CN212588577U

CN212588577U - 5G communication multilayer circuit board structure

Info

Publication number: CN212588577U
Application number: CN202021821811.5U
Authority: CN
Inventors: 伍晓刚
Original assignee: Shenzhen Junwei Shichuang Electronics Co Ltd
Current assignee: Shenzhen Junwei Shichuang Electronics Co Ltd
Priority date: 2020-08-27
Filing date: 2020-08-27
Publication date: 2021-02-23
Anticipated expiration: 2030-08-27

Abstract

The utility model discloses a 5G communication multilayer circuit board structure, including the core, the top and the bottom of core all are provided with the intensity layer, and one side that the intensity layer was kept away from relatively all is provided with the heat-conducting layer, and the core is provided with the polypropylene between intensity layer and the heat-conducting layer, and the intensity layer includes bakelite paper and glass cloth, and the top and the bottom of core all are provided with bakelite paper, and one side that bakelite paper kept away from relatively all is provided with glass cloth, and the heat-conducting layer includes heat dissipation graphite membrane and polyphenylene sulfide, and one side that the intensity layer was kept away from relatively all is provided with the heat dissipation graphite membrane. The utility model discloses a set up the intensity that the intensity layer is used for increasing the core to prevent that the core from being pressed absolutely, be used for the heat discharge that produces the core through setting up the heat-conducting layer, thereby realize cooling to the core, solved current circuit board simultaneously when using because external uncertain factor leads to the circuit board to be crushed, thereby lead to the cracked problem of circuit board.

Description

5G communication multilayer circuit board structure

Technical Field

The utility model relates to a 5G communication technical field specifically is a 5G communication multilayer circuit board structure.

Background

The fifth generation mobile communication technology is the latest generation cellular mobile communication technology and is an extension following 4G, 3G and 2G systems, the performance goal of 5G is high data rate, delay reduction, energy saving, cost reduction, system capacity increase and large-scale equipment connection, the first phase of the 5G specification in Release-15 is to adapt to early commercial deployment, the second phase of Release-16 will be completed in 2020 and 4 months, and is submitted to International Telecommunication Union (ITU) as a candidate for IMT-2020 technology, the ITUIMT-2020 specification requires up to 20Gbit/s, and can realize wide channel bandwidth and large capacity MIMO.

The circuit board is crushed due to external uncertain factors when the existing circuit board is used, so that the circuit board is broken, and the use requirement cannot be met.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a 5G communication multilayer circuit board structure possesses the advantage that intensity is high, has solved current circuit board and has leaded to the circuit board to be crushed because external uncertain factor when using to lead to the cracked problem of circuit board.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a 5G communication multilayer circuit board structure, includes the core, the top and the bottom of core all are provided with the intensity layer, the one side that the intensity layer was kept away from relatively all is provided with the heat-conducting layer.

Preferably, polypropylene is arranged between the core plate, the strength layer and the heat conduction layer.

Preferably, the strength layer comprises phenolic aldehyde bakelite paper and glass cloth, the top and the bottom of the core plate are both provided with the phenolic aldehyde bakelite paper, and the glass cloth is arranged on one side, far away from the phenolic aldehyde bakelite paper relatively.

Preferably, the heat conducting layer comprises a heat dissipation graphite film and polyphenylene sulfide, the heat dissipation graphite film is arranged on one side, away from the strength layer, of the strength layer, and the polyphenylene sulfide is arranged on one side, away from the heat dissipation graphite film, of the heat dissipation graphite film.

Preferably, the core board, the strength layer, the heat conduction layer and the polypropylene are bonded through epoxy resin.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. the utility model discloses a set up the intensity that the intensity layer is used for increasing the core to prevent that the core from being pressed absolutely, be used for the heat discharge that produces the core through setting up the heat-conducting layer, thereby realize cooling to the core, solved current circuit board simultaneously when using because external uncertain factor leads to the circuit board to be crushed, thereby lead to the cracked problem of circuit board.

2. The utility model discloses polypropylene has chemical resistance, heat resistance, electrical insulation, high strength mechanical properties and good high wear resistance processing property etc, through setting up polypropylene and being used for separating the core, intensity layer and heat-conducting layer, thereby prevent that its circuit from producing electrostatic magnetic field, bakelite paper has good mechanical strength, insulating properties and certain waterproof performance, glass cloth has the properties such as insulating, thermal insulation, corrosion-resistant, do not burn, high temperature resistance, high strength, through the cooperation increase core mechanical strength between bakelite paper and the glass cloth, thereby prevent that the core from being broken, the heat dissipation graphite film has very high heat conductivity, the polyphenylene sulfide has advantages such as mechanical strength is high, high temperature resistant, chemical resistance, difficult combustion, thermal stability is good, electrical property is excellent, in electronics, automobile, machinery and chemical industry all have wide application, the core that cooperation through between heat dissipation graphite film and the polyphenylene sulfide increases, thereby increase the life of core, be used for increasing the stable in structure between core, intensity layer, heat-conducting layer and the polypropylene through setting up epoxy to holistic mechanical strength has been increased.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic cross-sectional structure view of the strength layer of the present invention;

fig. 3 is a schematic view of the cross-sectional structure of the heat-conducting layer of the present invention.

In the figure: 1. a core board; 2. a strength layer; 201. phenolic bakelite paper; 202. glass cloth; 3. a heat conductive layer; 301. a heat-dissipating graphite film; 302. polyphenylene sulfide.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description herein, it is to be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings to facilitate the description of the patent and to simplify the description, but do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be considered limiting of the patent. In the description of the present application, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly and can, for example, be fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in this patent may be understood by those of ordinary skill in the art as appropriate.

Referring to fig. 1-3, a 5G communication multilayer circuit board structure includes a core board 1, a strength layer 2 is disposed on both the top and the bottom of the core board 1, a heat conduction layer 3 is disposed on the side of the strength layer 2 away from the strength layer 2, the strength of the core board 1 is increased by disposing the strength layer 2, so as to prevent the core board 1 from being broken, the heat conduction layer 3 is disposed to discharge heat generated by the core board 1, so as to cool the core board 1, polypropylene is disposed between the core board 1, the strength layer 2 and the heat conduction layer 3, the polypropylene has chemical resistance, heat resistance, electrical insulation, high-strength mechanical properties and good high wear-resistant processability, etc., the polypropylene is disposed to separate the core board 1, the strength layer 2 and the heat conduction layer 3, so as to prevent the circuit thereof from generating an electrostatic magnetic field, the strength layer 2 includes bakelite paper 201 and glass cloth 202, the top and the bottom of the core board 1 are both, the side of the bakelite paper 201 which is relatively far away is provided with glass cloth 202, the bakelite paper 201 has good mechanical strength, insulating property and certain waterproof property, the glass cloth 202 has the properties of insulation, heat insulation, corrosion resistance, incombustibility, high temperature resistance, high strength and the like, the mechanical strength of the core board 1 is increased through the matching between the bakelite paper 201 and the glass cloth 202, so that the core board 1 is prevented from being broken, the heat conducting layer 3 comprises a heat-radiating graphite film 301 and polyphenylene sulfide 302, the side of the strength layer 2 which is relatively far away is provided with the heat-radiating graphite film 301, the side of the heat-radiating graphite film 301 which is relatively far away is provided with the polyphenylene sulfide 302, the heat-radiating graphite film 301 has very high heat conductivity, the polyphenylene sulfide 302 has the advantages of high mechanical strength, high temperature resistance, chemical resistance, flame retardancy, good thermal stability, excellent electrical property and the like, and is widely applied in the fields, increase the thermal diffusivity of core 1 through the cooperation between heat dissipation graphite membrane 301 and the polyphenylene sulfide 302 to increase core 1's life, bond through epoxy between core 1, strength layer 2, heat-conducting layer 3 and the polypropylene, be used for increasing the stable in structure between core 1, strength layer 2, heat-conducting layer 3 and the polypropylene through setting up epoxy, thereby increased holistic mechanical strength.

When in use, the polypropylene has chemical resistance, heat resistance, electrical insulation, high-strength mechanical property, good high-wear-resistance processing property and the like, the polypropylene is arranged to separate the core plate 1, the strength layer 2 and the heat conduction layer 3, so as to prevent a circuit thereof from generating an electrostatic magnetic field, the bakelite paper 201 has good mechanical strength, insulating property and certain waterproof property, the glass cloth 202 has the properties of insulation, heat insulation, corrosion resistance, nonflammability, high temperature resistance, high strength and the like, the mechanical strength of the core plate 1 is increased through the matching between the bakelite paper 201 and the glass cloth 202, so as to prevent the core plate 1 from being broken, the heat dissipation graphite film 301 has very high heat conductivity, the polyphenylene sulfide 302 has the advantages of high mechanical strength, high temperature resistance, chemical resistance, flame resistance, good thermal stability, good electrical property and the like, and is widely applied to the fields of electronics, automobiles, machinery and chemical industry, the heat dissipation performance of the core plate 1 is improved through the matching between the heat dissipation graphite film 301 and the polyphenylene sulfide 302, so that the service life of the core plate 1 is prolonged, the epoxy resin is arranged to increase the structural stability among the core plate 1, the strength layer 2, the heat conduction layer 3 and the polypropylene, and the overall mechanical strength is improved.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a 5G communication multilayer circuit board structure, includes core (1), its characterized in that: the heat-conducting core plate is characterized in that strength layers (2) are arranged at the top and the bottom of the core plate (1), and heat-conducting layers (3) are arranged on the sides, far away from the strength layers (2), of the strength layers.

2. The structure of claim 1, wherein the structure of the 5G communication multi-layer circuit board comprises: polypropylene is arranged among the core plate (1), the strength layer (2) and the heat conduction layer (3).

3. The structure of claim 1, wherein the structure of the 5G communication multi-layer circuit board comprises: the strength layer (2) comprises phenolic aldehyde bakelite paper (201) and glass cloth (202), the phenolic aldehyde bakelite paper (201) is arranged at the top and the bottom of the core plate (1), and the glass cloth (202) is arranged on one side, far away from the phenolic aldehyde bakelite paper (201) relatively.

4. The structure of claim 1, wherein the structure of the 5G communication multi-layer circuit board comprises: the heat conducting layer (3) comprises a heat dissipation graphite film (301) and polyphenylene sulfide (302), the heat dissipation graphite film (301) is arranged on one side, away from the strength layer (2), of the strength layer, and the polyphenylene sulfide (302) is arranged on one side, away from the heat dissipation graphite film (301), of the strength layer.

5. The structure of claim 1, wherein the structure of the 5G communication multi-layer circuit board comprises: the core plate (1), the strength layer (2), the heat conduction layer (3) and the polypropylene are bonded through epoxy resin.