CN207382663U - New Anti-interference heat radiating type circuit board - Google Patents
New Anti-interference heat radiating type circuit board Download PDFInfo
- Publication number
- CN207382663U CN207382663U CN201721357866.3U CN201721357866U CN207382663U CN 207382663 U CN207382663 U CN 207382663U CN 201721357866 U CN201721357866 U CN 201721357866U CN 207382663 U CN207382663 U CN 207382663U
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- CN
- China
- Prior art keywords
- circuit board
- substrate
- copper
- interference
- metal derby
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
A kind of New Anti-interference heat radiating type circuit board includes substrate and interlayered circuit board, and substrate is provided with heat dissipation layers of copper, and interlayered circuit board is provided with copper foil confining bed；Anti-interference metal derby is further included, anti-interference metal derby is inserted on substrate and interlayered circuit board, and tail end offsets with heat dissipation layers of copper, and front end offsets with copper foil confining bed.Anti-interference metal derby is pressed onto in heat dissipation layers of copper, the contact area that the structure can increase anti-interference metal derby between the layers of copper that radiates, simultaneously as anti-interference metal derby is pressed onto on substrate, the connection structure between anti-interference metal derby and substrate is stable, firm, relative position is unlikely to deform.It is stable connection between anti-interference metal derby and heat dissipation layers of copper, reliable, it solves the problems, such as to be embedded in bonding strength between copper billet and PCB circuit board copper-clad in the prior art smaller.Front end offsets with copper foil confining bed, and the contact area between anti-interference metal derby and copper foil confining bed is larger, can improve the heat-sinking capability of the utility model.
Description
Technical field
The utility model is related to circuit board apparatus technical fields, and more specifically, more particularly to a kind of New Anti-interference dissipates
Heat type circuit board.
Background technology
When in use, the electronic component set thereon can discharge heat to PCB circuit board, in order to solve the fever of circuit board
Problem can set copper-clad in PCB circuit board, and substantial amounts of copper sheet will be set so in PCB circuit board, and copper product is led
Hot property is more excellent, is conducive to radiate.
But even setting copper-clad in PCB circuit board, certain technological deficiency is still had：Such as using
When near high-frequency signal line, PCB circuit board can be subject to largely electromagnetic interference, influence circuit in PCB circuit board
The transmission of signal；2nd, the thickness of copper-clad is smaller, and heat-sinking capability is limited.
In order to improve the heat-sinking capability of PCB circuit board and improve the antijamming capability of PCB circuit board, adopt in the prior art
With the structure design of PCB circuit board insertion copper billet, the embedded copper billet in PCB circuit board is connected in fact by copper billet with copper-clad
Existing heat conduction increases the heat-sinking capability of PCB circuit board using copper billet.However, copper-clad is connected with copper billet, bonding strength compared with
It is small, the breakage problem for connecting portion occur is very easy to, so as to influence the conduction of the heat between copper-clad and copper billet.
Utility model content
(1) technical problem
In conclusion it is smaller how to solve to be embedded in bonding strength between copper billet and PCB circuit board copper-clad in the prior art
The problem of, become those skilled in the art's urgent problem to be solved.
(2) technical solution
The utility model provides a kind of New Anti-interference heat radiating type circuit board, includes substrate, is printed on the substrate
Brushed with the first circuit, interlayered circuit board is provided with below the substrate, it is electric in being printed with second on the interlayered circuit board
Road, the substrate are pressed with the interlayered circuit board.Based on said structure design, the utility model is in the upper side of the substrate
Heat dissipation layers of copper is provided with, the downside of the interlayered circuit board is provided with copper foil confining bed；
It is described in offering the second mounting hole on the interlayered circuit board in offering the first mounting hole on the substrate
The aperture of second mounting hole is less than the aperture of first mounting hole；
Anti-interference metal derby is further included, the anti-interference metal derby includes to be inserted into second mounting hole
Front end, for the middle part that is inserted into first mounting hole and compared with the tail end that the substrate protrudes, institute
It states front end, the middle part and the tail end and has been in turn connected to form step structure, the anti-interference metal derby is
Copper anti-interference metal derby, the anti-interference metal derby are an integral structure；
The anti-interference metal derby is inserted into first mounting hole and second mounting hole, the tail end with
The heat dissipation layers of copper offsets, and the front end offsets with the copper foil confining bed.
Preferably, the substrate is FR4 circuit boards, and the interlayered circuit board is PP wiring boards,
Preferably, the interlayered circuit board is provided with multiple, and whole interlayered circuit boards enumerates setting successively；From institute
The aperture for stating substrate towards second mounting hole opened up on the direction of the copper foil confining bed, the interlayered circuit board is gradual
It reduces.
Preferably, the front end is the step structure with whole the second mounting hole shape adaptations.
(3) advantageous effect
In said structure design, anti-interference metal derby is inserted into the first mounting hole and the second mounting hole, tail end
It offsets with heat dissipation layers of copper, front end offsets with copper foil confining bed, so can compress substrate and folder by anti-interference metal derby
Layer circuit board.Anti-interference metal derby is pressed onto in heat dissipation layers of copper, which can increase between anti-interference metal derby and heat dissipation layers of copper
Contact area, simultaneously as anti-interference metal derby is pressed onto on substrate, the connection structure between anti-interference metal derby and substrate is steady
Fixed, firm, relative position is unlikely to deform, in this way, stable connection, reliable, solution between anti-interference metal derby and heat dissipation layers of copper
Bonding strength smaller problem between copper billet and PCB circuit board copper-clad is embedded in the prior art.Front end is closed with copper foil
Layer offsets, and the contact area between anti-interference metal derby and copper foil confining bed is larger, can improve the heat radiation energy of the utility model
Power.
Description of the drawings
Fig. 1 is the structure diagram of New Anti-interference heat radiating type circuit board in the utility model embodiment；
In Fig. 1, the correspondence of component names and accompanying drawing number is：
Substrate 1, interlayered circuit board 2, heat dissipation layers of copper 3, copper foil confining bed 4, front end 5,
Middle part 6, tail end 7.
Specific embodiment
The embodiment of the utility model is described in further detail with reference to the accompanying drawings and examples.Following embodiment
For illustrating the utility model, but cannot be used for limiting the scope of the utility model.
In the description of the utility model, unless otherwise indicated, " multiple " are meant that two or more；Term
The orientation or position of the instructions such as " on ", " under ", "left", "right", " interior ", " outer ", " front end ", " rear end ", " head ", " afterbody " are closed
Be for based on orientation shown in the drawings or position relationship, be for only for ease of description the utility model and simplify description rather than
Indicate or imply that signified device or element there must be specific orientation, with specific azimuth configuration and operation, therefore cannot
It is interpreted as the limitation to the utility model.In addition, term " first ", " second ", " the 3rd " etc. are only used for description purpose, and cannot
It is interpreted as indicating or implying relative importance.
, it is necessary to illustrate in the description of the utility model, unless otherwise clearly defined and limited, term " phase
Even ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected or be integrally connected；It can
To be mechanical connection or be electrically connected；It can be directly connected, can also be indirectly connected by intermediary.For this
For the those of ordinary skill in field, concrete meaning of the above-mentioned term in the utility model can be understood with concrete condition.
It please refers to Fig.1, Fig. 1 is the structure diagram of New Anti-interference heat radiating type circuit board in the utility model embodiment.
The utility model provides a kind of New Anti-interference heat radiating type circuit board, which is based on existing PCB circuits
Harden structure designs, and one block of metal derby is provided with especially on the substrate 1 of circuit board, is reached by metal derby and absorbs heat, reduces
The purpose of electromagnetic interference.
In an embodiment of the utility model, New Anti-interference heat radiating type circuit board includes substrate 1, substrate 1
Using FR4 board designs, in being printed with the first circuit on substrate 1, and pass through the connection of the first circuit by multiple electronic components, in
The lower section of substrate 1 is provided with interlayered circuit board 2, can be by base by second circuit in being printed with second circuit on interlayered circuit board 2
Several electronic components set on plate 1 realize connection, and interlayered circuit board 2 is arranged on the lower section of substrate 1, substrate 1 and interlayer circuit
Plate 2 presses.
Since the utility model does not carry out structure improvement to the substrate 1 and interlayered circuit board 2 of PCB circuit board, because
This, the utility model does not carry out excessive repeat to the specific connection and circuit printing of substrate 1 and interlayered circuit board 2.
In order to improve the heat-sinking capability of substrate 1, the utility model is provided with heat dissipation layers of copper 3, Yu Jia in the upper side of substrate 1
The downside of layer circuit board 2 is provided with copper foil confining bed 4.The heat that the electronic component so set on substrate 1 generates at work
Amount can be quickly conducted to heat dissipation layers of copper 3 and copper foil confining bed 4, the laying area of the layers of copper 3 that radiates and copper foil confining bed 4
Larger, by radiating, layers of copper 3 and copper foil confining bed 4 can be quickly by heat diffusion into environment, so as to reach the mesh of heat dissipation
's.
The utility model is in offering the first mounting hole on substrate 1, in offering the second mounting hole on interlayered circuit board 2,
The aperture of second mounting hole is less than the aperture of the first mounting hole；Anti-interference metal derby is further included, anti-interference metal derby includes
For be inserted into the second mounting hole front end 5, for the middle part 6 that is inserted into the first mounting hole and compared with substrate
The tail end 7 of 1 protrusion, front end 5, middle part 6 and tail end 7 have been in turn connected to form step structure, anti-interference metal
Block is copper anti-interference metal derby, and anti-interference metal derby is an integral structure；Anti-interference metal derby be inserted into the first mounting hole with
And second in mounting hole, tail end 7 offsets with heat dissipation layers of copper 3, and front end 5 offsets with copper foil confining bed 4.
In said structure design, anti-interference metal derby is inserted into the first mounting hole and the second mounting hole, tail end 7
With heat dissipation layers of copper 3 offset, front end 5 offsets with copper foil confining bed 4, so can by anti-interference metal derby compression substrate 1 with
And interlayered circuit board 2.Anti-interference metal derby is pressed onto in heat dissipation layers of copper 3, which can increase anti-interference metal derby and radiating copper
Contact area between layer 3, simultaneously as anti-interference metal derby is pressed onto on substrate 1, between anti-interference metal derby and substrate 1
Connection structure is stable, firm, relative position is unlikely to deform, in this way, the connection between anti-interference metal derby and heat dissipation layers of copper 3 is steady
It is fixed, reliable, solve the problems, such as that embedded bonding strength between copper billet and PCB circuit board copper-clad is smaller in the prior art.Front end
Portion 5 offsets with copper foil confining bed 4, and the contact area between anti-interference metal derby and copper foil confining bed 4 is larger, can improve this reality
With new heat-sinking capability.
Specifically, substrate 1 is FR4 circuit boards, and interlayered circuit board 2 is PP wiring boards,
In the utility model, interlayered circuit board 2 is provided with multiple, whole interlayered circuit boards 2 and enumerates setting successively；From
Substrate 1 is towards the decreasing pore size of the second mounting hole opened up on the direction of copper foil confining bed 4, interlayered circuit board 2.Based on upper
Structure design is stated, front end 5 is the step structure with the second whole mounting hole shape adaptations.
In said structure design, anti-interference metal derby substrate 1 and each interlayered circuit board 2 can be carried out it is pressed, this
The anti-interference metal derby of sample can also play the role of reinforcing to substrate 1 and interlayered circuit board 2.
The embodiment of the utility model in order to example and description for the sake of and provide, and be not exhaustively or will
The utility model is limited to disclosed form.Many modifications and variations are aobvious and easy for the ordinary skill in the art
See.Selection and description embodiment are to more preferably illustrate the principle and practical application of the utility model, and make this field
Those of ordinary skill it will be appreciated that the utility model so as to designing the various embodiments with various modifications suitable for special-purpose.
Claims (4)
1. a kind of New Anti-interference heat radiating type circuit board includes substrate (1), in being printed with the first circuit on the substrate, in
Interlayered circuit board (2) is provided with below the substrate, in being printed with second circuit on the interlayered circuit board, the substrate with
The interlayered circuit board pressing, which is characterized in that
The upper side of the substrate is provided with heat dissipation layers of copper (3), the downside of the interlayered circuit board is provided with copper foil envelope
Close layer (4)；
In offering the first mounting hole on the substrate, in offering the second mounting hole on the interlayered circuit board, described second
The aperture of mounting hole is less than the aperture of first mounting hole；
Anti-interference metal derby is further included, the anti-interference metal derby includes before being inserted into second mounting hole
End (5), the middle part (6) for being inserted into first mounting hole and the tail end compared with substrate protrusion
(7), the front end, the middle part and the tail end have been in turn connected to form step structure, the anti-interference gold
Category block is copper anti-interference metal derby, and the anti-interference metal derby is an integral structure；
The anti-interference metal derby is inserted into first mounting hole and second mounting hole, the tail end with it is described
Heat dissipation layers of copper offsets, and the front end offsets with the copper foil confining bed.
2. New Anti-interference heat radiating type circuit board according to claim 1, which is characterized in that
The substrate is FR4 circuit boards, and the interlayered circuit board is PP wiring boards.
3. New Anti-interference heat radiating type circuit board according to claim 1 or 2, which is characterized in that
The interlayered circuit board is provided with multiple, whole interlayered circuit boards and enumerates setting successively；
From the substrate towards second mounting hole opened up on the direction of the copper foil confining bed, the interlayered circuit board
Decreasing pore size.
4. New Anti-interference heat radiating type circuit board according to claim 3, which is characterized in that
The front end is the step structure with whole the second mounting hole shape adaptations.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721357866.3U CN207382663U (en) | 2017-10-20 | 2017-10-20 | New Anti-interference heat radiating type circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721357866.3U CN207382663U (en) | 2017-10-20 | 2017-10-20 | New Anti-interference heat radiating type circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207382663U true CN207382663U (en) | 2018-05-18 |
Family
ID=62336320
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721357866.3U Expired - Fee Related CN207382663U (en) | 2017-10-20 | 2017-10-20 | New Anti-interference heat radiating type circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207382663U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111328216A (en) * | 2020-03-02 | 2020-06-23 | 黄石广合精密电路有限公司 | Manufacturing method of PCB (printed circuit board) containing conductive adhesive embedded copper blocks, PCB and electronic equipment |
-
2017
- 2017-10-20 CN CN201721357866.3U patent/CN207382663U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111328216A (en) * | 2020-03-02 | 2020-06-23 | 黄石广合精密电路有限公司 | Manufacturing method of PCB (printed circuit board) containing conductive adhesive embedded copper blocks, PCB and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190725 Address after: 518000 Shenzhen Baoan District Shiyan Street Shilong Community Senhaino Kechuang Building 1812 Patentee after: Shenzhen Rui Rui Technology Co., Ltd. Address before: 510000 Creative Center of TCL Cultural Industrial Park, 69 Spectrum West Road, Science City, Guangzhou High-tech Industrial Development Zone, Guangdong Province Patentee before: Guangzhou Jusan quicksand Technology Co. Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180518 Termination date: 20191020 |