which characterized in that: the machine case comprises a machine case body, and also comprises a front panel assembly, a rear panel assembly, an upper cover plate and a lower cover plate which are respectively fixedly covered on the front, the rear, the upper and the lower of the machine case body; a back plate is arranged between the case body and the back plate assembly, one side of the back plate assembly close to the case body is fixed with the back plate through screws, and one side of the back plate assembly far away from the case body is provided with a fan assembly;

the surface of the top cover plate and the bottom cover plate of the case body is evenly provided with radiating fins, the top and the bottom of the front panel assembly and the rear panel assembly are both provided with an air duct inlet and an air duct outlet, and the air inlet flow has two branch circuits: the airflow of the first branch passes through an inlet and an outlet of a top air duct of the front panel assembly, the space where the radiating fins of the top cover plate of the case body are located and an inlet and an outlet of a top air duct of the rear panel assembly in sequence, and the airflow of the second branch passes through an inlet and an outlet of a bottom air duct of the front panel assembly, the space where the radiating fins of the bottom cover plate of the case body are located and an inlet and an outlet of; after the airflows of the first branch and the second branch are converged on the rear panel assembly, the airflows are brought out by a fan assembly on the rear panel assembly;

more than one module is arranged in the case, and the module comprises an AMC module; the module is provided with a reinforced cold conducting plate for transferring heat generated by the AMC module to a heat sink.

2. A MTCA standard based ruggedized, sealed enclosure of claim 1, wherein: the arrangement mode of the radiating fins is as follows: the plane of each radiating fin is perpendicular to the plane of the front panel assembly and the plane of the top cover plate of the case body, and the plane of the top cover plate of the case body is parallel to the plane of the bottom cover plate of the case body.

3. A MTCA standard based ruggedized, sealed enclosure of claim 1, wherein: the periphery of the top cover plate and the bottom cover plate of the case body are respectively provided with a mounting boss, and the height of the mounting bosses is larger than that of the radiating fins.

4. A MTCA standard based ruggedized, sealed enclosure of claim 1, wherein: and sealing grooves are formed in the contact positions of the front panel assembly and the case body and the contact positions of the rear panel assembly and the case body, and double-peak conductive sealing rubber strips are assembled in the sealing grooves.

5. A MTCA standard based ruggedized, sealed enclosure of claim 1, wherein: the top cover plate, the bottom cover plate, the left side plate and the right side plate of the case body and more than one vertical plate arranged in the case body form an integrated case with four sealed sides up and down through tailor welding.

6. A MTCA standard based ruggedized, sealed enclosure of claim 1, wherein: the top of the reinforced cold guide plate of the AMC module is provided with more than one locking strip; more than one case guide groove is correspondingly arranged on the inner side of the case body; the locking bar and the AMC module are fixed together and are installed into the case along the case guide groove as a whole to be locked and fixed.

7. The MTCA standard-based ruggedized, sealed chassis of claim 6, wherein: the locking strip is a wedge-shaped locking strip.

8. A MTCA standard based ruggedized, sealed enclosure of claim 1, wherein: and a flexible heat conducting pad is arranged between the reinforcing cold conducting plate of the AMC module and the heating device of the AMC module.

9. An MTCA standard-based method for assembling a reinforced sealed case is characterized by comprising the following steps of:

firstly, fixing a back plate and a rear panel assembly together through screws to form a relatively closed whole, then loading the whole into a fan assembly, and fixing the whole together through screws to form a rear panel part;

the outer surfaces of the top cover plate and the bottom cover plate are uniformly provided with a case body of radiating fins, and the case body and the rear panel part are fixed together through screws; the module is arranged in the case body along the case guide groove through an auxiliary pluggable device of the module, is oppositely inserted with the back plate, and is tensioned and fixed in the case through a wedge-shaped locking strip after being assembled in place; and then the front panel assembly and the case body are fixed through screws, and the whole machine is assembled.

10. A method of assembling a ruggedized, sealed enclosure based on an MTCA standard of claim 9, wherein: the reinforced sealed case based on the MTCA standard has the following heat dissipation paths:

heating device of AMC module → flexible heat conducting pad of AMC module → reinforced cold conducting plate of AMC module → wedge locking strip of AMC module → chassis guide groove of chassis body → chassis air duct heat dissipation surface → forced convection cooling of air around chassis.

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