CN201515058U - Shrapnel contact slot - Google Patents
Shrapnel contact slot Download PDFInfo
- Publication number
- CN201515058U CN201515058U CN2009203112728U CN200920311272U CN201515058U CN 201515058 U CN201515058 U CN 201515058U CN 2009203112728 U CN2009203112728 U CN 2009203112728U CN 200920311272 U CN200920311272 U CN 200920311272U CN 201515058 U CN201515058 U CN 201515058U
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- CN
- China
- Prior art keywords
- shell fragment
- circuit board
- printed circuit
- pcb
- pads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model provides a shrapnel contact slot, which is mainly suitable to fix a element on a printed circuit board, wherein one lateral surface of the element is provided with a plurality of pads. The printed circuit board is provided with a plurality of pads corresponding to the pads of the element, wherein the shrapnel contact slot mainly comprises a shrapnel contact socket; the shrapenl contact socket is provided with a plurality of shrapnels; the shrapnels pass through the shrapnel contact socket to be respectively correspondingly in contact with the pads of the element and the pads on the printed circuit board for connecting the electrical properties between the element and the printed circuit board; the element is a BGA element or a CPU element; the shrapnels are metal shrapnels; and the shrapnel contact socket is made from a high-temperature resistance insulating polyimide film. The BGA element or the CPU element in the utility model can realize electrical connection with the printed circuit board without any welding, and is favorable for industry energy saving and development of the non-welding technology.
Description
Technical field
The utility model relates to a kind of slot, relates in particular to a kind of shell fragment contact slot that need not weld.
Background technology
Industry BGA element commonly used directly is welded on the printed circuit board (PCB) by the soldered ball of its bottom, be welded on the I/O end and printed circuit board (PCB) mutual connection of the soldered ball of printed circuit board (PCB) by these, with a kind of encapsulation technology that realizes interconnecting between packaging body and the printed circuit board (PCB) as circuit.Its shortcoming is as follows: be unfavorable for failure analysis, do failure analysis and tear the BGA element possibly open; Be unfavorable for changing the BGA element, changing the BGA element needs high temperature to tear and weld processing procedure open; And welding causes the BGA component wear easily, needs the cost height of scolder.
In addition, industry has the MPI Socket of up-to-date exploitation at present, the Connection Element of this MPI Socket and the PAD on the printed circuit board (PCB) utilize the rubber of containing metal particle as joint pin, not only cost is very high, the rubber conductance that contains metallic particles is relatively poor, can not satisfy the big BGA element of high frequency or caloric value, and this MPI Socket ageing resistace is relatively poor, reliability is low.
Summary of the invention
In view of the above problems, the utility model provides a kind of shell fragment contact slot.
In order to achieve the above object, the utility model has adopted following technical scheme: a kind of shell fragment contact slot, it is applicable to that mainly the element that the one side is provided with a plurality of pads is fixed on the printed circuit board (PCB), this printed circuit board (PCB) is provided with a plurality of pads corresponding with the pad of this element, wherein, this shell fragment contact slot mainly comprises the shell fragment contact base, this shell fragment contact base is provided with a plurality of shell fragments, described shell fragment pass this shell fragment contact base respectively with the pad and the corresponding contact of the pad on the printed circuit board (PCB) of element, thereby realize electrically connecting between element and the printed circuit board (PCB).
Preferable, the utility model provides a kind of shell fragment contact slot, and wherein, described element is BGA element or CPU element, and described shell fragment is a metal clips, and described shell fragment contact base adopts the polyimide film of resistant to elevated temperatures insulation to make.
Compared to prior art, the utility model provides a kind of shell fragment contact slot, and wherein, described BGA element or CPU element can be realized electric connection between itself and the printed circuit board (PCB) without any need for welding; Even need do failure analysis, do not need heat to tear open and weld yet; Terminal client or maintenace point can conveniently change BGA, do not need firing equipment or direct change owner plate; Help the development that industry is energy-conservation and exempt from welding procedure.
Description of drawings
Fig. 1 is a schematic diagram of the present utility model
Fig. 2 is that the utility model combines schematic diagram with printed circuit board (PCB)
Embodiment
Please refer to Figure 1 and Figure 2.The utility model provides a kind of shell fragment contact slot, it mainly is applicable to BGA element or CPU element is fixed on the printed circuit board (PCB) 20, and described BGA element or CPU element can be realized electric connection between itself and the printed circuit board (PCB) 20 without any need for welding.
Wherein, be example with BGA element 10 in the present embodiment, these BGA element 10 1 sides are provided with a plurality of pads 101, and again, described printed circuit board (PCB) 20 is provided with a plurality of pads 101 with the pad 101 corresponding settings of this BGA element 10.
Moreover, this shell fragment contact slot mainly comprises shell fragment contact base 301, in present embodiment, this shell fragment contact base 301 can adopt the polyimide film of resistant to elevated temperatures insulation to make, this shell fragment contact base 301 is provided with a plurality of shell fragments 302, described shell fragment 302 passes this shell fragment contact base 301, and these shell fragment 302 1 ends contact with the pad 101 of BGA element 10, pad 101 corresponding contacts on its another terminal and this printed circuit board (PCB) 20, thereby the electric connection between realization BGA element 10 and the printed circuit board (PCB) 20.
Please refer to Fig. 2 again, for the utility model combines schematic diagram with printed circuit board (PCB).At first shell fragment contact base 301 is locked on the printed circuit board (PCB) 20, pad 101 corresponding contacts on terminal and this printed circuit board (PCB) 20 of shell fragment 302 on this shell fragment contact base 301, BGA element 10 is fixed on this shell fragment contact base 301 then, and make another end of the shell fragment 302 on this shell fragment contact base 301 contact, again radiator 30 is fixed on this BGA element 10 at last with the pad 101 of BGA element 10.
Compared to prior art, shrapnel contact slot described in the utility model, wherein, described BGA element 10 can be realized electric connection between itself and the printed circuit board (PCB) 20 without any need for welding; Even need to do failure analysis, do not need heat to tear open and weld yet; Terminal client or maintenace point can conveniently change BGA element 10, do not need firing equipment or directly change printed circuit board (PCB); Be conducive to the development that industry is energy-conservation and exempt from welding procedure.
Claims (4)
1. shell fragment contact slot, it is applicable to that mainly the element that the one side is provided with a plurality of pads is fixed on the printed circuit board (PCB), this printed circuit board (PCB) is provided with a plurality of pads corresponding with the pad of this element, it is characterized in that, this shell fragment contact slot mainly comprises:
The shell fragment contact base, it is provided with a plurality of shell fragments in order to electrical performance between Connection Element and the printed circuit board (PCB), described shell fragment pass this shell fragment contact base respectively with the pad and the corresponding contact of the pad on the printed circuit board (PCB) of element.
2. shell fragment contact slot according to claim 1 is characterized in that, described element is BGA element or CPU element.
3. shell fragment contact slot according to claim 1 is characterized in that described shell fragment is a metal clips.
4. shell fragment contact slot according to claim 1 is characterized in that described shell fragment contact base adopts the polyimide film of resistant to elevated temperatures insulation to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009203112728U CN201515058U (en) | 2009-09-24 | 2009-09-24 | Shrapnel contact slot |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009203112728U CN201515058U (en) | 2009-09-24 | 2009-09-24 | Shrapnel contact slot |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201515058U true CN201515058U (en) | 2010-06-23 |
Family
ID=42486469
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009203112728U Expired - Fee Related CN201515058U (en) | 2009-09-24 | 2009-09-24 | Shrapnel contact slot |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201515058U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102338755A (en) * | 2010-07-15 | 2012-02-01 | 鸿富锦精密工业（深圳）有限公司 | Failure analysis method for contact point of electronic component |
| CN102760999A (en) * | 2011-04-26 | 2012-10-31 | 赛米控电子股份有限公司 | Circuit device |
| CN104319519A (en) * | 2014-08-29 | 2015-01-28 | 中航光电科技股份有限公司 | A resilient contact spring and an adaptor using the same |
-
2009
- 2009-09-24 CN CN2009203112728U patent/CN201515058U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102338755A (en) * | 2010-07-15 | 2012-02-01 | 鸿富锦精密工业（深圳）有限公司 | Failure analysis method for contact point of electronic component |
| CN102760999A (en) * | 2011-04-26 | 2012-10-31 | 赛米控电子股份有限公司 | Circuit device |
| CN102760999B (en) * | 2011-04-26 | 2016-05-18 | 赛米控电子股份有限公司 | Circuits System |
| CN104319519A (en) * | 2014-08-29 | 2015-01-28 | 中航光电科技股份有限公司 | A resilient contact spring and an adaptor using the same |
| WO2016029886A1 (en) * | 2014-08-29 | 2016-03-03 | 中航光电科技股份有限公司 | Elastic contact spring and adapter using the contact spring |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100623 Termination date: 20130924 |