CN219555235U - High-frequency high-pressure-resistance aluminum-based copper-clad plate - Google Patents
High-frequency high-pressure-resistance aluminum-based copper-clad plate Download PDFInfo
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- CN219555235U CN219555235U CN202320439368.2U CN202320439368U CN219555235U CN 219555235 U CN219555235 U CN 219555235U CN 202320439368 U CN202320439368 U CN 202320439368U CN 219555235 U CN219555235 U CN 219555235U
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- based copper
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Abstract
The utility model discloses a high-frequency high-pressure-resistance aluminum-based copper-clad plate which comprises an aluminum substrate, wherein the upper end of the aluminum substrate is connected with an insulating layer, the upper end of the insulating layer is connected with a conducting layer, cavities are formed in the bottom end of the insulating layer at equal intervals, a heat-conducting plate is arranged in each cavity, and fixing holes are formed in four corners of the upper ends of the aluminum substrate, the insulating layer and the conducting layer. The beneficial effects are that: according to the aluminum-based copper-clad plate, the cavity and the heat conducting plate are arranged, so that in the using process, the heat conducting performance of the insulating layer can be improved, the heat radiating capacity of the aluminum-based copper-clad plate is further guaranteed, voltage breakdown of the insulating layer can be prevented, the pressure resistance of the aluminum-based copper-clad plate is guaranteed, and the practicability of the aluminum-based copper-clad plate is improved.
Description
Technical Field
The utility model relates to the technical field of aluminum-based copper-clad plates, in particular to a high-frequency high-pressure-resistance aluminum-based copper-clad plate.
Background
The aluminum substrate is a metal-based copper-clad plate with good heat dissipation function, and a single panel is generally composed of a three-layer structure, namely a circuit layer (copper foil), an insulating layer and a metal base layer.
The existing aluminum-based copper-clad plate realizes the corresponding function by changing the material of the insulating layer in the use process, the material of the insulating layer is mostly made of resin, the heat conductivity coefficient of the resin is far smaller than that of the copper plate and the filter plate, and therefore the heat dissipation effect of the aluminum-based plate is poor, meanwhile, the risk of voltage breakdown exists in the use process of the resin insulating layer, the use performance of the aluminum-based plate is further affected, and the practicability of the aluminum-based plate is reduced.
Disclosure of Invention
First, the technical problem to be solved
Aiming at the current state of the art, the utility model provides the aluminum substrate which has good heat dissipation effect, can effectively prevent voltage breakdown resin and improve the pressure resistance of the aluminum substrate.
(II) technical scheme
The utility model is realized by the following technical scheme: the utility model provides a high-frequency high-pressure-resistance aluminum-based copper-clad plate, which comprises an aluminum substrate, wherein the upper end of the aluminum substrate is connected with an insulating layer, the upper end of the insulating layer is connected with a conducting layer, cavities are formed in the bottom end of the insulating layer at equal intervals, a heat-conducting plate is arranged in each cavity, and fixing holes are formed in four corners of the upper ends of the aluminum substrate, the insulating layer and the conducting layer.
Further, the insulating layer is adhered to the aluminum substrate, and the conductive layer is adhered to the insulating layer.
By adopting the technical scheme, the aluminum base plate, the insulating layer and the conductive layer form the aluminum base copper-clad plate.
Further, the insulating layer is formed by polyolefin resin glass sheets, and the conductive layer is made of copper foil.
By adopting the technical scheme, the insulating layer is formed by the polyolefin resin glass sheet, so that the high-frequency performance of the insulating layer can be ensured, and the copper foil can ensure the conductivity of the insulating layer.
Further, the insulating layer is formed in the cavity, and the heat conducting plate is bonded with the cavity.
Through adopting above-mentioned technical scheme, the cavity is for the heat conduction board provides installation space, the heat conduction board can improve on the one hand the heat conductivility of insulating layer, and then guarantees aluminium base copper-clad plate's heat dispersion, on the other hand can prevent voltage breakdown the insulating layer, guarantees aluminium base copper-clad plate's withstand voltage performance, improves its practicality.
Further, the material of the heat conducting plate is aluminum nitride.
By adopting the technical scheme, the heat conductivity of the aluminum nitride is larger than that of the material used for the insulating layer, so that the heat conductivity of the aluminum nitride can be improved.
Further, the fixing holes are formed in the aluminum substrate, the insulating layer and the conductive layer.
By adopting the technical scheme, the fixing holes are convenient for installing and fixing the fixing holes.
(III) beneficial effects
Compared with the prior art, the utility model has the following beneficial effects:
in order to solve the problems that the existing aluminum-based copper-clad plate realizes the corresponding function by changing the material of an insulating layer in the use process, the material of the insulating layer is mostly made of resin, the heat conductivity coefficient of the resin is far smaller than that of the copper plate and a filter plate, so that the heat dissipation effect of the aluminum-based plate is poor, and meanwhile, the resin insulating layer also has the risk of voltage breakdown in the use process, so that the use performance of the aluminum-based plate is influenced, and the practicability of the aluminum-based plate is reduced.
Drawings
FIG. 1 is a schematic structural view of a high-frequency high-pressure-resistance aluminum-based copper-clad plate according to the utility model;
fig. 2 is a front cross-sectional view of an insulating layer in a high-frequency high-voltage-resistant aluminum-based copper-clad plate according to the present utility model.
The reference numerals are explained as follows:
1. an aluminum substrate; 2. an insulating layer; 3. a conductive layer; 4. a fixing hole; 5. a cavity; 6. a heat conducting plate.
Detailed Description
The present utility model will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present utility model more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
As shown in fig. 1-2, the high-frequency high-pressure-resistance aluminum-based copper-clad plate in the embodiment comprises an aluminum substrate 1, wherein the aluminum substrate 1 can be used as a base material layer, the upper end of the aluminum substrate 1 is connected with an insulating layer 2, the insulating layer 2 is insulated, the upper end of the insulating layer 2 is connected with a conducting layer 3, the conducting layer 3 is used for conducting electricity, the bottom end of the insulating layer 2 is provided with cavities 5 at equal intervals, heat conducting plates 6 are installed in the cavities 5, in the use process, the heat conducting plates 6 in the cavities 5 can improve the heat conducting performance of the insulating layer 2 on one hand, further, the heat radiating capacity of the aluminum-based copper-clad plate can be guaranteed, on the other hand, the voltage breakdown of the insulating layer 2 can be prevented, the pressure-resistant performance of the aluminum-based copper-clad plate is guaranteed, fixing holes 4 are formed in four corners of the upper ends of the aluminum substrate 1, the insulating layer 2 and the conducting layer 3, and the fixing holes 4 are convenient for installing and fixing the aluminum-based copper-clad plate.
As shown in fig. 1-2, in this embodiment, the insulating layer 2 is adhered to the aluminum substrate 1, the conductive layer 3 is adhered to the insulating layer 2, the aluminum substrate 1, the insulating layer 2 and the conductive layer 3 form an aluminum-based copper-clad plate, the insulating layer 2 is made of a polyolefin resin glass sheet, the conductive layer 3 is made of a copper foil, the insulating layer 2 is made of a polyolefin resin glass sheet, the high-frequency performance of the copper foil can be ensured, and the copper foil can ensure the conductivity of the copper foil.
As shown in fig. 1-2, in this embodiment, the insulating layer 2 is formed in the cavity 5, the heat conducting plate 6 is adhered to the cavity 5, the cavity 5 provides an installation space for the heat conducting plate 6, on one hand, the heat conducting performance of the insulating layer 2 can be improved by the heat conducting plate 6, and further, the heat dissipation capability of the aluminum-based copper-clad plate is guaranteed, on the other hand, the voltage breakdown of the insulating layer 2 can be prevented, the pressure resistance of the aluminum-based copper-clad plate is guaranteed, the practicability of the aluminum-based copper-clad plate is improved, the heat conducting plate 6 is made of aluminum nitride, and since the heat conductivity coefficient of the aluminum nitride is greater than that of the material used for the insulating layer 2, the heat conductivity of the aluminum-based copper-clad plate can be improved, the fixing holes 4 are formed in the aluminum-based plate 1, the insulating layer 2 and the conductive layer 3, and the fixing holes 4 are convenient for installing and fixing the aluminum-based copper-clad plate.
The specific implementation process of this embodiment is as follows: when the aluminum-based copper-clad plate is used, the aluminum-based copper-clad plate is installed and fixed through the fixing holes 4, then an electronic component is installed on the conductive layer 3, in the use process, the high-frequency performance of the insulating layer 2 can be guaranteed due to the fact that the insulating layer 2 is formed by polyolefin resin glass sheets, meanwhile, the material of the heat conducting plate 6 in the cavity 5 is aluminum nitride, on one hand, the heat conducting performance of the insulating layer 2 can be improved, and then the heat radiating capacity of the aluminum-based copper-clad plate is guaranteed, on the other hand, voltage breakdown of the insulating layer 2 can be prevented, the voltage withstand performance of the aluminum-based copper-clad plate is guaranteed, and the practicability of the aluminum-based copper-clad plate is improved.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present utility model. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present utility model is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (6)
1. The utility model provides a high frequency high pressure resistance aluminium base copper-clad plate which characterized in that: including aluminium base board (1), aluminium base board (1) upper end is connected with insulating layer (2), insulating layer (2) upper end is connected with conducting layer (3), bottom equidistant in insulating layer (2) is equipped with cavity (5), install heat-conducting plate (6) in cavity (5), aluminium base board (1) insulating layer (2) and fixed orifices (4) have all been seted up in conducting layer (3) upper end four corners department.
2. The high-frequency high-pressure-resistance aluminum-based copper-clad plate according to claim 1, wherein: the insulating layer (2) is adhered to the aluminum substrate (1), and the conductive layer (3) is adhered to the insulating layer (2).
3. The high-frequency high-pressure-resistance aluminum-based copper-clad plate according to claim 1, wherein: the insulating layer (2) is formed by polyolefin resin glass sheets, and the material of the conductive layer (3) is copper foil.
4. The high-frequency high-pressure-resistance aluminum-based copper-clad plate according to claim 1, wherein: the cavity (5) is formed with the insulating layer (2), and the heat conducting plate (6) is bonded with the cavity (5).
5. The high-frequency high-pressure-resistance aluminum-based copper-clad plate according to claim 4, wherein: the material of the heat conducting plate (6) is aluminum nitride.
6. The high-frequency high-pressure-resistance aluminum-based copper-clad plate according to claim 5, wherein: the fixing holes (4) are formed in the aluminum substrate (1), the insulating layer (2) and the conducting layer (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320439368.2U CN219555235U (en) | 2023-03-09 | 2023-03-09 | High-frequency high-pressure-resistance aluminum-based copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320439368.2U CN219555235U (en) | 2023-03-09 | 2023-03-09 | High-frequency high-pressure-resistance aluminum-based copper-clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219555235U true CN219555235U (en) | 2023-08-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320439368.2U Active CN219555235U (en) | 2023-03-09 | 2023-03-09 | High-frequency high-pressure-resistance aluminum-based copper-clad plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219555235U (en) |
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2023
- 2023-03-09 CN CN202320439368.2U patent/CN219555235U/en active Active
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