CN201066957Y - A printed circuit board and meter mounting welding tray - Google Patents
A printed circuit board and meter mounting welding tray Download PDFInfo
- Publication number
- CN201066957Y CN201066957Y CNU2007201555652U CN200720155565U CN201066957Y CN 201066957 Y CN201066957 Y CN 201066957Y CN U2007201555652 U CNU2007201555652 U CN U2007201555652U CN 200720155565 U CN200720155565 U CN 200720155565U CN 201066957 Y CN201066957 Y CN 201066957Y
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- Prior art keywords
- surface mount
- circuit element
- mount pad
- circuit board
- projection
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Abstract
The utility model discloses a printed circuit board, which comprises at least one surface mount solder pad. At least one heave is arranged on the surface mount solder pad. The utility model also provides a surface mount circuit board which is provided with at least one heave. By using a heave design on the surface mount solder pad, the utility model can increase the flexibility of the design of the printed circuit board by using that air convection among the heaves is good for the heat dissipation of a high-power circuit component and the height of the heave can be adjusted according to needs.
Description
Technical field
The utility model relates to electronic technology field, especially refers to a kind of printed circuit board (PCB) and Surface Mount pad.
Background technology
At electronic technology field, in order to comply with the trend that electronic equipment develops to miniaturization and microminiaturized direction, the integrated level of circuit element in the electronic equipment is required improving constantly, the mechanical dimension of many circuit elements and volume also are required constantly to reduce; But when the overall mechanical dimension of circuit element reduces, because the increase or the other reasons of the new function of electronic equipment, the power of circuit element self is but in continuous increase, thereby increasing large power, electrically circuit component has appearred, comprise: inductance, electric capacity, resistance and triode etc., the reducing of circuit element volume must cause the density of heat flow rate of electronic equipment constantly to increase with the increase of power.In actual applications, the volume of electronic equipment constantly reduces on the one hand, and the density of heat flow rate of electronic equipment constantly increases on the other hand, thereby makes the heat radiation difficulty of electronic equipment strengthen, and becomes the bottleneck of electronic device design.Therefore, how to increase radiating mode, also just become the difficult problem in the electronic device design circuit element.
In the prior art radiating mode of circuit element is had multiplely, wherein utilize PCB (Printed CircuitBoard, printed circuit board (PCB)) heat radiation to be a kind of more common radiating mode.Metal pad is installed at the circuit element position that corresponding caloric value is big on the PCB veneer, goes out to utilize the heat diffusion on this metal pad circuit element that caloric value is big.And this metal pad is also comparatively common with the Surface Mount pad, at the mounted on surface Surface Mount pad of PCB veneer, circuit element is directly pasted by this Surface Mount pad be welded on the PCB veneer.
The printed circuit board arrangement of prior art as shown in Figure 1, circuit element 1 is provided with two pin twos, certainly in actual applications, be not limited only to two pins on the circuit element 1, also can be a plurality of pins, projection 5 in the PCB veneer 4 is that circuit element 1 is installed in plane space shared on the PCB veneer 4, the space size of this projection 5 is to reserve according to the size of circuit element 1 when design PCB veneer, the Surface Mount pad 3 of planar structure is arranged on the PCB veneer 4, Surface Mount pad 3 in the corresponding PCB veneer 4 of two pin twos of circuit element 1 is arranged on the PCB veneer 4, be connected thereby reach with PCB veneer 4 excellent electrical property, and can by Surface Mount pad 3 with the heat diffusion on the circuit element 1 in outside air.
By the printed circuit board arrangement of above-mentioned prior art shown in Figure 1 as can be known, the Surface Mount pad of printed circuit board (PCB) all is the Surface Mount pad of planar structure in the prior art, and this planar structure is unfavorable for the good heat radiating of large power, electrically circuit component.
The utility model content
The utility model provides a kind of printed circuit board (PCB) and Surface Mount pad, is unfavorable for the problem of large power, electrically circuit component good heat radiating with the planar structure Surface Mount pad that solves printed circuit board (PCB) in the prior art.
For reaching above-mentioned purpose, the utility model provides a kind of printed circuit board (PCB), comprises at least one Surface Mount pad, and described Surface Mount pad is provided with at least one projection.
When described projection is a plurality of, be provided with the space between described a plurality of projectioies.
The height of projection that is positioned on the different Surface Mount pads is similar and different.
Described projection and described Surface Mount pad are integrated.
Described projection is fixed on the described Surface Mount pad by the crimping mode.
The utility model also provides a kind of Surface Mount pad, and described Surface Mount pad is provided with at least one projection.
When described projection is a plurality of, be provided with the space between described a plurality of projectioies.
Described projection and described Surface Mount pad are integrated.
Described projection is fixed on the described Surface Mount pad by the crimping mode.
Compared with prior art, a kind of printed circuit board (PCB) of the utility model and Surface Mount pad utilize the cross-ventilation between the projection to reach the effect that the large power, electrically circuit component is better dispelled the heat by the convex design on planar structure Surface Mount pad.
Description of drawings
Fig. 1 is a printed circuit board arrangement schematic diagram in the prior art;
Fig. 2 is the printed circuit board arrangement schematic diagram of the utility model embodiment one;
Fig. 3 is the printed circuit board arrangement schematic diagram of the utility model embodiment two;
Fig. 4 is the printed circuit board arrangement schematic diagram of the utility model embodiment three.
Embodiment
Be elaborated below in conjunction with the drawings and specific embodiments.
As shown in Figure 2, Fig. 2 is the printed circuit board arrangement schematic diagram of the utility model embodiment one.Wherein, circuit element 1 is the big large power, electrically circuit component of caloric value, and comprising: high-power inductance, high power capacity, high-power resistance and triode etc. are also included within other big any circuit elements of caloric value in the practical application certainly.Have two pin twos on the circuit element 1.Circuit element 1 in embodiment illustrated in fig. 2 comprises two pin twos, and certainly, the circuit element 1 among the utility model embodiment not only is confined to have the circuit element of two pins, also comprises the circuit element with a plurality of pins.Projection 5 in the PCB veneer 4 is that circuit element 1 is installed in the required plane space that takies on the PCB veneer 4, and the space size of this projection 5 is to reserve according to the size of circuit element 1 when design PCB veneer 4.Relevant position in projection 5 is provided with Surface Mount pad 3, makes the pin two of circuit element 1 be welded on the Surface Mount pad 3 of planar structure, thereby when making circuit element 1 be fixed on the PCB veneer 4, the projection of circuit element 1 on PCB veneer 4 can overlap with projection 5.
Be provided with a plurality of rectangular preiections 6 on Surface Mount pad 3, so-called rectangular preiection is meant that this protruding cross section is a rectangular configuration, and these a plurality of rectangular preiections 6 can be arranged on by the mode of crimping on the Surface Mount pad 3, rectangular preiection 6 and the structure of Surface Mount pad 3 for being separated from each other; Also can this rectangular preiection 6 and Surface Mount pad 3 be designed to integral structure by compression molding techniques in addition, rectangular preiection 6 and the Surface Mount pad 3 with this integral structure together is arranged on the PCB veneer 4 then.
Bulge-structure in embodiment illustrated in fig. 2, not only circuit element 1 is played certain supporting role, also increased the area of dissipation of circuit element 1, because rectangular preiection 6 directly contacts with outside air, can the part heat that circuit element 1 produces be diffused in the outside air by the Metal Contact of rectangular preiection 6 with outside air.All be provided with certain space arbitrarily between the rectangular preiection 6, and also be provided with certain space between the edge of these a plurality of rectangular preiections 6 and Surface Mount pad 3, can certainly not establish the space, be decided according to the actual requirements, the air flows in this space can be diffused into the part heat that circuit element 1 produces in the outside air.
Therefore, the Surface Mount pad of bulge-structure embodiment illustrated in fig. 2 is the Surface Mount pad of midplane structure compared to existing technology, not only area of dissipation is greater than the Surface Mount pad of prior art midplane structure, and the space that is provided with between the projection can be diffused into the part heat that circuit element 1 produces in the outside air by cross-ventilated mode, can reach better heat radiating effect.
The cross section that the convex shape of the utility model embodiment not only is confined in embodiment illustrated in fig. 2 is the rectangle situation, comprises that also cross section is other shapes such as triangle, rhombus, circle, even can be designed to irregular shape according to actual needs; In addition, the arrangement mode between the utility model embodiment projection does not have strict qualification yet, can arrange according to actual needs, and the pore size between the projection also can adjust accordingly according to actual needs.
As shown in Figure 3, Fig. 3 is the printed circuit board arrangement schematic diagram of the utility model embodiment two.The printed circuit board arrangement of the utility model embodiment two, with embodiment illustrated in fig. 2 in structural similarity, different places are, projection in the present embodiment two is leg-of-mutton shaped design, and the arrangement mode of those a plurality of triangular hills 7 also shows slightly different with arrangement mode in embodiment illustrated in fig. 2.According to actual needs, triangular hill 7 can be arranged according to certain rule, and be provided with certain space between each triangular hill 7, the part heat that circuit element 1 produces can be diffused in the outside air by the air flows in this space.
Therefore; the arrangement mode of convex shape among the utility model embodiment and projection depends on fully and carries out the artificial design according to actual needs of PCB when encapsulation that any in actual applications feasible convex shape and arrangement mode all should belong to protection range of the present utility model.
In addition, the bulge-structure of the utility model embodiment designs except the effect with heat radiation, also has the purposes of regulating circuit element heights.Some occasion in actual applications, need carry out suitable adjustment to the height of circuit element, to satisfy actual needs, but, because the size of circuit element all has certain standard, also be that size is more fixing, and the Surface Mount pad of pcb board is a planar structure, thereby causes the Height Adjustment of circuit element is implemented the comparison difficulty.And the characteristics of the utility model embodiment bulge-structure height-adjustable can solve the problem of the circuit element Height Adjustment difficulty that exists in the above-mentioned practical application just.
As shown in Figure 4, Fig. 4 is the printed circuit board arrangement schematic diagram of the utility model embodiment three.Some occasion in actual applications, because it is more to be integrated on the PCB veneer 4 powerful circuit element, circuit element 1a as shown in Figure 4, circuit element 1b, for reaching those powerful circuit element 1a, circuit element 1b are carried out efficiently radiates heat, ensure the purpose of its operate as normal, need on circuit element 1a, circuit element 1b, set up radiator 8.Radiator 8 generally is installed in the top of circuit element 1a, circuit element 1b, for reaching good heat radiating, the top of radiator 8 with circuit element 1a, circuit element 1b need be contacted, but because the height dimension of circuit element 1a and circuit element 1b has different, therefore need suitably to adjust height, thereby make the height on circuit element 1a and circuit element 1b top can reach consistent.And the size of circuit element is more fixing in the prior art, and the Surface Mount pad on the PCB veneer 4 is planar structure, thereby makes the height of adjusting circuit element realize difficulty.
In the present embodiment, be fixed on height of projection on the Surface Mount pad 3, reach the purpose of adjusting the circuit element height by adjusting.For highly lower circuit element 1b, when carrying out the PCB encapsulation, higher protruding 9b can be set on plane Surface Mount pad 3; For highly higher circuit element 1a, when carrying out the PCB encapsulation, lower protruding 9a can be set on plane Surface Mount pad 3, thereby make the top height of circuit element 1a and circuit element 1b reach consistent.Radiator 8 is fixed on circuit element 1a and the circuit element 1b then, because by protruding 9a and protruding 9b, arrive the top Height Adjustment of circuit element 1a and circuit element 1b consistent, therefore after radiator 8 is fixed on circuit element 1a and the circuit element 1b, radiator 8 can keep excellent contact with circuit element 1a and circuit element 1b, thereby makes radiator 8 can bring into play thermolysis preferably.
Certainly, above-mentioned embodiment of the present utility model is not limited in the Application Of Radiator occasion is installed, and should be pointed out that any application scenario that needs to adjust the circuit element height all should belong to protection range of the present utility model.
In sum, printed circuit board (PCB) of the present utility model is by the bulge-structure design on existing planar structure Surface Mount pad, utilize the Metal Contact between projection and the outside air, and the cross-ventilation in the space between projection, reach the effect that circuit element is better dispelled the heat, in the PCB structure little at the circuit element volume, that power is big, integrated level is high, can ensure the good heat radiating and the operate as normal of circuit element; And the height of projection among the utility model embodiment can be adjusted according to actual needs, thereby has strengthened the flexibility of PCB design.In addition, it is pointed out that the shape of the utility model projection and the arrangement mode between projection can carry out respective design according to actual needs, any in actual applications feasible convex shape and arrangement mode all should belong to protection range of the present utility model.
The above only is a preferred implementation of the present utility model; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the utility model principle; can also make some improvements and modifications, these improvements and modifications also should be considered as protection range of the present utility model.
Claims (9)
1. a printed circuit board (PCB) comprises at least one Surface Mount pad, it is characterized in that, described Surface Mount pad is provided with at least one projection.
2. printed circuit board (PCB) according to claim 1 is characterized in that, when described projection is a plurality of, is provided with the space between described a plurality of projectioies.
3. printed circuit board (PCB) according to claim 1 is characterized in that the height of projection that is positioned on the different Surface Mount pads is similar and different.
4. printed circuit board (PCB) according to claim 1 is characterized in that described projection and described Surface Mount pad are integrated.
5. printed circuit board (PCB) according to claim 1 is characterized in that described projection is fixed on the described Surface Mount pad by the crimping mode.
6. a Surface Mount pad is characterized in that, described Surface Mount pad is provided with at least one projection.
7. as Surface Mount pad as described in the claim 6, it is characterized in that, when described projection is a plurality of, be provided with the space between described a plurality of projectioies.
8. as Surface Mount pad as described in the claim 6, it is characterized in that described projection and described Surface Mount pad are integrated.
9. as Surface Mount pad as described in the claim 6, it is characterized in that described projection is fixed on the described Surface Mount pad by the crimping mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201555652U CN201066957Y (en) | 2007-07-06 | 2007-07-06 | A printed circuit board and meter mounting welding tray |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201555652U CN201066957Y (en) | 2007-07-06 | 2007-07-06 | A printed circuit board and meter mounting welding tray |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201066957Y true CN201066957Y (en) | 2008-05-28 |
Family
ID=39484142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007201555652U Expired - Lifetime CN201066957Y (en) | 2007-07-06 | 2007-07-06 | A printed circuit board and meter mounting welding tray |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201066957Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011103736A1 (en) * | 2010-02-25 | 2011-09-01 | 中兴通讯股份有限公司 | Wireless communication module |
| CN103415170A (en) * | 2013-07-30 | 2013-11-27 | 昆山维金五金制品有限公司 | Flat-panel display connecting piece conductive to heat radiation |
| CN104023468A (en) * | 2014-06-16 | 2014-09-03 | 杭州华三通信技术有限公司 | Fixing structure of PCB and PCB |
| CN105451439A (en) * | 2015-12-09 | 2016-03-30 | 歌尔声学股份有限公司 | Flexible printed circuit board and fabrication method thereof |
-
2007
- 2007-07-06 CN CNU2007201555652U patent/CN201066957Y/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011103736A1 (en) * | 2010-02-25 | 2011-09-01 | 中兴通讯股份有限公司 | Wireless communication module |
| CN103415170A (en) * | 2013-07-30 | 2013-11-27 | 昆山维金五金制品有限公司 | Flat-panel display connecting piece conductive to heat radiation |
| CN104023468A (en) * | 2014-06-16 | 2014-09-03 | 杭州华三通信技术有限公司 | Fixing structure of PCB and PCB |
| CN105451439A (en) * | 2015-12-09 | 2016-03-30 | 歌尔声学股份有限公司 | Flexible printed circuit board and fabrication method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20080528 |
|
| CX01 | Expiry of patent term |