CN218830767U

CN218830767U - PCB heat radiation structure

Info

Publication number: CN218830767U
Application number: CN202222925046.7U
Authority: CN
Inventors: 孙冬生; 柏化春; 蔡希鹏
Original assignee: Suzhou Hollyson Vision Co ltd
Current assignee: Suzhou Hollyson Vision Co ltd
Priority date: 2022-11-03
Filing date: 2022-11-03
Publication date: 2023-04-07
Anticipated expiration: 2032-11-03

Abstract

The utility model relates to a PCB board field, the utility model discloses a PCB board heat radiation structure, which comprises a circuit board, the shield cover body is installed to the upper end of circuit board, and the fin main part is installed to the lower extreme, the both sides of the cover body are fixed with the side, and the front end is fixed with the positive limit, the front end of the cover body is fixed with first connecting plate, and the rear end is fixed with the second connecting plate, the front end of heating panel is fixed with first backup pad, and the rear end is fixed with the second backup pad, the front end of heating panel is fixed with the fixed plate, the position of first backup pad is corresponding with first connecting plate, the second backup pad is corresponding with the position of second connecting plate, the utility model discloses simple structure, convenient operation sets up two-sided heat dissipation to the radiating effect has been improved, and increases heat conduction silicone grease, can reduce the stress that the circuit board received when the lock attaches, and then reduces the original paper damage on the circuit board.

Description

PCB heat radiation structure

Technical Field

The utility model relates to a PCB board technical field specifically is a PCB board heat radiation structure.

Background

The PCB is a printed circuit board, and an insulating plate is used as a base material to realize the electrical connection of electronic components. As is well known, electronic components can generate heat in the using process, and the service life of the components can be greatly shortened if the heat dissipation performance of a PCB is poor.

A conventional LED drive board heat dissipation scheme is characterized in that a shielding cover, an LED drive board, a heat conduction insulating paste and a die-casting aluminum heat radiator are locked and attached by screws. Because the heat conducting insulation is pasted with the thickness, the PCB can generate stress when being locked, and the components on the board are easy to lose efficacy under the stress. And the AD12 die-casting aluminum radiator has large volume and low production efficiency.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a PCB board heat radiation structure to solve the problem of above-mentioned concrete problem.

In order to achieve the above object, the utility model provides a following technical scheme: a PCB heat radiation structure comprises a circuit board, wherein a shielding case body is arranged at the upper end of the circuit board, and a heat radiation fin main body is arranged at the lower end of the circuit board;

the shielding case body comprises side edges, a front edge, a first connecting plate, a second connecting plate and a cover body, the side edges are fixed to two sides of the cover body, the front edge is fixed to the front end of the cover body, the first connecting plate is fixed to the front end of the cover body, and the second connecting plate is fixed to the rear end of the cover body.

Wherein, the side is L-shaped.

Wherein the first connecting plate is provided with two symmetrical branches at two sides of the front edge.

The radiating fin main body comprises a radiating plate, a first supporting plate, a second supporting plate and a fixing plate, the first supporting plate is fixed to the front end of the radiating plate, the second supporting plate is fixed to the rear end of the radiating plate, and the fixing plate is fixed to the front end of the radiating plate.

The first support plate corresponds to the first connecting plate in position, and the second support plate corresponds to the second connecting plate in position.

Wherein, there is 0.3 mm's step between first backup pad and the second backup pad and the heating panel.

Compared with the prior art, the beneficial effects of the utility model are that:

the utility model discloses at first place the circuit board on the heating panel, then first backup pad and second backup pad can keep apart circuit board and heating panel, can realize that metal casing and PCB board heat dissipation area do not throw out of gear, and the junction wireless circuit of step and circuit board, play insulating effect, then pour into heat conduction silicone grease into between heating panel and the circuit board, insert the cover body again on the heating panel from one side of fixed plate, then when fixed plate and positive edge contact, heating panel and cover body coupling target in place, then with first backup pad and first connecting plate fixed connection through the bolt, second backup pad and second connecting plate fixed connection, then pour into heat conduction silicone grease into between circuit board and the cover body again, and the device simple structure, and convenient for operation, set up two-sided heat dissipation, thereby the radiating effect has been improved, and heat conduction silicone grease has been increased, can reduce the stress that the circuit board received when the lock attaches, and then reduce the original paper damage on the circuit board.

Drawings

FIG. 1 is a schematic view of the main structure of the present invention;

fig. 2 is a schematic structural view of the bottom view of the present invention;

fig. 3 is a schematic structural diagram of a top view of the present invention;

fig. 4 is a schematic structural diagram of a left side view of the present invention;

fig. 5 is a schematic structural diagram of an explosion diagram of the present invention.

In the figure: 1. a circuit board; 2. a shield case body; 21. a side edge; 22. righting; 23. a first connecting plate; 24. a second connecting plate; 25. a cover body; 3. a heat sink main body; 31. a heat dissipation plate; 32. a first support plate; 33. a second support plate; 34. and (5) fixing the plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-5, the present invention provides a technical solution: a PCB heat radiation structure comprises a circuit board 1, wherein a shielding case body 2 is arranged at the upper end of the circuit board 1, and a heat radiation fin main body 3 is arranged at the lower end of the circuit board 1;

the shielding case body 2 comprises a side 21, a front edge 22, a first connecting plate 23, a second connecting plate 24 and a cover body 25, the side 21 is fixed on two sides of the cover body 25, the front edge 22 is fixed on the front end, the first connecting plate 23 is fixed on the front end of the cover body 25, the second connecting plate 24 is fixed on the rear end, the circuit board 1 is placed on the radiating fin main body 3, then heat-conducting silicone grease is injected into a gap between the circuit board 1 and the radiating fin main body 3, then the shielding case body 2 is placed on the circuit board 1, and is fixedly connected with the radiating fin main body 3, the circuit board 1 is fixed between the shielding case body 2 and the radiating fin main body 3, and heat-conducting silicone grease is injected between the shielding case body 2 and the circuit board 1, so that double-sided heat dissipation is formed, the heat dissipation effect is improved, and the heat-conducting silicone grease is increased, stress on the circuit board 1 during locking attachment can be reduced, and damage of original components on the circuit board 1 is reduced.

Wherein, side 21 is the L type, is convenient for carry out the joint with fin main part 3 and circuit board 1 and fixes.

The first connecting plate 23 is provided with two symmetrical branches at two sides of the front edge 22, which can improve the stability of connection with the heat sink main body 3.

The heat sink body 3 comprises a heat dissipation plate 31, a first support plate 32, a second support plate 33 and a fixing plate 34, the first support plate 32 is fixed at the front end of the heat dissipation plate 31, the second support plate 33 is fixed at the rear end of the heat dissipation plate 31, the fixing plate 34 is fixed at the front end of the heat dissipation plate 31, heat-conducting silicone grease coated on the heat dissipation plate 31 and the circuit board 1 region can conduct heat quickly and effectively to the heat dissipation plate 31 for heat dissipation, so that the PCB works more reliably, firstly, the circuit board 1 is placed on the heat dissipation plate 31, then, the circuit board 1 and the heat dissipation plate 31 can be isolated by the first support plate 32 and the second support plate 33, the heat-conducting silicone grease is injected between the heat dissipation plate 31 and the circuit board 1, then, the cover body 25 is inserted into the heat dissipation plate 31 from one side of the fixing plate 34, then, when the fixing plate 34 is in contact with the front edge 22, the heat dissipation plate 31 and the cover body 25 are connected in place, then, the first support plate 32 is fixedly connected with the first connection plate 23 by bolts, the second support plate 33 is fixedly connected with the second connection plate 24, and then, the heat-conducting silicone grease is injected between the circuit board 1 and the cover body 25.

The first support plate 32 corresponds to the first connection plate 23, and the second support plate 33 corresponds to the second connection plate 24, so that the heat dissipation plate 31 and the cover 25 can be fixedly connected.

Wherein, there is 0.3 mm's step between first backup pad 32 and second backup pad 33 and the heating panel 31, can realize that metal casing and PCB board heat dissipation area do not connect, and the circuit is not had in the junction of step and circuit board 1, plays insulating effect.

The working principle is as follows: when the heat dissipation structure is used, firstly, the circuit board 1 is placed on the heat dissipation plate 31, then the circuit board 1 can be isolated from the heat dissipation plate 31 by the first support plate 32 and the second support plate 33, disconnection between the metal shell and the heat dissipation area of the PCB can be realized, and no circuit exists at the connection part of the step and the circuit board 1, so that an insulation effect is achieved, then, heat conduction silicone grease is injected between the heat dissipation plate 31 and the circuit board 1, then, the cover body 25 is inserted into the heat dissipation plate 31 from one side of the fixing plate 34, then, when the fixing plate 34 is in contact with the front edge 22, the heat dissipation plate 31 and the cover body 25 are connected in place, then, the first support plate 32 is fixedly connected with the first connecting plate 23 through bolts, the second support plate 33 is fixedly connected with the second connecting plate 24, then, heat conduction silicone grease is injected between the circuit board 1 and the cover body 25, so that double-sided heat dissipation is formed, and the heat dissipation effect is improved, and the heat conduction silicone grease is added, so that stress on the circuit board 1 when being locked can be reduced, and further, damage of elements on the circuit board 1 is reduced.

Claims

1. The utility model provides a PCB board heat radiation structure, includes circuit board (1), its characterized in that: the upper end of the circuit board (1) is provided with a shielding case body (2), and the lower end is provided with a radiating fin main body (3);

the shielding case body (2) comprises a side edge (21), a positive edge (22), a first connecting plate (23), a second connecting plate (24) and a cover body (25), the side edge (21) is fixed to two sides of the cover body (25), the positive edge (22) is fixed to the front end of the cover body (25), the first connecting plate (23) is fixed to the front end of the cover body (25), and the second connecting plate (24) is fixed to the rear end of the cover body.

2. The PCB board heat dissipation structure of claim 1, wherein: the side edge (21) is L-shaped.

3. The PCB board heat dissipation structure of claim 1, wherein: the first connecting plate (23) is provided with two symmetrical branches on both sides of the front edge (22).

4. The PCB board heat dissipation structure of claim 1, wherein: the radiating fin main part (3) includes heating panel (31), first backup pad (32), second backup pad (33) and fixed plate (34), the front end of heating panel (31) is fixed with first backup pad (32), and the rear end is fixed with second backup pad (33), the front end of heating panel (31) is fixed with fixed plate (34).

5. The PCB heat dissipation structure of claim 4, wherein: the first support plate (32) corresponds to the first connecting plate (23), and the second support plate (33) corresponds to the second connecting plate (24).

6. The PCB heat dissipation structure of claim 4, wherein: a step of 0.3mm is arranged between the first support plate (32), the second support plate (33) and the heat dissipation plate (31).